LED integrated packaging light source based on semiconductor light emitting technology
By incorporating structures such as flow channels, flow holes, arc grooves, and circular grooves into the LED packaged light source, the problem of package separation caused by resin aging is solved, heat dissipation and sealing performance are improved, service life is extended, and the stability of light emission and conductivity is guaranteed.
Patent Information
- Application Number
- CN202520392080.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-06
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2035-03-06
AI Technical Summary
Resin materials are prone to aging during long-term use of LEDs, which weakens or even separates the bonding force between the package and the resin, affecting the sealing performance and service life of the package.
An integrated LED package light source based on semiconductor light-emitting technology was designed. By setting flow grooves and flow holes in the package to dissipate heat, and adding arc grooves and circular grooves inside to increase the contact area and friction of the resin, the reflector and wire structure are combined to ensure sealing and conductivity.
It effectively prevents heat buildup, improves the sealing between the resin and the encapsulation, extends service life, and ensures the stability of the luminescent effect and the reliability of the conductive connection.
Smart Images
Figure CN223859590U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to encapsulation light source technical field especially is a kind of LED integrated encapsulation light source based on semiconductor light emitting technology. BACKGROUND
[0002] Light emitting diode is a kind of commonly used light emitting device, and it emits light by the combination of electron and hole, which can be used as backlight source of large-size display screen, smart phone, vehicle panel and notebook computer, etc.
[0003] In light emitting diode, resin is a relatively important encapsulation material, and under long-time use of light emitting diode, resin material cannot completely avoid aging problem, once resin is dried, it will cause the bonding force between resin and encapsulation body to weaken, and even separate. Therefore, the LED integrated encapsulation light source based on semiconductor light emitting technology is proposed to solve the above technical problems. UTILITY MODEL CONTENT
[0004] Therefore, the utility model provides a kind of LED integrated encapsulation light source based on semiconductor light emitting technology, which solves the above problems.
[0005] To achieve the above object, the utility model adopts the following technical scheme: including encapsulation body, the bottom of the encapsulation body is provided with connecting body, the bottom of the connecting body is provided with flow-through groove, the encapsulation body is uniformly provided with flow-through hole communicated with flow-through groove, the inner side of the encapsulation body is provided with circular arc groove, the inner side of the circular arc groove on the encapsulation body is provided with circular groove, the outer side of the circular groove on the encapsulation body is provided with plug-in groove, the inner side of the plug-in groove is plugged with reflecting plate, the inner side of the encapsulation body is fixedly provided with base plate, the top of the base plate is fixedly provided with N-type semiconductor, and the top of the N-type semiconductor is fixedly provided with P-type semiconductor.
[0006] As a preferred scheme, the base plate and the N-type semiconductor are fixedly provided with protective shell, the middle of the protective shell is fixedly provided with partition strip, the P-type semiconductor is provided with reserved slot, and the protective shell is located in the inner side of the reserved slot.
[0007] As a preferred scheme, the N-type semiconductor is fixedly connected with second lead wire, the P-type semiconductor is fixedly connected with first lead wire, and the first lead wire and the second lead wire are extended to the outer side of the connecting body.
[0008] As a preferred scheme, the reflecting plate is composed of multiple cuboids and half circular ring.
[0009] As a preferred solution, the inside of the package and above the P-type semiconductor is filled with a second filling resin, the second filling resin is in contact with the circular arc groove, and the second filling resin extends to the inside of the circular groove.
[0010] As a preferred solution, the first filling resin is filled between the connecting body and the substrate on the package.
[0011] The utility model discloses compared with prior art has apparent advantages and beneficial effects, specifically speaking, from the above technical scheme can know, it mainly is:
[0012] The through groove of the bottom of the connecting body cooperates with the through hole of the package which is uniformly arranged and communicated with the through groove to transmit heat to the outside of the device when heat is generated between the device and the circuit board, thereby preventing the heat from being dissipated after the device and the circuit board are fully attached.
[0013] The circular arc groove on the inside of the package is used to increase the contact area and friction force between the inside of the package and the second filling resin, so that the second filling resin is easy to separate from the package after drying, thereby ensuring the sealing performance of the second filling resin after encapsulating the device, which is beneficial to prolong the service life of the device.
[0014] To more clearly illustrate the structural features and effects of the utility model, the utility model will be described in detail below with reference to the drawings and specific embodiments. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 is the overall structure schematic diagram of the embodiment of the utility model;
[0016] Figure 2 is the P-type semiconductor structure schematic diagram of the embodiment of the utility model;
[0017] Figure 3 is the reflective plate structure schematic diagram of the embodiment of the utility model;
[0018] Figure 4 is the overall structure cut schematic diagram of the embodiment of the utility model;
[0019] Figure 5 is the P-type semiconductor structure schematic diagram of the embodiment of the utility model; Figure 4Structure schematic view of enlarged middle A;
[0020] Figure 6 Structure schematic view of arc groove of the embodiment of the utility model.
[0021] Mark explanation: 1, package body; 2, connecting body; 3, flow groove; 4, flow hole; 5, base plate; 6, N-type semiconductor; 7, P-type semiconductor; 8, reserved groove; 9, protective shell; 10, partition strip; 11, first wire; 12, second wire; 13, first filling resin; 14, second filling resin; 15, arc groove; 16, circular groove; 17, reflecting plate; 18, plug-in groove. DETAILED DESCRIPTION
[0022] In order to make the utility model purposes, technical scheme and advantages are more clear and explicit, the following is combined with the drawing and implementation example, and the utility model is further detailed.The specific embodiments described herein are merely used to explain the utility model and are not used to limit the utility model.
[0023] It should be noted that when an element is referred to as being "fixed" to another element, it can be directly on the other element or there can be intervening elements. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements can be present. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0024] Please refer to Figures 1 to 6 The utility model embodiment provides a kind of LED integrated package light source based on semiconductor light emitting technology, including package body 1, the bottom of package body 1 is equipped with connecting body 2, the bottom of connecting body 2 is equipped with flow groove 3, package body 1 is uniformly equipped with flow hole 4 being communicated with flow groove 3, the inside of package body 1 is equipped with arc groove 15, and the inside of package body 1 and located arc groove 15 is equipped with circular groove 16, and the outside of package body 1 and located circular groove 16 is equipped with plug-in groove 18, and the inside of plug-in groove 18 is inserted with reflecting plate 17, and the inside of package body 1 is fixedly provided with base plate 5, the top of base plate 5 is fixedly provided with N-type semiconductor 6, and the top of N-type semiconductor 6 is fixedly provided with P-type semiconductor 7;
[0025] In the use of the device, the encapsulant 1 and the connecting body 2 opened at the bottom of the encapsulant 1 are used as the shell of the device, so that the components inside the device are isolated from the outside world, and the material of the encapsulant 1 is transparent, which is used for light transmission of the device. The flow-through groove 3 opened at the bottom of the connecting body 2 cooperates with the flow-through holes 4 uniformly opened on the encapsulant 1 and connected with the flow-through groove 3 to generate heat between the device and the circuit board, so that the heat is transmitted to the outside of the device through the flow-through groove 3 and the flow-through hole 4, thereby preventing the heat from being easily dissipated after the device and the circuit board are fully attached. The circular arc groove 15 opened in the inner side of the encapsulant 1 is used to increase the contact area and friction force between the encapsulant 1 and the second filling resin 14 after contact, so that the second filling resin 14 is easy to separate from the encapsulant 1 after drying, thereby ensuring the sealing performance of the second filling resin 14 after encapsulating the device, which is beneficial to prolong the service life of the device. The circular groove 16 opened on the encapsulant 1 and located on the inner side of the circular arc groove 15 cooperates with the circular arc groove 15 to further enlarge the contact area and friction force between the second filling resin 14 and the encapsulant 1, thereby improving the sealing effect of the second filling resin 14 after encapsulation. The insertion groove 18 opened on the encapsulant 1 and located on the outer side of the circular groove 16 is used to bear the reflecting plate 17. The reflecting plate 17 inserted into the inner side of the insertion groove 18 is used to improve the light emitting effect of the device. The base plate 5 fixedly arranged in the inner side of the encapsulant 1 is used to load the N-type semiconductor 6. The N-type semiconductor 6 fixedly arranged on the top of the base plate 5 is used to load the P-type semiconductor 7. The P-type semiconductor 7 fixedly arranged on the top of the N-type semiconductor 6 cooperates with the N-type semiconductor 6 to realize light emission when current flows between the N-type semiconductor 6 and the P-type semiconductor 7. The circuit board is a mature prior art which will not be described in detail herein.
[0026] Please refer to Figure 2 The base plate 5 and the N-type semiconductor 6 are fixedly provided with a protective shell 9. The middle part of the protective shell 9 is fixedly provided with a partition strip 10. The P-type semiconductor 7 is provided with a reserved slot 8. The protective shell 9 is located on the inner side of the reserved slot 8.
[0027] In the use of the device, the protective shell 9 fixedly arranged on the base plate 5 and the N-type semiconductor 6 cooperates with the partition strip 10 fixedly arranged in the middle of the protective shell 9 to guide the first wire 11 and the second wire 12, so as to prevent the first wire 11 and the second wire 12 from being mistakenly touched with the N-type semiconductor 6 and the P-type semiconductor 7, thereby ensuring the normal light emission of the P-type semiconductor 7. The protective shell 9 and the partition strip 10 are uniformly made of insulating material, which can prevent the first wire 11 and the second wire 12 from being mistakenly touched. The reserved slot 8 opened on the P-type semiconductor 7 is used for the arrangement of the first wire 11 and the second wire 12.
[0028] Please refer to Figure 1 andFigure 2 The second wire 12 is fixedly connected to the N-type semiconductor 6, and the first wire 11 is fixedly connected to the P-type semiconductor 7, and the first wire 11 and the second wire 12 extend to the outside of the connecting body 2;
[0029] In use, the second wire 12 fixedly connected to the N-type semiconductor 6 cooperates with the first wire 11 fixedly connected to the P-type semiconductor 7, and after the first wire 11 and the second wire 12 are connected on the circuit board, the first wire 11 and the second wire 12 conduct electricity, and when the current flows through the N-type semiconductor 6 and the P-type semiconductor 7, light is emitted above the P-type semiconductor 7.
[0030] Referring to Figure 3 The reflecting plate 17 is composed of a plurality of cuboids and half circular rings;
[0031] In use, since the reflecting plate 17 is composed of a plurality of cuboids and half circular rings, the reflecting plate 17 can be installed in cooperation with the packaging body 1 and the circular arc groove 15, so that the internal structure layout of the device is more reasonable, and the appearance is improved.
[0032] Referring to Figure 4 The second filling resin 14 is filled in the packaging body 1 and above the P-type semiconductor 7, the second filling resin 14 is attached to the circular arc groove 15, and the second filling resin 14 extends to the inside of the circular groove 16;
[0033] In use, the second filling resin 14 filled in the packaging body 1 and above the P-type semiconductor 7 is used to seal between the packaging body 1 and the P-type semiconductor 7, so as to ensure the service life of the P-type semiconductor 7 and the connecting components thereof, and since the second filling resin 14 extends to the inside of the circular groove 16, the contact area of the second filling resin 14 and the packaging body 1 can be further expanded, so that after the second filling resin 14 is filled, the second filling resin 14 and the packaging body 1 are prevented from being easily separated.
[0034] Referring to Figure 4 The first filling resin 13 is filled between the connecting body 2 and the substrate 5 of the packaging body 1;
[0035] In use, the first filling resin 13 filled between the connecting body 2 and the substrate 5 of the packaging body 1 is used to increase the sealing effect of the packaging body 1 and the connecting body 2 at the bottom of the substrate 5, so as to prevent the high temperature and high humidity environment outside from affecting the normal light emission of the device.
[0036] The above merely describes preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement and improvement made within the principles of the present application shall be included in the protection scope of the present application.
Claims
1. An LED integrated package light source based on semiconductor light emitting technology, characterized by: The application relates to a packaging body (1) which is provided with a connecting body (2) at the bottom, a flow-through groove (3) at the bottom of the connecting body (2), flow-through holes (4) which are uniformly arranged on the packaging body (1) and are connected with the flow-through groove (3), a circular arc groove (15) arranged at the inner side of the packaging body (1), a circular groove (16) arranged on the packaging body (1) and located at the inner side of the circular arc groove (15), a plug-in groove (18) arranged on the packaging body (1) and located at the outer side of the circular groove (16), a reflecting plate (17) which is plugged into the plug-in groove (18), a base plate (5) which is fixedly arranged at the inner side of the packaging body (1), an N-type semiconductor (6) which is fixedly arranged at the top of the base plate (5), and a P-type semiconductor (7) which is fixedly arranged at the top of the N-type semiconductor (6).
2. A LED integrated package light source based on semiconductor light emitting technology according to claim 1, characterized in that: The base plate (5) and the N-type semiconductor (6) are fixedly provided with a protective shell (9), the middle part of the protective shell (9) is fixedly provided with a partition strip (10), the P-type semiconductor (7) is provided with a reserved groove (8), and the protective shell (9) is located at the inner side of the reserved groove (8).
3. The LED integrated package light source based on semiconductor light emitting technology according to claim 1, characterized in that: The N-type semiconductor (6) is fixedly connected with a second lead wire (12), the P-type semiconductor (7) is fixedly connected with a first lead wire (11), and the first lead wire (11) and the second lead wire (12) both extend to the outer side of the connecting body (2).
4. The LED integrated package light source based on semiconductor light emitting technology according to claim 1, characterized in that: The reflecting plate (17) is composed of a plurality of cuboids and a half circular ring.
5. The LED integrated package light source based on semiconductor light emitting technology according to claim 1, characterized in that: The inner side of the packaging body (1) and above the P-type semiconductor (7) is filled with a second filling resin (14), the second filling resin (14) is attached to the circular arc groove (15), and the second filling resin (14) extends to the inner side of the circular groove (16).
6. The LED integrated package light source based on semiconductor light emitting technology according to claim 1, characterized in that: The connecting body (2) and the base plate (5) on the packaging body (1) are filled with a first filling resin (13).