Electromagnetic shielding protection device of shielding type high-voltage integrated circuit

Abstract

The utility model discloses an electromagnetic shielding protection device of a shielding type high-voltage integrated circuit, which comprises a shielding shell, the shielding shell comprises a conductive metal base and a conductive metal shell, the conductive metal shell is detachably arranged on the conductive metal base, a heat dissipation assembly is arranged at the top of the conductive metal shell, and the heat dissipation assembly comprises a heat pipe. The evaporation section of the heat pipe is arranged in the conductive metal shell, and the condensation section of the heat pipe penetrates through the conductive metal shell in a sealed mode and then is arranged outside the conductive metal shell. According to the utility model, the high-voltage integrated circuit is sealed and protected through the closed shielding shell, and moisture and dust are effectively prevented from entering the shielding shell, so that the high-voltage integrated circuit can adapt to complex and severe environmental conditions such as moisture and dustiness.

Description

Technical Field

[0001] This utility model relates to the field of high voltage integrated circuit protection technology, and in particular to an electromagnetic shielding protection device for shielded high voltage integrated circuits. Background Technology

[0002] With the continuous development of electronic technology, high-voltage integrated circuits have been widely used in many fields such as power systems and communication equipment. However, high-voltage integrated circuits generate strong electromagnetic interference during operation and are also susceptible to the influence of the external electromagnetic environment. This not only affects the performance and stability of the integrated circuit itself, but may also interfere with other surrounding electronic equipment.

[0003] Chinese utility model patent with announcement number CN217241245U discloses an electromagnetic shielding device, including a panel, a support frame, a first shielding mesh plate and a second shielding mesh plate; the panel is provided with a first through groove, which penetrates the panel along the thickness direction of the panel; the support frame is a hollow column, and one free end of the support frame is fixedly connected to the panel; the first shielding mesh plate is fixed inside the panel; and the second shielding mesh plate is fixed inside the other free end of the support frame.

[0004] The aforementioned electromagnetic shielding device can effectively shield electromagnetic waves without affecting the normal structure and use of communication equipment.

[0005] However, shortcomings still exist in practical use, the most prominent being poor waterproof and dustproof performance. In real-world applications, electronic devices often face various complex environmental conditions, such as humid climates and dusty industrial environments. Due to the lack of adequate waterproof and dustproof capabilities, the aforementioned devices allow moisture and dust to easily penetrate, affecting not only the performance of the shielding mesh and reducing its shielding effectiveness, but also damaging other electronic components within the device. This significantly shortens the device's lifespan and increases maintenance costs and the risk of failure. Utility Model Content

[0006] The purpose of this invention is to provide an electromagnetic shielding protection device for shielded high-voltage integrated circuits, so as to solve the technical problems of low protection performance, affecting performance and short service life of high-voltage integrated circuits.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] An electromagnetic shielding protection device for a shielded high-voltage integrated circuit includes a shielding housing for electromagnetic shielding the high-voltage integrated circuit. The shielding housing includes a conductive metal base and a conductive metal outer shell. The conductive metal outer shell is detachably mounted on the conductive metal base. A heat dissipation component is provided on the top of the conductive metal outer shell for dissipating heat from the inside of the conductive metal outer shell.

[0009] The heat dissipation component includes a heat pipe, with the evaporation section of the heat pipe located inside the conductive metal casing and the condensation section of the heat pipe sealed through the conductive metal casing and located outside the conductive metal casing.

[0010] A heat exchange cover is fixedly connected to the top of the conductive metal shell. A semiconductor refrigeration chip is fixedly embedded in the heat exchange cover. The cooling surface of the semiconductor refrigeration chip is located inside the heat exchange cover, the heating surface of the semiconductor refrigeration chip is located outside the heat exchange cover, and the condensation section of the heat pipe is located inside the heat exchange cover.

[0011] As a further embodiment of this utility model, a first heat sink is fixedly connected to the inner top of the conductive metal shell, the evaporation section of the heat pipe is connected to the first heat sink, a second heat sink is fixedly installed inside the heat exchange cover, the lower end of the second heat sink is connected to the condensation section of the heat pipe, and the top of the second heat sink is in contact with the cooling surface of the semiconductor refrigeration chip.

[0012] As a further embodiment of this utility model, a first fan is fixedly installed at the bottom of the first heat sink.

[0013] As a further embodiment of this utility model, a third heat sink is fixedly installed on the top of the heat exchange cover, and a thermally conductive silicone grease layer is filled between the bottom of the third heat sink and the heating surface of the semiconductor cooling chip.

[0014] As a further embodiment of this invention, a second fan is fixedly mounted on the top of the third heat sink.

[0015] As a further embodiment of this utility model, a magnetic conductive layer is fixedly connected to the inner wall of the conductive metal shell, a silicon-based absorbing layer is fixedly connected to the inner wall of the magnetic conductive layer, and an insulating shielding coating is sprayed onto the inner wall of the silicon-based absorbing layer.

[0016] As a further embodiment of this utility model, the bottom of the conductive metal shell is provided with a flange, which is fixedly mounted on the conductive metal base by bolts.

[0017] As a further embodiment of this utility model, an annular sealing groove is provided at the bottom of the flange, and a conductive sealing ring is provided inside the annular sealing groove.

[0018] Compared with existing technologies, the electromagnetic shielding protection device for shielded high-voltage integrated circuits provided by this utility model has the following beneficial effects:

[0019] This utility model can seal and protect high-voltage integrated circuits by setting a sealed shielding shell, effectively preventing moisture and dust from entering the interior of the shielding shell, so that it can adapt to complex and harsh environmental conditions such as humid and dusty conditions.

[0020] The heat dissipation component can quickly exchange heat inside the conductive metal casing, ensuring that the high-voltage integrated circuit can operate continuously and stably.

[0021] The composite shielding structure achieves broadband electromagnetic protection and improves the performance of electromagnetic shielding. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only examples of embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model;

[0024] Figure 2 This is a partial cross-sectional view of an embodiment of the present utility model;

[0025] Figure 3 for Figure 2 A magnified structural diagram of part A in the diagram;

[0026] Figure 4 This is a partial exploded structural diagram of an embodiment of the present invention.

[0027] Figure label:

[0028] 1. Conductive metal base; 2. Conductive metal shell; 201. Cable connector; 202. Electromagnetic sealing sleeve; 203. Flanged edge; 2031. Bolt; 204. Annular sealing groove; 2001. Magnetic conductive layer; 2002. Silicon-based wave-absorbing layer; 2003. Insulating shielding coating; 3. Heat dissipation assembly; 301. Heat pipe; 302. First heat sink; 303. First fan; 304. Heat exchange cover; 305. Semiconductor cooling chip; 306. Second heat sink; 307. Third heat sink; 308. Second fan. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only for explaining the present invention and are not intended to limit the present invention.

[0030] In the description of the embodiments of the present invention, it should be understood that the terms "upper", "lower", "front", "rear", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of the present invention.

[0031] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation", "connection" and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an integral connection, or a detachable connection; they can refer to the internal connection of two components; they can refer to a direct connection or an indirect connection through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present invention should be understood according to the specific circumstances.

[0032] See Figures 1 to 4 As shown in the figure, an electromagnetic shielding protection device for a shielded high-voltage integrated circuit according to an embodiment of the present invention includes a shielding shell for electromagnetic shielding the high-voltage integrated circuit. The shielding shell includes a conductive metal base 1 and a conductive metal outer shell 2. The bottom of the conductive metal outer shell 2 is provided with a flange 203. The flange 203 is fixedly installed on the conductive metal base 1 by bolts 2031. In order to ensure the shielding effect and sealing performance, an annular sealing groove 204 is provided at the bottom of the flange 203. A conductive sealing ring is provided in the annular sealing groove 204. The top of the conductive metal outer shell 2 is provided with a heat dissipation component 3 for dissipating heat from the inside of the conductive metal outer shell 2.

[0033] The heat dissipation assembly 3 includes a heat pipe 301. The evaporation section of the heat pipe 301 is located inside the conductive metal shell 2, and the condensation section of the heat pipe 301 is sealed through the conductive metal shell 2 and located outside the conductive metal shell 2.

[0034] A heat exchange cover 304 is fixedly connected to the top of the conductive metal shell 2. A semiconductor cooling chip 305 is fixedly embedded in the heat exchange cover 304. The cooling surface of the semiconductor cooling chip 305 is located inside the heat exchange cover 304, and the heating surface of the semiconductor cooling chip 305 is located outside the heat exchange cover 304. The condensing section of the heat pipe 301 is located inside the heat exchange cover 304.

[0035] In this embodiment of the present invention, a first heat sink 302 is fixedly connected to the inner top of the conductive metal shell 2, the evaporation section of the heat pipe 301 is connected to the first heat sink 302, and a second heat sink 306 is fixedly installed inside the heat exchange cover 304. The lower end of the second heat sink 306 is connected to the condensation section of the heat pipe 301, and the top of the second heat sink 306 is in contact with the cooling surface of the semiconductor cooling chip 305. The first heat sink 302 can effectively increase the contact area with the air inside the conductive metal shell 2, and the second heat sink 306 can quickly diffuse the cold energy generated by the semiconductor cooling chip 305 to the condensation section of the heat pipe 301, thereby effectively improving the heat exchange efficiency.

[0036] A first fan 303 is fixedly installed at the bottom of the first heat sink 302, which can accelerate the airflow inside the conductive metal casing 2, thereby further improving the heat exchange effect.

[0037] A third heat sink 307 is fixedly installed on the top of the heat exchange cover 304. A thermally conductive silicone grease layer is filled between the bottom of the third heat sink 307 and the heating surface of the semiconductor cooling chip 305, which can improve the heat dissipation effect on the heating surface of the semiconductor cooling chip 305.

[0038] To further improve the heat dissipation efficiency of the heat pipe 301 heating surface, a second fan 308 is fixedly installed on the top of the third heat sink 307.

[0039] In this embodiment of the invention, a magnetically conductive layer 2001 is fixedly connected to the inner wall of the conductive metal shell 2, and a silicon-based absorbing layer 2002 is fixedly connected to the inner wall of the magnetically conductive layer 2001. An insulating shielding coating 2003 is sprayed onto the inner wall of the silicon-based absorbing layer 2002. The conductive metal shell 2 is made of aluminum alloy, which can reflect high-frequency electromagnetic waves greater than 100MHz. The magnetically conductive layer 2001 is made of iron-nickel alloy, which can absorb low-frequency magnetic fields below 10MHz. The silicon-based absorbing layer 2002 is made of silicon carbide-based absorbing material, which is used to reduce interlayer electromagnetic resonance and suppress the generation of standing waves. The insulating shielding coating 2003 is made of ceramic-based composite coating, which can suppress common-mode current conduction and block high-frequency electric field coupling paths.

[0040] A cable connector 201 is provided on one side of the conductive metal casing 2, and an electromagnetic sealing sleeve 202 is fitted on the cable connector 201 to realize the connection between the high-voltage integrated circuit and external equipment and effectively shield electromagnetic interference.

[0041] This invention relates to a method for use in seawater where a high-voltage integrated circuit is fixed on a mounting base of a conductive metal base 1. The terminals of the high-voltage integrated circuit are connected to one end of a cable connector 201. The conductive metal housing 2 is fixed to the conductive metal base 1 by bolts 2031. External devices are connected to the other end of the cable connector 201 via wires.

[0042] During operation, the high-voltage integrated circuit generates heat, which raises the air temperature inside the conductive metal casing 2. The first heat sink 302 is fixed to the inner top of the conductive metal casing 2. It has a large surface area, which can effectively increase the contact area with the hot air inside the conductive metal casing 2 and quickly absorb the heat in the hot air. The evaporation section of the heat pipe 301 is connected to the first heat sink 302. When the first heat sink 302 absorbs heat, the heat will be transferred to the evaporation section of the heat pipe 301. After the working medium inside the heat pipe absorbs heat in the evaporation section, it undergoes a phase change from liquid to gas. The vapor flows rapidly to the condensation section under the action of the pressure difference inside the heat pipe.

[0043] The condensing section of the heat pipe 301 is sealed and passes through the conductive metal outer shell 2 and is located inside the heat exchange cover 304. A semiconductor cooling chip 305 is fixedly embedded on the heat exchange cover 304, with its cooling surface located inside the heat exchange cover 304 and its heating surface located outside. When the semiconductor cooling chip 305 is energized, it will generate a cooling effect, and the temperature of the cooling surface will decrease. The lower end of the second heat sink 306 inside the heat exchange cover 304 is connected to the condensing section of the heat pipe 301, and the top is in contact with the cooling surface of the semiconductor cooling chip 305. The cold energy generated by the semiconductor cooling chip 305 is rapidly diffused to the condensing section of the heat pipe 301 through the second heat sink 306, causing the vapor in the heat pipe 301 to release heat in the condensing section and then re-condense into a liquid state. Then, under the action of gravity or capillary force, it flows back to the evaporation section, forming a cycle. In this way, through the coordinated work of the heat pipe 301 and the semiconductor cooling chip 305, the heat inside the conductive metal outer shell 2 is efficiently transferred to the outside.

[0044] The first fan 303, fixedly mounted at the bottom of the first heat sink 302, accelerates the airflow inside the conductive metal casing 2, allowing hot air to contact the first heat sink 302 more quickly, improving the heat exchange effect and transferring the heat generated by the high-voltage integrated circuit to the heat pipe 301 more quickly. The bottom of the third heat sink 307 on the top of the heat exchange cover 304 is filled with a layer of thermally conductive silicone grease between it and the heating surface of the thermoelectric cooler 305, which can improve the heat transfer efficiency. The second fan 308, fixedly mounted on the top of the third heat sink 307, accelerates the airflow around the heating surface of the thermoelectric cooler 305, quickly dissipating the heat generated by the heating surface of the thermoelectric cooler 305, ensuring that the thermoelectric cooler 305 can work continuously and stably, and further improving the efficiency of the entire heat dissipation system.

[0045] The foregoing has shown and described the basic principles of the present invention. The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. The above embodiments and descriptions in the specification are only illustrative of the principles of the present invention. Any modifications, equivalent substitutions, and improvements made within the scope of the present invention without departing from the scope of the present invention should be included within the protection scope of the present invention.

Claims

1. An electromagnetic shielding protection device for a shielded high-voltage integrated circuit, characterized in that: The shielding housing includes a shielding shell for electromagnetic shielding of high voltage integrated circuits. The shielding shell includes a conductive metal base (1) and a conductive metal shell (2). The conductive metal shell (2) is detachably mounted on the conductive metal base (1). A heat dissipation component (3) is provided on the top of the conductive metal shell (2) for dissipating heat inside the conductive metal shell (2). The heat dissipation assembly (3) includes a heat pipe (301), the evaporation section of the heat pipe (301) is disposed inside the conductive metal shell (2), and the condensation section of the heat pipe (301) is sealed through the conductive metal shell (2) and disposed outside the conductive metal shell (2). A heat exchange cover (304) is fixedly connected to the top of the conductive metal shell (2). A semiconductor refrigeration chip (305) is fixedly embedded on the heat exchange cover (304). The cooling surface of the semiconductor refrigeration chip (305) is located inside the heat exchange cover (304), and the heating surface of the semiconductor refrigeration chip (305) is located outside the heat exchange cover (304). The condensation section of the heat pipe (301) is located inside the heat exchange cover (304).

2. The electromagnetic shielding protection device for a shielded high-voltage integrated circuit according to claim 1, characterized in that: The conductive metal shell (2) is fixedly connected to the inner top of a first heat sink (302), the evaporation section of the heat pipe (301) is connected to the first heat sink (302), the heat exchange cover (304) is fixedly installed with a second heat sink (306), the lower end of the second heat sink (306) is connected to the condensation section of the heat pipe (301), and the top of the second heat sink (306) is in contact with the cooling surface of the semiconductor refrigeration chip (305).

3. The electromagnetic shielding protection device for a shielded high-voltage integrated circuit according to claim 2, characterized in that: A first fan (303) is fixedly installed at the bottom of the first heat sink (302).

4. The electromagnetic shielding protection device for a shielded high-voltage integrated circuit according to claim 3, characterized in that: A third heat sink (307) is fixedly installed on the top of the heat exchange cover (304), and a thermally conductive silicone grease layer is filled between the bottom of the third heat sink (307) and the heating surface of the semiconductor cooling chip (305).

5. The electromagnetic shielding protection device for a shielded high-voltage integrated circuit according to claim 4, characterized in that: The second fan (308) is fixedly installed on the top of the third heat sink (307).

6. The electromagnetic shielding protection device for a shielded high-voltage integrated circuit according to claim 5, characterized in that: The inner wall of the conductive metal shell (2) is fixedly connected to a magnetic layer (2001), the inner wall of the magnetic layer (2001) is fixedly connected to a silicon-based absorbing layer (2002), and the inner wall of the silicon-based absorbing layer (2002) is sprayed with an insulating shielding coating (2003).

7. The electromagnetic shielding protection device for a shielded high-voltage integrated circuit according to claim 6, characterized in that: The bottom of the conductive metal shell (2) is provided with a flange (203), and the flange (203) is fixedly installed on the conductive metal base (1) by bolts (2031).

8. The electromagnetic shielding protection device for a shielded high-voltage integrated circuit according to claim 7, characterized in that: The bottom of the flange (203) is provided with an annular sealing groove (204), and a conductive sealing ring is provided in the annular sealing groove (204).

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