Light emitting diode packaging structure

Abstract

A light-emitting diode packaging structure comprises a light-emitting element, a packaging piece, a reflecting layer and a protective layer. The light-emitting element is provided with a first surface, a second surface opposite to the first surface and a side surface connected with the first surface and the second surface, and the second surface of the light-emitting element is provided with an electrode part. The package covers the light-emitting element and at least exposes an electrode portion of the light-emitting element. The reflective layer is located on the light-emitting element or the package. The protection layer covers the reflection layer, the reflection layer is arranged between at least one of the packaging piece and the light-emitting element and the protection layer, and one side face, exposed out of the protection layer and the reflection layer, of the packaging piece is defined as a light emitting side. Therefore, the light emitting diode packaging structure provided by the utility model can prevent light leakage caused by the fact that the reflecting layer is damaged by external force, and avoid the oxidation problem caused by air and moisture, thereby improving the reliability of products.

Description

Technical Field

[0001] This utility model relates to a light-emitting diode, and more particularly to a light-emitting diode packaging structure that can emit light from the side. Background Technology

[0002] As a highly efficient light source, light-emitting diodes (LEDs) possess numerous advantages such as environmental friendliness, energy saving, and long lifespan, and have been widely used in various fields and applications, such as as backlight sources. In recent years, with the increasing demand for LEDs to be thinner and to improve their performance, it is indeed necessary to propose a new LED packaging structure to meet these requirements. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a light-emitting diode packaging structure that can not only improve the yield and reliability of the product, but also achieve thinness and uniform side light emission.

[0004] Another technical problem to be solved by this utility model is to provide a light-emitting diode packaging structure that, while using a reflective layer to increase the lateral light emission intensity, can prevent light leakage caused by damage to the reflective layer due to external force, and can avoid oxidation of the reflective layer due to air and moisture, which would affect reliability.

[0005] To address the aforementioned technical problems, this utility model provides a light-emitting diode (LED) packaging structure, comprising: a light-emitting element having a first surface and a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, wherein the second surface of the light-emitting element is provided with an electrode portion; a package covering the light-emitting element and at least exposing the electrode portion of the light-emitting element; a reflective layer located on the light-emitting element or the package; and a protective layer covering the reflective layer, wherein the reflective layer is located between the package and at least one of the light-emitting element and the protective layer, and a side of the package exposed between the protective layer and the reflective layer is defined as a light-emitting side.

[0006] Preferably, the protective layer includes a body and a side extension, the side extension being connected to the periphery of the body and extending toward the package, the side of the reflective layer contacting or not contacting the side extension, the package forming a recess corresponding to a top surface of the side extension, the recess cooperating with the side extension, the side extension having a bottom surface, the horizontal height of the bottom surface being higher than, equal to, or lower than the horizontal height of the first surface of the light-emitting element, a first height being between a bottom surface of the package and an outer surface of the protective layer, and the side extension having a second height, the second height being ≤ half of the first height.

[0007] Preferably, the side extension has a first width, and the distance between the outer side of the package and the side surface of the light-emitting element is defined as a second width, wherein the first width is less than or equal to the second width.

[0008] Preferably, the area of ​​the reflective layer is greater than or equal to the area of ​​the first surface of the light-emitting element and less than or equal to the area of ​​the top surface of the package.

[0009] Preferably, the side surface of the reflective layer is shielded by the side extension.

[0010] Preferably, the reflective layer is located on the light-emitting element, and the reflective layer is in contact with the light-emitting element or is spaced apart from the light-emitting element.

[0011] Preferably, the thickness of the reflective layer ranges from 200 nanometers to 5 micrometers.

[0012] Preferably, the thickness of the protective layer ranges from 1 micrometer to 1000 micrometers.

[0013] Preferably, the protective layer includes a body and a side extension, the side extension being connected to a plurality of sides of the body and extending toward the second surface of the light-emitting element, the bottom surface of the side extension being flush with the bottom surface of the package, and the side surface of the reflective layer contacting or not contacting the side extension.

[0014] Preferably, the protective layer further includes a protrusion at one end of the light-emitting side of the package, the protrusion being connected to the remaining side of the body and extending toward the package, the side of the reflective layer contacting or not contacting the protrusion, the package forming a recess on a top surface corresponding to the protrusion, the recess engaging with the protrusion, the protrusion having a bottom end, the horizontal height of the bottom end being higher than, equal to, or lower than the horizontal height of the first surface of the light-emitting element, a first height being present between the bottom surface of the package and an outer surface of the protective layer, and the protrusion having a second height, the second height being ≤ half of the first height.

[0015] Preferably, the protrusion has a first width, and the distance between the outer side of the package and the side surface of the light-emitting element is defined as a second width, wherein the first width is less than or equal to the second width.

[0016] Preferably, the side surface of the reflective layer is shielded by the side extension and the protrusion.

[0017] Preferably, the reflective layer is in contact with the light-emitting element or is spaced apart from the light-emitting element.

[0018] To address the aforementioned technical problems, this utility model also provides a light-emitting diode (LED) packaging structure, comprising: a light-emitting element having a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface; a light-transmitting package covering at least the side surface of the light-emitting element; a reflective layer located on at least one of the light-emitting element and the light-transmitting package; and a protective layer having an inner surface and an outer surface, the inner surface and the outer surface being located on opposite sides of the protective layer, the protective layer covering the reflective layer, the inner surface of the protective layer contacting the reflective layer, such that the reflective layer is located between the light-transmitting package and at least one of the light-emitting elements and the protective layer, and at least a portion of the side surface of the light-transmitting package is not covered by the protective layer.

[0019] Preferably, the vertical projection area of ​​the reflective layer is located within the vertical projection area of ​​the protective layer.

[0020] Preferably, the protective layer includes a body and at least one side extension, the at least one side extension being connected to at least one side of the body and extending toward the second surface of the light-transmitting package or the light-emitting element, and the side of the reflective layer contacting or not contacting the at least one side extension.

[0021] Preferably, the protective layer further includes a protrusion connected to the remaining sides of the body and extending toward the light-transmitting package. The side of the reflective layer may or may not contact the protrusion. The light-transmitting package forms a recess corresponding to a top surface of the protrusion. The recess and the protrusion cooperate with each other. The protrusion has a bottom end. The horizontal height of the bottom end is higher than, equal to, or lower than the horizontal height of the first surface of the light-emitting element. There is a first height between a bottom surface of the light-transmitting package and the outer surface of the protective layer. The protrusion has a second height, where the second height is ≤ half of the first height.

[0022] Preferably, the protrusion has a first width, and the distance between the outer side of the light-transmitting package and the side surface of the light-emitting element is defined as a second width, wherein the first width is less than or equal to the second width.

[0023] Preferably, the area of ​​the reflective layer is greater than or equal to the area of ​​the first surface of the light-emitting element and less than or equal to the area of ​​the top surface of the light-transmitting package.

[0024] Preferably, the side of the reflective layer is shielded by the at least one side extension and the protrusion.

[0025] Preferably, the reflective layer is in contact with the light-emitting element or is spaced apart from the light-emitting element.

[0026] Preferably, the light-transmitting package is a wavelength conversion layer, and the wavelength conversion layer is spaced between the reflective layer and the light-emitting element.

[0027] Preferably, the protective layer is a light-shielding layer, and the bottom surface of the side extension is flush with the bottom surface of the light-transmitting package.

[0028] The beneficial effects of this utility model are as follows: The LED packaging structure provided by this utility model includes a light-emitting element, a package, a reflective layer, and a protective layer. The package covers the light-emitting element and exposes at least the electrode portion of the light-emitting element. The reflective layer is located on the light-emitting element or the package. The protective layer covers the reflective layer and is located between the package, at least one of the light-emitting element, and the protective layer. The side of the package exposed between the protective layer and the reflective layer is defined as the light-emitting side, and light can be emitted from the side of the package, thus achieving the effect of side light emission. This utility model can simultaneously achieve thinness and uniform side light emission. Furthermore, the protective layer covering the reflective layer can more completely cover the reflective layer, avoiding pinhole problems caused by impurities during the process or damage from external forces that could cause frontal light leakage. The protective layer can also prevent the metal reflective layer from directly contacting the atmosphere (air and moisture) and causing oxidation problems.

[0029] To further understand the features and technical content of this utility model, please refer to the following detailed description and drawings of this utility model. However, the drawings are provided for reference and illustration only and are not intended to limit this utility model. Attached Figure Description

[0030] Figure 1 This is a top view of the LED packaging structure according to the first embodiment of this utility model.

[0031] Figure 2 for Figure 1 Sectional view along II-II.

[0032] Figure 3 for Figure 1 Sectional view along III-III.

[0033] Figure 4 This is a front sectional view of the light-emitting diode package structure according to the second embodiment of this utility model.

[0034] Figure 5 This is a side cross-sectional view of the light-emitting diode package structure according to the second embodiment of this utility model.

[0035] Figure 6 This is a front sectional view of the LED packaging structure according to the third embodiment of this utility model.

[0036] Figure 7 This is a side cross-sectional view of the light-emitting diode package structure according to the third embodiment of this utility model.

[0037] Figure 8 This is a front sectional view of the light-emitting diode packaging structure according to the fourth embodiment of this utility model.

[0038] Figure 9 This is a side sectional view of the light-emitting diode package structure according to the fourth embodiment of this utility model.

[0039] Figure 10 This is a front sectional view of the light-emitting diode package structure according to the fifth embodiment of this utility model.

[0040] Figure 11 This is a side sectional view of the light-emitting diode package structure according to the fifth embodiment of this utility model.

[0041] Figure 12 This is a front sectional view of the LED packaging structure according to the sixth embodiment of this utility model.

[0042] Figure 13 This is a side sectional view of the light-emitting diode package structure according to the sixth embodiment of this utility model.

[0043] Figure 14 This is a top view of the LED packaging structure according to the seventh embodiment of this utility model.

[0044] Figure 15 for Figure 14 10V-10V sectional view.

[0045] Figure 16 for Figure 14 Sectional view of XVI-XVI.

[0046] Figure 17 This is a front sectional view of the light-emitting diode package structure according to the eighth embodiment of this utility model.

[0047] Figure 18 This is a side sectional view of the light-emitting diode package structure according to the eighth embodiment of this utility model. Detailed Implementation

[0048] The following specific embodiments illustrate the implementation of the "light-emitting diode packaging structure" disclosed in this utility model. Those skilled in the art can understand the advantages and effects of this utility model from the content disclosed in this specification. This utility model can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this utility model. Furthermore, the accompanying drawings of this utility model are for simple illustrative purposes only and are not depictions of actual dimensions, as stated in advance. The following embodiments will further describe the relevant technical content of this utility model in detail, but the disclosed content is not intended to limit the scope of protection of this utility model.

[0049] It should be understood that while terms such as "first," "second," and "third" may be used in this document to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term "or" as used herein should, as appropriate, include any combination of one or more of the associated listed items.

[0050] [Example]

[0051] Typical light sources, such as LEDs, exhibit a spatial luminous intensity distribution in a Lambertian radiation mode, with a beam angle of approximately 120 degrees. In other words, when the emission angle exceeds 120 degrees, the light intensity weakens (i.e., the light intensity is stronger at the center of the emission angle and weaker around the edges), resulting in insufficient lateral light intensity from the LED and thus limiting its applications. Therefore, this invention provides a reflective layer on the upper surface of the encapsulating adhesive layer to form a side-mounted LED package structure. Furthermore, since chip-scale package (CSP) technology allows for further miniaturization of LEDs, this invention uses this packaging form as an example, but is not limited to it.

[0052] The LED packaging structure of this invention includes a light-emitting element 1, a package 2, and a reflective layer 3, such as a metal thin film. However, because the metal thin film is placed on the top (outer) layer of the LED packaging structure, it is easily damaged by machine operation, and the metal thin film itself is prone to pinhole problems due to impurities during the process, leading to light leakage from the element. In addition, if a highly reactive metal (such as silver) thin film is used, oxidation problems caused by direct contact with air and moisture are likely to occur. Therefore, the LED packaging structure of one embodiment of this invention also includes a protective layer 4.

[0053] Please see details Figures 1 to 3 , Figure 1This is a top view of the light-emitting diode package structure according to the first embodiment of this utility model. Figure 2 for Figure 1 Sectional view along II-II (front sectional view), Figure 3 for Figure 1 A sectional view along line III-III (side sectional view). This embodiment is a four-sided light-emitting structure, including a light-emitting element 1, a package 2, a reflective layer 3, and a protective layer 4.

[0054] The light-emitting element 1 can be a combination of one or more light-emitting diodes (LEDs) and laser diodes, which can emit light of different wavelengths, such as infrared light, ultraviolet light, or visible light. Furthermore, the light-emitting element 1 can be a flip-chip LED, but this invention does not limit the type, shape, wavelength, or number of light-emitting elements 1; it can be a light-emitting chip capable of emitting various colors and wavelengths of light, depending on the requirements. In this embodiment, the light-emitting element 1 is generally rectangular, and has a first surface 13, a second surface 14 opposite to the first surface 13, a side surface 15 connecting the first surface 13 and the second surface 14, and an electrode portion 11 disposed on the second surface 14.

[0055] The encapsulation 2 covers at least the side surface 15 of the light-emitting element 1. The encapsulation 2 is a light-transmitting encapsulating layer, which may contain phosphors, SiO2, TiO2, or carbon black powders, and can serve as a wavelength conversion layer, light diffusion layer, etc. Specifically, the encapsulation 2 covers the periphery of the light-emitting element 1, and a thinned encapsulation 2 or an uncovered encapsulation 2 may be disposed on the first surface 13 of the light-emitting element 1, which is beneficial for the thinning of the light-emitting diode encapsulation structure. In this embodiment, the encapsulation 2 can be manufactured by molding, covering the first surface 13 and side surface 15 of the light-emitting element 1, exposing the second surface 14 and electrode portion 11 of the light-emitting element 1; however, the present invention is not limited to this. In other embodiments, the encapsulation 2 may also be a transparent encapsulating layer, which can completely cover the light-emitting element 1, exposing only the electrode portion 11 of the light-emitting element 1, so that the electrode portion 11 can be electrically connected to an external circuit board, allowing the light-emitting element 1 to obtain power and receive control signals from the outside through the electrode portion 11.

[0056] The reflective layer 3 is located on the light-emitting element 1 or the package 2, and the reflective layer 3 can contact the light-emitting element 1 (see details). Figures 4 to 5 The reflective layer 3 may be spaced apart from the light-emitting element 1. In other words, the reflective layer 3 covers at least one of the first surface 13 of the light-emitting element 1 and the top surface 23 of the package 2, but this invention is not limited thereto. The reflective layer 3 has high reflectivity and may be a single-layer or multi-layer structure of metal, dielectric material, or metal plus dielectric material.

[0057] In this embodiment, the reflective layer 3 covers the top surface 23 of the package 2 and is spaced apart from the first surface 13 of the light-emitting element 1 by a distance. The area of ​​the reflective layer 3 is not less than the area of ​​the first surface 13 of the light-emitting element 1, and not greater than the area of ​​the top surface 23 of the package 2. Figures 1 to 3 As shown, the area of ​​the reflective layer 3 is larger than the area of ​​the first surface 13 of the light-emitting element 1, and approximately equal to the area of ​​the top surface 23 of the package 2. The reflective layer 3 has a thickness t1 (as shown in the figure). Figure 2 and Figure 3 As shown), the thickness t1 of the reflective layer 3 is preferably 200 nanometers to 5 micrometers. For example, the thickness t1 of the reflective layer 3 can be 200 nanometers, 500 nanometers, 1 micrometer, 3 micrometers or 5 micrometers, etc., so that the reflective layer 3 can achieve a better thickness, while having the predetermined reflective effect and not occupying too much thickness space.

[0058] The protective layer 4 has an inner surface 41 and an outer surface 42 opposite to the inner surface 41. The protective layer 4 covers the reflective layer 3, and the inner surface 41 of the protective layer 4 contacts the reflective layer 3. In other words, the reflective layer 3 is located between the package 2 and at least one of the light-emitting element 1 and the protective layer 4. Preferably, the vertical projection area of ​​the reflective layer 3 is located within the vertical projection area of ​​the protective layer 4. The protective layer 4 can be made of materials such as silicone, resin, or plastic, and can be mixed with powders such as SiO2, TiO2, or carbon black to form white, black, or other colors. The protective layer 4 has a thickness t2 (e.g., ...). Figure 2 and Figure 3 As shown in the diagram, for example, if the protective layer 4 is made of silicone, its thickness t2 ≥ 5 micrometers is preferred, such as 5 micrometers, 8 micrometers, 10 micrometers, or 20 micrometers; if the protective layer 4 is made of resin, the thickness t2 of the protective layer 4 can be thinner, for example, t2 ≥ 1 micrometer. In short, the thickness range of the protective layer 4 is 1μm ≤ t2 ≤ 1000μm, so that the protective layer 4 can achieve a better thickness, which not only has a better protective effect but also does not occupy too much thickness space.

[0059] At least a portion of the sides of the package 2 are not covered by the protective layer 4. The side of the package 2 exposed to the protective layer 4 and the reflective layer 3 is defined as a light-emitting side 22. In this embodiment, the reflective layer 3 is located between the package 2 and the protective layer 4, and the four sides of the package 2 are not covered by the protective layer 4 and the reflective layer 3; each side can be considered a light-emitting side 22. With this design, the light beam emitted by the light-emitting element 1 passes through the package 2 (if doped with phosphor, the light emitted by the light-emitting diode chip can be converted into a predetermined wavelength), and then is reflected by the reflective layer 3 and emitted outward through the light-emitting side 22 of the package 2, thereby enabling the light-emitting diode package structure to achieve the effect of emitting light from all four sides.

[0060] Please see Figures 4 to 5 , Figure 4This is a front sectional view of the light-emitting diode package structure according to the second embodiment of this utility model; Figure 5 This is a side sectional view of the LED packaging structure according to the second embodiment of the present invention. The LED packaging structure of the second embodiment is similar to that of the first embodiment, and the similarities will not be repeated. Compared with the first embodiment, the difference in the LED packaging structure of the second embodiment of the present invention is that the reflective layer 3 is located on the light-emitting element 1, covering the first surface 13 of the light-emitting component 1. In this embodiment, the light-emitting side 22 is exposed between the protective layer 4 and the reflective layer 3. Through this design, not only can the light beam emitted by the light-emitting element 1 be directly reflected by the reflective layer 3 and emitted outward through the light-emitting side 22 of the package 2, thereby enabling the LED packaging structure to achieve the effect of emitting light from all four sides, but it also facilitates the thinning of the LED packaging structure and further reduces its size.

[0061] Please see Figures 6 to 7 , Figure 6 This is a front sectional view of the LED packaging structure according to the third embodiment of this utility model; Figure 7 This is a side sectional view of the LED packaging structure according to the third embodiment of the present invention. The LED packaging structure of the third embodiment is similar to that of the first embodiment, and the similarities will not be repeated. Compared with the first embodiment, the LED packaging structure of the third embodiment of the present invention differs in the area of ​​the reflective layer 3 and the fact that the protective layer 4 extends further to cover the side of the reflective layer 3.

[0062] In this embodiment, the protective layer 4 includes a body 43 and a side extension 44. The side extension 44 is connected to the periphery of the body 43 and extends toward the package 2. The side of the reflective layer 3 contacts the side extension 44. However, this invention is not limited to this. In other embodiments, the side of the reflective layer 3 is only shielded by the side extension 44 and may not directly contact the side extension 44. In this embodiment, the area of ​​the reflective layer 3 is larger than the area of ​​the first surface 13 of the light-emitting element 1 and smaller than the area of ​​the vertical projection of the package 2 on the horizontal plane. Furthermore, the package 2 forms a recess 231 on the top surface 23 corresponding to the side extension 44. The recess 231 cooperates with the side extension 44. The side extension 44 has a bottom surface 441. The horizontal height of the bottom surface 441 may be higher than or equal to the horizontal height of the first surface 13 of the light-emitting element 1, but is not limited thereto. In other embodiments, the horizontal height of the bottom surface 441 may be slightly lower than the horizontal height of the first surface 13 of the light-emitting element 1. Therefore, the side extension 44 of the protective layer 4 will not only not affect the light emission of the light-emitting element 1, but also provide better protection for the reflective layer 3 and better bonding with the package 2.

[0063] It is worth noting that in other embodiments, the top surface 23 of the encapsulation 2 adjacent to the protective layer 4 may not have a recess 231, and the side extension 44 of the protective layer 4 (e.g., a transparent adhesive layer) may extend to cover multiple sides of the encapsulation 2, which can also achieve the effect of protecting the reflective layer 3.

[0064] Please see Figures 8 to 9 , Figure 8 This is a front sectional view of the light-emitting diode packaging structure according to the fourth embodiment of this utility model; Figure 9 This is a side sectional view of the LED packaging structure according to the fourth embodiment of the present invention. The LED packaging structure of the fourth embodiment is similar to that of the third embodiment, and the similarities will not be repeated. Compared with the third embodiment, the LED packaging structure of the fourth embodiment of the present invention differs in the area of ​​the reflective layer 3 and the width of the side extension 44 of the protective layer 4. In this embodiment, the area of ​​the reflective layer 3 is slightly larger than or equal to the area of ​​the first surface 13 of the light-emitting element 1, and from the direction of the front sectional view, the recess 231 formed by the top surface 23 of the package 2 corresponding to the side extension 44 has a larger accommodating space, resulting in a wider width of the side extension 44 compared to the third embodiment.

[0065] Please see Figures 10 to 11 , Figure 10 This is a front sectional view of the light-emitting diode packaging structure according to the fifth embodiment of this utility model; Figure 11 This is a side sectional view of the LED packaging structure according to the fifth embodiment of the present invention. The LED packaging structure of the fifth embodiment is similar to that of the third embodiment, and the similarities will not be repeated. Compared with the third embodiment, the LED packaging structure of the fifth embodiment of the present invention differs in that the reflective layer 3 is located on the light-emitting element 1, covering the first surface 13 of the light-emitting element 1, and the horizontal height of the bottom surface 441 is slightly lower than the horizontal height of the first surface 13 of the light-emitting element 1, but this does not affect the light emission of the light-emitting element 1, and it can facilitate the thinning of the LED packaging structure and further reduce its volume.

[0066] Please see Figures 12 to 13 , Figure 12 This is a front sectional view of the LED packaging structure according to the sixth embodiment of this utility model; Figure 13 This is a side sectional view of the LED packaging structure according to the sixth embodiment of the present invention. The LED packaging structure of the sixth embodiment is similar to that of the fifth embodiment, and the similarities will not be repeated. Compared with the fifth embodiment, the LED packaging structure of the sixth embodiment of the present invention differs in that the area of ​​the reflective layer 3 is slightly larger than or equal to the area of ​​the first surface 13 of the light-emitting element 1, and the side of the reflective layer 3 does not contact the side extension 44.

[0067] Furthermore, whether viewed from the front view or the side view section, a first height H can be defined between the bottom surface 21 of the package 2 and the outer surface 42 of the protective layer 4 (e.g., ...). Figure 6 and Figure 7 As shown), the bottom surface 441 of the side extension 44 and the outer surface 42 of the protective layer 4 have a second height h, where the second height h ≤ half of the first height H. Furthermore, the side extension 44 can be defined to have a first width w, and the distance between the outer side of the package 2 and the side surface 15 of the light-emitting element 1 can be defined as a second width W, where the first width w ≤ the second width W. Alternatively, the area of ​​the reflective layer 3 can be defined as ≥ the area of ​​the first surface 13 of the light-emitting element 1 and ≤ the area of ​​the top surface 23 of the package 2. The side surface of the reflective layer 3 can be shielded by the side extension 44 (e.g., ...). Figures 6 to 13 As shown), it has a better protective effect. It can not only prevent light leakage caused by damage to the reflective layer 3 by external objects or external forces, but also block air and moisture to avoid oxidation.

[0068] In this invention, the type of protective layer 4 covering the encapsulation 2 is not limited. In another embodiment, at least a portion of the sides of the encapsulation 2 are not covered by the protective layer 4, which can also achieve the effect of side light emission.

[0069] Please see Figures 14 to 16 , Figure 14 This is a top view of the LED packaging structure according to the seventh embodiment of this utility model. Figure 15 for Figure 14 Sectional view of XXV-XXV (front sectional view), Figure 16 for Figure 14 The XVI-XVI sectional view (side sectional view). This embodiment is a single-sided light-emitting structure, including a light-emitting element 1, a package 2, a reflective layer 3 and a protective layer 4.

[0070] In this embodiment, the encapsulation 2 covers the light-emitting element 1, covering the first surface 13 and side surface 15 of the light-emitting element 1, exposing the second surface 14 and electrode portion 11 of the light-emitting element 1. A reflective layer 3 covers the encapsulation 2. For example, the reflective layer 3 may contact the light-emitting element 1 or be spaced apart from it. In other words, the reflective layer 3 covers at least one of the first surface 13 of the light-emitting element 1 and the top surface 23 of the encapsulation 2. This invention is not limited to this.

[0071] In this embodiment, the protective layer 4 can be a light-shielding layer made of a light-shielding material. The protective layer 4 covers the reflective layer 3, and the inner surface 41 of the protective layer 4 contacts the reflective layer 3, so that the reflective layer 3 is located between the package 2 and the protective layer 4. However, this is not a limitation. In other embodiments, the reflective layer 3 can cover the light-emitting element 1. The similarities between the light-emitting diode package structure of the seventh embodiment and the first to sixth embodiments described above will not be repeated. The main difference between this embodiment and the first to sixth embodiments is that in this embodiment, only one side of the package 2 is not covered by the protective layer 4, while the other sides are covered. In other words, the package 2 has only one light-emitting side 22. The light beam emitted by the light-emitting element 1 passes through the package 2, is reflected by the reflective layer 3, and is then emitted outward from the light-emitting side 22 of the package 2, thereby enabling the light-emitting diode package structure to achieve the effect of single-sided light emission.

[0072] In this embodiment, the protective layer 4 includes a body 43 and a side extension 44. The side extension 44 is connected to three sides of the body 43 and extends toward the second surface 14 of the light-emitting element 1. The bottom surface 441 of the side extension 44 is approximately flush with the bottom surface 21 of the package 2. Other aspects, such as whether the side of the reflective layer 3 contacts or does not contact the side extension 44, whether the reflective layer 3 contacts the light-emitting element 1 or is spaced apart from the light-emitting element 1, or whether the area of ​​the reflective layer 3 is not less than the area of ​​the first surface 13 of the light-emitting element 1, are similar to those in the first to sixth embodiments and will not be described again.

[0073] However, it should be noted that the protective layer 4 can cover at least one side of the package 2 depending on the light-emitting design requirements. Therefore, in another embodiment, the protective layer 4 may also include a body 43 and at least one side extension 44, with the at least one side extension 44 connected to at least one side of the body 43 and extending toward the second surface 14 of the light-emitting element 1. For example, the protective layer 4 may have a side extension 44 extending toward the second surface 14 of the light-emitting element 1, thereby enabling the light-emitting diode package structure to achieve the effect of three-sided light emission. Alternatively, the protective layer 4 may have two side extensions 44 extending toward the second surface 14 of the light-emitting element 1, thereby enabling the light-emitting diode package structure to achieve the effect of two-sided light emission.

[0074] Please see Figures 17 to 18 , Figure 17 This is a front sectional view of the light-emitting diode package structure according to the eighth embodiment of this utility model. Figure 18 This is a side cross-sectional view of the LED packaging structure according to the eighth embodiment of the present invention. The main difference between this embodiment and the seventh embodiment is that the protective layer 4 may also include a protrusion 44' (e.g., ...) at one end of the light-emitting side 22 of the package 2. Figure 18As shown, the protrusion 44' is connected to one side of the body 43 and extends toward the package 2. Correspondingly, the package 2 forms a recess 231 on the top surface 23 of the protrusion 44'. The recess 231 and the protrusion 44' cooperate with each other. The horizontal height of a bottom end 441' of the protrusion 44' can be higher than, lower than or equal to the horizontal height of the first surface 13 of the light-emitting element 1. The side of the reflective layer 3 can contact or not contact the protrusion 44'.

[0075] Please see Figure 18 From a side cross-sectional view, there is a first height H between the bottom surface 21 of the package 2 and the outer surface 42 of the protective layer 4, and a second height h between the protrusion 44' and the first height H. The protrusion 44' has a first width w, and the distance between the outer side of the package 2 and the side surface 15 of the light-emitting element 1 is defined as a second width W, where the first width w ≤ the second width W. In this embodiment, the area of ​​the reflective layer 3 is greater than or equal to the area of ​​the first surface 13 of the light-emitting element 1, and smaller than the area of ​​the vertical projection of the package 2 on the horizontal plane. Moreover, the vertical projection area of ​​the reflective layer 3 is located within the vertical projection area of ​​the protective layer 4. Preferably, the side of the reflective layer 3 can be shielded by the side extension 44 and the protrusion 44'. This not only prevents the reflective layer 3 from being damaged by external forces and causing light leakage, but also blocks external air and moisture, preventing the reflective layer 3 from oxidizing and affecting the reliability of the product.

[0076] [Beneficial Effects of the Examples]

[0077] The beneficial effects of this utility model are as follows: The LED packaging structure provided by this utility model can cover the light-emitting element with a package and expose at least the electrode portion of the light-emitting element. The reflective layer is located on the light-emitting element or the package, and the protective layer covers the reflective layer. The reflective layer is located between the package and at least one of the light-emitting elements and the protective layer. At least one side of the package (defined as the light-emitting side) is exposed to the protective layer and the reflective layer. This not only allows the light emitted by the light-emitting element to be emitted from the light-emitting side to achieve the effect of side (single-sided or multi-sided) light emission, but also allows it to be applied to special light patterns required by keyboard or display modules, such as batwing light patterns or single-sided light emission. Furthermore, since the reflective layer is covered with a protective layer, it can protect the reflective layer from damage caused by external forces, or from light leakage caused by pinholes due to impurities during the process. The protective layer can also prevent oxidation problems caused by direct contact between the metal reflective layer and air and moisture. In summary, the LED packaging structure provided by this invention can not only improve product yield and reliability, but also achieve both thinness and uniform side light emission.

[0078] However, the above description is only a preferred embodiment of the present utility model and is not intended to limit the scope of patent protection of the present utility model. Therefore, all equivalent changes made based on the content of the present utility model specification and drawings are similarly included within the scope of protection of the present utility model and are hereby stated.

Claims

1. A light-emitting diode (LED) packaging structure, characterized in that, include: A light-emitting element has a first surface and a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface, wherein the second surface of the light-emitting element is provided with an electrode portion; A package that covers the light-emitting element and exposes at least the electrode portion of the light-emitting element; A reflective layer is located on the light-emitting element or the package; and A protective layer is provided, which covers the reflective layer and is located between the package and at least one of the light-emitting elements and the protective layer. The side of the package exposed above the protective layer and the reflective layer is defined as a light-emitting side.

2. The light-emitting diode packaging structure as described in claim 1, characterized in that, The protective layer includes a body and a side extension. The side extension is connected to the periphery of the body and extends toward the package. The side of the reflective layer may or may not contact the side extension. The package forms a recess on a top surface corresponding to the side extension. The recess cooperates with the side extension. The side extension has a bottom surface. The horizontal height of the bottom surface is higher than, equal to, or lower than the horizontal height of the first surface of the light-emitting element. There is a first height between the bottom surface of the package and an outer surface of the protective layer. The side extension has a second height, which is less than or equal to half of the first height.

3. The light-emitting diode packaging structure as described in claim 2, characterized in that, The side extension has a first width, and the distance between the outer side of the package and the side surface of the light-emitting element is defined as a second width, wherein the first width is less than or equal to the second width.

4. The light-emitting diode packaging structure as described in claim 2, characterized in that, The area of ​​the reflective layer is greater than or equal to the area of ​​the first surface of the light-emitting element and less than or equal to the area of ​​the top surface of the package.

5. The light-emitting diode packaging structure as described in claim 2, characterized in that, The side of the reflective layer is correspondingly shielded by the side extension.

6. The light-emitting diode packaging structure as described in claim 1, characterized in that, The reflective layer is located on the light-emitting element, and the reflective layer is in contact with the light-emitting element or is spaced apart from the light-emitting element.

7. The light-emitting diode packaging structure as described in claim 1, characterized in that, The thickness of the reflective layer ranges from 200 nanometers to 5 micrometers.

8. The light-emitting diode packaging structure as described in claim 1, characterized in that, The thickness of the protective layer ranges from 1 micrometer to 1000 micrometers.

9. The light-emitting diode packaging structure as described in claim 1, characterized in that, The protective layer includes a body and a side extension. The side extension is connected to a plurality of sides of the body and extends toward the second surface of the light-emitting element. The bottom surface of the side extension is flush with the bottom surface of the package. The side surface of the reflective layer may or may not contact the side extension.

10. The light-emitting diode packaging structure as described in claim 9, characterized in that, The protective layer also includes a protrusion at one end of the light-emitting side of the package, the protrusion being connected to the remaining side of the body and extending toward the package. The side of the reflective layer may or may not contact the protrusion. The package forms a recess on a top surface corresponding to the protrusion, the recess engaging with the protrusion. The protrusion has a bottom end, the horizontal height of which is higher than, equal to, or lower than the horizontal height of the first surface of the light-emitting element. There is a first height between the bottom surface of the package and an outer surface of the protective layer. The protrusion has a second height, the second height being ≤ half of the first height.

11. The light-emitting diode packaging structure as described in claim 10, characterized in that, The protrusion has a first width, and the distance between the outer side of the package and the side surface of the light-emitting element is defined as a second width, wherein the first width is less than or equal to the second width.

12. The light-emitting diode packaging structure as described in claim 11, characterized in that, The side surface of the reflective layer is correspondingly shielded by the side extension and the protrusion.

13. The light-emitting diode packaging structure as described in claim 9, characterized in that, The reflective layer is in contact with the light-emitting element or is spaced apart from the light-emitting element.

14. A light-emitting diode (LED) packaging structure, characterized in that, include: A light-emitting element has a first surface, a second surface opposite to the first surface, and a side surface connecting the first surface and the second surface; A light-transmitting package, at least covering the side surface of the light-emitting element; A reflective layer is located on at least one of the light-emitting element and the light-transmitting package; as well as A protective layer has an inner surface and an outer surface, the inner surface and the outer surface being located on opposite sides of the protective layer, the protective layer covering the reflective layer, the inner surface of the protective layer contacting the reflective layer, such that the reflective layer is located between the light-transmitting package and at least one of the light-emitting elements and the protective layer, and at least a portion of the sides of the light-transmitting package are not covered by the protective layer.

15. The light-emitting diode packaging structure as described in claim 14, characterized in that, The vertical projection area of ​​the reflective layer is located within the vertical projection area of ​​the protective layer.

16. The light-emitting diode packaging structure as described in claim 15, characterized in that, The protective layer includes a body and at least one side extension, the at least one side extension being connected to at least one side of the body and extending toward the second surface of the light-transmitting package or the light-emitting element, the side of the reflective layer being in contact with or not in contact with the at least one side extension.

17. The light-emitting diode packaging structure as described in claim 16, characterized in that, The protective layer further includes a protrusion connected to the remaining sides of the body and extending toward the light-transmitting package. The side of the reflective layer may or may not contact the protrusion. The light-transmitting package forms a recess corresponding to a top surface of the protrusion, which cooperates with the protrusion. The protrusion has a bottom end whose horizontal height is higher than, equal to, or lower than the horizontal height of the first surface of the light-emitting element. There is a first height between a bottom surface of the light-transmitting package and the outer surface of the protective layer. The protrusion has a second height, which is ≤ half of the first height.

18. The light-emitting diode packaging structure as described in claim 17, characterized in that, The protrusion has a first width, and the distance between the outer side of the light-transmitting package and the side surface of the light-emitting element is defined as a second width, wherein the first width is less than or equal to the second width.

19. The light-emitting diode packaging structure as described in claim 14, characterized in that, The area of ​​the reflective layer is greater than or equal to the area of ​​the first surface of the light-emitting element and less than or equal to the area of ​​the top surface of the light-transmitting package.

20. The light-emitting diode packaging structure as described in claim 17, characterized in that, The side of the reflective layer is correspondingly shielded by the at least one side extension and the protrusion.

21. The light-emitting diode packaging structure as described in claim 14, characterized in that, The reflective layer is in contact with the light-emitting element or is spaced apart from the light-emitting element.

22. The light-emitting diode packaging structure as described in claim 14, characterized in that, The light-transmitting package is a wavelength conversion layer, and the wavelength conversion layer is spaced between the reflective layer and the light-emitting element.

23. The light-emitting diode packaging structure as described in claim 16, characterized in that, The protective layer is a light-shielding layer, and the bottom surface of the side extension is flush with the bottom surface of the light-transmitting package.

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