Correcting device
By combining the design of the support structure, the correction components, the drive mechanism and the reset mechanism, the problem of the complex structure of the existing silicon wafer correction device is solved, and the efficient and accurate correction of the silicon wafer position is achieved, reducing energy consumption and cost.
Patent Information
- Application Number
- CN202520214988.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-11
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-02-11
AI Technical Summary
Existing silicon wafer straightening devices have complex structures and require multiple driving components, which affects the efficiency of silicon wafer position adjustment and processing.
The design employs a combination of a support structure, four correction components, a drive mechanism, and a reset mechanism. Two drive mechanisms drive the correction components spaced apart along the first and second directions to achieve synchronous correction, reducing the number of drive components and improving adjustment efficiency.
It simplifies the silicon wafer position correction process, improves adjustment efficiency, reduces energy consumption and equipment costs, and ensures the accuracy of silicon wafer position and prevents silicon wafer damage.
Smart Images

Figure CN223844257U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of silicon wafer processing technology, and in particular to a correction device. Background Technology
[0002] A silicon wafer is a thin sheet made of silicon material, which usually has a flat surface and a specific crystal structure. It is widely used in electronics, optoelectronics and semiconductors. During the production process, silicon wafers are transported to the wafer carrier via an assembly line. Due to the slippage of the silicon wafers on the conveyor belt, there is a deviation in the position of the silicon wafers after they are transported to the wafer carrier. Usually, after the wafer carrier is full of silicon wafers, the position of the silicon wafers in the wafer carrier is corrected.
[0003] In existing technologies, two identical calibration structures are symmetrically arranged on both sides of the wafer carrier structure. The silicon wafer in the wafer carrier is calibrated in the X direction by a motor drive. The calibration structure includes multiple calibration columns and servo motors. The spacing between adjacent columns is adjusted by the servo motors to adjust the position of the silicon wafer in the Y direction. This silicon wafer correction mechanism is relatively complex, requires multiple driving components, and the X and Y positions of the silicon wafer need to be adjusted separately, which affects the position adjustment efficiency of the silicon wafer and thus affects the processing efficiency of the silicon wafer.
[0004] Therefore, a corrective device is needed to solve the above problems. Utility Model Content
[0005] The purpose of this invention is to provide a correction device that can correct the position of silicon wafers in a wafer carrier during silicon wafer processing. It has a simple structure, is easy to adjust, and ensures the positional accuracy during silicon wafer processing.
[0006] To achieve this objective, the present invention adopts the following technical solution:
[0007] Corrective device, the corrective device comprising:
[0008] A support structure for placing a sheet carrier;
[0009] Four straightening components, two of which are spaced apart along a first direction on the support structure for correcting the position of the silicon wafers in the sheet carrier in the first direction, and the other two of which are spaced apart along a second direction on the support structure for correcting the position of the silicon wafers in the sheet carrier in the second direction, wherein the first direction and the second direction are angled together.
[0010] A driving mechanism is connected to all four correction components. The driving mechanism is capable of driving two correction components in a first direction to move closer to each other, and is also capable of driving two correction components in a second direction to move closer to each other.
[0011] A reset mechanism that enables the four correction components to be reset.
[0012] As an optional technical solution, there are two drive mechanisms, one of which is drivenly connected to two correction components spaced apart along a first direction, and the other drive mechanism is drivenly connected to two correction components spaced apart along a second direction.
[0013] As an optional technical solution, the driving mechanism includes a driving component and two transmission components, wherein the driving component is connected to the two correction components respectively through the two transmission components.
[0014] As an optional technical solution, the transmission assembly includes a left-hand lead screw, a right-hand lead screw, and two abutment structures. The left-hand lead screw and the right-hand lead screw are connected by a coupling. The left-hand lead screw is connected to the driving member. One abutment structure is threadedly connected to the left-hand lead screw, and the other abutment structure is threadedly connected to the right-hand lead screw. The abutment structure threadedly connected to the left-hand lead screw and the abutment structure threadedly connected to the right-hand lead screw respectively abut against the ends of the straightening assembly located on both sides of the sheet carrier, away from the sheet carrier.
[0015] As an optional technical solution, the transmission assembly further includes two guide components, which are configured to cooperate with the two abutment structures so that the abutment structures can move along the first direction or the second direction.
[0016] As an optional technical solution, the support structure includes a support plate and a mounting plate, the support plate and the mounting plate are arranged in parallel, and the drive mechanism is mounted on the mounting plate; the support plate is provided with a plurality of guide grooves, the guide grooves being used to cooperate with the correction component.
[0017] As an optional technical solution, the guide groove includes a guide portion and a rolling portion, the guide portion and the rolling portion are arranged in a stepped manner, and the corrective rod is provided with a first rolling element, which is rotatably disposed on the rolling portion.
[0018] As an optional technical solution, the correction component includes at least two correction rods, the mounting plate has multiple rolling grooves, the multiple rolling grooves are arranged one-to-one with the multiple guide grooves, and the rolling grooves are connected to the rolling part. The correction rods are provided with second rolling elements, which are rotatably disposed in the rolling grooves.
[0019] As an optional technical solution, the support structure further includes a limiting plate, which is disposed between the mounting plate and the support plate. The limiting plate is provided with multiple limiting grooves, and the openings on both sides of the multiple limiting grooves are respectively connected to the rolling parts of the multiple rolling grooves and the multiple guide grooves.
[0020] As an optional technical solution, the reset mechanism includes a spring, with multiple springs corresponding to multiple limiting grooves and multiple correcting rods. One end of the spring abuts against the groove wall of the limiting groove, and the other end of the spring abuts against the correcting rod. The spring is located on the side of the correcting rod close to the sheet carrier.
[0021] The beneficial effects of this utility model are:
[0022] This utility model discloses a correction device, which includes a support structure, four correction components, a drive mechanism, and a reset mechanism. Two correction components are spaced apart on the support structure along a first direction for correcting the position of silicon wafers within a sheet carrier in the first direction. The other two correction components are spaced apart on the support structure along a second direction for correcting the position of silicon wafers within a sheet carrier in the second direction. The drive mechanism and the reset mechanism are both located on the support structure and are drively connected to the four correction components. The drive mechanism drives the two correction components spaced apart along the first direction and the two correction components spaced apart along the second direction to move closer to each other. The reset mechanism resets the correction components. When this correction device corrects the position of a silicon wafer in a wafer carrier, two correction components spaced apart along a first direction can work synchronously, and two correction components spaced apart along a second direction can also work synchronously, thereby ensuring the efficiency of silicon wafer position correction. Furthermore, by setting fewer drive components than correction components, energy consumption and equipment costs can be reduced. The reset component can ensure the normal reset of the correction components and prevent the correction components from applying excessive force to the silicon wafer, thereby effectively avoiding damage to the silicon wafer. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the sheet carrier according to an embodiment of the present invention;
[0024] Figure 2 This is a schematic diagram of the structure of the correction device according to an embodiment of the present utility model;
[0025] Figure 3 This is a schematic diagram of the structure of the correction device of this utility model for correcting the position of a silicon wafer in a sheet carrier;
[0026] Figure 4 This is a structural schematic diagram of the correction device from the bottom view of an embodiment of the present invention;
[0027] Figure 5 This is a structural schematic diagram of the correction device (mounting plate hidden) according to an embodiment of the present utility model from the bottom view.
[0028] Figure 6 This is a structural schematic diagram of the correction device (support plate hidden) according to an embodiment of the present utility model from a frontal view.
[0029] Figure 7 This is a schematic diagram of the structure of the support plate according to an embodiment of the present utility model;
[0030] Figure 8 This is a schematic diagram of the structure of the limiting plate according to an embodiment of the present utility model;
[0031] Figure 9 This is a schematic diagram of the mounting plate according to an embodiment of the present utility model;
[0032] Figure 10 This is a schematic diagram of a portion of the structure of the correction component according to an embodiment of the present invention.
[0033] In the picture:
[0034] 1. Correction device; 2. Sheet carrier; 201. Base plate; 202. Opening slot; 3. Silicon wafer;
[0035] 10. Support structure; 11. Support plate; 111. Guide groove; 1111. Guide part; 1112. Rolling part; 12. Mounting plate; 121. Rolling groove; 122. Abutment groove; 13. Limiting plate; 131. Limiting groove;
[0036] 20. Correction mechanism; 211. Drive motor; 212. Left-hand lead screw; 213. Right-hand lead screw; 214. Abutment structure; 2141. Connecting part; 2142. Abutment part; 215. Coupling; 22. Spring; 231. Correction rod; 2311. First rolling element; 2312. Second rolling element; 2313. Guide bushing; 241. Guide rail; 242. Slider. Detailed Implementation
[0037] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present invention, not the entire structure.
[0038] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.
[0039] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0040] In the description of this embodiment, the terms "upper," "lower," "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.
[0041] like Figures 1 to 10As shown, this embodiment provides a correction device 1 for correcting the position of silicon wafers 3 in a sheet carrier 2. The correction device 1 includes a support structure 10 and four correction components. The support structure 10 is used to hold the sheet carrier 2. Two correction components are spaced apart along a first direction on the support structure 10 for correcting the position of the silicon wafers 3 in the sheet carrier 2 in the first direction. The other two correction components are spaced apart along a second direction on the support structure 10 for correcting the position of the silicon wafers 3 in the sheet carrier 2 in the second direction. The first and second directions are angled. A driving mechanism is connected to all four correction components. The driving mechanism drives the two correction components spaced apart along the first direction to move closer together, and also drives the two correction components spaced apart along the second direction to move closer together. A reset mechanism enables the four correction components to reset.
[0042] Specifically, in this embodiment, when the position of the silicon wafer 3 in the sheet carrier 2 is corrected, the driving mechanism can drive two correction components spaced apart along the first direction to move closer to each other, and can also drive two correction components spaced apart along the second direction to move closer to each other, so that the four correction components can abut against the periphery of the respective silicon wafer 3, thereby adjusting the position of the silicon wafer 3 in the sheet carrier 2, effectively ensuring the positional accuracy of the silicon wafer 3 in the sheet carrier 2, and the position adjustment efficiency is high.
[0043] Furthermore, two drive mechanisms are provided. One drive mechanism is driven by two correction components spaced apart along a first direction, and the other drive mechanism is driven by two correction components spaced apart along a second direction. Specifically, in this embodiment, when correcting the position of the silicon wafer 3 in the sheet carrier 2, the two drive mechanisms simultaneously drive the corresponding two correction components to move closer to each other, so that the four correction components can abut against the periphery of the respective silicon wafer 3, thereby adjusting the position of all silicon wafers 3, ensuring that the position correction of the silicon wafer 3 has good accuracy and high correction efficiency. Moreover, the two correction components spaced apart along the first direction are driven by one drive mechanism, and the two correction components spaced apart along the second direction are driven by another drive mechanism. This arrangement improves control flexibility, reduces the number of drive mechanisms, saves space, effectively reduces component costs, and lowers equipment energy consumption.
[0044] Specifically, in this embodiment, the sheet carrier 2 is a flower basket, and the shape of the flower basket is rectangular. The first direction is the extension direction of the first side of the rectangle, and the second direction is the extension direction of the second side that is perpendicular to the first side of the rectangle. Therefore, the first direction and the second direction in this embodiment are perpendicular.
[0045] Furthermore, such as Figure 4As shown, the driving mechanism includes a driving component and two transmission assemblies. The driving component is connected to the two correction assemblies via the two transmission assemblies. Specifically, in this embodiment, the driving component is a drive motor 211, which is fixedly mounted on the mounting plate 12. The drive motor 211 is connected to the correction assemblies via the transmission assemblies, thereby ensuring that the functions of the two correction assemblies can be realized normally.
[0046] Furthermore, such as Figure 4 and Figure 5 As shown, the transmission assembly includes a left-hand lead screw 212, a right-hand lead screw 213, and two abutment structures 214. The left-hand lead screw 212 and the right-hand lead screw 213 are connected by a coupling 215. The left-hand lead screw 212 is connected to the drive component. One abutment structure 214 is threadedly connected to the left-hand lead screw 212, and the other abutment structure 214 is threadedly connected to the right-hand lead screw 213. The abutment structure 214 threadedly connected to the left-hand lead screw 212 and the abutment structure 214 threadedly connected to the right-hand lead screw 213 respectively abut against the ends of the straightening components located on both sides of the sheet carrier 2 away from the sheet carrier 2. Specifically, in this embodiment, both the left-hand lead screw 212 and the right-hand lead screw 213 are rotatably mounted on the mounting plate 12 via bearings, and are connected by a coupling 215. The left-hand lead screw 212 is connected to the drive motor 211, and the abutment structure 214 abuts against the correction component. The abutment structure 214 is restricted from rotation by the correction component and can only move along the axial direction of either the left-hand lead screw 212 or the right-hand lead screw 213. When the drive motor 211 rotates, since the two abutment structures 214 are threadedly connected to the left-hand lead screw 212 and the right-hand lead screw respectively, and since the left-hand lead screw 212 and the right-hand lead screw rotate in opposite directions, the two abutment structures 214 can move closer to or further away from each other. When the two abutment structures 214 move closer to each other, they push against the corresponding correction components, thereby bringing the two correction components closer together and achieving the purpose of correcting the position of the silicon wafer 3.
[0047] Specifically, in this embodiment, as Figure 5 As shown, the abutment structure 214 includes a connecting part 2141 and an abutment part 2142, which are fixedly connected. The connecting part 2141 has a threaded hole and is threadedly connected to a left-hand lead screw 212 or a right-hand lead screw 213. The abutment part 2142 abuts against the straightening rod 231. The abutment part 2142 can only move along the axial direction of the lead screw, thereby pushing the straightening rod 231 to move along the direction closer to the silicon wafer 3, so as to achieve the purpose of correcting the position of the silicon wafer 3.
[0048] Specifically, in this embodiment, as Figure 5As shown, the transmission assembly also includes two guide structures, which are configured to cooperate with two abutment structures 214 to enable the abutment structures 214 to move along a first direction or a second direction. Specifically, in this embodiment, the guide structure includes a guide rail 241 and a slider 242. The guide rail 241 is fixedly mounted on the support structure 10, and the slider 242 is mounted on the abutment portion 2142 and slidably mounted on the guide rail 241. This configuration can guide the movement of the abutment structure 214, thereby improving the stability of the movement of the abutment structure 214 and ensuring the normal operation of the silicon wafer 3 position correction.
[0049] Specifically, in this embodiment, the guide rail 241 is disposed on the side of the limiting plate 13 away from the support plate 11, and the abutting part 2142 of the abutting structure 214 is located between the limiting plate 13 and the mounting plate 12.
[0050] Furthermore, such as Figure 1 , Figures 3 to 6 As shown, the support structure 10 includes a support plate 11 and a mounting plate 12, which are arranged in parallel. The drive mechanism is mounted on the mounting plate 12. The support plate 11 is provided with multiple guide grooves 111, and all the straightening rods 231 are slidably disposed in all the guide grooves 111. Specifically, in this embodiment, the drive mechanism is mounted on the side of the mounting plate 12 away from the support plate 11, and the end face of the support plate 11 away from the mounting plate 12 is used to support the sheet carrier 2. The straightening rods 231 are sequentially inserted through the support plate 11 and the mounting plate 12, and the guide grooves 111 of the support plate 11 can guide the straightening rods 231 to a certain extent, thereby improving the stability of the straightening rods 231 and ensuring the reliability of the position correction of the silicon wafer 3.
[0051] Furthermore, such as Figure 7 As shown, the correction assembly includes at least two correction rods 231. The guide groove 111 includes a guide portion 1111 and a rolling portion 1112, which are arranged in a stepped manner. A first rolling element 2311 is provided on the correction rod 231, and the first rolling element 2311 is rotatably disposed on the rolling portion 1112. Specifically, in this embodiment, the correction assembly includes two correction rods 231, which are parallel and spaced apart. Both correction rods 231 are positioned as close as possible to the corner of the silicon wafer 3. This arrangement ensures a longer contact length between the correction assembly and the silicon wafer 3, thereby ensuring high reliability in correcting the position of the silicon wafer 3. Furthermore, in this embodiment, the height of the correction rod 231 needs to exceed the height of the topmost silicon wafer 3 on the sheet carrier 2, thereby ensuring that all silicon wafers 3 have a correction function and ensuring the consistency of the position of the silicon wafers 3.
[0052] Specifically, in this embodiment, the rolling part 1112 is disposed on the side of the guide part 1111 near the mounting plate 12, and the first rolling element 2311 is disposed on the straightening rod 231. The first rolling element 2311 is tumbling disposed in the rolling part 1112. This arrangement allows the first rolling element to be confined between the rolling part 1112 and the mounting plate 12, ensuring the rolling range of the first rolling element 2311 and avoiding jamming. It also transforms the sliding of the straightening rod 231 along the guide groove 111 into the rolling of the first rolling element 2311 along the rolling part 1112, thereby effectively reducing the friction force on the straightening rod 231, thereby improving the moving efficiency of the straightening rod 231 when performing silicon wafer 3 position correction, avoiding jamming, and helping to reduce the wear of the straightening rod 231, thereby improving the service life of the straightening device 1.
[0053] In this embodiment, the first rolling element 2311 is a bearing. In other embodiments, the first rolling element 2311 may also be a roller or the like, which will not be elaborated here.
[0054] Furthermore, such as Figure 4 and Figure 9 As shown, the mounting plate 12 has multiple rolling grooves 121, which correspond one-to-one with multiple guide grooves 111. The rolling grooves 121 and the rolling portions 1112 are connected. A second rolling element 2312 is provided on the straightening rod 231, and the second rolling element 2312 is rotatably disposed within the rolling groove 121. Specifically, in this embodiment, the rolling groove 121 on the mounting plate 12 is located on the side of the mounting plate 12 closest to the support plate 11, and the rolling groove 121 and the rolling portion 1112 are connected. The second rolling element 2312 on the straightening rod 231 is rotatably disposed within the rolling groove 121. This arrangement allows the straightening rod 231 to change from sliding along the mounting plate 12 to rolling, reducing mutual wear between the straightening rod 231 and the mounting plate 12, thereby improving its service life. Furthermore, the arrangement of the first rolling element 2311 and the second rolling element 2312 improves the force balance of the straightening rod 231, which helps ensure the verticality of the straightening rod 231, thereby ensuring the straightening effect of the silicon wafer 3.
[0055] Specifically, in this embodiment, as Figure 9 As shown, the rolling groove 121 is also stepped. The rolling groove 121 is connected to the outside through the abutment groove 122. The abutment groove 122 and the rolling groove 121 are connected by an abutment surface. The abutment surface can abut against the second rolling member 2312, thereby ensuring the rolling reliability of the second rolling member 2312 and thus ensuring the positional accuracy of the straightening rod 231.
[0056] In this embodiment, the second rolling element 2312 is a bearing. In other embodiments, the second rolling element 2312 may also be a roller or the like, which will not be elaborated here.
[0057] Furthermore, such as Figure 1 , Figures 3 to 6 As shown, the support structure 10 also includes a limiting plate 13, which is disposed between the mounting plate 12 and the support plate 11. The limiting plate 13 is provided with a plurality of limiting grooves 131, and the openings on both sides of the plurality of limiting grooves 131 are respectively connected to the rolling parts 1112 of the plurality of rolling grooves 121 and the plurality of guide grooves 111. Specifically, in this embodiment, the width of the limiting grooves 131 on the limiting plate 13 is matched with the diameter of the correction rod 231. The correction rod 231 can slide along the limiting grooves 131, and the two sides of the limiting plate 13 can abut against at least one of the first rolling member 2311 and the second rolling member 2312, thereby improving the rolling stability of the first rolling member 2311 and the second rolling member 2312, thereby improving the positional accuracy of the correction rod 231, and thus ensuring the positional correction effect of the silicon wafer 3.
[0058] Furthermore, such as Figure 5 and Figure 10 As shown, the reset mechanism includes a spring 22. Multiple springs 22 are arranged in a corresponding manner with multiple limiting grooves 131 and multiple correcting rods 231. One end of the spring 22 abuts against the groove wall of the limiting groove 131, and the other end of the spring 22 abuts against the correcting rod 231. The spring 22 is located on the side of the correcting rod 231 near the sheet carrier 2. Specifically, in this embodiment, the reset mechanism further includes a guide sleeve 2313, which is fixedly sleeved on the outer periphery of the correcting rod 231. The spring 22 seat of the guide sleeve 2313 points to the limiting groove 131. The spring 22 is sleeved on the spring 22 seat and is located in the limiting groove 131. When the driving mechanism drives the two correcting components to approach each other, the correcting rods 231 of the two correcting components compress the corresponding springs 22. When the drive motor 211 rotates in the opposite direction, the spring 22 rebounds and can provide pressure to the correcting rod 231, thereby resetting the correcting components for the next use. The spring 22 can also provide a certain elastic force to the correcting rod 231, thereby preventing the correcting rod 231 from providing excessive force to the silicon wafer 3, thus preventing damage to the silicon wafer 3 due to excessive force and ensuring the quality of the silicon wafer 3.
[0059] Specifically, in this embodiment, please refer to Figure 2 The sheet carrier 2 is a flower basket. In order to facilitate the position correction of the silicon wafer 3 in the flower basket, an opening slot 202 corresponding to the guide slot 111 needs to be provided on the bottom plate 201 of the flower basket. When the correction mechanism 20 approaches the silicon wafer 3 under the drive of the drive component, the correction rod 231 can enter the opening slot 202 and then abut against the silicon wafer 3 to achieve the purpose of adjusting the position of the silicon wafer 3.
[0060] The following is based on Figures 1 to 10The usage process of the correction device 1 in this embodiment will be described in detail. First, the wafer carrier 2 containing the silicon wafer 3 is placed on the support plate 11 of the support structure 10, ensuring that all guide grooves 111 on the support plate 11 correspond one-to-one with all opening grooves 202 on the wafer carrier 2. Then, two drive motors 211 are started simultaneously. The rotation of the two drive motors 211 causes the transmission rods formed by two sets of left-hand lead screws 212 and right-hand lead screws 213 to rotate synchronously. The two abutting structures 214 on the transmission rods formed by the left-hand lead screws 212 and right-hand lead screws 213 move closer to each other. Since the abutting structures 214 abut against the side of the straightening component away from the wafer carrier 2, the two abutting structures 214 move closer to each other, causing the two straightening components to move closer to each other as well. The straightening rod 231 compresses the corresponding spring 22, causing the spring 22 to be compressed until the two straightening components abut against both sides of the silicon wafer 3 respectively. At the same time, the two abutting structures 214 on the transmission rods of the other set of left-hand lead screws 212 and right-hand lead screws 213 also move closer to each other. The two abutting structures 214 approach each other, and because the abutting structure 214 abuts against the side of the straightening component away from the sheet carrier 2, the two abutting structures 214 approach each other, causing the two straightening components to also approach each other, until the other two straightening components abut against the other two sides of the silicon wafer 3 respectively. Then, the two drive motors 211 rotate in opposite directions, and the two abutting structures 214 on the same transmission rod formed by the left-hand lead screw 212 and the right-hand lead screw 213 move away from each other. The spring 22 rebounds and provides elastic force to the straightening rod 231, thereby causing the two oppositely arranged straightening components to reset. The two abutting structures 214 on the other transmission rod formed by the left-hand lead screw 212 and the right-hand lead screw 213 also move away from each other. The spring 22 rebounds and provides elastic force to the straightening rod 231, thereby causing the other two oppositely arranged straightening components to reset as well. Then, the two drive motors 211 are turned off, and the sheet carrier 2, which has completed the adjustment of the silicon wafer 3 position, is removed, thus completing the position adjustment of the silicon wafer 3.
[0061] Obviously, the above embodiments of this utility model are merely examples for clearly illustrating the present utility model, and are not intended to limit the implementation of the present utility model. Those skilled in the art can make various obvious changes, readjustments, and substitutions without departing from the protection scope of this utility model. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of the claims of this utility model.
Claims
1. A correction device, characterized in that, The corrective device includes: A support structure for placing a sheet carrier; Four straightening components, two of which are spaced apart along a first direction on the support structure for correcting the position of the silicon wafers in the sheet carrier in the first direction, and the other two of which are spaced apart along a second direction on the support structure for correcting the position of the silicon wafers in the sheet carrier in the second direction, wherein the first direction and the second direction are angled together. A driving mechanism is provided, which is connected to all four correction components. The driving mechanism is capable of driving two correction components that are spaced apart along the first direction to move closer to each other, and is also capable of driving two correction components that are spaced apart along the second direction to move closer to each other. A reset mechanism that enables the four correction components to be reset.
2. The corrective device according to claim 1, characterized in that, The drive mechanism is provided in two parts. One drive mechanism is drivenly connected to two correction components that are spaced apart along a first direction, and the other drive mechanism is drivenly connected to two correction components that are spaced apart along a second direction.
3. The corrective device according to claim 2, characterized in that, The driving mechanism includes a driving component and two transmission components, wherein the driving component is connected to the two correction components respectively through the two transmission components.
4. The corrective device according to claim 3, characterized in that, The transmission assembly includes a left-hand lead screw, a right-hand lead screw, and two abutment structures. The left-hand lead screw and the right-hand lead screw are connected by a coupling. The left-hand lead screw is connected to the drive member. One abutment structure is threadedly connected to the left-hand lead screw, and the other abutment structure is threadedly connected to the right-hand lead screw. The abutment structure threadedly connected to the left-hand lead screw and the abutment structure threadedly connected to the right-hand lead screw respectively abut against the ends of the straightening assembly located on both sides of the sheet carrier, away from the sheet carrier.
5. The corrective device according to claim 4, characterized in that, The transmission assembly further includes two guide structures, which are configured to cooperate with the two abutment structures so that the abutment structures can move along the first direction or the second direction.
6. The corrective device according to any one of claims 1-5, characterized in that, The support structure includes a support plate and a mounting plate, which are arranged in parallel. The drive mechanism is mounted on the mounting plate. The support plate is provided with a plurality of guide grooves, which are used to cooperate with the correction component.
7. The corrective device according to claim 6, characterized in that, The correction assembly includes at least two correction rods, the guide groove includes a guide portion and a rolling portion, the guide portion and the rolling portion are arranged in a stepped manner, and a first rolling element is provided on the correction rod, the first rolling element being rotatably disposed on the rolling portion.
8. The corrective device according to claim 7, characterized in that, The mounting plate has multiple rolling grooves, and the multiple rolling grooves are arranged one-to-one with the multiple guide grooves. The rolling grooves are connected to the rolling parts. The straightening rod is provided with a second rolling element, which is rolled in the rolling groove.
9. The corrective device according to claim 8, characterized in that, The support structure also includes a limiting plate, which is disposed between the mounting plate and the support plate. The limiting plate is provided with multiple limiting grooves, and the openings on both sides of the multiple limiting grooves are respectively connected to the rolling parts of the multiple rolling grooves and the multiple guide grooves.
10. The corrective device according to claim 9, characterized in that, The reset mechanism includes a spring, and a plurality of springs are arranged in a one-to-one correspondence with a plurality of limiting grooves and a plurality of correcting rods. One end of the spring abuts against the groove wall of the limiting groove, and the other end of the spring abuts against the correcting rod. The spring is located on the side of the correcting rod close to the sheet carrier.