Microswitch and vehicle

Abstract

The utility model provides a microswitch and a vehicle, the microswitch comprises a shell assembly, a circuit board, a connecting piece and a sealant, a mounting cavity is defined in the shell assembly, a glue injection groove is formed in the shell assembly, a first connecting hole communicated with the mounting cavity is formed in the bottom of the glue injection groove, and the circuit board is located in the mounting cavity; the connecting piece penetrates through the first connecting hole and fixes the circuit board in the shell assembly, and the sealant is arranged in the sealant injection groove and covers the first connecting hole and the connecting piece, so that the circuit board is sealed and fixed, even if the microswitch is located in an external environment in a high-temperature and high-humidity state and the sealant is partially cracked, the circuit board cannot be directly exposed, and the service life of the microswitch is prolonged. Therefore, the circuit board is protected and waterproof to a certain extent, and the normal use of the microswitch is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of vehicles, in particular to a micro switch and a vehicle. BACKGROUND

[0002] The micro switch is widely used in automobiles, and is mainly used to control some functions of the automobile, such as locking / unlocking of the door, turn signal switch, wiper switch, etc. It is usually used to realize contact and separation of a small distance to trigger the corresponding operation.

[0003] In the related art, the mounting method of the circuit board of the micro switch is to fix and seal by using sealing glue. Specifically, a groove is opened on the surface of the micro switch, the circuit board is placed in the groove, and then the sealing glue fills the space in the entire groove to realize the mounting and sealing of the circuit board. However, when the micro switch is located in a high-temperature and high-humidity environment, the sealing glue is prone to cracking, which causes the sealing failure of the circuit board, and thus part of the circuit board is exposed and damaged. CONTENT OF THE UTILITY MODEL

[0004] The present application provides a micro switch and a vehicle, which aims to seal and protect the circuit board of the micro switch, and can reduce the possibility of sealing failure of the circuit board.

[0005] The specific scheme is as follows:

[0006] The embodiment of the first aspect of the present application provides a micro switch, which comprises:

[0007] A housing assembly, an installation cavity is defined in the inside of the housing assembly, a glue injection groove is arranged on the outside of the housing assembly, and a first connecting hole in communication with the installation cavity is arranged at the bottom of the glue injection groove;

[0008] A circuit board, the circuit board is arranged in the installation cavity;

[0009] A connecting piece, the connecting piece is arranged through the first connecting hole and fixes the circuit board in the housing assembly; and

[0010] Sealing glue, the sealing glue is arranged in the glue injection groove and covers the connecting piece and the first connecting hole.

[0011] The micro switch in the embodiment of the application comprises a shell assembly, and an installation cavity is defined in the interior of the shell assembly, so that the circuit board is located in the installation cavity. An injection groove is arranged on the exterior of the shell assembly, and a first connecting hole communicating with the installation cavity is arranged at the bottom of the injection groove. The circuit board is connected with the shell assembly through the connecting piece penetrating the first connecting hole, so that the circuit board is fixed. Then, the first connecting hole and the connecting piece are sealed by the sealing glue arranged in the injection groove. In this way, the circuit board is wrapped in the switch by the shell assembly, so that the circuit board is not directly exposed to the outside. The position of the first connecting hole on the shell assembly is sealed by the sealing glue, so that the sealing performance of the connection between the circuit board and the shell assembly is ensured. Even if the sealing glue is partially cracked due to the high temperature and high humidity of the external environment, the circuit board will not be directly exposed to the outside and affected by the high temperature and high humidity of the external environment. Water outside the micro switch will not flow into the installation cavity through the position of the first connecting hole. Therefore, the circuit board is protected and waterproofed to a certain extent, so that the normal use of the micro switch is ensured.

[0012] In some embodiments, bosses are formed on the side wall and / or bottom wall of the injection groove.

[0013] By arranging the bosses on the side wall and / or bottom wall of the injection groove, the sealing glue can have a larger contact area with the side wall or bottom surface of the injection groove, so that a longer and more tortuous extension path is formed on the surface of the injection groove. In this way, the position between the slot of the injection groove and the first connecting hole is further blocked by the bosses, so that the sealing effect of the sealing glue in the injection groove on the first connecting hole is further improved.

[0014] In some embodiments, the bosses are arranged along the length direction or width direction of the injection groove, or the bosses are arranged around the first connecting hole.

[0015] In this way, the bosses can completely block in the length or width direction of the injection groove, so that the blocking effect of the bosses is further improved, and the sealing effect of the sealing glue in the injection groove on the first connecting hole is further improved.

[0016] In some embodiments, the number of bosses is multiple, and the multiple bosses are arranged at intervals on the side wall and / or bottom wall of the injection groove.

[0017] By arranging multiple boss structures, the blocking effect can be further improved, and when the number of first connecting holes is multiple, each first connecting hole can be correspondingly arranged, so that the sealing degree is ensured.

[0018] In some embodiments, the first connecting holes are multiple, and the multiple first connecting holes are arranged at intervals, and the number of the connecting pieces is the same as that of the first connecting holes, and each connecting piece is arranged in a corresponding first connecting hole.

[0019] In this way, multiple fixing between the circuit board and the base is achieved, and the connection effect between the circuit board and the base is better. When a pressing force is applied to the micro switch, the connection between the circuit board and the base is more reliable, and the possibility of relative displacement is smaller.

[0020] In some embodiments, the circuit board comprises a board body and a key switch, the key switch is located at the center position of the board body, and the circuit board body is provided with a second connecting hole for cooperating with the connecting piece.

[0021] A first distance is formed between the center point of the board body and the edge of the board body, a second distance is formed between the center point of the second connecting hole and the edge of the board body, and the ratio of the second distance to the first distance is 0.3-0.7.

[0022] The glue injection groove is located at a position corresponding to the second connecting hole of the shell assembly.

[0023] Since the deformation of the shell assembly and the circuit board at the position of the key switch is the largest when the micro switch is pressed externally, the size ratio of the second distance between the center point of the second connecting hole and the edge of the board body to the first distance between the edge of the key switch and the edge of the board body is set to 0.3-0.7, so that the second connecting hole is located at the eccentric position of the board body relative to the key switch. Correspondingly, the glue injection groove is also located at the eccentric position corresponding to the center point of the board body. Compared with the design that the glue injection groove and the sealant are located at the center position of the shell assembly, the sealant is subjected to smaller force and smaller deformation, and is less likely to crack.

[0024] In some embodiments, the connecting piece is welded to the circuit board.

[0025] And / or, the connecting piece is welded to the shell assembly.

[0026] By welding the connecting piece to the circuit board, the fixing of the connecting piece relative to the circuit board is ensured, so that the fixing effect between the circuit board and the shell assembly is ensured when the circuit board and the shell assembly are fixed by the connecting piece. Similarly, by welding the connecting piece to the shell assembly, the fixing of the connecting piece relative to the shell assembly is ensured, which also ensures the fixing effect between the circuit board and the shell assembly.

[0027] In some embodiments, the housing assembly comprises a shell and a base, a mounting groove is formed on a side of the base facing the shell, and a shell cover is arranged at a groove opening of the mounting groove so that the shell and the mounting groove jointly form the mounting chamber.

[0028] The circuit board is arranged in the mounting groove, and the first connecting hole is formed on a bottom surface of the mounting groove.

[0029] In this way, the circuit board can be conveniently placed on the base, that is, the circuit board and the base are conveniently matched and installed, and the circuit board plays a certain positioning role.

[0030] In some embodiments, an annular sealing groove is arranged on a groove bottom surface of the mounting groove, the annular sealing groove is annularly arranged at a hole edge of the first connecting hole, and the annular sealing groove, the circuit board and the connecting piece jointly form an annular sealing cavity.

[0031] The base further comprises a sealing gasket, and the sealing gasket is arranged in the annular sealing cavity and is in interference fit with the annular sealing cavity.

[0032] By annularly arranging the annular sealing groove at the hole edge of the first connecting hole, the annular sealing cavity is jointly formed by the annular sealing groove, the circuit board and the connecting piece, further, the sealing gasket is arranged in the annular sealing cavity and is pressed in the annular sealing cavity, so that the gap formed among the groove wall of the annular sealing groove, the side of the circuit board facing the mounting groove and the side wall of the connecting piece can be blocked, and the installation position of the circuit board and the base can be sealed to a greater extent, thus the circuit board can be better sealed, and the protection of the circuit board is further strengthened.

[0033] Embodiments of the second aspect of the application provide a micro switch, comprising the micro switch as described above.

[0034] The vehicle in the embodiment of the application, by making the micro switch include a shell assembly, the inside of the shell assembly is limited to define a mounting chamber, the circuit board is located in the mounting chamber, meanwhile, a glue injection groove is arranged on the outside of the shell assembly, and a first connecting hole communicated with the mounting chamber is arranged at the bottom of the glue injection groove, the circuit board is connected with the shell assembly through the connecting piece penetrating in the first connecting hole, so as to fix the circuit board, then the first connecting hole and the connecting piece are sealed by the sealing glue arranged in the glue injection groove. By this setting, the circuit board is wrapped in the switch by the shell assembly, so that the circuit board is not directly exposed outside, and the position of the first connecting hole on the base is sealed by the sealing glue, so as to ensure the sealing of the connection between the circuit board and the shell assembly. Even if the sealing glue is partially cracked due to the high temperature and high humidity of the external environment of the micro switch, the circuit board will not be directly exposed outside and affected by the high temperature and high humidity of the external environment, and the water outside the micro switch will not flow into the mounting chamber through the position of the first connecting hole. Therefore, the circuit board is protected and waterproofed to a certain extent, and the normal use of the micro switch is ensured. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 is a structural schematic diagram of a micro switch provided by the embodiment of the application;

[0036] Figure 2 is an exploded view of a micro switch provided by the embodiment of the application;

[0037] Figure 3 is a structural schematic diagram of a base and an inner shell of a micro switch provided by the embodiment of the application;

[0038] Figure 4 is a structural schematic diagram of a circuit board of a micro switch provided by the embodiment of the application;

[0039] Figure 5 is a sectional view of a circuit board of a micro switch provided by the embodiment of the application;

[0040] Figure 6 is a sectional view of a micro switch provided by the embodiment of the application;

[0041] Figure 7 is Figure 6 a partial enlarged schematic diagram of part A in FIG. 8;

[0042] Figure 8 is a structural schematic diagram of a base of a micro switch provided by the embodiment of the application;

[0043] Figure 9 is a structural schematic diagram of a base of a micro switch provided by the embodiment of the application from another perspective;

[0044] Figure 10 is a sectional view of a base of a micro switch provided by an embodiment of the present application.

[0045] 10, housing; 11, outer shell; 111, mounting body; 112, pressing portion; 12, inner shell; 121, clamping hole;

[0046] 20, base; 21, glue injection groove; 22, first connecting hole; 23, buckle; 24, mounting groove; 25, annular sealing groove; 26, sealing gasket; 27, boss;

[0047] 30, circuit board; 31, second connecting hole; 32, key switch; 33, welding point; 34, board body;

[0048] 40, connecting piece;

[0049] 50, sealing glue;

[0050] 60, bolt;

[0051] 70, elastic member;

[0052] 80, connecting line;

[0053] 100, mounting chamber;

[0054] L1, first distance formed between the edge of the key switch and the edge of the board body; L2, second distance formed between the center point of the second connecting hole and the edge of the board body. DETAILED DESCRIPTION

[0055] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application will be further described in detail below in combination with the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and not to limit the present application.

[0056] In the description of the present application, it should be understood that if the orientation or position relationship indicated by the terms "upper", "lower", "left", "right" and the like is based on the orientation or position relationship shown in the drawings, it is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore the terms describing the position relationship in the drawings are only used for exemplary illustration, and cannot be understood as a limitation of the present application, for those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0057] In addition, the terms "first", "second", etc. are used only for descriptive purposes and should not be construed as implying or suggesting relative importance or an indicated number of technical features. Thus, features defined with "first", "second", etc. can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise explicitly specified and limited.

[0058] In the description of the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be broadly understood, for example, can be fixedly connected, or can be detachably connected, or can be integrated; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0059] Micro switches are widely used in automobiles, mainly used to control some functions of the automobile, such as locking / unlocking the door, turning on the turn signal, and turning on the windshield wiper, etc. It is usually used to realize the contact and separation of a small distance to trigger the corresponding operation.

[0060] Taking the application on the rear tail lamp structure of the vehicle as an example, some vehicles are designed with a through type tail lamp, that is, the tail lamp extends from the vehicle body to the back door, so as to have a more smooth and beautiful tail lamp shape. The micro switch can help realize the electrical conduction or disconnection of the tail lamp, that is, when the micro switch is not pressed, the tail lamp part on the back door is not electrically connected with the tail lamp part of the vehicle, and the tail lamp on the back door is turned off. When the micro switch is pressed, the tail lamp part on the back door is electrically connected with the tail lamp part of the vehicle, and all parts of the tail lamp can be turned on.

[0061] At present, the mounting method of the circuit board of the micro switch adopts sealing glue for fixation and sealing. Specifically, a groove is opened on the surface of the micro switch, the circuit board is placed in the groove, and then the sealing glue fills the space in the entire groove to realize the mounting and sealing of the circuit board. The sealing glue not only realizes the mounting of the circuit board, but also realizes the waterproof sealing function, which can prevent external water from entering the position of the circuit board in the switch and avoid damage to the circuit board structure due to water entering the switch. However, when the micro switch is in a high temperature and high humidity environment, the sealing glue is prone to cracking, resulting in sealing failure of the circuit board, so that part of the circuit board is exposed and damaged.

[0062] Based on the above, the applicant of the present application proposes the technical scheme in the embodiments of the present application, specifically, the mounting position of the circuit board is adjusted, the circuit board is arranged in the inside of the micro switch, and glue sealing is only performed at the connection position of the circuit board and the micro switch, so that compared with the mode that the circuit board is mounted on the surface of the micro switch and glue sealing is performed, the possibility of the sealing failure of the circuit board is reduced on the basis that the sealing is still fixed by the sealing glue to ensure the fixing effect, and therefore the protection effect of the circuit board is better.

[0063] The above is the core idea of the present application, and the technical scheme in the embodiments of the present application will be described clearly and completely in combination with the drawings in the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by the person skilled in the art without creative labor are within the protection scope of the present application.

[0064] As shown in Figures 1-10 The embodiment of the first aspect of the present application provides a micro switch, which comprises a shell assembly and a circuit board 30, a shell 10 and a base 20 are connected to each other, the inside of the shell assembly defines a mounting cavity 100, and the circuit board 30 is located in the mounting cavity 100.

[0065] Specifically, the shell 10 comprises a shell 11, the shell 11 comprises a mounting body 111 and a pressing portion 112, specifically, the mounting body 111 of the shell 10 is used for being connected and fixed with the base 20, and the mounting body 111 can be made of hard plastic, for example. The pressing portion 112 is arranged on the mounting body 111 and is opposite to the circuit board 30, the pressing portion 112 can be made of soft rubber, for example, so that when an external force is applied on the shell 10, the pressing portion 112 can press the electronic component key switch 32 on the circuit board 30 in the mounting cavity 100, and specific reference can be made to Figure 2 In addition, the shell 10 and the base 20 can be connected by a bolt 60 to ensure the fixing effect between the shell 10 and the base 20.

[0066] Based on this, the housing 10 may further include an inner housing 12, which is located between the outer housing 11 and the base 20, and is correspondingly disposed inside the pressing part 112. The inner housing 12 is provided with contact points that can make electrical contact with the electronic component button switch 32 on the circuit board 30. In specific implementation, the switch can be triggered by the contact between the inner housing 12 and the circuit board 30. That is, when the pressing part 112 of the outer housing 11 is subjected to a pressing force, the pressing part 112 collapses and deforms toward the interior of the mounting chamber 100 and contacts the inner housing 12. The pressing force then acts on the inner housing 12 and pushes the inner housing 12 toward the circuit board 30 until the contact points on the inner housing 12 contact the button switch 32 on the circuit board 30, thereby realizing electrical conduction.

[0067] The inner shell 12 can be limited and installed inside the outer shell 11, specifically so that the inner shell 12 can only move relative to the outer shell 11 in the direction of the perpendicular line in the shell 10, thereby ensuring the movement of the inner shell 12 under the action of pressing. For example, a positioning guide groove is provided on the inner side of the outer shell 11, so that the inner shell 12 is movably connected to the outer shell 11 through the positioning guide groove.

[0068] In other possible implementations, the inner shell 12 can be connected only to the base 20, without being connected to the outer shell 11. The inner shell 12 and the base 20 can be connected, for example, by a snap-fit ​​connection. In this case, since the inner shell 12 needs to be movable relative to the circuit board 30, the connection between the inner shell 12 and the snap-fit ​​23 has a margin of movement. That is, while ensuring the connection with the base 20, the inner shell 12 can also move relative to the base 20.

[0069] For details, please refer to Figure 3 As shown, for example, when a locking hole 121 is provided on the inner shell 12 and a buckle 23 is provided on the base 20, the locking hole 121 has a certain length along the vertical axis of the shell 10. This length is the distance that the inner shell 12 can move relative to the base 20 and the circuit board 30. This distance needs to ensure that the contact point on the inner shell 12 can make complete contact with the button switch 32 on the circuit board 30, and also ensure that the contact point on the inner shell 12 can be completely separated from the button switch 32 on the circuit board 30. Of course, in other embodiments, other connection methods can be used between the inner shell 12 and the base 20, as long as the inner shell 12 is connected relative to the base 20 and can generate relative displacement.

[0070] On this basis, the inner shell 12 and the base 20 can also be provided with an elastic member 70, which can rebound the inner shell 12, that is, the inner shell 12 can rebound to the initial position when the pressing force disappears. Exemplarily, the elastic member 70 can use a spring. And the elastic member 70 can be symmetrically provided with two between the inner shell 12 and the base 20, to ensure the stability of the movement of the inner shell 12 relative to the base 20.

[0071] It should be noted that the circuit board 30 is an electronic element for realizing the trigger of the micro switch, that is, a PCBA (Printed Circuit Board Assembly) element. The circuit board 30 includes a plurality of electronic components and a key switch 32. The micro switch also includes a connecting line 80, and the circuit board 30 is specifically connected with the vehicle machine through the connecting line 80, for signal transmission.

[0072] The shell 10 and the base 20 are connected with each other, for jointly forming the whole shell of the micro switch, and the shell 10 and the base 20 jointly form an installation cavity 100, and the circuit board 30 is located in the installation cavity 100. That is, the circuit board 30 is wrapped to a certain extent by the shell 10 and the base 20, so that the circuit board 30 will not be directly exposed to the outside world, so when the micro switch is in a high temperature and high humidity environment, the circuit board 30 will not be directly exposed to the outside, so it will not be affected by the high temperature and high humidity environment to a certain extent, thus protecting and waterproofing the circuit board 30 to a certain extent.

[0073] Further, the side of the base 20 away from the shell 10 is provided with a glue injection groove 21, and the bottom of the glue injection groove 21 is provided with a first connecting hole 22 communicating with the installation cavity 100, and the micro switch further includes a connecting piece 40, the connecting piece 40 is provided in the first connecting hole 22, and the circuit board 30 is fixed to the base 20, and the glue injection groove 21 is provided with a sealing glue 50, and the sealing glue 50 covers the connecting piece 40 and the first connecting hole 22.

[0074] The side of the base 20 away from the shell 10, i.e. the outer side of the base 20 relative to the mounting chamber 100. Since the glue injection groove 21 is exposed, the first connecting hole 22 formed in the bottom of the glue injection groove 21 is also exposed, therefore, by setting the sealant 50 in the glue injection groove 21, the position of the first connecting hole 22 in the bottom of the glue injection groove 21 and the connecting piece 40 is sealed. In this way, when the micro switch is in a high temperature and high humidity environment, such as when the micro switch is soaked in water due to some reasons, external water will not enter the inside of the mounting chamber 100 from the position of the first connecting hole 22 to cause the circuit board 30 to be exposed to water. Even if the sealant 50 in the glue injection groove 21 cracks due to soaking in water, water will not directly flow to the position of the first connecting hole 22, thus achieving a certain degree of waterproof effect on the circuit board 30.

[0075] In summary, the micro switch provided by the embodiment defines the mounting chamber 100 by the shell assembly, so that the circuit board 30 is located in the mounting chamber 100. At the same time, the glue injection groove 21 is provided on the outer side of the shell assembly, and the first connecting hole 22 communicating with the mounting chamber 100 is provided in the bottom of the glue injection groove 21. The circuit board 30 is connected to the shell assembly through the connecting piece 40 passing through the first connecting hole 22, so as to fix the circuit board 30. Then, the sealant 50 provided in the glue injection groove 21 seals the first connecting hole 22 and the connecting piece 40. In this way, the circuit board 30 is wrapped inside the switch by the shell assembly, so that the circuit board 30 is not directly exposed to the outside. At the same time, the position of the first connecting hole 22 on the base 20 is sealed by the sealant 50, which ensures the sealing of the connection between the circuit board 30 and the shell assembly. Even if the micro switch is located in a high temperature and high humidity environment, causing the sealant to partially crack, the circuit board 30 will not be directly exposed to the outside and affected by the high temperature and high humidity environment. Water outside the micro switch will not flow into the inside of the mounting chamber 100 through the position of the first connecting hole 22, thus achieving a certain degree of protection and waterproof effect on the circuit board 30, and ensuring the normal use of the micro switch.

[0076] In addition, when the circuit board 30 is mounted, the side of the circuit board 30 provided with electronic components is directed towards the shell 10, i.e. the electronic components are located on the back side of the first connecting hole 22, which can further ensure the safety of the circuit board 30.

[0077] In some embodiments, the height of the glue injection groove 21 can be set to be no less than 3mm. In this way, the glue injection amount can be increased, so that the hardness of the sealant 50 after curing is higher, the sealing effect is better, and cracking is less likely to occur. It should be noted that the height of the glue injection groove 21 refers to the distance from the groove bottom of the glue injection groove 21 to the groove opening of the glue injection groove 21 along the median line direction of the micro switch. In addition, the groove type of the glue injection groove 21 can be set to be rectangular or other shapes, and similarly, the cross-sectional shape of the glue injection groove 21 in the height direction can be set to be rectangular or other shapes.

[0078] In addition, the glue injection amount of the sealant can ensure that the connecting piece and the first connecting hole can be sealed. For example, the glue injection groove can be filled directly, thereby achieving better sealing and fixing effects.

[0079] As shown in Figure 3 In some embodiments, the side of the base 20 facing the shell 10 is provided with a mounting groove 24, and the shell 10 is arranged at the groove opening of the mounting groove 24 to form a mounting chamber 100 together with the mounting groove 24. The circuit board 30 is arranged in the mounting groove 24, and the first connecting hole 22 is arranged on the bottom surface of the mounting groove 24.

[0080] That is, the circuit board 30 is specifically arranged in the base 20, and the shell 10 mainly plays a role of sealing the mounting chamber 100 on the base 20, that is, encapsulating the entire micro switch. In this way, the base 20 and the circuit board 30 can be more conveniently matched and installed, and the circuit board 30 can be positioned to a certain extent.

[0081] In specific implementation, the mounting groove 24 can be set to a groove type matched with the outer contour shape of the circuit board 30, thereby achieving a certain positioning effect and further improving the installation speed.

[0082] As shown in Figure 8 and Figure 10 In some embodiments, an annular sealing groove 25 can also be arranged on the bottom surface of the mounting groove 24, the annular sealing groove 25 is arranged at the hole edge of the first connecting hole 22, the annular sealing groove 25, the circuit board 30 and the connecting piece 40 jointly form an annular sealing cavity, and the base 20 further comprises a sealing gasket 26, the sealing gasket 26 is arranged in the annular sealing cavity and is in interference fit with the annular sealing cavity.

[0083] The annular sealing groove 25 is arranged on the bottom surface of the mounting groove 24 to provide a mounting position for the sealing gasket 26. Further, the groove wall of the annular sealing groove 25, the side of the circuit board 30 facing the mounting groove 24, and the side wall of the connecting piece 40 can jointly enclose an annular space, and the sealing gasket 26 is located in the annular space. Further, the sealing gasket 26 is in interference fit with the annular sealing cavity, that is, the sealing gasket 26 is pressed in the annular sealing cavity, so as to block the gap formed among the groove wall of the annular sealing groove 25, the side of the circuit board 30 facing the mounting groove 24, and the side wall of the connecting piece 40, thereby sealing the mounting position of the circuit board 30 and the base 20 to a greater extent, and thus better sealing effect of the circuit board 30 can be achieved, and the protection of the circuit board 30 is further strengthened.

[0084] As shown in Figure 8 some embodiments, the number of the first connecting holes 22 can be multiple, and the multiple first connecting holes 22 are arranged at intervals on the bottom surface of the glue injection groove 21. The number of the connecting pieces 40 is the same as that of the first connecting holes 22, and each connecting piece 40 is arranged in a corresponding first connecting hole 22.

[0085] By arranging the corresponding multiple first connecting holes 22 and making the connecting pieces 40 correspond to the first connecting holes 22 one by one to be arranged and connected, the circuit board 30 and the base 20 are fixed at multiple positions, and the connection effect is better. When the micro switch is pressed by an external force, the possibility of relative displacement between the circuit board 30 and the base 20 is smaller, and the connection between the circuit board 30 and the base 20 is more reliable.

[0086] As shown in Figure 4 some embodiments, the circuit board 30 further includes a board body 34, and the key switch 32 is located at the center position of the board body 34. The board body 34 is further provided with a second connecting hole 31 for cooperating with the connecting piece.

[0087] When the micro switch is assembled, the connecting piece 40 can be arranged in the first connecting hole 22 and the second connecting hole 31 at the same time, so that the circuit board 30 and the base 20 are relatively fixed by the connecting piece 40. Then, the glue injection groove 21 outside the base 20 is injected with glue, so that the sealing glue 50 seals the connecting piece 40 and the first connecting hole 22. After the sealing glue 50 is hardened and fixed, the inner shell 12 is further installed on the base 20, for example, by the aforementioned clamping connection. Finally, the outer shell 11 is installed on the side of the base 20 where the inner shell 12 is arranged, and the outer shell 11 is further fixed and connected with the base 20, so that the micro switch is completely assembled.

[0088] Exemplarily, the number of the second connecting holes 31 can also be set to be multiple, and the connecting pieces 40 are correspondingly arranged to pass through the first connecting holes 22 and the second connecting holes 31. In the embodiment, two first connecting holes 22 and two second connecting holes 31 are arranged, and in other embodiments, other numbers of the first connecting holes 22 and the second connecting holes 31 can also be arranged.

[0089] Further, in some embodiments, a first distance is formed between the center point of the plate body 34 and the edge of the plate body 34, and a second distance is formed between the center point of the second connecting hole 31 and the edge of the plate body 34, and the size ratio of the second distance to the first distance is 0.3-0.7.

[0090] Since the base 20 and the circuit board 30 are subjected to the greatest force at the position of the key switch 32 when the micro switch is pressed by the outside, the deformation is also the greatest, therefore, the size ratio of the second distance formed between the center point of the second connecting hole 31 and the edge of the plate body 34 to the first distance formed between the center point of the plate body 34 and the edge of the plate body 34 is set to be 0.3-0.7, which can realize that the second connecting hole 31 is located at the eccentric position of the plate body 34 relative to the key switch 32, and correspondingly, the glue injection groove 21 is also located at the eccentric position corresponding to the center point of the plate body 34. Compared with the design that the glue injection groove 21 and the sealing glue 50 are located at the center position of the base 20, the sealing glue 50 is subjected to smaller force and smaller deformation, and is less likely to crack.

[0091] The size ratio of the second distance formed between the center point of the second connecting hole 31 and the edge of the plate body 34 to the first distance formed between the center point of the plate body 34 and the edge of the plate body 34 is set to be 0.3-0.7, which can make the eccentric design of the second connecting hole 31 more obvious, thereby ensuring that the sealing glue 50 is subjected to smaller force. When the ratio is less than 0.3, the connection between the circuit board 30 and the base 20 is too close to the edge, which can affect the connection reliability between the circuit board 30 and the base 20. When the ratio is greater than 0.7, the second connecting hole 31 is too close to the key switch 32, and even can be located below the key switch 32, which can affect the installation of the connecting piece 40 and the circuit board 20, and affect the effect of the eccentric design.

[0092] For details, please refer to Figure 5 The first distance formed between the edge of the key switch 32 and the edge of the plate body 34 is L1, the second distance formed between the center point of the second connecting hole 31 and the edge of the plate body 34 is L2, and the numerical ratio of the first distance to the first distance is L2 / L1, that is, the numerical ratio of L2 / L1 is 0.3-0.7. In the embodiment, the ratio is set to be 0.4. Of course, in other embodiments, other ratios between 0.3 and 0.7 can also be set.

[0093] On this basis, the connecting piece 40 and the circuit board 30 can be connected by welding. In this way, the connecting piece 40 can be fixed relative to the circuit board 30, thereby ensuring the fixing effect between the circuit board 30 and the base 20 when the circuit board 30 is fixed to the base 20 through the connecting piece 40.

[0094] Referring to Figure 7 When implemented, since the circuit board 30 needs to be connected to the connecting wire 80 by welding, a welding point 33 can be formed at the opening of the second connecting hole 31 on the side away from the first connecting hole 22, that is, the connecting wire 80 and the connecting piece 40 are connected at the same time.

[0095] Specifically, since the connecting wire 80 electrically connected to the circuit board 30 needs to be led out, the connecting piece 40 can be a hollow piece, that is, the connecting piece 40 has a passage inside. After one end of the connecting wire 80 is welded to the side of the circuit board 30 away from the first connecting hole 22, the connecting wire 80 is led out from the inside of the connecting piece 40, and the connecting wire 80 passes through the glue injection groove 21, such as the groove wall of the glue injection groove 21, and extends to the outside of the switch. For details, see Figure 1 .

[0096] In some embodiments, the material of the connecting piece 40 can be plastic, and the connecting piece 40 and the base 20 are also connected by welding. In this way, on the one hand, the connecting piece 40 can make the base 20 and the circuit board 30 relatively insulated, and on the other hand, it also ensures the fixing of the connecting piece 40 relative to the base 20, that is, it ensures the fixing effect between the circuit board 30 and the base 20.

[0097] When implemented, the connecting piece 40 is made of thermoplastic plastic. The connecting piece 40 and the base 20 can be welded and fixed by plastic welding technology, that is, the two plastic parts are fused by heating method to connect into one whole. Of course, in other embodiments, the connecting piece 40 can also be made of other materials, and the connecting piece 40 and the base 20 can also be connected in other ways.

[0098] Specifically, the connecting piece 40 is first arranged in the first connecting hole 22 and the second connecting hole 31, and then the connecting wire 80 is introduced to the position of the welding point 33 through the passage inside the connecting piece 40. After the circuit board and the base are fixed by the connecting piece, the connecting piece 40 and the connecting wire 80 are welded and fixed. For example, soldering can be used. Of course, in other embodiments, other welding methods can also be used.

[0099] As Figure 7 and Figure 8As shown, in some embodiments, the bottom wall of the glue injection groove 21 is further provided with a boss 27, which is protruding from the bottom wall of the glue injection groove 21 towards the opening of the glue injection groove 21.

[0100] By providing the boss 27 on the bottom wall of the glue injection groove 21, the sealing glue 50 can have a larger contact area with the bottom wall of the glue injection groove 21, so as to form a longer and more tortuous extension path on the surface of the glue injection groove 21. In this way, the position between the opening of the glue injection groove 21 and the first connecting hole 22 is further blocked by the boss 27, so as to further improve the sealing effect of the sealing glue 50 in the glue injection groove 21 on the first connecting hole 22.

[0101] In the present embodiment, the boss 27 is provided on the bottom wall of the glue injection groove 21. Of course, in other embodiments, the boss 27 can be provided on the side wall of the glue injection groove 21, or the boss 27 can be provided on both the bottom wall and the side wall of the glue injection groove 21.

[0102] As shown in FIGS. 1 and 2, Figure 7 and Figure 8 In an implementable manner, the boss 27 extends along the length direction or the width direction of the glue injection groove 21, or the boss 27 is arranged around the first connecting hole 22.

[0103] In this way, the boss 27 can form a complete block in the length or width direction of the glue injection groove 21, or a complete block along the axial direction of the first connecting hole 22, so as to further strengthen the blocking effect of the boss 27, and further improve the sealing effect of the sealing glue 50 in the glue injection groove 21 on the first connecting hole 22.

[0104] In some embodiments, the number of bosses 27 can be set to be multiple, and the multiple bosses 27 are arranged at intervals on the side wall or the bottom wall of the glue injection groove 21. In this way, the blocking effect can be further increased by the multiple boss 27 structures, and when the number of first connecting holes 22 is multiple, a corresponding boss 27 can be arranged for each first connecting hole 22 to ensure the sealing degree.

[0105] It should be noted that when the multiple bosses 27 are arranged at intervals on the bottom wall of the glue injection groove 21, the bosses 27 can be arranged at intervals along the length or width direction of the glue injection groove 21. Or, when the multiple bosses 27 are arranged at intervals on the side wall of the glue injection groove 21, the bosses 27 can be arranged at intervals along the height direction of the glue injection groove 21, and the designer can flexibly adjust according to the actual situation during implementation.

[0106] In the present embodiment, the boss 27 is arranged around the first connecting hole 22, and one boss 27 is arranged around the edge of each of the two first connecting holes 22. Meanwhile, a section of boss 27 can be additionally arranged between the two bosses 27 to connect the two bosses 27 arranged around, which can be specifically seen inFigure 8 Of course, in other embodiments, other types of boss 27 structures or arrangements can be used.

[0107] The embodiments of the second aspect of the application also provide a vehicle comprising the micro switch described above.

[0108] The micro switch is installed in the interior of the vehicle and is electrically connected to the vehicle system to realize corresponding functions, such as electrical connection or disconnection between the tail light on the vehicle body and the tail light on the back door of the vehicle.

[0109] The structure of the micro switch has been described in detail in the above embodiments, and thus will not be described here again.

[0110] The vehicle provided in the embodiments comprises a housing assembly and a circuit board 30, the housing assembly defines an installation cavity 100 therein, the circuit board 30 is located in the installation cavity 100, a glue injection groove 21 is arranged on the housing assembly, a first connecting hole 22 that is in communication with the installation cavity 100 is arranged at the bottom of the glue injection groove 21, the circuit board 30 is connected to the housing assembly through a connecting piece 40 that is arranged in the first connecting hole 22, the circuit board 30 is fixed, and then the first connecting hole 22 and the connecting piece 40 are sealed by a sealing glue 50 arranged in the glue injection groove 21. In this way, the circuit board 30 is wrapped in the switch by the housing assembly, so that the circuit board 30 is not directly exposed to the outside, and the position of the first connecting hole 22 on the housing assembly is sealed by the sealing glue 50, which ensures the sealing of the connection between the circuit board 30 and the housing assembly. Even if the sealing glue is partially cracked due to the high temperature and high humidity of the external environment, the circuit board 30 will not be directly exposed to the outside and affected by the high temperature and high humidity of the external environment, and water outside the micro switch will not flow into the installation cavity 100 through the position of the first connecting hole 22. Therefore, the circuit board 30 is protected and waterproofed to a certain extent, and the normal use of the micro switch is ensured.

[0111] In addition, the vehicle provided in the embodiments has good use performance due to the use of the micro switch provided in the above embodiments.

[0112] It should be noted that the vehicle provided in the embodiments should also comprise other modules or components that can enable the vehicle to operate normally, and thus the other modules or components comprised in the vehicle provided in the embodiments will not be described here.

[0113] The above merely provides the specific implementation of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can easily think of the changes or replacements within the technical range disclosed by the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A microswitch, characterised in that, The application relates to a micro switch, which comprises the following parts: a housing assembly, the inside of which defines a mounting chamber, and the outside of which is provided with a glue injection groove, the bottom of the glue injection groove being provided with a first connecting hole communicating with the mounting chamber; a circuit board arranged in the mounting chamber; a connecting piece penetrating through the first connecting hole and fixing the circuit board in the housing assembly; and a sealing glue arranged in the glue injection groove and covering the connecting piece and the first connecting hole.

2. Microswitch according to claim 1, characterized in that A boss is formed on the side wall and / or bottom wall of the glue injection groove.

3. The microswitch according to claim 2, wherein The boss is arranged along the length direction or width direction of the glue injection groove, or the boss is arranged around the first connecting hole.

4. The microswitch of claim 2, wherein A plurality of bosses are arranged on the side wall and / or bottom wall of the glue injection groove.

5. The microswitch of claim 1, wherein A plurality of first connecting holes are arranged at intervals, and the number of connecting pieces is the same as that of the first connecting holes, each connecting piece penetrating through a corresponding first connecting hole.

6. The microswitch of claim 1, wherein The circuit board comprises a board body and a key switch, the key switch being located at the center of the board body, and the board body being provided with a second connecting hole for cooperating with the connecting piece. A first distance is formed between the center point of the board body and the edge of the board body, a second distance is formed between the center point of the second connecting hole and the edge of the board body, and the ratio of the second distance to the first distance is 0.3-0.

7. The glue injection groove is located at the position of the housing assembly corresponding to the second connecting hole.

7. The microswitch of claim 1, wherein The connecting piece is welded to the circuit board. The connecting piece is welded to the housing assembly.

8. Microswitch according to any of claims 1-7, characterized in that The housing assembly comprises a shell and a base, the side of the base facing the shell is provided with a mounting groove, and the shell covers the groove opening of the mounting groove so that the shell and the mounting groove jointly define the mounting chamber. The circuit board is arranged in the mounting groove, and the first connecting hole is arranged on the bottom surface of the mounting groove.

9. The microswitch according to claim 8, wherein An annular sealing groove is arranged on the bottom surface of the mounting groove, the annular sealing groove is arranged around the edge of the first connecting hole, and the annular sealing groove, the circuit board and the connecting piece jointly define an annular sealing cavity. The base further comprises a sealing gasket, the sealing gasket is arranged in the annular sealing cavity and is in interference fit with the annular sealing cavity.

10. A vehicle characterized by comprising: The application further relates to a micro switch comprising any one of the micro switches according to claims 1-9.

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