Back pin structure of flat-foot LED indoor support

Abstract

The utility model relates to the technical field of packaging supports, and particularly discloses a back pin structure of a flat-foot LED indoor support, which comprises a substrate, and a cup body is arranged on one side of the substrate; the pin structure is arranged on the other side of the substrate, the pin structure comprises a common pin and three control pins, and the pin structure is flush with the bottom surface of the substrate; the pin structure is flush with the bottom of the substrate 1, the folding design is adopted, space is greatly saved, the whole device is more compact and can be conveniently installed and integrated into various devices, especially in application scenes with limited space, meanwhile, the folding position of the pin structure extends to the outside of the substrate, the pins can be unfolded when needed, and therefore the pin structure can be folded, and the pin structure is convenient to assemble and disassemble. The flexibility of the product and the adaptability to different application scenes are improved, and diversified use requirements are met.

Description

Technical Field

[0001] This utility model belongs to the field of packaging bracket technology, specifically relating to a back pin structure of a flat-foot LED indoor bracket. Background Technology

[0002] In the field of electronic packaging and microelectronic interconnection, with the increasing trend of product miniaturization and high-density integration, the requirements for welding processes are also becoming more and more stringent. Currently, most existing packaging brackets use "C"-shaped leads, which requires the lead to be extended, resulting in large spacing between individual components and a small number of individual components. At the same time, the subsequent processes of the lead structure have high requirements for the folding size of the leads.

[0003] For example, patent CN220306276U discloses an RGB flat-foot packaging bracket. By adopting a flat-foot design, the overall volume of the packaging bracket can be effectively reduced, which is beneficial to the thinning of the display. The flat-foot design also gives the packaging bracket good fit, and the pins are not exposed to the outside, resulting in good anti-interference. In addition, the cup opening forms an outward-extending horn-shaped structure, which allows the packaging bracket to have a larger light emission angle and improve brightness. However, although the above patent facilitates precision soldering, it also limits its use in other aspects, and its use is subject to certain limitations. Utility Model Content

[0004] The purpose of this invention is to provide a back pin structure for a flat-footed indoor LED bracket to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A flat-legged indoor LED bracket with a rear pin structure, comprising:

[0007] A substrate, wherein a cup is provided on one side of the substrate;

[0008] A pin structure is disposed on the other side of the substrate. The pin structure includes a common pin and three control pins. The pin structure is flush with the bottom surface of the substrate.

[0009] Preferably, a groove for placing pin structures is also provided on the other side of the substrate.

[0010] Preferably, both the common foot and the control foot are in a folded state, with their ends facing the center of the substrate, and the folded portion has a concave structure.

[0011] Preferably, the inner wall of the cup body is provided with a reflective coating.

[0012] Preferably, the fold of the pin structure extends to the outside of the substrate, and the pin edge is pre-plated with an electroplating hole.

[0013] Preferably, the common pin is L-shaped and corresponds to the die bonding portion on the other side of the substrate.

[0014] Preferably, the three control pins correspond to the wiring portion on the other side of the substrate.

[0015] Preferably, the internal cavity of the cup body is funnel-shaped.

[0016] Preferably, the inner edge of the cup body is provided with plastic protrusions.

[0017] Compared with the prior art, the beneficial effects of this utility model are:

[0018] (1) By folding the pin structure to the bottom of the substrate, the space is greatly saved, making the whole device more compact and easy to install and integrate into various devices, especially in space-constrained application scenarios. At the same time, the fold of the pin structure extends to the outside of the substrate, so that the pin can be unfolded when needed, increasing the product's flexibility and adaptability to different application scenarios, and meeting diverse usage needs.

[0019] (2) By setting a reflective coating on the inner wall of the cup, light is reflected inside the cup, which increases the utilization rate of light and thus improves the overall light effect. The internal cavity of the cup is designed in a trumpet shape, which helps the light to be focused and dispersed, making the light more concentrated or more evenly distributed in the required area. Attached Figure Description

[0020] Figure 1 This is one of the schematic diagrams of Embodiment 1 of the present utility model;

[0021] Figure 2 This is a second schematic diagram of Embodiment 1 of the present utility model;

[0022] Figure 3 This is a longitudinal sectional view of Embodiment 1 of the present utility model;

[0023] Figure 4 This is a schematic diagram of the bottom surface of Embodiment 2 of this utility model;

[0024] Figure 5 This is a schematic diagram of the structure before cutting in Embodiment 3 of this utility model;

[0025] Figure 6 This is a cross-sectional view of Embodiment 4 of the present utility model;

[0026] Figure 7 This is a longitudinal section diagram of Embodiment 5 of the present utility model;

[0027] In the diagram: 1. Substrate; 2. Cup body; 3. Common foot; 4. Control foot; 5. Groove; 6. Reflective coating; 7. Plastic boss; 8. Recessed structure. Detailed Implementation

[0028] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0029] Example 1:

[0030] Please see Figures 1-3 As shown, a flat-legged indoor LED bracket back pin structure includes:

[0031] A substrate 1, with a cup body 2 disposed on one side of the substrate 1;

[0032] The pin structure is located on the other side of the substrate 1. The pin structure includes a common pin 3 and three control pins 4. Both the common pin 3 and the control pins 4 are folded, with their ends facing the center of the substrate 1. The folded part is provided with a concave structure 8. Designing a part of the pin to be concave inward can increase the contact area between the pin and the PCB board, improve the stability and reliability of the connection. At the same time, the concave design can also prevent the pin from lifting or falling off due to external force during soldering or assembly, thereby avoiding the problem of missing pins after mounting.

[0033] In one embodiment of the present invention, a groove 5 for placing a pin structure is also provided on the other side of the substrate 1.

[0034] In one embodiment of this utility model, the pin structure is flush with the bottom surface of the substrate 1.

[0035] In one embodiment of the present invention, the fold of the pin structure extends to the outside of the substrate 1, and the pin edge is provided with an electroplating hole.

[0036] In one embodiment of this utility model, a plastic boss 7 is provided on the inner edge of the cup body 2. By adding a plastic boss on the edge of the solder pad, the contact area between the plastic and the substrate can be increased, thereby enhancing the bonding force between the two and ensuring the stability of the cup structure. The design of the plastic boss can effectively prevent water and moisture from seeping in from the edge of the solder pad, thereby improving the overall waterproof performance of the cup and extending its service life.

[0037] As can be seen from the above, during use, the pin structure is flush with the bottom of the substrate 1 and adopts a folding design, which greatly saves space and makes the whole device more compact, making it easier to install and integrate into various devices, especially in space-constrained application scenarios.

[0038] After the pin structure is folded, its ends face the center of the substrate, which not only helps to protect the pins from external impacts and damage, but also reduces the risk of short circuits between the pins to a certain extent.

[0039] Meanwhile, the folded portion of the pin structure extends to the outside of the substrate, allowing the pins to unfold when needed, increasing the product's flexibility and adaptability to different application scenarios, and meeting diverse usage requirements.

[0040] Example 2:

[0041] refer to Figure 4 As shown, a flat-legged indoor LED bracket back pin structure includes:

[0042] A substrate 1, with a cup body 2 disposed on one side of the substrate 1;

[0043] The pin structure is located on the other side of the substrate 1. The pin structure includes a common pin 3 and three control pins 4. The pin structure is flush with the bottom surface of the substrate 1.

[0044] In one embodiment of this utility model, the inner wall of the cup body 2 is provided with a reflective coating 6.

[0045] In one embodiment of this utility model, the common foot 3 is "L" shaped, corresponding to the die bonding portion on the other side of the substrate 1.

[0046] In one embodiment of this utility model, the three control pins 4 correspond to the wiring portion on the other side of the substrate 1.

[0047] In one embodiment of this utility model, the internal cavity of the cup body 2 is funnel-shaped.

[0048] As can be seen from the above, the inner wall of the cup body 2 is provided with a reflective coating 6, which makes the light reflect inside the cup body, increases the utilization rate of light, and thus improves the overall light effect;

[0049] The internal cavity of the cup body 2 is designed in a funnel shape. This shape helps to direct and disperse light, making the light more concentrated or more evenly distributed in the desired area.

[0050] Example 3:

[0051] refer to Figure 5Using precision machining equipment, pre-punched electroplating holes are machined on the pins. The pins are then cleaned and degreased to remove surface dirt and grease. The pins are placed in the electroplating tank, ensuring that the pre-punched electroplating holes are completely submerged in the electroplating solution. The power is turned on, and parameters such as current density and electroplating time are adjusted to perform the electroplating operation. The electroplated workpiece is then cut along the vertical lines marked on both sides to form individual materials.

[0052] Example 4:

[0053] refer to Figure 6 Through the bracket's lifting structure, the bracket's height is precisely controlled within the range of 0.4-1.5mm. This ensures sufficient space to accommodate the LED beads and form an effective moisture barrier, while also preventing structural instability caused by an excessively tall bracket. The bracket's shape is designed to tightly wrap around the LED beads, forming a moisture barrier that effectively blocks the intrusion of humid air. Both the common foot 3 and the control foot 4 are folded at 90°, and the ends are designed with flat feet to ensure a tight fit with the mounting surface, improving installation stability. The vertical structure design makes the heat conduction path between the bracket and the LED beads more direct, which is conducive to rapid heat dissipation and improves heat dissipation efficiency.

[0054] Example 5:

[0055] refer to Figure 7 By adding a plastic boss 7 to the side of the pin, the height and shape of the boss are used to cover the pin and prevent it from being directly exposed. The boss and the pin are integrated, which allows the boss to support the pin more effectively and avoid deformation or breakage of the pin due to uneven force during use. This ensures that the pin can be properly inserted into the socket or connected to other components. The boss design effectively covers the pin and prevents it from being directly exposed, improving the appearance quality and durability of the product.

[0056] All standard parts used in this invention can be purchased from the market, and irregularly shaped parts can be customized according to the description and drawings. The specific connection methods for each part all employ conventional methods such as bolts, rivets, and welding, which are mature technologies in the prior art. The machinery, parts, and equipment all use conventional models in the prior art, and the circuit connections also use conventional connection methods in the prior art, which will not be detailed here. Any content not described in detail in this specification belongs to the prior art known to those skilled in the art.

[0057] In the description of this utility model, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. "A plurality of" means two or more, unless otherwise explicitly specified.

[0058] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0059] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0060] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0061] The accompanying drawings of the embodiments disclosed in this utility model only involve the structures involved in the embodiments disclosed in this utility model. Other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other.

[0062] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A back pin structure for a flat-legged indoor LED bracket, characterized in that, include: A substrate (1) has a cup body (2) disposed on one side of the substrate (1); A pin structure is disposed on the other side of the substrate (1). The pin structure includes a common pin (3) and three control pins (4). The pin structure is flush with the bottom surface of the substrate (1). The other side of the substrate (1) is also provided with a groove (5) for placing the pin structure; The common foot (3) and the control foot (4) are both in a folded state, with their ends facing the center of the substrate (1), and a concave structure (8) is provided at the fold. The inner wall of the cup body (2) is provided with a reflective coating (6).

2. The back pin structure of a flat-foot LED indoor bracket according to claim 1, characterized in that: The fold of the pin structure extends to the outside of the substrate (1), and the edge of the pin is pre-plated with an electroplating hole.

3. The back pin structure of a flat-legged indoor LED bracket according to claim 1, characterized in that: The common pin (3) is L-shaped and corresponds to the die-bonding portion on the other side of the substrate (1).

4. The back pin structure of a flat-footed indoor LED bracket according to claim 1, characterized in that: The three control pins (4) correspond to the wiring portion on the other side of the substrate (1).

5. The back pin structure of a flat-legged indoor LED bracket according to claim 1, characterized in that: The internal cavity of the cup body (2) is trumpet-shaped.

6. The back pin structure of a flat-legged indoor LED bracket according to claim 1, characterized in that: The inner edge of the cup body (2) is provided with plastic protrusions (7).

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