Non-contact intelligent card carrier tape, non-contact intelligent card module and intelligent equipment

Abstract

The utility model discloses a non-contact intelligent card carrier tape, an intelligent card module and intelligent equipment. The non-contact intelligent card carrier band comprises a patch area and an antenna area. A bearing surface for bearing a chip is arranged on the surface of one side of the chip mounting area; the antenna area and the patch area are arranged side by side, and the antenna area is connected with the patch area; wherein an overflowing space is arranged between one end, close to the antenna area, of the patch area and the antenna area, a first bending part is arranged at one end, close to the antenna area, of the patch area, and the first bending part is arranged to bend and protrude towards one side where the bearing surface is located. According to the non-contact intelligent card carrier tape provided by the embodiment of the invention, the first bending part is arranged at one end, close to the antenna area, of the patch area, so that the first bending part can also be embedded into the packaging body after packaging is completed. Thus, the packaging body and the carrier tape form a mutually embedded structure, the connection strength of the patch area and the packaging body is increased, the strength of a non-contact intelligent card mold after packaging is completed can be effectively improved, and the risk of abnormal problems such as bending and deformation is reduced.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit packaging technology, and more specifically, to a contactless smart card carrier, a contactless smart card module, and a smart device. Background Technology

[0002] Currently, the trend in contactless smart card packaging technology is that the thickness is gradually decreasing, from 400μm to 250μm. Correspondingly, the thickness of the contactless smart card carrier tape has also decreased from 85μm to about 65μm. However, the decrease in thickness has led to insufficient strength of the carrier tape, which may result in abnormal phenomena such as bending and deformation. Utility Model Content

[0003] The technical problem to be solved by this application is to provide a contactless smart card carrier, a smart card module and a smart device, which can reduce the risk of abnormal problems such as bending and deformation caused by insufficient strength of the contactless smart card carrier.

[0004] This application provides a contactless smart card carrier tape, including: a patch area and an antenna area; one side surface of the patch area is provided with a carrier surface for carrying a chip; the antenna area is arranged side by side with the patch area and connected to the patch area; wherein, a current-passing space is provided between the end of the patch area near the antenna area and the antenna area, and the end of the patch area near the antenna area is provided with a first bending portion, the first bending portion being configured to bend and protrude toward the side where the carrier surface is located.

[0005] The contactless smart card carrier tape provided in this application embodiment has a first bending portion at one end of the patch area near the antenna area, so that the first bending portion can also be embedded in the package body after packaging. In this way, the package body and the carrier tape form an interlocking structure, which increases the connection strength between the patch area and the package body, and can effectively improve the strength of the contactless smart card mold after packaging, thereby reducing the risk of abnormal problems such as bending and deformation.

[0006] Based on the above technical solution, the following improvements can be made to this application.

[0007] In an exemplary embodiment, the first bend is further configured to bend and extend toward the side closer to the antenna region, so that the first bend forms a receiving groove communicating with the overcurrent space.

[0008] In an exemplary embodiment, the first bending portion includes a first segment and a second segment. The first segment is connected to the main body of the patch area and extends along the thickness direction of the patch area toward the side where the bearing surface is located. The second segment is connected to the first segment and extends toward the direction close to the antenna area.

[0009] In one exemplary embodiment, the antenna region has a second bending portion at one end near the patch region, and the second bending portion is configured to bend and protrude toward the side where the bearing surface is located.

[0010] In an exemplary embodiment, the antenna region near the patch region is provided with a solder joint area, which is configured to be electrically connected to the chip of the patch region via a soldering line; the width of the antenna region is greater than the width of the patch region, and the portion of the antenna region protruding from the patch region in the width direction is connected to the patch region; the solder joint area includes two first solder joint areas, which are spaced apart at both ends of the antenna region along the width direction of the antenna region.

[0011] In an exemplary embodiment, two recessed clearance areas are provided at both ends of the patch area in the width direction; the solder joint area further includes two second solder joint areas, which are respectively located in the corresponding clearance areas and connected to the corresponding first solder joint areas.

[0012] In one exemplary embodiment, at least a portion of the clearance zone is arranged side-by-side with the first bend along the width direction of the antenna region.

[0013] In an exemplary embodiment, the solder joint area further includes two third solder joint areas, which are located on both sides of the main body of the patch area and are respectively connected to the corresponding first solder joint areas.

[0014] This application embodiment also provides a contactless smart card module, including: a contactless smart card carrier as described in any of the above embodiments, a chip mounted on the carrier surface, and a package encapsulating the chip in the contactless smart card carrier, wherein the patch area is separated from the antenna area and connected through the package.

[0015] This application also provides a smart device, including the contactless smart card module as described in the above embodiments.

[0016] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objectives and other advantages of this invention can be realized and obtained by means of the structures particularly pointed out in the description and the accompanying drawings. Attached Figure Description

[0017] The accompanying drawings are used to provide a further understanding of the technical solutions of this application and constitute a part of the specification. They are used together with the embodiments of this application to explain the technical solutions of this application and do not constitute a limitation on the technical solutions of this application.

[0018] Figure 1This is a cross-sectional view of a contactless smart card module in conventional technology.

[0019] Figure 2 This is a cross-sectional view of a contactless smart card module provided in some embodiments of this application;

[0020] Figure 3 This is a partial top view of a contactless smart card module in conventional technology. The package and another antenna area are omitted from the diagram.

[0021] Figure 4 This is a partial top view of a contactless smart card module provided in some embodiments of this application, omitting the package and another antenna area.

[0022] In the attached diagram, Figure 1 and Figure 3 The list of components represented by the labels is as follows:

[0023] 11' Surface Mount Area, 12' Antenna Area, 121' First Solder Joint Area, 13' Overcurrent Space; 2' Chip; 3' Package; 4' Solder Line;

[0024] Figure 2 and Figure 4 The list of components represented by the labels is as follows:

[0025] 11. Surface mount area; 111. First bend; 1111. First segment; 1112. Second segment; 1113. Receiving slot; 112. Clearance area; 12. Antenna area; 121. First solder joint area; 122. Second solder joint area; 123. Third solder joint area; 13. Overcurrent space; 2. Chip; 3. Package; 4. Soldering line. Detailed Implementation

[0026] The principles and features of this application are described below with reference to the accompanying drawings. The examples given are only for explaining this application and are not intended to limit the scope of this application.

[0027] like Figure 2 and Figure 4 As shown, this application embodiment provides a contactless smart card carrier tape (hereinafter referred to as carrier tape), including: patch area 11 and antenna area 12.

[0028] One side surface of the surface mount area 11 is provided with a support surface for carrying the chip 2. For example... Figure 2 As shown, antenna area 12 and patch area 11 are arranged side by side along the length of the contactless smart card carrier tape and are connected to patch area 11. There are two antenna areas 12, symmetrically arranged on both sides of patch area 11. Before packaging, patch area 11 and antenna area 12 are connected together (physical connection) to ensure that the carrier tape is a complete component, rather than multiple fragmented components, such as... Figure 4As shown. Subsequently, chip 2 can be fixed to the carrier surface of the patch area 11, and the antenna area 12 (the solder joint area) can be electrically connected to chip 2 via solder wire 4 (e.g., ...). Figure 4 (As shown), and then encapsulation is performed. The encapsulation process involves placing the carrier tape with the chip 2 fixed in place into a mold, injecting liquid encapsulation 3, and waiting for the encapsulation 3 to solidify. After the encapsulation 3 has solidified, the physical connection between the antenna area 12 and the patch area 11 is disconnected (for example, by cutting or punching), so that the patch area 11 and the antenna area 12 are completely disconnected.

[0029] Among them, a current-passing space 13 is provided between the end of the patch area 11 near the antenna area 12 and the antenna area 12, such as Figure 2 As shown. The flow space 13 allows high-viscosity liquid fluid (which can be a solid raw material heated to become a high-viscosity liquid fluid, and the liquid fluid solidifies to form the package body 3, or molded body or colloid) to enter the flow space 13 during the packaging process, so that the patch area 11 and the antenna area 12 can be connected through the package body 3 after packaging, ensuring the integrity of the contactless smart card mold.

[0030] Furthermore, the patch area 11 has a first bend 111 at one end near the antenna area 12, such as... Figure 2 As shown, the first bending portion 111 is configured to bend and protrude towards the side where the bearing surface is located. In this way, after subsequent encapsulation, the first bending portion 111 can be embedded into the package body 3, so that the package body 3 and the carrier tape form an interlocking structure.

[0031] In conventional technologies, such as Figure 1 As shown, the patch area 11' and the antenna area 12' are flush. After packaging, only a portion of the package 3' is embedded in the current-carrying space 13', and the embedding depth is basically the same as the thickness of the carrier tape. As the thickness of the carrier tape decreases, the thickness of the package 3' embedded in the carrier also decreases, resulting in a decrease in the connection strength between the patch area 11' and the antenna area 12' after packaging, which makes it prone to bending, deformation and other problems.

[0032] The contactless smart card carrier tape provided in this embodiment of the application has a first bent portion 111 at one end of the patch area 11 near the antenna area 12, so that the first bent portion 111 can also be embedded in the package body 3 after packaging. Thus, the package body 3 and the carrier tape form an interlocking structure (e.g., ...). Figure 2 As shown in the figure, the connection strength between the patch area 11 and the package body 3 is increased, which can effectively improve the strength of the non-contact smart card mold after packaging, thereby reducing the risk of abnormal problems such as bending and deformation.

[0033] Furthermore, compared to etching to create an uneven structure in the carrier tape, the first bending portion 111 in this solution is formed by bending, which does not cause a reduction in the local thickness of the carrier tape. The overall thickness can be maintained at around 65μm, which is beneficial to improving the strength of the carrier tape itself and thus reducing the risk of bending, deformation and other problems.

[0034] The specific shape of the flow space 13 is not limited, and it can be a flow gap, flow hole, flow groove, etc. Furthermore, the first bending portion 111 can extend to both ends of the width direction of the patch area 11, or it can only extend to one end of the width direction of the patch area 11, or it can be located in the middle region of the bending direction of the patch area 11.

[0035] In some exemplary embodiments, the first bend 111 is further configured to bend and extend toward the side closer to the antenna region 12, such as... Figure 2 As shown, the first bend 111 is configured to form a receiving groove 1113 that communicates with the flow space 13.

[0036] In this way, during the subsequent encapsulation process, the liquid fluid can also fill the receiving groove 1113, and after solidification, it can firmly fasten the first bend 111 from the back side of the carrier tape (i.e., the opposite side of the bearing surface), such as... Figure 2 As shown, this helps to enhance the strength of the contactless smart card module.

[0037] In some exemplary embodiments, such as Figure 2 As shown, the first bending portion 111 includes a first segment 1111 and a second segment 1112. The first segment 1111 is connected to the main body of the patch area 11 and extends along the thickness direction of the patch area 11 toward the side where the bearing surface is located. The second segment 1112 is connected to the first segment 1111 and extends toward the direction closer to the antenna area 12.

[0038] Of course, the first bending portion 111 may not be divided into two segments; for example, it may be an inclined single-segment structure or a curved arc-shaped structure. Alternatively, the first bending portion 111 may be divided into three or more segments, such as an "n"-shaped structure, a wave-shaped structure, or a sawtooth structure. These technical solutions do not deviate from the design concept and purpose of this application, and therefore are all within the protection scope of this application.

[0039] In some exemplary embodiments, such as Figure 2 As shown, the first segment 1111 is perpendicular to the main body of the patch area 11, and the second segment 1112 is perpendicular to the first segment 1111. In this way, the structure of the first bent portion 111 is relatively regular, which is convenient for processing and shaping.

[0040] Of course, the first segment 1111 can be approximately perpendicular to the main body of the patch area 11, or the first segment 1111 can be inclined relative to the main body of the patch area 11, so that the first segment 1111 and the main body of the patch area 11 form an acute or obtuse angle structure. Similarly, the second segment 1112 can be approximately perpendicular to the first segment 1111, or the second segment 1112 can be inclined relative to the first segment 1111, so that the second segment 1112 and the first segment 1111 form an acute or obtuse angle structure.

[0041] For example, in one embodiment, the first segment 1111 is inclined relative to the main body of the patch area 11, and the first segment 1111 and the main body of the patch area 11 form an acute angle structure. The second segment 1112 is inclined relative to the first segment 1111, and the second segment 1112 and the first segment 1111 form an acute angle structure. The second segment 1112 is parallel to the main body of the patch area 11. In this way, the main body of the patch area 11, the first segment 1111, and the second segment 111 form a Z-shaped structure, which is also convenient for processing and shaping. Furthermore, the length of the second segment 1112 can be greater than the length of the first segment 1111, which helps to improve the connection strength between the patch area 11 and the package 3, thereby enhancing the strength of the contactless smart card module.

[0042] In some exemplary embodiments, the antenna region 12 is provided with a second bending portion (not shown in the figure) at one end near the patch region 11, and the second bending portion is configured to bend and protrude toward the side where the bearing surface is located.

[0043] In this way, after the encapsulation is completed, the second bending part can also be embedded in the encapsulation body 3, which increases the connection strength between the antenna area 12 and the encapsulation body 3, and can further improve the strength of the non-contact smart card mold after encapsulation, thereby further reducing the risk of abnormal problems such as bending and deformation.

[0044] The structure of the second bend can be referenced from the structure of the first bend 111, and the direction can be adjusted accordingly.

[0045] In some exemplary embodiments, the antenna region 12 is provided with a solder joint area near the patch region 11. The solder joint area is configured to be electrically connected to the chip 2 of the patch region 11 via solder lines 4. The solder joint area includes two first solder joint areas 121, such as... Figure 4 As shown, two first solder joint areas 121 are spaced apart at both ends of the antenna area 12 along the width direction of the antenna area 12.

[0046] like Figure 4As shown, the width of the antenna region 12 is greater than the width of the patch region 11, and the portion of the antenna region 12 that protrudes from the patch region 11 in the width direction is connected to the patch region 11. In this way, a current-carrying space 13 can be left between the end of the patch region 11 near the antenna region 12 and the patch region 11, but this does not affect the physical connection between the antenna region 12 and the patch region 11.

[0047] In the field of contactless smart cards, the size of the chip 2' is decreasing, which brings two problems: 1) the space of the carrier tape patch area 11' is wasted; 2) the length of the solder line 4' is longer, which also results in waste, and the longer solder line 4' is more susceptible to impact and deformation during molding, affecting reliability.

[0048] Therefore, in some exemplary embodiments, such as Figure 4 As shown, the patch area 11 has two recessed clearance areas 112 at both ends in the width direction. The solder joint area also includes two second solder joint areas 122, which are located in the corresponding clearance areas 112 and connected to the corresponding first solder joint area 121.

[0049] In this way, the area of ​​the surface mount region 11 is reduced, which can reduce the waste of space in the surface mount region 11 while still meeting the carrying requirements of the small-sized chip 2. The space freed up in the surface mount region 11 can be used as the second solder joint region 122, which allows for more flexible placement of the solder joints. By better selecting the position of the solder joints, the length of the soldering wire 4 can be effectively reduced, thereby saving soldering wire costs and improving the reliability of the module.

[0050] In some exemplary embodiments, such as Figure 4 As shown, at least a portion of the clearance zone 112 is arranged side by side with the first bend 111 along the width direction of the antenna zone 12.

[0051] In other words, the two clearance zones 112 can be completely located on both sides of the first bend 111. Furthermore, the dimensions of the clearance zones 112 along the length of the carrier belt can be the same as or shorter than the first bend 111. This results in a more regular carrier belt structure, and the shape formed by the first solder joint area 121 and the second solder joint area 122 is also more regular, making it easier to rationally select the location of the solder joints.

[0052] Alternatively, the two clearance zones 112 may also be partially located on both sides of the first bend 111. Since the size of the clearance zone 112 along the length of the carrier belt is larger than that of the first bend 111, the portions of the two clearance zones 112 that protrude from the first bend 111 are located on both sides of the main body of the patch area 11.

[0053] Of course, the two clearance zones 112 can also be located entirely on both sides of the main body of the patch area 11, offset from the first bend 111.

[0054] In some exemplary embodiments, such as Figure 4 As shown, the solder joint area also includes two third solder joint areas 123, which are located on both sides of the main body of the patch area 11 and are connected to the corresponding first solder joint area 121.

[0055] In other words, the antenna area 12 is located on both sides of the patch area 11 in the width direction and extends further along the length direction of the carrier tape, thereby further expanding the soldering area and making the position of the solder joint more flexible. By better selecting the position of the solder joint, the length of the solder line 4 can be effectively reduced.

[0056] Figure 3 This is a partial top view of a contactless smart card module in conventional technology; the package 3' and another antenna region 12' are omitted from the diagram. Figure 3 In the process, the solder joint area of ​​an antenna region 12' only includes two first solder joint areas 121', resulting in a large waste of area in the patch area 11' and a relatively long solder line 4'.

[0057] Figure 4 This is a partial top view of a contactless smart card module provided in some embodiments of this application, omitting the package 3 and another antenna region 12. Figure 4 In this design, the area of ​​patch area 11 is reduced, effectively reducing the waste of patch area 11. The solder joint area of ​​antenna area 12 includes two first solder joint areas 121, two second solder joint areas 122 and two third solder joint areas 123, reducing the length of solder line 4.

[0058] This application embodiment also provides a contactless smart card module, including: a contactless smart card carrier tape as described in any of the above embodiments, a chip 2 mounted on a carrier surface, a welding line 4 connecting the solder joint area and the chip 2, and a package 3 encapsulating the chip 2 in the contactless smart card carrier tape, wherein the patch area 11 and the antenna area 12 are separated (the physical connection between the patch area 11 and the antenna area 12 can be broken by punching, cutting or other processes) and connected through the package 3.

[0059] The contactless smart card module provided in this application embodiment has all the above-mentioned beneficial effects because it includes the contactless smart card carrier of any of the above embodiments, and will not be repeated here.

[0060] This application also provides a smart device, including a contactless smart card module as described in the above embodiments, and thus has all the above-mentioned beneficial effects, which will not be repeated here.

[0061] In summary, the contactless smart card carrier tape, contactless smart card module, and smart device provided in this application embodiment improve the module strength of the contactless smart card module by modifying the design of the carrier tape patch area; and increase the solderable area of ​​the carrier tape solder joints by reducing the area of ​​the unused patch area, effectively saving wire bonding costs.

[0062] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0063] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0064] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0065] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0066] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0067] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A contactless smart card carrier tape, characterized in that, include: Patch area and antenna area; One side surface of the patch area is provided with a carrier surface for carrying the chip; the antenna area is arranged side by side with the patch area and is connected to the patch area; Wherein, a current-passing space is provided between the end of the patch area near the antenna area and the antenna area, and a first bending portion is provided at the end of the patch area near the antenna area, the first bending portion being configured to bend and protrude toward the side where the bearing surface is located.

2. The contactless smart card carrier tape according to claim 1, characterized in that, The first bending portion is further configured to bend and extend toward the side closer to the antenna region, so that the first bending portion forms a receiving groove communicating with the overcurrent space.

3. The contactless smart card carrier tape according to claim 2, characterized in that, The first bending portion includes a first segment and a second segment. The first segment is connected to the main body of the patch area and extends along the thickness direction of the patch area toward the side where the bearing surface is located. The second segment is connected to the first segment and extends toward the direction close to the antenna area.

4. The contactless smart card carrier tape according to any one of claims 1 to 3, characterized in that, The antenna region is provided with a second bending portion at one end near the patch region, and the second bending portion is configured to bend and protrude toward the side where the bearing surface is located.

5. The contactless smart card carrier tape according to any one of claims 1 to 3, characterized in that, The antenna region near the patch region is provided with a solder joint area, which is configured to be electrically connected to the chip in the patch region via solder lines; The width of the antenna region is greater than the width of the patch region, and the portion of the antenna region that protrudes from the patch region in the width direction is connected to the patch region; the solder joint region includes two first solder joint regions, which are spaced apart at both ends of the antenna region along the width direction of the antenna region.

6. The contactless smart card carrier tape according to claim 5, characterized in that, The patch area has two recessed clearance areas at both ends in the width direction; The solder joint area also includes two second solder joint areas, which are located in the corresponding free space and connected to the corresponding first solder joint area.

7. The contactless smart card carrier tape according to claim 6, characterized in that, At least a portion of the clearance zone is arranged side by side with the first bend along the width direction of the antenna zone.

8. The contactless smart card carrier tape according to claim 5, characterized in that, The solder joint area also includes two third solder joint areas, which are located on both sides of the main body of the patch area and are respectively connected to the corresponding first solder joint areas.

9. A contactless smart card module, characterized in that, include: The contactless smart card carrier tape, the chip mounted on the carrier surface, and the package encapsulating the chip in the contactless smart card carrier tape as described in any one of claims 1 to 8, wherein the patch area is separated from the antenna area and connected through the package.

10. A smart device, characterized in that, Includes the contactless smart card module as described in claim 9.

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