Film coating clamp suitable for various chip sizes
By improving the coating fixture structure, and utilizing a motor-driven bidirectional lead screw and damper in conjunction with a spring, the problems of easy chip damage and difficulty in controlling clamping force are solved, achieving stable clamping and efficient production of multiple chip sizes.
Patent Information
- Application Number
- CN202520123158.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-01-27
- Estimated Expiration
- 2035-01-20
AI Technical Summary
Existing chip coating fixtures have simple structures, making the chips susceptible to damage from external impacts or vibrations. The clamping force is difficult to control, resulting in low production efficiency.
The clamping structure consists of components such as a mounting base plate, support plate, bidirectional lead screw, adjusting plate, damper, clamping plate, spring, and motor. The motor drives the bidirectional lead screw to rotate and adjust the clamping plate. Combined with the damper and spring, it provides a stable clamping force and is suitable for various chip sizes.
It achieves stable clamping of chips of different specifications, avoids excessive or insufficient clamping force, improves production efficiency and processing quality, and reduces additional adjustment and calibration steps.
Smart Images
Figure CN223844265U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of chip coating fixture technology, and in particular to a coating fixture suitable for various chip sizes. Background Technology
[0002] Chip coating fixtures are tools used in semiconductor manufacturing and packaging processes, especially during chip surface coating operations such as applying protective films and photoresists, to ensure a flat, stable, and precisely positioned chip surface. They are commonly used in chip protection, processing, film application, and assembly steps to prevent bubbles, cracks, or other defects in the film layer, maintaining high precision and consistency of the chip. The coating fixture ensures the chip is stably fixed in the appropriate position during the coating process, precisely holding the chip surface and preventing uneven or incorrect film coating. The coating fixture helps maintain the chip in a horizontal or vertical position, allowing the film material to be evenly covered on the chip surface. It avoids uneven coating caused by chip tilting or displacement, thus ensuring the quality of the film layer.
[0003] However, the existing fixtures have simple structures, and the chips are subject to external impacts or vibrations during use. The chips are easily subjected to direct impacts, which can cause cracks, breaks or other physical damage to their surfaces. In addition, the chip clamping force is not easy to control during the clamping process. If the clamping force is too high, the chip is easily damaged, and if the clamping force is too low, the chip is easily dropped. Additional adjustments and corrections are required during the assembly process, which leads to a longer production cycle and reduces the overall production efficiency. Utility Model Content
[0004] The purpose of this invention is to solve the technical problems of existing fixtures, which have simple structures, are subject to external impacts or vibrations during use, and are prone to direct impacts that cause cracks, breaks or other physical damage to their surfaces. In addition, the clamping force is difficult to control during the clamping process. If the clamping force is too high, the chip is easily damaged, and if the clamping force is too low, the chip is easily dropped. Additional adjustments and corrections are required during assembly, which leads to a longer production cycle and reduces the overall production efficiency. Therefore, this invention proposes a coating fixture suitable for various chip sizes.
[0005] To achieve the above objectives, the present invention adopts the following technical solution: a coating fixture suitable for various chip sizes, comprising a mounting substrate, two support plates fixedly connected to the upper surface near both ends of the mounting substrate, a bidirectional lead screw rotatably connected to the opposing surfaces of the two support plates via bearings, two adjusting plates threadedly connected to the outer surfaces near both ends of the bidirectional lead screw, a damper fixedly connected to one side surface of each of the two adjusting plates, a clamping plate fixedly connected to one end of each of the two dampers, a spring fixedly connected to one side surface of each of the two clamping plates, and a motor fixedly connected to one side surface of one of the support plates.
[0006] Furthermore, the outer surfaces of the two dampers are threaded with adjusting members, which are nut-shaped.
[0007] Furthermore, the outer surface of the damper is embedded inside the two springs.
[0008] Furthermore, one end of each of the two springs is fixedly connected to a bidirectional bearing, and one side surface of each of the two bidirectional bearings is fixedly connected to the outer surface of the two adjusting members.
[0009] Furthermore, a limiting groove is formed on the upper surface of the mounting base plate, and two limiting sliders are embedded inside the limiting groove. The upper surfaces of the two limiting sliders are fixedly connected to the lower surfaces of the two adjusting plates.
[0010] Furthermore, rubber pads are fixedly connected to the opposing surfaces of both clamps.
[0011] Compared with the prior art, the advantages and positive effects of this utility model are as follows:
[0012] 1. In this utility model, during use, the chip is placed horizontally between two clamping plates. The output end of the motor drives the bidirectional lead screw to rotate, bringing the two adjusting plates closer together. The opposing surfaces of the two clamping plates are in contact with the outer surface of the chip. The bidirectional lead screw continues to rotate, causing the two adjusting plates to compress the springs and dampers. The two dampers and springs are synchronously compressed to a specified stroke, absorbing kinetic energy and providing a stable clamping force for the chip. This avoids excessively high or low clamping force, ensuring the clamping effect and preventing damage to the chip due to excessive clamping force or chip detachment due to insufficient clamping force. It is applicable to chips of different specifications without additional adjustment or calibration, ensuring product processing efficiency and quality.
[0013] 2. In this utility model, the adjusting component is rotated using a professional tool wrench, causing the adjusting component to compress the spring through a double-sided bearing. The stroke of the spring is adjusted according to the chip size. The double-sided bearing avoids friction between the spring and the adjusting component, preventing wear of the components and ensuring their service life. The damper provides support when the spring is subjected to lateral force, preventing the spring from bending and deforming, and ensuring the normal operation of the components. When the two adjusting plates move, the two limiting sliders slide synchronously inside the limiting groove, limiting the movement trajectory of the two adjusting plates, preventing the two adjusting plates from shaking, and ensuring the accuracy of clamping. The two rubber pads deform under force when clamping the chip, forming grooves to increase friction and prevent the chip from sliding displacement after being subjected to force. Attached Figure Description
[0014] Figure 1 A three-dimensional structural schematic diagram of a coating fixture suitable for various chip sizes provided by this utility model;
[0015] Figure 2 A three-dimensional structural diagram of a coating fixture adjustment plate suitable for various chip sizes provided by this utility model;
[0016] Figure 3 A three-dimensional structural diagram of a coating clamp damper suitable for various chip sizes provided by this utility model;
[0017] Figure 4 This is a three-dimensional structural diagram of a coating fixture limiting groove suitable for various chip sizes, provided by this utility model.
[0018] Legend: 1. Mounting base plate; 2. Support plate; 3. Two-way lead screw; 4. Adjusting plate; 5. Limiting groove; 6. Limiting slider; 7. Spring; 8. Two-way bearing; 9. Adjusting component; 10. Clamping plate; 11. Rubber pad; 12. Motor; 13. Damper. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0020] Example 1
[0021] like Figure 1-4 As shown, the present invention provides a technical solution: a coating fixture suitable for various chip sizes, including a mounting substrate 1, two support plates 2 fixedly connected to the upper surface near both ends of the mounting substrate 1, a bidirectional lead screw 3 rotatably connected to the opposite surface of the two support plates 2 via bearings, two adjusting plates 4 threadedly connected to the outer surface near both ends of the bidirectional lead screw 3, a damper 13 fixedly connected to one side surface of each of the two adjusting plates 4, a clamping plate 10 fixedly connected to one end of each of the two dampers 13, a spring 7 fixedly connected to one side surface of each of the two clamping plates 10, and a motor 12 fixedly connected to one side surface of one of the support plates 2.
[0022] In this embodiment, during use, the chip is placed horizontally between the two clamping plates 10. The output end of the motor 12 drives the bidirectional lead screw 3 to rotate, causing the two adjusting plates 4 to move closer to each other. The opposing surfaces of the two clamping plates 10 are in contact with the outer surface of the chip. The bidirectional lead screw 3 continues to rotate, causing the two adjusting plates 4 to compress the spring 7 and the damper 13. The two dampers 13 and the spring 7 are synchronously compressed to a specified stroke, absorbing kinetic energy and providing a stable clamping force for the chip. This avoids excessively high or low clamping force, ensuring the clamping effect and preventing damage to the chip due to excessively high clamping force or chip detachment due to excessively low clamping force. No additional adjustment or correction is required, making it suitable for chips of different specifications and ensuring product processing efficiency and quality.
[0023] Example 2
[0024] like Figure 1-4 As shown, the outer surfaces of the two dampers 13 are threaded with adjusting members 9, which are nut-shaped. The outer surfaces of the dampers 13 are embedded in the interiors of the two springs 7. One end of each of the two springs 7 is fixedly connected to a double-bearing 8. One side surface of each of the two double-bearing 8 is fixedly connected to the outer surface of the two adjusting members 9. A limiting groove 5 is formed on the upper surface of the mounting base plate 1. Two limiting sliders 6 are embedded inside the limiting groove 5. The upper surfaces of the two limiting sliders 6 are fixedly connected to the lower surfaces of the two adjusting plates 4. Rubber pads 11 are fixedly connected to the opposite surfaces of the two clamping plates 10.
[0025] In this embodiment, the adjusting component 9 is rotated using a professional tool wrench, causing it to compress the spring 7 via the bidirectional bearing 8. The stroke of the spring 7 is adjusted according to the chip size. The bidirectional bearing 8 prevents friction between the spring 7 and the adjusting component 9, thus preventing wear and ensuring the service life of the components. The damper 13 provides support when the spring 7 is subjected to lateral force, preventing the spring 7 from bending and deforming, and ensuring the normal operation of the components. When the two adjusting plates 4 move, the two limiting sliders 6 slide synchronously inside the limiting groove 5, limiting the movement trajectory of the two adjusting plates 4, preventing the two adjusting plates 4 from shaking, and ensuring the accuracy during clamping. The two rubber pads 11 deform under force when clamping the chip, forming grooves to increase friction and prevent the chip from sliding after being subjected to force.
[0026] Working principle: such as Figure 1-4As shown, in use, the chip is placed horizontally between the two clamping plates 10. The output end of the motor 12 drives the bidirectional lead screw 3 to rotate, bringing the two adjusting plates 4 closer together. The opposing surfaces of the two clamping plates 10 are in contact with the outer surface of the chip. The bidirectional lead screw 3 continues to rotate, causing the two adjusting plates 4 to compress the spring 7 and the damper 13. The two dampers 13 and the spring 7 are synchronously compressed to a specified stroke, absorbing kinetic energy. The adjusting component 9 is rotated using a professional tool wrench, causing the adjusting component 9 to compress the spring 7 through the bidirectional bearing 8. The stroke of the spring 7 is adjusted according to the chip size. The bidirectional bearing 8 prevents friction between the spring 7 and the adjusting component 9, preventing wear of the parts. The damper 13 provides support when the spring 7 is subjected to lateral force, preventing the spring 7 from bending and deforming. When the two adjusting plates 4 move, the two limiting sliders 6 slide synchronously inside the limiting groove 5, limiting the movement trajectory of the two adjusting plates 4. The two rubber pads 11 deform under force when clamping the chip, forming grooves.
[0027] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the present utility model.
Claims
1. A coating fixture suitable for various chip sizes, comprising a mounting substrate (1), characterized in that: Two support plates (2) are fixedly connected to the upper surface of the mounting base (1) near both ends. The opposing surfaces of the two support plates (2) are rotatably connected to a bidirectional lead screw (3) via bearings. Two adjusting plates (4) are threadedly connected to the outer surface of the bidirectional lead screw (3) near both ends. A damper (13) is fixedly connected to one side surface of each of the two adjusting plates (4). A clamping plate (10) is fixedly connected to one end of each of the two dampers (13). A spring (7) is fixedly connected to one side surface of each of the two clamping plates (10). A motor (12) is fixedly connected to one side surface of one of the support plates (2).
2. The coating fixture suitable for various chip sizes according to claim 1, characterized in that: The outer surfaces of the two dampers (13) are threaded with adjusting members (9), which are nut-shaped.
3. A coating fixture suitable for various chip sizes according to claim 2, characterized in that: The outer surface of the damper (13) is embedded inside the two springs (7).
4. A coating fixture suitable for various chip sizes according to claim 3, characterized in that: One end of each of the two springs (7) is fixedly connected to a bidirectional bearing (8), and one side surface of each of the two bidirectional bearings (8) is fixedly connected to the outer surface of the two adjusting members (9).
5. A coating fixture suitable for various chip sizes according to claim 1, characterized in that: The upper surface of the mounting base plate (1) is provided with a limiting groove (5), and two limiting sliders (6) are embedded inside the limiting groove (5). The upper surfaces of the two limiting sliders (6) are fixedly connected to the lower surfaces of the two adjusting plates (4).
6. A coating fixture suitable for various chip sizes according to claim 1, characterized in that: Rubber pads (11) are fixedly connected to the opposing surfaces of the two clamps (10).