Curing jig and chip packaging equipment
By designing the fixing groove and pressure plate assembly of the curing fixture, the problem of insufficient back deformation restriction of module products in traditional chip packaging equipment is solved, and higher packaging yield and production yield are achieved.
Patent Information
- Application Number
- CN202423290647.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2034-12-30
AI Technical Summary
Traditional chip packaging equipment's curing fixtures cannot effectively limit the deformation of the back of the module product during the thermosetting process, resulting in insufficient flatness of the back surface of the packaging shell.
A curing fixture was designed, including a base and a pressure plate assembly. By cooperating with the fixing groove and the pressure plate assembly, the bottom of the fixing groove abuts against the back of the module product, and the pressure plate assembly provides thrust to limit the deformation of the module product, thereby improving the flatness of the back surface.
This improved the flatness of the back surface of the module product, and increased the curing yield and production yield of the packaging shell.
Smart Images
Figure CN223859617U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of chip packaging, and in particular to a curing jig and a chip packaging device. BACKGROUND
[0002] When the module product is used, the back of the product is attached to the heat sink, and the flatness of the attachment has a crucial influence on the heat dissipation of the module, so the surface flatness of the back of the module product is very important when the chip of the module product is packaged. When the packaging shell is cured and shaped, the curing jig of the traditional chip packaging device usually presses the edge of the back of the shell by pressing block, so that the middle part of the back of the module product cannot be limited by the deformation of the jig during the heat curing process, and further causes the surface flatness of the back of the packaging shell to be insufficient. CONTENT OF THE UTILITY MODEL
[0003] Therefore, the utility model aims at overcoming the defects in the prior art, and provides a curing jig which can improve the surface flatness of the back of the module product.
[0004] The present application also provides a chip packaging device.
[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the present application is as follows:
[0006] According to the curing jig of the first aspect of the present application, the curing jig comprises a base, the base is provided with a fixing groove, the fixing groove is used for placing a module product, the groove bottom of the fixing groove and the groove opening of the fixing groove are arranged opposite along a first direction, the groove bottom of the fixing groove is used for abutting against the back of the module product, and the groove opening of the fixing groove is used for making at least part of the module product protrude from the fixing groove; a pressing plate assembly is connected with the base and arranged opposite to the fixing groove along the first direction, the pressing plate assembly is used for pressing at least part of the module product protruding from the fixing groove, and is used for providing a pushing force along the first direction towards the groove bottom of the fixing groove to the module product.
[0007] The curing jig of the utility model has the following advantages:
[0008] In the curing jig of the present application, when curing the package shell of the module product, the module product can be placed at least partially in the fixing groove to be fixed by the fixing groove. In this process, since the groove bottom of the fixing groove is used to abut against the back of the module product, the module product protrudes at least partially from the fixing groove, and the pressing plate assembly is used to press at least partially on the module product protruding from the fixing groove and to provide a pushing force to the module product along the first direction towards the groove bottom of the fixing groove. Therefore, when the pressing plate assembly provides a pushing force to the module product along the first direction towards the groove bottom of the fixing groove, the groove bottom of the fixing groove can apply a reaction force to the module product along the first direction towards the groove opening of the fixing groove to limit the deformation of the back of the module product by the groove bottom of the fixing groove, thereby improving the surface flatness of the back of the module product.
[0009] According to the curing jig of the first aspect of the present application, the curing jig further comprises a second direction intersecting with the first direction, and the base is provided with a curing groove group comprising a plurality of fixing grooves arranged along the second direction.
[0010] According to the curing jig of the first aspect of the present application, the pressing plate assembly is arranged along the second direction and covers each fixing groove of the curing groove group along the second direction.
[0011] According to the curing jig of the first aspect of the present application, the curing jig further comprises a third direction intersecting with the second direction and the first direction respectively, and the base is provided with a plurality of curing groove groups and a plurality of pressing plate assemblies. The plurality of curing groove groups are arranged along the third direction at intervals, and each pressing plate assembly is arranged opposite to a curing groove group along the first direction.
[0012] According to the curing jig of the first aspect of the present application, the pressing plate assembly comprises a pressing plate and a plurality of pressing block groups. The pressing plate is connected to the base and arranged opposite to the fixing groove along the first direction. The pressing plate is arranged along the second direction. The plurality of pressing block groups are arranged at intervals along the second direction on one side of the pressing plate close to the fixing groove along the first direction. Each pressing block group comprises a plurality of pressing blocks arranged at intervals and enclosed to define an avoiding space.
[0013] According to the curing jig of the first aspect of the present application, the pressing block is an elastic pressing block, and each elastic pressing block is bonded to the pressing plate.
[0014] According to the curing jig of the first aspect of the present application, the pressing block is a plastic pressing block, and the pressing plate assembly further comprises an elastic member having elastic potential energy in the first direction, one end of the elastic member being connected with the pressing plate, and the other end of the elastic member being connected with the plastic pressing block.
[0015] According to the curing jig of the first aspect of the present application, both ends of the pressing plate in the second direction are movably connected with the base.
[0016] According to the curing jig of the first aspect of the present application, one end of the pressing plate in the second direction is hingedly connected with the base, and the other end of the pressing plate in the second direction is clampingly connected with the base.
[0017] According to the chip packaging device of the second aspect of the present application, the chip packaging device comprises the curing jig as described above.
[0018] The chip packaging device of the present application has the following advantages.
[0019] In the chip packaging device of the present application, since the curing jig described above can improve the surface flatness of the back of the module product, the chip packaging device of the present application can have a higher packaging yield and a higher production yield of the module product. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor.
[0021] Figure 1 The connection structure between the base and the module product in the present application is shown Figure 1 ;
[0022] Figure 2 The connection structure between the base and the module product in the present application is shown Figure 2 ;
[0023] Figure 3 The structure of the base in the present application is shown
[0024] Figure 4 The structure of the pressing plate assembly in the present application is shown
[0025] Figure 5 The connection structure between the pressing plate and the pressing block in an embodiment of the present application is shown
[0026] Figure 6Fig. 2 shows a schematic view of a connection structure between a pressing plate and a pressing block according to another embodiment of the present application.
[0027] Main element symbol explanation:
[0028] 10 - curing jig;
[0029] 100 - base; 110 - fixing groove; 120 - curing groove group;
[0030] 200 - pressing plate assembly; 210 - pressing plate; 220 - pressing block group; 221 - pressing block; 230 - avoiding space; 240 - elastic member;
[0031] 20 - module product;
[0032] z - first direction; y - second direction; x - third direction. DETAILED DESCRIPTION
[0033] Embodiments of the present application are described in detail below with reference to the attached drawings, wherein the same or similar components have the same or similar designations throughout the several views. The embodiments described below are examples of the present application, and are not intended to limit the present application.
[0034] In the description of the present application, it is to be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" are based on the orientations or positional relationships shown in the drawings, and are merely for the purpose of facilitating the description of the present application and simplifying the description, and are not intended to indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be construed as limiting the present application.
[0035] In addition, the terms "first" and "second" are used only for descriptive purposes, and cannot be construed as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first" and "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified.
[0036] In the present application, unless specifically defined otherwise and limited, the terms "mount", "connect", "connection", "fixed", and the like should be understood broadly, for example, can be fixed connection, can also be detachable connection, or integral; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0037] In the present application, unless specifically defined otherwise and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be in indirect contact through an intermediate medium. Moreover, the first feature "above", "over" and "on" the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "under" and "under" the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0038] Referring to FIGS. 1-2, Figure 1 and Figure 3 The curing jig 10 related to the embodiments of the present application includes a base 100 and a pressing plate assembly 200.
[0039] Specifically, the base 100 is provided with a fixing groove 110 for placing the module product 20. The groove bottom of the fixing groove 110 and the groove opening of the fixing groove 110 are oppositely arranged along a first direction z. The groove bottom of the fixing groove 110 is used to abut against the back of the module product 20, and the groove opening of the fixing groove 110 is used to make at least part of the module product 20 protrude out of the fixing groove 110. The pressing plate assembly 200 is connected with the base 100 and oppositely arranged with the fixing groove 110 along the first direction z. The pressing plate assembly 200 is used to press at least part of the module product 20 protruding out of the fixing groove 110, and to provide a pushing force along the first direction z towards the groove bottom of the fixing groove 110 to the module product 20.
[0040] It should be noted that the first direction z is Figure 1 the direction indicated by z.
[0041] In the curing jig 10 of the present application, when curing the package shell of the module product 20, the module product 20 can be placed at least partially in the fixing groove 110 to be fixed by the fixing groove 110, in which process, since the groove bottom of the fixing groove 110 is used to abut against the back of the module product 20, the module product 20 is at least partially protruded from the fixing groove 110, and the pressing plate assembly 200 is used to press at least the part of the module product 20 protruded from the fixing groove 110 and to provide a pushing force along the first direction z towards the groove bottom of the fixing groove 110 to the module product 20, thus, when the pressing plate assembly 200 provides a pushing force along the first direction z towards the groove bottom of the fixing groove 110 to the module product 20, the groove bottom of the fixing groove 110 can apply a reaction force along the first direction z towards the groove opening of the fixing groove 110 to the module product 20 to limit the deformation of the back of the module product 20 by the groove bottom of the fixing groove 110, thereby improving the surface flatness of the back of the module product of the module product 20.
[0042] Referring to Figure 2 As shown in the figure, the curing jig 10 further comprises a second direction y, the second direction y intersects the first direction z, the base 100 is provided with a curing groove group 120, the curing groove group 120 comprises a plurality of fixing grooves 110 arranged along the second direction y.
[0043] It should be noted that the second direction y is Figure 1 the direction indicated by y in the figure.
[0044] In the present embodiment, the curing groove group 120 comprises a plurality of fixing grooves 110 arranged along the second direction y, thus, when curing the module product 20, a plurality of module products 20 can be simultaneously fixed by the curing jig 10 to improve the curing efficiency of the package shell of the module product 20, thereby improving the packaging efficiency of the chip.
[0045] Referring to Figure 2 and Figure 4 As shown in the figure, the pressing plate assembly 200 is arranged along the second direction y and covers each fixing groove 110 of the curing groove group 120 along the second direction y.
[0046] In the present embodiment, since the pressing plate assembly 200 is arranged along the second direction y and covers each fixing groove 110 of the curing groove group 120 along the second direction y, the pressing plate assembly 200 can simultaneously apply a pushing force along the first direction z towards the groove bottom of the fixing groove 110 to a plurality of fixing grooves 110 of the curing groove group 120 to limit the deformation of the back of the module product 20 by the groove bottom of the fixing groove 110, thereby improving the curing yield and product consistency of the package shell of the module product 20.
[0047] Referring to Figure 2As shown, the curing jig 10 further comprises a third direction x intersecting the second direction y and the first direction z respectively, the base 100 is provided with a plurality of curing groove groups 120 and a plurality of pressing plate assemblies 200, the plurality of curing groove groups 120 are arranged at intervals along the third direction x, and each pressing plate assembly 200 is arranged opposite to a curing groove group 120 along the first direction z.
[0048] It should be noted that the third direction x is Figure 1 the direction indicated by x.
[0049] In this embodiment, since the base 100 is provided with a plurality of curing groove groups 120 and a plurality of pressing plate assemblies 200, the plurality of curing groove groups 120 are arranged at intervals along the third direction x, and each pressing plate assembly 200 is arranged opposite to a curing groove group 120 along the first direction z, the plurality of module products 20 can be fixed by the plurality of curing groove groups 120, so as to further improve the curing efficiency of the packaging shell of the module product 20, and further, the plurality of module products 20 fixed in the curing groove group 120 can be pressed by the plurality of pressing plate assemblies 200 along the first direction z towards the groove bottom of the fixing groove 110, so as to limit the deformation of the back of the module product 20 by the groove bottom of the fixing groove 110, thereby further improving the curing yield and product consistency of the packaging shell of the module product 20.
[0050] Referring to Figure 4 As shown, the pressing plate assembly 200 comprises a pressing plate 210 and a plurality of pressing block groups 220, the pressing plate 210 is connected with the base 100 and arranged opposite to the fixing groove 110 along the first direction z, the pressing plate 210 extends along the second direction y, and the plurality of pressing block groups 220 are arranged at intervals on the side of the pressing plate 210 close to the fixing groove 110 along the first direction z, each pressing block group 220 comprises a plurality of pressing blocks 221 arranged at intervals and enclosed to define an avoiding space 230.
[0051] It should be noted that in the module product 20, one side opposite to the back of the module product 20 is provided with a plurality of PIN pins, and the electrical connection between the module product 20 and the external device is realized by the plurality of PIN pins.
[0052] In the embodiment, the pressing plate 210 and the fixing groove 110 are oppositely arranged along the first direction z and extend along the second direction y, and the plurality of pressing block groups 220 are arranged along the second direction y on the side of the pressing plate 210 close to the fixing groove 110 along the first direction z, so that the plurality of module products 20 fixed in the fixing groove 110 group can be pressed by the plurality of pressing block groups 220 to improve the curing yield of the packaging shell of the module product 20 and the product consistency, the plurality of pressing block groups 220 can be fixed by the pressing plate 210 to improve the consistency of the pushing force of the plurality of pressing block groups 220 on the module product 20 along the first direction z towards the groove bottom of the fixing groove 110, further, the plurality of pressing block groups 220 can be driven by the pressing plate 210 to press the module product 20 to improve the convenience of the pressing block group 220 pressing the module product 20. Since each pressing block group 220 includes a plurality of pressing blocks 221, the plurality of pressing blocks 221 are arranged in a spaced and enclosed manner to define an avoiding space 230, so that the plurality of pressing blocks 221 can simultaneously press the module product 20 to improve the pressing effect on the module product 20, and the PIN pin of the module product 20 can be avoided by the avoiding space 230 to avoid damage to the PIN pin by the pressing block 221.
[0053] Specifically, generally, the packaging shell of the module product 20 is a rectangular shell, each pressing block group 220 includes four pressing blocks 221, and each pressing block 221 is arranged at one corner of the packaging shell of the module product 20.
[0054] Referring to Figure 5 In some embodiments, the pressing block 221 is an elastic pressing block 221, and each elastic pressing block 221 is bonded to the pressing plate 210.
[0055] Specifically, the elastic pressing block 221 is bonded to the pressing plate 210 by high-temperature adhesive.
[0056] In the embodiment, the elastic pressing block 221 can be bonded to the pressing plate 210 to realize the connection of the pressing block 221 and the pressing plate 210, and when the elastic pressing plate 210 is arranged on the module product 20, the elastic force of the elastic pressing block 221 can provide a buffer force for the pressing of the module product 20 by the pressing block 221 to avoid damage to the module product 20 by the pressing block 221.
[0057] Referring to Figure 6 In other embodiments, the pressing block 221 is a plastic pressing block 221, and the pressing plate assembly 200 further includes an elastic member 240 having an elastic potential energy along the first direction z, one end of the elastic member 240 is connected to the pressing plate 210, and the other end of the elastic member 240 is connected to the plastic pressing block 221.
[0058] In the embodiment, since one end of the elastic member 240 is connected with the pressing plate 210 and the other end of the elastic member 240 is connected with the plastic pressing block 221, the plastic pressing block 221 can be connected with the pressing plate 210 through the elastic member 240, and since the elastic member 240 has elastic potential energy along the first direction z, when the plastic pressing block 221 is pressed on the module product 20, the elastic force of the elastic member 240 can provide buffering force for the pressing of the plastic pressing block 221 on the module product 20, so as to avoid damage of the module product 20 caused by the plastic pressing block 221.
[0059] Specifically, both ends of the pressing plate 210 along the second direction y are movably connected with the base 100.
[0060] In the embodiment, since both ends of the pressing plate 210 along the second direction y are movably connected with the base 100, the pressing plate 210 can be conveniently disassembled, and the module product 20 can be conveniently installed and disassembled on the curing jig 10, so as to improve the chip packaging efficiency of the module product 20.
[0061] Specifically, one end of the pressing plate 210 along the second direction y is hingedly connected with the base 100, and the other end of the pressing plate 210 along the second direction y is clampedly connected with the base 100.
[0062] Specifically, the one end of the pressing plate 210 hingedly connected with the base 100 can rotate relative to the base 100 around the third direction x.
[0063] In the embodiment, since one end of the pressing plate 210 along the second direction y is hingedly connected with the base 100 and the other end of the pressing plate 210 along the second direction y is clampedly connected with the base 100, the pressing plate assembly 200 can realize pressing and loosening of the module product 20 through the clamped connection of the pressing plate 210 with the base 100, so as to improve the fixing convenience of the module product 20, and the pressing plate assembly 200 can be rotatably connected with the base 100 through the hinge connection of the pressing plate 210 with the base 100, so as to avoid interference between the module product 20 and the pressing plate assembly 200 during the fixing of the module product 20.
[0064] The chip packaging device provided in the embodiment comprises the curing jig 10.
[0065] In the chip packaging device, since the curing jig 10 can improve the surface flatness of the back of the module product, the chip packaging device can have higher packaging yield and higher production yield of the module product 20.
[0066] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any suitable manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the specification and the features of the different embodiments or examples without contradiction.
[0067] Although the embodiments of the present application have been shown and described above, it is understood that the above-described embodiments are exemplary and are not to be construed as limiting the present application, and the person skilled in the art can make changes, modifications, replacements and variations to the above-described embodiments within the scope of the present application.
Claims
1. A curing fixture, characterized by, The curing fixture comprises: a base provided with a fixing groove for placing a module product, a groove bottom of the fixing groove and a groove opening of the fixing groove being oppositely arranged along a first direction, the groove bottom being used for abutting against a back of the module product, and the groove opening being used for allowing at least a part of the module product to protrude out of the fixing groove; a pressing plate assembly connected with the base and oppositely arranged with the fixing groove along the first direction, the pressing plate assembly being used for pressing at least a part of the module product protruding out of the fixing groove and for providing a pushing force along the first direction towards the groove bottom of the fixing groove to the module product.
2. The curing fixture of claim 1, wherein, The curing fixture further comprises a second direction intersecting with the first direction, the base is provided with a curing groove group comprising a plurality of fixing grooves arranged along the second direction.
3. The curing fixture of claim 2, wherein, The pressing plate assembly is arranged along the second direction and covers each fixing groove of the curing groove group along the second direction.
4. The curing fixture of claim 3, wherein, The curing fixture further comprises a third direction intersecting with the second direction and the first direction respectively, the base is provided with a plurality of curing groove groups and a plurality of pressing plate assemblies, the plurality of curing groove groups are arranged along the third direction at intervals, and each pressing plate assembly is oppositely arranged with a curing groove group along the first direction.
5. The curing fixture of claim 3, wherein, The pressing plate assembly comprises a pressing plate and a plurality of pressing block groups, the pressing plate is connected with the base and oppositely arranged with the fixing groove along the first direction, the pressing plate is arranged along the second direction, and the plurality of pressing block groups are arranged at intervals along the second direction on a side of the pressing plate close to the fixing groove along the first direction, each pressing block group comprises a plurality of pressing blocks arranged at intervals and enclosed to define an avoiding space.
6. The curing fixture of claim 5, wherein, The pressing block is an elastic pressing block, and each elastic pressing block is bonded with the pressing plate.
7. The curing fixture of claim 5, wherein, The pressing block is a plastic pressing block, and the pressing plate assembly further comprises an elastic member having an elastic potential energy along the first direction, one end of the elastic member is connected with the pressing plate, and the other end of the elastic member is connected with the plastic pressing block.
8. The curing fixture of claim 5, wherein, Both ends of the pressing plate along the second direction are movably connected with the base.
9. The curing fixture of claim 8, wherein, One end of the pressing plate along the second direction is hingedly connected with the base, and the other end of the pressing plate along the second direction is clampedly connected with the base.
10. A chip packaging apparatus, characterized by comprising: The curing fixture comprises: The curing fixture of any one of claims 1-9.