Ball mounting device and semiconductor packaging structure
By setting coaxial ball placement grooves and copper pillar protection holes at the bottom of the chip placement slot in the ball placement fixture, the problem of chip copper pillars falling off is solved, improving the reliability and stability of the semiconductor packaging structure, reducing the defect rate, and improving electrical performance and production efficiency.
Patent Information
- Application Number
- CN202423293588.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-01-30
- Estimated Expiration
- 2034-12-30
AI Technical Summary
In existing semiconductor packaging structures, the chip copper pillars are prone to falling off, causing test disconnection problems.
A chip placement groove and a copper pillar protection hole are set at the bottom of the chip placement groove of the chip placement fixture, and the two are set coaxially. The copper pillar of the chip to be packaged is housed in the copper pillar protection hole, and the copper pillar is fixed and protected by the copper pillar protection hole to prevent it from falling off.
It effectively prevents the copper pillars from falling off during the packaging process due to external forces, improves the reliability and stability of the packaging structure, reduces the defect rate, and improves electrical performance and production efficiency.
Smart Images
Figure CN223859665U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor packaging, in particular to a ball mounting device and a semiconductor packaging structure. BACKGROUND
[0002] With the rapid development of the semiconductor industry, fan-out wafer level packaging structures are widely used in the semiconductor industry, and the main advantages are high-density integration, small product size, superior product performance, fast signal transmission frequency, etc. The fan-out wafer level packaging structure usually uses formic acid reflow to form a tin ball at the end of the copper column. The chip copper column of the packaging structure in the prior art is prone to falling off, which can cause the test to be disconnected. CONTENT OF THE INVENTION
[0003] The purpose of the present application is to provide a ball mounting device and a semiconductor packaging structure, which can solve the problem of test disconnection caused by the chip copper column falling off in the packaging structure in the prior art.
[0004] The embodiments of the present application are implemented as follows:
[0005] In a first aspect of the embodiments of the present application, a ball mounting device is provided, which includes a ball mounting jig, a chip placement slot is arranged on the ball mounting jig, a ball mounting groove and a copper column protection hole are arranged at the bottom of the chip placement slot, the ball mounting groove and the copper column protection hole are coaxially arranged, and when a chip to be packaged is placed in the chip placement slot, the copper column of the chip to be packaged is accommodated in the copper column protection hole. The ball mounting device can solve the problem of test disconnection caused by the chip copper column falling off in the packaging structure in the prior art.
[0006] As an implementable manner, the diameter of the ball mounting groove is greater than the diameter of the copper column protection hole.
[0007] As an implementable manner, the depth of the ball mounting groove is less than the depth of the copper column protection hole.
[0008] As an implementable manner, the number of the ball mounting grooves is multiple, and the multiple ball mounting grooves are distributed at intervals along the bottom of the chip placement slot.
[0009] As an implementable manner, the depth of the chip placement slot is greater than the thickness of the chip to be packaged.
[0010] As an implementable manner, a glue body is further arranged in the chip placement slot and located on the side of the chip to be packaged away from the copper column.
[0011] As an implementable mode, the side wall of the chip placing groove is provided with a heat dissipation hole, and the heat dissipation hole is arranged in a penetrating manner along the connecting direction of the side wall of the chip placing groove and the side wall of the ball mounting jig.
[0012] As an implementable mode, the number of the heat dissipation holes is multiple, and the multiple heat dissipation holes are uniformly distributed along the side wall of the chip placing groove.
[0013] As an implementable mode, the ball mounting jig is made of ceramic or metal.
[0014] The second aspect of the embodiment of the present application provides a semiconductor packaging structure, which comprises a chip to be packaged and the ball mounting device, the surface of the chip to be packaged is provided with a copper column, the chip to be packaged is placed in the chip placing groove of the ball mounting device, and the copper column of the chip to be packaged is correspondingly accommodated in the copper column protection hole of the ball mounting device. The ball mounting device can solve the problem that the packaging structure in the prior art is prone to test disconnection due to the falling of the copper column of the chip.
[0015] The beneficial effects of the embodiment of the present application include:
[0016] The ball mounting device comprises a ball mounting jig, a chip placing groove is arranged on the ball mounting jig, a ball mounting groove and a copper column protection hole are arranged on the groove bottom of the chip placing groove, and the ball mounting groove and the copper column protection hole are coaxially arranged. When the chip to be packaged is placed in the chip placing groove, the copper column of the chip to be packaged is correspondingly accommodated in the copper column protection hole. Compared with the prior art, the ball mounting device provided by the present application can accommodate, fix and protect the copper column by adding the copper column protection hole on the groove bottom of the chip placing groove during the ball mounting process, effectively preventing the copper column from falling due to various reasons during the packaging process, thereby avoiding packaging failure or test disconnection caused by the falling of the copper column, greatly improving the reliability and stability of the semiconductor packaging structure, and reducing the product failure rate. BRIEF DESCRIPTION OF DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following will briefly introduce the drawings needed to be used in the embodiments. It should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can also be obtained without creative labor on the basis of these drawings.
[0018] Figure 1 An exploded view of the semiconductor packaging structure provided by the embodiment of the present application;
[0019] Figure 2 A structural schematic view of the chip to be packaged provided by the embodiment of the present application;
[0020] Figure 3 A structure diagram of a chip placement slot provided by an embodiment of the present application is shown in the following figure;
[0021] Figure 4 A structure diagram of a semiconductor package structure provided by an embodiment of the present application is shown in the following figure;
[0022] Figure 5 A structure diagram of a semiconductor package structure provided by another embodiment of the present application is shown in the following figure.
[0023] Figure: 100-semiconductor package structure; 10-ball placement tool; 11-chip placement slot; 111-ball placement groove; 112-copper column protection hole; 113-heat dissipation hole; 20-gel; 30-chip to be packaged; 31-copper column. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions of the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments of the present application. The components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.
[0025] Therefore, the following detailed description of the embodiments of the present application provided in the drawings is not intended to limit the scope of the claimed present application, but only represents selected embodiments of the present application. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in the present application without making creative efforts are within the scope of protection of the present application.
[0026] It should be noted that: similar reference numerals and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.
[0027] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the present application is used, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" and the like are only used for differentiation in description, and cannot be understood as indicating or implying relative importance.
[0028] Furthermore, terms such as "horizontal", "vertical" and the like are used as terms of convenience to provide reference frames for description purposes and are not intended to limit the position of the components. For example, "horizontal" merely refers to a direction that is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal but can be slightly tilted.
[0029] In the description of the present application, it should also be noted that unless specifically stated and limited otherwise, the terms "set", "mounted", "connected", "linked" should be understood broadly, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, can be electrically connected; can be directly connected, can be indirectly connected through an intermediate medium, or can be connected inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0030] Please refer to Figures 1 to 5 The embodiment of the present application provides a ball mounting device, which comprises a ball mounting jig 10, a chip placing groove 11 is arranged on the ball mounting jig 10, a ball mounting groove 111 and a copper column protection hole 112 are arranged on the groove bottom of the chip placing groove 11, and the ball mounting groove 111 and the copper column protection hole 112 are coaxially arranged. When the chip to be packaged 30 is placed in the chip placing groove 11, the copper column 31 of the chip to be packaged 30 is correspondingly accommodated in the copper column protection hole 112. The ball mounting device can solve the problem that the packaging structure in the prior art is prone to disconnection in testing due to the falling of the copper column 31 of the chip.
[0031] It should be noted that, as Figures 1 to 3 shown, the ball mounting device comprises a ball mounting jig 10, a chip placing groove 11 is arranged on the ball mounting jig 10, and the chip placing groove 11 is a specific position for placing the chip to be packaged 30. A ball mounting groove 111 and a copper column protection hole 112 are arranged on the groove bottom of the chip placing groove 11, and the two are coaxially arranged. When the chip to be packaged 30 is placed in the chip placing groove 11, the copper column 31 on the chip to be packaged 30 can be accurately placed in the copper column protection hole 112. In this way, in the ball mounting process, the copper column 31 can be accommodated, fixed and protected by the copper column protection hole 112, so as to avoid the copper column 31 from being affected by external force in the ball mounting process, thereby avoiding the position deviation or falling phenomenon, and improving the reliability and stability of the semiconductor packaging structure 100.
[0032] Compared with the prior art, the ball mounting device provided by the present application adds a copper column protection hole 112 at the groove bottom of the chip placing groove 11, effectively prevents the copper column 31 from falling in the packaging process due to various reasons (such as vibration, collision in operation, etc.), thereby avoiding the problems of packaging failure or test disconnection caused by the falling of the copper column 31, greatly improving the reliability and stability of the packaging structure, and reducing the product failure rate.
[0033] Moreover, the ball mounting device provided by the application also effectively improves the accuracy of the ball mounting position through the coaxial arrangement of the ball mounting groove 111 and the copper column protection hole 112. During the ball mounting operation, the solder ball can be accurately placed in the ball mounting groove 111 and form a good electrical connection with the copper column 31. This accurate ball mounting method helps to ensure the electrical performance of the chip to be packaged 30, reduces the problems such as short circuit and open circuit that may be caused by inaccurate ball mounting position, and improves the overall performance and working efficiency of the chip to be packaged 30.
[0034] In this way, since the ball mounting device provided by the application can effectively avoid the problem of copper column 31 falling off, the rework and repair work required due to packaging failure can be reduced, thereby saving production time and cost and improving production efficiency. At the same time, since the ball mounting device provided by the application can improve the accuracy of ball mounting, it helps to improve the one-time packaging success rate and further speed up the production process.
[0035] In addition, the ball mounting device provided by the application has a simple structure and is easy to operate and use. The operator only needs to correctly place the chip to be packaged 30 in the chip placement groove 11, and then perform the subsequent ball mounting operation, which reduces the requirement for the technical level and operation experience of the operator and facilitates wide application in production.
[0036] As an implementable manner, the diameter of the ball mounting groove 111 is greater than the diameter of the copper column protection hole 112.
[0037] It should be noted that, as shown in Figure 1 and Figure 3 The ball mounting groove 111 and the copper column protection hole 112 are two important structures on the chip placement groove 11 of the ball mounting jig 10, wherein the ball mounting groove 111 is used for placing the solder ball and is a key part for the chip to be packaged 30 to realize electrical connection with the external circuit; and the copper column protection hole 112 is used for accommodating the copper column 31 of the chip to be packaged 30 to play a role of accommodating, fixing and protecting the copper column 31.
[0038] The diameter of the ball mounting groove 111 is greater than the diameter of the copper column protection hole 112, which means that the ball mounting groove 111 occupies a larger space range on the plane where the groove bottom of the chip placement groove 11 is located. This size relationship can make the solder ball have enough space for placement and will not affect the connection between the solder ball and the copper column 31 due to too small space. At the same time, the smaller copper column protection hole 112 can tightly wrap the copper column 31 of the chip and better fix the position of the copper column 31 to prevent displacement or damage of the copper column 31 during the ball mounting process.
[0039] It should be understood that the shape and size of the copper pillar protection hole 112 are adapted to the shape and size of the copper pillar 31. As an implementable manner, the depth of the ball placement groove 111 is less than the depth of the copper pillar protection hole 112.
[0040] It should be noted that, as shown in Figure 2 and Figure 3 , the ball placement groove 111 is used for placing the solder ball, and the depth is relatively shallow; while the copper pillar protection hole 112 is used for accommodating the copper pillar 31, and the depth is relatively deep. Under this structure design, when the chip to be packaged 30 is placed in the chip placement groove 11, the copper pillar 31 can be deeply inserted into the copper pillar protection hole 112, and the ball placement groove 111 only needs to provide appropriate space for the solder ball to be stably placed inside.
[0041] The deeper copper pillar protection hole 112 can provide more sufficient protection for the copper pillar 31 of the chip to be packaged 30. During the entire ball placement process and subsequent possible processing, transportation and other links, since the copper pillar 31 is fixed deeply in the copper pillar protection hole 112, the possibility of damage to the copper pillar 31 caused by external factors (such as collision, friction, etc.) is reduced. For example, when the equipment on the production line vibrates or the chip is accidentally touched by manual operation, since the copper pillar 31 is in the relatively deep copper pillar protection hole 112, it is not easy to be disturbed by external force to be broken or deformed.
[0042] Considering that the chip usually has multiple pins or connection points (i.e. copper pillars 31), as an implementable manner, as shown in Figure 1 and Figure 3 , in the embodiment, the number of ball placement grooves 111 is multiple, and the multiple ball placement grooves 111 are distributed along the groove bottom of the chip placement groove 11 at intervals, so that each ball placement groove 111 can correspond to one connection point respectively. By placing solder balls in these ball placement grooves 111, each functional pin (such as power pin, data transmission pin, ground pin, etc.) of the chip can be connected to the external circuit respectively.
[0043] As an implementable manner, as shown in Figure 1 , the depth of the chip placement groove 11 is greater than the thickness of the chip to be packaged 30. In this way, after the chip is placed in the chip placement groove 11, the upper surface of the chip (i.e. the side away from the copper pillar 31) is lower than the edge of the chip placement groove 11, and there is a certain space above the chip. As shown in Figure 1 and Figure 4 , the ball placement device further comprises a colloid 20. At this time, by fixing the colloid 20 in the chip placement groove 11 and on the side (i.e. the above-mentioned space) away from the copper pillar 31 of the chip to be packaged 30, the packaging, fixation and protection of the chip to be packaged 30 can be realized through the cooperation of the colloid 20 and the ball placement jig 10.
[0044] As an implementable manner, as shown in Figure 5 The side wall of the chip placement slot 11 is provided with a plurality of heat dissipation holes 113, and the heat dissipation holes 113 are arranged in a penetrating manner along the direction of the line connecting the side wall of the chip placement slot 11 and the side wall of the ball mounting jig 10. In this way, a channel for heat dissipation can be formed between the side wall of the chip placement slot 11 and the side wall of the ball mounting jig 10. When the chip generates heat, the heat can be quickly dissipated through the heat dissipation holes 113 in the side wall of the chip placement slot 11, effectively preventing the chip from being damaged due to overheating.
[0045] As an implementable manner, as shown in Figure 5 The plurality of heat dissipation holes 113 are uniformly distributed along the side wall of the chip placement slot 11. In this way, the heat dissipation effect of the chip can be effectively improved.
[0046] As an implementable manner, the material of the ball mounting jig 10 is ceramic or metal. For example, when the material of the ball mounting jig 10 is ceramic, the electrical connection points can be kept insulated to prevent current leakage, thereby improving the electrical performance and reliability of the packaged chip. In addition, since the ceramic material is generally not easy to react with other chemical substances, it can resist the erosion of these chemical substances, maintain its performance and structural integrity, and prolong the service life of the ball mounting jig 10. Alternatively, when the material of the ball mounting jig 10 is metal, the heat generated by the chip can be effectively conducted to the surrounding environment. In addition, since the metal material has high strength and toughness, it can withstand a certain degree of external impact and mechanical pressure, thereby ensuring the structural integrity of the ball mounting jig 10. Those skilled in the art can make reasonable selection and design according to the actual situation, which is not limited here.
[0047] In a second aspect, the application provides a semiconductor packaging structure 100, which comprises a chip to be packaged 30 and the ball mounting device described above. The surface of the chip to be packaged 30 is provided with a copper column 31. The chip to be packaged 30 is placed in the chip placement slot 11 of the ball mounting device, and the copper column 31 of the chip to be packaged 30 is accommodated in the copper column protection hole 112 of the ball mounting device. The structure and advantages of the ball mounting device have been described in detail in the foregoing embodiments, and thus will not be described here.
[0048] The above is only an optional embodiment of the application and is not intended to limit the application. Those skilled in the art can make various modifications and changes to the application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the application shall be included in the protection scope of the application.
[0049] It should be further noted that the various technical features described in the above specific embodiments can be combined in any suitable manner, and the application is not limited to the combinations explicitly described.
Claims
1. A ball-planting device, characterized in that The ball mounting jig comprises a chip mounting groove, a ball mounting groove and a copper column protection hole are arranged on the groove bottom of the chip mounting groove, and the ball mounting groove and the copper column protection hole are coaxially arranged.
2. The device of claim 1, wherein The diameter of the ball mounting groove is greater than the diameter of the copper column protection hole.
3. The device of claim 1, wherein the ball implanting device is characterized by: The depth of the ball mounting groove is less than the depth of the copper column protection hole.
4. The device of claim 1, wherein, The number of the ball mounting grooves is multiple, and the multiple ball mounting grooves are distributed at intervals along the groove bottom of the chip mounting groove.
5. The device of claim 1, wherein, The depth of the chip mounting groove is greater than the thickness of the chip to be packaged.
6. The device of claim 5, wherein the ball is implanted in the patient's body. The chip mounting groove further comprises a colloid, which is fixedly arranged in the chip mounting groove and located on the side of the chip to be packaged away from the copper column.
7. The device of claim 1, wherein, The sidewall of the chip mounting groove is provided with a heat dissipation hole, and the heat dissipation hole is through along the direction of the line connecting the sidewall of the chip mounting groove and the sidewall of the ball mounting jig.
8. The ball implantation device of claim 7, wherein, The number of the heat dissipation holes is multiple, and the multiple heat dissipation holes are uniformly distributed along the sidewall of the chip mounting groove.
9. The device of claim 1, wherein, The material of the ball mounting jig is ceramic or metal.
10. A semiconductor package structure, comprising: The ball mounting device comprises a chip to be packaged and a ball mounting device according to any one of claims 1-9, the surface of the chip to be packaged is provided with a copper column, the chip to be packaged is placed in the chip mounting groove of the ball mounting device, and the copper column of the chip to be packaged is correspondingly accommodated in the copper column protection hole of the ball mounting device.