Double-color light source structure and sighting device

Abstract

The utility model relates to the technical field of sighting device light sources, and particularly provides a double-color light source structure and a sighting device. The first light-emitting chip is arranged on the substrate and is electrically connected with the substrate; the second light-emitting chip is arranged on the first light-emitting chip and is electrically connected with the substrate and the first light-emitting chip; light emitted by the first light-emitting chip and light emitted by the second light-emitting chip are arranged in different colors, the first light-emitting chip is used for providing range indication, and the second light-emitting chip is used for providing target indication. A high-performance and high-reliability double-color light source structure is provided, accurate and clear target range and shooting point indication can be provided in various environments, the stability of the sighting device is improved, the service life of the sighting device is prolonged, and the applicability of the sighting device is improved. The double-color light source structure enables the sighting device to have an excellent visual effect and target recognition performance, and the requirements of the market for efficient and reliable sighting equipment are met.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of sight light source, in particular to a dual-color light source structure and a sight. BACKGROUND

[0002] The existing sight mainly adopts single-color (such as red light or green light) patterns to indicate the shooting target, which is suitable for simple target indication. In some special applications, especially in occasions where the target range and accurate shooting point need to be clearly distinguished, the existing technology often uses two different light-emitting patterns through LED devices to represent the target range and the shooting point. However, since the light-emitting of the existing LED device is limited to a single color, the distinction between range indication and target indication is not clear enough, which brings poor target identification experience to users and cannot meet the more accurate and efficient shooting requirements.

[0003] In order to improve the indication effect, some industries use color OLED micro screens to distinguish range target indication and shooting target indication by different colors. Although the OLED screen has improved the display effect, it still has many shortcomings. First, the environmental adaptability of OLED products is poor, which is easily affected by temperature, humidity and other factors, resulting in short product life. Second, the driving system of OLED screen is complex, the cost is high, and the maintenance and replacement are difficult, which increases the overall cost of the product and the difficulty of subsequent maintenance.

[0004] Therefore, how to realize clear target range and shooting point indication while keeping low cost, and improve the reliability and durability of the product, has become a problem to be solved in the current technology. CONTENT OF THE INVENTION

[0005] In view of the shortcomings of the prior art, the present application aims to provide a dual-color light source structure and a sight, which aims to solve the problem of high cost and poor environmental stability of the dual-color light source structure of the existing sight.

[0006] The technical solution adopted by the present application to solve the technical problem is as follows: a dual-color light source structure for a sight, comprising:

[0007] a substrate;

[0008] a first light-emitting chip, disposed on the substrate and electrically connected to the substrate;

[0009] a second light-emitting chip, disposed on the first light-emitting chip and electrically connected to the substrate and the first light-emitting chip;

[0010] The first light emitting chip is configured to provide a range indication, and the second light emitting chip is configured to provide a target indication.

[0011] Optionally, the substrate is provided with a first chip welding area, a first electrode welding area and a second electrode welding area; the first light emitting chip is welded on the first chip welding area;

[0012] The end surface of the first light emitting chip away from the substrate is provided with a second chip welding area, a first inner lead welding area and a second inner lead welding area;

[0013] The second light emitting chip is welded on the second chip welding area, and the second light emitting chip is provided with a bonding area away from the end surface of the first light emitting chip;

[0014] The first inner lead welding area is electrically connected with the first electrode welding area, the bonding area is electrically connected with the second inner lead welding area, and the second inner lead welding area is electrically connected with the second electrode welding area.

[0015] Optionally, the double-color light source structure further comprises:

[0016] A first bonding wire is used to electrically connect the first inner lead welding area with the first electrode welding area;

[0017] A second bonding wire is used to electrically connect the bonding area with the second inner lead welding area;

[0018] A third bonding wire is used to electrically connect the second inner lead welding area with the second electrode welding area.

[0019] Optionally, the double-color light source structure further comprises a connecting layer used to electrically connect the first light emitting chip and the second light emitting chip.

[0020] Optionally, the first light emitting chip comprises, in order from bottom to top, a first P-type metal layer, a first P-type substrate, a first bonding layer, a first P-type doped layer, a first N-type doped layer and a first N-type metal layer;

[0021] The second light emitting chip comprises, in order from bottom to top, a second N-type metal layer, a second N-type substrate, a second N-type doped layer, a second P-type doped layer and a second P-type metal layer;

[0022] The connecting layer is located between the first N-level metal layer and the second N-level metal layer, a first PN junction is formed between the first P-type doped layer and the first N-type doped layer, and a second PN junction is formed between the second P-type doped layer and the second N-type doped layer; the second chip welding area, the first inner lead welding area, and the second inner lead welding area are all arranged on the first N-level metal layer.

[0023] Optionally, the first light emitting chip comprises, from bottom to top, a third N-level metal layer, a third N-type substrate, a third N-type doped layer, a third P-type doped layer, and a third P-level metal layer.

[0024] The second light emitting chip comprises, from bottom to top, a fourth P-level metal layer, a fourth P-type substrate, a fourth bonding layer, a fourth P-type doped layer, a fourth N-type doped layer, and a fourth N-level metal layer.

[0025] The connecting layer is located between the third P-level metal layer and the fourth P-level metal layer, a third PN junction is formed between the third P-type doped layer and the third N-type doped layer, and a fourth PN junction is formed between the fourth P-type doped layer and the fourth N-type doped layer.

[0026] Optionally, the first light emitting chip has a first light emitting pattern, the second light emitting chip has a second light emitting pattern, and the second light emitting pattern is located inside the first light emitting pattern.

[0027] The second bonding wire is located inside the first light emitting pattern, the first bonding wire and the third bonding wire are both arranged in a via, and the first bonding wire, the second bonding wire, and the third bonding wire do not block the first light emitting pattern.

[0028] Optionally, the second light emitting pattern is arranged in a central arrow shape, an auxiliary point shape, a horseshoe shape, or a central point shape; and the first light emitting pattern is arranged in a circular shape, an arc shape, or a cross line shape.

[0029] Optionally, the first light emitting chip has a light emitting color including any one of red, green, or blue, the second light emitting chip has a light emitting color including any one of red, green, or blue, and the first light emitting chip and the second light emitting chip emit light of different colors.

[0030] Another technical solution adopted by the application to solve the technical problem is a sight, which comprises the dual-color light source structure as described above.

[0031] Advantages:

[0032] This application provides a dual-color light source structure and a sight. The dual-color light source structure uses two light-emitting chips that emit different colors of light, one for range indication and the other for target indication. This effectively distinguishes the target range and the firing point visually, enabling users to quickly and accurately identify the firing target and improving the target recognition experience of the sight. At the same time, the dual-color light source structure simplifies the light source structure and manufacturing process by stacking the two light-emitting chips on the same substrate. Compared with traditional color OLED screens or multiple individual light-emitting chip combinations, the dual-color light-emitting chip stacking packaging method is simpler in process, easier to mass-produce, reduces the complexity and cost of the production process, and can be compatible with existing product requirements, thereby greatly reducing the cost of the product and avoiding high-cost drive systems and complex circuit designs. It can better adapt to market demands; at the same time, LED chips themselves have strong anti-interference capabilities and long service life. The method of stacking and packaging light-emitting chips makes the dual-color light source structure provided by this application not only have high structural reliability, but also can work stably under more severe environmental conditions, overcoming the shortcomings of OLED technology in terms of poor environmental adaptability and short lifespan; ultimately, the dual-color light source structure not only has high performance, but also improves the overall cost-effectiveness of the product while reducing production and use costs. Attached Figure Description

[0033] Figure 1 This is a cross-sectional schematic diagram of the dual-color light source structure provided in this application;

[0034] Figure 2 This is a cross-sectional schematic diagram of another embodiment of the dual-color light source structure provided in this application;

[0035] Figure 3 This is a cross-sectional schematic diagram of another embodiment of the dual-color light source structure provided in this application;

[0036] Figure 4 This is a schematic diagram of the light-emitting pattern of the dual-color light source structure provided in this application;

[0037] Figure 5 This is another schematic diagram of the light-emitting pattern of the dual-color light source structure provided in this application;

[0038] Explanation of reference numerals in the attached figures:

[0039] 10, dual-color light source structure; 11, substrate; 12, first light emitting chip; 13, second light emitting chip; 14, first bonding wire; 15, second bonding wire; 16, third bonding wire; 17, connection layer; 111, first chip soldering area; 112, first electrode soldering area; 113, second electrode soldering area; 121, second chip soldering area; 122, first inner lead soldering area; 123, second inner lead soldering area; 124, first light emitting pattern; 1251, first P-type metal layer; 1252, first P-type substrate; 1253, first bonding layer; 1254, first P-type doped layer; 1255, first N-type doped layer; 1256, first N-type metal layer; 1257, first PN junction; 1261, third N-type metal layer; 1262, third N-type substrate; 1263, third N-type doped layer; 1264, third P-type doped layer; 1265, third P-type metal layer; 1266, third PN junction; 131, bonding area; 132, second light emitting pattern; 1331, second N-type metal layer; 1332, second N-type substrate; 1333, second N-type doped layer; 1334, second P-type doped layer; 1335, second P-type metal layer; 1336, second PN junction; 1341, fourth P-type metal layer; 1342, fourth P-type substrate; 1343, fourth bonding layer; 1344, fourth P-type doped layer; 1345, fourth N-type doped layer; 1346, fourth N-type metal layer; 1347, fourth PN junction. DETAILED DESCRIPTION

[0040] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not used to limit the present application.

[0041] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only used to facilitate the description of the present application and simplify the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second" are only for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more features. In the description of the present application, unless otherwise stated, the meaning of "a plurality of" is two or more.

[0042] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integral connection; it can be mechanical connection, or electrical connection; it can be direct connection, or indirect connection through intermediate medium, or internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0043] Please refer to Figure 1 In the first embodiment of the present application, a dual-color light source structure 10 is provided for a gunsight, so that the gunsight can provide range indication and target indication, and the colors of the range indication and the target indication are different; the dual-color light source structure 10 comprises a substrate 11, a first light emitting chip 12 and a second light emitting chip 13; the substrate 11, the first light emitting chip 12 and the second light emitting chip 13 are sequentially stacked from bottom to top, specifically, the first light emitting chip 12 is arranged on the substrate 11 and electrically connected with the substrate 11; the second light emitting chip 13 is arranged on the first light emitting chip 12 and electrically connected with the substrate 11 and the first light emitting chip 12; at the same time, the light emitted by the first light emitting chip 12 and the second light emitting chip 13 is of different colors, the first light emitting chip 12 is used to provide range indication, and the second light emitting chip 13 is used to provide target indication.

[0044] By arranging two light emitting chips emitting light of different colors, which are respectively used for range indication and target indication, the target range and the shooting point are effectively visually distinguished, so that the user can quickly and accurately identify the shooting target, and the target identification experience of the gunsight is improved; at the same time, the dual-color light source structure 10 stacks the two light emitting chips on the same substrate 11, which simplifies the light source structure and the manufacturing process. Compared with the traditional color OLED screen or the combination structure of multiple separate light emitting chips, the dual-color light emitting chip stacking packaging process is simpler, easy to mass produce, reduces the complexity and cost of the production process, and at the same time can be compatible with the existing product demand, thereby greatly reducing the cost of the product, and avoiding the high-cost driving system and complex circuit design. It can better adapt to market demand; at the same time, the LED chip itself has strong anti-interference ability and long service life, and the use of light emitting chip stacking packaging makes the dual-color light source structure 10 provided by the present application not only has high structural reliability, but also can work stably under more severe environmental conditions, overcoming the shortcomings of poor environmental adaptability and short service life of OLED technology; finally, the dual-color light source structure 10 not only has high performance, but also improves the performance-price ratio of the product on the basis of reducing production and use cost.

[0045] In some embodiments, the substrate 11 is provided with a first chip welding area 111, a first electrode welding area 112, and a second electrode welding area 113, thereby providing a stable connection point for the first light-emitting chip 12, ensuring that the first light-emitting chip 12 and the second light-emitting chip 13 can be stably connected with the substrate 11 and the circuit, simplifying the electrical connection, improving the efficiency of the welding process, and reducing the problem of unstable light source caused by poor contact. The first light-emitting chip 12 is welded on the first chip welding area 111, ensuring that the range indicating LED chip can be firmly fixed on the substrate 11, and guaranteeing good electrical connection and light-emitting effect. The end surface of the first light-emitting chip 12 away from the substrate 11 is provided with a second chip welding area 121, a first inner lead welding area 122, and a second inner lead welding area 123. The second light-emitting chip 13 is welded on the second chip welding area 121, and the end surface of the second light-emitting chip 13 away from the first light-emitting chip 12 is provided with a bonding area 131. The first inner lead welding area 122 is electrically connected with the first electrode welding area 112, the bonding area 131 is electrically connected with the second inner lead welding area 123, and the second inner lead welding area 123 is electrically connected with the second electrode welding area 113. Thus, the stable stacking between the first light-emitting chip 12 and the second light-emitting chip 13 is realized, the electrical connection between the second light-emitting chip 13 and the first light-emitting chip 12 is ensured to be stable, and the risk of chip relative displacement in the traditional planar arrangement mode is avoided. In addition, the stacked mode makes the dual-color light source structure 10 more compact, reduces the manufacturing cost, ensures good performance of the product in complex environments, and improves the comprehensive performance and market competitiveness of the dual-color light source structure 10.

[0046] In some embodiments, the dual-color light source structure 10 further comprises a first bonding wire 14, a second bonding wire 15 and a third bonding wire 16, the first bonding wire 14 is used to electrically connect the first inner lead bonding area 122 and the first electrode bonding area 112, thereby ensuring the stability of current transmission, reducing the risk of poor contact, ensuring the normal work and stable light emission of the range indicating LED chip, and improving the reliability of the dual-color light source structure 10; the second bonding wire 15 is used to electrically connect the bonding area 131 and the second inner lead bonding area 123, the second bonding wire 15 optimizes the electrical connection of the target indicating LED chip, ensures the stability in actual application, makes the light emission effect of the target indicating LED chip more stable, and further improves the reliability of the dual-color light source structure 10; the third bonding wire 16 is used to electrically connect the second inner lead bonding area 123 and the second electrode bonding area 113; the third bonding wire 16 optimizes the current transmission path, ensures the current conduction efficiency between the second light emitting chip 13 and the substrate 11, reduces the performance decline caused by unstable electrical connection, enhances the stability and service life of the dual-color light source structure 10; it should be noted that the second light emitting chip 13 and the first light emitting chip 12 are electrically connected with the substrate 11 through the second bonding wire 15 and the third bonding wire 16.

[0047] For further reference, please see Figure 2 and Figure 3 In some embodiments, the dual-color light source structure 10 further comprises a connecting layer 17 for electrically connecting the first light emitting chip 12 and the second light emitting chip 13. The addition of the connecting layer 17 not only strengthens the electrical connection between the two light emitting chips, but also further improves the stability and efficiency of the light source structure. The connecting layer 17 can be made of conductive materials (such as metal or conductive polymer) and connected to the two chips through welding, crimping or other appropriate connection processes.

[0048] In some embodiments, the first light emitting chip 12 comprises, from bottom to top, a first P-type metal layer 1251, a first P-type substrate 1252, a first bonding layer 1253, a first P-type doped layer 1254, a first N-type doped layer 1255, and a first N-type metal layer 1256; the second light emitting chip 13 comprises, from bottom to top, a second N-type metal layer 1331, a second N-type substrate 1332, a second N-type doped layer 1333, a second P-type doped layer 1334, and a second P-type metal layer 1335; the connecting layer 17 is located between the first N-type metal layer 1256 and the second N-type metal layer 1331, a first PN junction 1257 is formed between the first P-type doped layer 1254 and the first N-type doped layer 1255, and a second PN junction 1336 is formed between the second P-type doped layer 1334 and the second N-type doped layer 1333. The arrangement of the connecting layer 17 improves the stability and efficiency of current transmission and ensures good electrical connection between the first light emitting chip 12 and the second light emitting chip 13. Meanwhile, the arrangement of the soldering area simplifies the production process, reduces the risk of poor contact, and improves the overall reliability of the light source structure. It should be noted that in this embodiment, the first light emitting chip 12 is a green light range indicating light emitting chip, and the second light emitting chip 13 is a red light target indicating light emitting chip.

[0049] In some embodiments, the first light emitting chip 12 comprises, from bottom to top, a third N-type metal layer 1261, a third N-type substrate 1262, a third N-type doped layer 1263, a third P-type doped layer 1264, and a third P-type metal layer 1265; the second light emitting chip 13 comprises, from bottom to top, a fourth P-type metal layer 1341, a fourth P-type substrate 1342, a fourth bonding layer 1343, a fourth P-type doped layer 1344, a fourth N-type doped layer 1345, and a fourth N-type metal layer 1346; the connecting layer 17 is located between the third P-type metal layer 1265 and the fourth P-type metal layer 1341, a third PN junction 1266 is formed between the third P-type doped layer 1264 and the third N-type doped layer 1263, and a fourth PN junction 1347 is formed between the fourth P-type doped layer 1344 and the fourth N-type doped layer 1345. The arrangement of the connecting layer 17 optimizes the electrical connection between the first light emitting chip 12 and the second light emitting chip 13, ensures the stability of current conduction and the efficiency of light source emission, and the reasonable arrangement of the soldering area makes the soldering process more convenient, effectively avoiding the instability problem caused by poor contact. It should be noted that in this embodiment, the first light emitting chip 12 is a red light range indicating light emitting chip, and the second light emitting chip 13 is a green light target indicating light emitting chip.

[0050] For further reference, please see Figure 4 and Figure 5In some embodiments, the first light-emitting chip 12 has a first light-emitting pattern 124, and the second light-emitting chip 13 has a second light-emitting pattern 132, which is located inside the first light-emitting pattern 124. The first light-emitting pattern 124 is a range indicating pattern, which is designed to provide a clear range indicating function, and the second light-emitting pattern 132 is designed to indicate a shooting point or a target position. The first light-emitting pattern 124 helps to improve the visibility and clarity of the range indication, so that the user can intuitively identify the target range, and the overall indicating accuracy of the sight is improved. The second light-emitting pattern 132 not only clearly indicates the shooting point, but also forms a hierarchical sense with the first light-emitting pattern 124 through the positional relationship, which enhances the visual effect and the user's recognition experience, helps the user to quickly and accurately judge the shooting target, and improves the efficiency and accuracy of the aiming. Since the second light-emitting pattern 132 is located inside the first light-emitting pattern 124, the light-emitting patterns of the two light-emitting chips are connected and coordinated with each other, which maximizes the use of light source distribution and space, so that the entire dual-color light source structure 10 is more compact and efficient.

[0051] In some embodiments, the second bonding wire 15 is located inside the first light-emitting pattern 124, and the first bonding wire 14 and the third bonding wire 16 are both arranged in a through-hole manner, and the first bonding wire 14, the second bonding wire 15 and the third bonding wire 16 do not block the first light-emitting pattern 124. In this way, the first bonding wire 14, the second bonding wire 15 and the third bonding wire 16 can effectively avoid blocking the range indicating pattern, and further improve the indicating effect of the dual-color light source structure 10 and the sight.

[0052] Further, the second light-emitting pattern 132 is arranged in a central arrow shape, an auxiliary point shape, a horseshoe shape or a central point shape, and the first light-emitting pattern 124 is arranged in a circular shape, an arc shape or a cross line shape. In this way, different first light-emitting patterns 124 and second light-emitting patterns 132 can be arranged according to different scene requirements, which improves the application range of the dual-color light source structure 10.

[0053] In some embodiments, the light-emitting color of the first light-emitting chip 12 includes any one of red, green or blue, the light-emitting color of the second light-emitting chip 13 includes any one of red, green or blue, and the light-emitting colors of the first light-emitting chip 12 and the second light-emitting chip 13 are different. By flexibly selecting the light-emitting colors of red, green or blue light and ensuring that the colors of the first light-emitting chip 12 and the second light-emitting chip 13 are different, the distinguishability of the range indication and the target indication is significantly improved, so that the user can quickly and accurately identify the shooting target in a complex environment, and the adaptability, accuracy and overall performance of the light source are improved.

[0054] The second embodiment of the utility model discloses a kind of sights, it includes the bicolor light source structure 10 as described in the first embodiment of the application above;It is known that a kind of high-performance, high-reliability sight is provided, accurate, clear target indication can be provided in a variety of environments, improve the stability of sight, service life and applicability.The bicolor light source structure 10 makes that sight has excellent visual effect and target identification performance, meets the demand of efficient, reliable sighting equipment to market.

[0055] In conclusion, the application provides a bicolor light source structure and a sight. The bicolor light source structure comprises a substrate, a first light-emitting chip disposed on the substrate and electrically connected to the substrate, and a second light-emitting chip disposed on the first light-emitting chip and electrically connected to the substrate and the first light-emitting chip. The light emitted by the first light-emitting chip and the second light-emitting chip is of different colors. The first light-emitting chip is used to provide range indication, and the second light-emitting chip is used to provide target indication. This effectively distinguishes the target range and the shooting point visually, enabling the user to quickly and accurately identify the shooting target and improving the target identification experience of the sight. At the same time, the bicolor light source structure simplifies the light source structure and the manufacturing process by stacking two light-emitting chips on the same substrate. Compared with the traditional color OLED screen or the combination structure of multiple separate light-emitting chips, the bicolor light-emitting chip stacking packaging process is simpler, easier to mass-produce, reduces the complexity and cost of the production process, is compatible with existing product requirements, greatly reduces the cost of the product, avoids the high-cost driving system and complex circuit design, and better meets market demand. At the same time, the LED chip itself has strong anti-interference ability and long service life. The bicolor light source structure provided by the application has high structural reliability and can work stably in more severe environmental conditions, overcoming the shortcomings of poor environmental adaptability and short service life of OLED technology. Ultimately, the bicolor light source structure not only has high performance, but also improves the performance-price ratio on the basis of reducing production and use costs.

[0056] It should be understood that the application is not limited to the examples described above, and those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications shall fall within the scope of the claims appended to the application.

Claims

1. A two-color light source structure for a gunsight, characterized by, The double-color light source structure comprises: a substrate; a first light emitting chip disposed on the substrate and electrically connected to the substrate; a second light emitting chip disposed on the first light emitting chip and electrically connected to the substrate and the first light emitting chip; wherein the first light emitting chip and the second light emitting chip emit light of different colors, the first light emitting chip is configured to provide a range indication, and the second light emitting chip is configured to provide a target indication.

2. The double-color light source structure according to claim 1, wherein: the substrate is provided with a first chip welding area, a first electrode welding area and a second electrode welding area; and the first light emitting chip is welded to the first chip welding area; an end surface of the first light emitting chip facing away from the substrate is provided with a second chip welding area, a first inner lead welding area and a second inner lead welding area; the second light emitting chip is welded to the second chip welding area, and an end surface of the second light emitting chip facing away from the first light emitting chip is provided with a bonding area; the first inner lead welding area is electrically connected to the first electrode welding area, the bonding area is electrically connected to the second inner lead welding area, and the second inner lead welding area is electrically connected to the second electrode welding area.

3. The two-color light source structure according to claim 2, characterized in that, The double-color light source structure further comprises: a first bonding wire for electrically connecting the first inner lead welding area to the first electrode welding area; a second bonding wire for electrically connecting the bonding area to the second inner lead welding area; a third bonding wire for electrically connecting the second inner lead welding area to the second electrode welding area.

4. The dual-color light source structure according to claim 2, wherein, The double-color light source structure further comprises a connecting layer for electrically connecting the first light emitting chip and the second light emitting chip.

5. The double-color light source structure according to claim 4, wherein: the first light emitting chip comprises, from bottom to top, a first P-type metal layer, a first P-type substrate, a first bonding layer, a first P-type doped layer, a first N-type doped layer and a first N-type metal layer; the second light emitting chip comprises, from bottom to top, a second N-type metal layer, a second N-type substrate, a second N-type doped layer, a second P-type doped layer and a second P-type metal layer; the connecting layer is located between the first N-type metal layer and the second N-type metal layer, a first PN junction is formed between the first P-type doped layer and the first N-type doped layer, and a second PN junction is formed between the second P-type doped layer and the second N-type doped layer; and the second chip welding area, the first inner lead welding area and the second inner lead welding area are all disposed on the first N-type metal layer.

6. The double-color light source structure according to claim 4, wherein: the first light emitting chip comprises, from bottom to top, a third N-type metal layer, a third N-type substrate, a third N-type doped layer, a third P-type doped layer and a third P-type metal layer; the second light emitting chip comprises, from bottom to top, a fourth P-type metal layer, a fourth P-type substrate, a fourth bonding layer, a fourth P-type doped layer, a fourth N-type doped layer and a fourth N-type metal layer. The connecting layer is located between the third P-type metal layer and the fourth P-type metal layer, and the third PN junction is formed between the third P-type doped layer and the third N-type doped layer, and the fourth PN junction is formed between the fourth P-type doped layer and the fourth N-type doped layer; the second chip welding area, the first inner lead welding area and the second inner lead welding area are all arranged on the third P-type metal layer.

7. The dual-color light source structure according to claim 3, wherein, The first light emitting chip has a first light emitting pattern, and the second light emitting chip has a second light emitting pattern, and the second light emitting pattern is located inside the first light emitting pattern. The second bonding wire is located inside the first light emitting pattern, the first bonding wire and the third bonding wire are both arranged in a through hole, and the first bonding wire, the second bonding wire and the third bonding wire do not block the first light emitting pattern.

8. The two-color light source structure according to claim 7, characterized in that, The second light emitting pattern is arranged in a central arrow shape, an auxiliary point shape, a horseshoe shape or a central point shape; and the first light emitting pattern is arranged in a circular shape, an arc shape or a cross line shape.

9. The dual-color light source structure of claim 1, wherein, The light emitting color of the first light emitting chip includes any one of red, green or blue, the light emitting color of the second light emitting chip includes any one of red, green or blue, and the light emitting colors of the first light emitting chip and the second light emitting chip are different.

10. A sight, characterized in that A dual-color light source structure as claimed in any one of claims 1-9.

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