Multilayer patch antenna device, antenna module and vehicle having the same

Abstract

The utility model relates to a motor vehicle, an antenna module and a patch antenna arrangement (21), in particular for a motor vehicle (24), wherein the multilayer patch antenna arrangement (21) comprises: a lower dielectric substrate layer (6) having a lower antenna (5); and an upper dielectric substrate layer (2) having an upper antenna (1), in which the dielectric substrate layers (2, 6; ), and in which the dielectric substrate layers (2, 6) each comprise plastic.

Description

[0001] The invention relates to a multilayer patch antenna device, to an antenna module and to a vehicle having a multilayer patch antenna device.

[0002] According to the prior art, especially in the automotive sector, multilayer ceramic patch antennas are increasingly used in antenna devices for providing, for example, telephone services (2G-5G).

[0003] DE 10 2022 200 018.8 discloses one such multilayer ceramic patch antenna.

[0004] The object of the invention is to improve antennas, especially for motor vehicles. This object is accordingly achieved by the subject matter of the independent patent claim. Several particularly advantageous design schemes of the invention are given in the dependent claims and the description. The design schemes of the invention can be implemented as an alternative to existing solutions for advantageous multilayer patch antennas.

[0005] According to the dependent claims, several design schemes of the invention are as follows:

[0006] According to one design scheme of the invention, the multilayer patch antenna device comprises a lower dielectric substrate layer with a lower antenna, a middle dielectric substrate layer with a middle antenna, and an upper dielectric substrate layer with an upper antenna, wherein the at least three dielectric substrate layers are arranged stacked, and wherein the dielectric substrate layers each comprise plastic.

[0007] According to another design scheme of the invention, the antennas are each arranged on a dielectric substrate layer, especially in the form of a continuous or interrupted upper metal layer for forming an antenna structure (especially on the side of the respective dielectric substrate layer which, in the assembled state on a motor vehicle, faces away from the motor vehicle).

[0008] According to another design scheme of the invention, the dielectric substrate layers each have an antenna or antennas on one side and, on the side of the dielectric substrate layer opposite the antenna or antennas, a conductive, especially metallic, surface as a ground layer.

[0009] According to another design scheme of the invention, on the ground layer of one or more of the dielectric substrate layers and / or on one or more of the dielectric substrate layers or on the antennas, there is an adhesive layer, especially composed of an adhesive or a double-sided adhesive tape, and / or an insulating layer, which is or can be arranged on a circuit board or another dielectric substrate layer or an antenna.

[0010] According to a further design of the application, the patch antenna device is arranged or can be arranged on a circuit board, which has at least one contact area, in particular metallic, electrically conductive, wherein the feed pins are respectively connected, in particular capacitively, with the electrically conductive contact area, in order to respectively contact exactly one or more of the antennas via the feed pins.

[0011] According to a further design of the application, the patch antenna device has one or two or four or more feed pins, which respectively contact exactly one or more of the antennas, in particular capacitively (or inductively or galvanically).

[0012] According to a further design of the application, the patch antenna device has one or two or three or four or six or more feed pins, which respectively have, at their end, an angled or flat area (running parallel to the at least one antenna), one of the areas respectively being in capacitive or inductive contact with at least one of the antennas, and one of the areas respectively being provided for a capacitive (or galvanic or inductive) contact with the circuit board.

[0013] According to a further design of the application, the patch antenna device has feed pins, which extend through recesses in one or more of the dielectric substrate layers, and / or through recesses in one or more of the antennas, and / or through recesses in one or more of the ground surfaces and / or through recesses in one or more of the adhesive layers.

[0014] According to a further design of the application, one or more of the dielectric substrate layers respectively comprises one or more additives in the plastic to adjust its dielectric constant.

[0015] According to a further design of the application, two or more of the dielectric substrate layers have the same or different relative dielectric constants εR.

[0016] According to a further design of the application, the patch antenna device has at least one antenna or at least two antennas, which are designed for transmitting and / or receiving radio signals to or from a cellular mobile radio network for a transmission / reception frequency range,

[0017] in particular wherein the antenna size (including geometry) and thus the transmission / reception frequency range are suitable for transmitting and / or receiving cellular mobile radio signals in one or more 2G / 3G / 4G / 5G / 6G frequency bands.

[0018] According to a further design of the application, one or more or all of the dielectric substrate layers and / or antennas have a rectangular outer contour.

[0019] According to a further design of the application, the antenna structure of the antenna is made by means of chemical galvanic coating, wherein the areas that are not to be coated have been covered on the surface by means of pad printing or screen printing or by means of a spray method.

[0020] Further features and advantages of several advantageous designs of the application result from the following description of several embodiments of the application with the aid of the drawings, in which all the above-mentioned designs of the application also form designs of the application in any (multiple) combination.

[0021] Here, several designs of the application are illustrated in a simplified, schematic and exemplary manner in the drawings:

[0022] Figure 1 A first patch antenna device according to the application is shown in perspective, with two substrate layers, antennas and contact portions of the respective plurality of antennas,

[0023] Figure 2 A first patch antenna device according to the application is shown in cross-section,

[0024] Figure 3 A first patch antenna device according to the application is shown, but with alternative contact portions of the antennas,

[0025] Figure 4 A capacitive coupling in a first patch antenna device according to the application is shown in cross-section,

[0026] Figure 5 A second patch antenna device according to the application is shown in perspective, with two substrate layers, antennas and separate (single) contact portions of the antennas of the respective substrate layer, here each antenna has two contact portions,

[0027] Figure 6 A second patch antenna device according to the application is shown in cross-section,

[0028] Figure 7 A third patch antenna device according to the application is shown in perspective, with three substrate layers and antennas,

[0029] Figure 8 A third patch antenna device according to the application is shown in cross-section,

[0030] Figure 9 A further example of an antenna in a patch antenna device is shown in plan view,

[0031] Figure 10 A contact portion of an antenna is shown in perspective, as Figure 9 is shown, and

[0032] Figure 11 A motor vehicle having an antenna module with the patch antenna device of the present invention is shown schematically in a side view.

[0033] Regarding several embodiments of the present invention, Figures 1 to 10 The patch antenna device 21 is shown, which has a predetermined (relative) permittivity ε. R The substrate layer is made of plastic.

[0034] This patch antenna device is particularly useful for, for example, being arranged in... Figure 11 The example shown is an antenna module 22 (such as a shark fin) on the roof 23 of a motor vehicle 24.

[0035] Figures 1 to 11 The patch antenna device 21 of the present invention is multi-layered, that is, for example, having two, three or more layers.

[0036] For example, a patch antenna device may accordingly include at least antenna 1 or 5 or 12, and / or substrate layer 2 or 5 or 13, and / or ground layer 3 or 7 or 14 and / or adhesive layer 4 or 8 or 15 (there are a total of the above four layers).

[0037] Figures 1 to 11 The patch antenna device 21 of the present invention has stacked layers arranged adjacent to each other, or more precisely (in the installed state, stacked on top of each other / overlapping / adjacent to each other), while EP 2721690 mentions a patch antenna device for a satellite solution having dielectric substrate layers made of plastic and ceramic arranged among each other.

[0038] For the sake of simplicity, in patch antenna assembly 21, the elements are designated as upper / middle / lower according to their position in the assembly state shown in the exemplary illustration, wherein they may also be mounted tilted or adjacent to each other.

[0039] exist Figure 1 and Figure 2 In this invention, the patch antenna device 21 is arranged on a circuit board (PCB) 10. Here, a lower adhesive layer 8 (such as adhesive or double-sided adhesive tape) is placed on the circuit board 10, wherein the lower adhesive layer 8 is also attached to the lower substrate layer 5. (Alternatively, instead of the adhesive layer, the patch antenna device 21 can also be mounted on the circuit board 10 in other ways, such as with pins / (multiple) screws, etc.)

[0040] Figure 1 and Figure 2 The patch antenna device 21 includes an upper dielectric substrate layer 2 having an upper antenna 1 and a lower dielectric substrate layer 6 having a lower antenna 5.

[0041] wherein the dielectric substrate layers 2, 6 (herein respectively comprising an antenna and / or a ground surface and / or an adhesive layer) are arranged stacked adjacent to each other (e.g. according to position one above the other),

[0042] and wherein the dielectric substrate layers 2, 6, 13 respectively comprise a plastic having a (same or different) predetermined (relative) dielectric constant ε R .

[0043] Herein, Figures 1 to 11 the inventive patch antenna device 21 in is multi-layered, i.e. has for example two, three or more than three (antenna) stacks, which for example can respectively comprise an antenna 1 or 5 or 12, a substrate layer 2 or 5 or 13, a ground layer 3 or 6 or 14 and an adhesive layer 4 or 8 or 15.

[0044] Figure 1 In the patch antenna device 21 in Figure 2 there is an upper antenna 1 at the (top) side of the upper substrate layer 2 and an upper ground layer 3 at the (bottom) side of the upper substrate layer 2, e.g. opposite, and an adhesive layer 4 for connecting to the lower substrate layer 6 (or its lower antenna 5) below the upper ground layer 3 (or alternatively, e.g. around the upper ground layer).

[0045] In principle, the contact of the antenna can be done in a direct and / or inductive and / or capacitive way.

[0046] The capacitive contact of the antenna 1, 5 is demonstrated in Figure 1 and Figure 2 .

[0047] The antenna 1 is for example in capacitive contact through one or here two feed pins 9a, 9b.

[0048] For example, the at least one feed pin 9a, 9b can be respectively (non- conductively) capacitively coupled to the antenna 1 by a (e.g. angularly or planarly extending) contact area at its (9a, 9b) end (20a-h) respectively.

[0049] The (e.g. angular or planar) area 20a-l at the here respectively demonstrated lower end of the feed pin 9a-9d is respectively provided for forming an inductive contact or a direct contact or especially a capacitive contact with a contact area 11 of the circuit board 10.

[0050] For example, the contact area 11 of the circuit board 10 can be respectively an electrically conductive and / or metallic surface or path, e.g. angularly (or alternatively, e.g. planarly) extending parallel to the feed pin 9a-9d.

[0051] For example, the feed pins 9a, 9b can be capacitively coupled with a plurality of antennas 1, 5, respectively, as shown in Figure 1 , Figure 2 , Figure 3 , Figure 4 or with only one antenna 1, respectively, as shown in Figure 5 or Figure 7 .

[0052] In Figure 1 , Figure 2 , Figure 3 , Figure 4 two feed pins 9a, 9b are provided, which are coupled (here in a capacitive manner) with two antennas, respectively,

[0053] However, in Figure 5 and 6 four feed pins 9a, 9b, 9c, 9d are provided, which are coupled (here in a capacitive manner) with only one antenna, respectively,

[0054] and in Figure 7 six feed pins 9a, 9b, 9c, 9d are provided, which are coupled (here in a capacitive manner) with only one antenna, respectively.

[0055] In Figure 1 , Figure 2 , Figure 3 , Figure 4 the feed pins 9a, 9b, 9c, 9d, for example, pass (from the dielectric substrate layer 2) through recesses 17a, 17b of the upper ground layer 3, through recesses 17c, 17d of the upper adhesive layer 4, through recesses 17e, 17f of the lower antenna 5, through recesses 17g, 17h of the lower dielectric substrate layer 6 and / or through recesses 17i, 17j of the lower ground layer 7 and / or up to recesses 17k, 17l of the lower adhesive layer 8, respectively.

[0056] For example, instead of as shown, if one or some or all of the feed pins 9a, 9b, 9c, 9d, etc. extend laterally (in the figure, for example, to the right) from some or all of the antennas 1, 5, (optional) 12 and / or laterally from some or all of the ground layers 3, 7, (optional) 14 and / or laterally from some or all of the adhesive layers 4, 8, 15, then no recesses are provided in these layers for 9a, 9b, 9c, 9d, etc., respectively.

[0057] Figure 4A capacitive feed zone 18 (for example, suitable for each of the feed pins 9a-9f) is shown for the upper antenna 1, constituted by the angled or straight upper region of the feed pin 9, and a capacitive feed zone for the angled or straight lower region of the feed pin 9, constituted by the elongated or flat contact region 20 of the circuit board 10.

[0058] Figure 7 and Figure 8 A patch antenna device 21 according to the application is shown, which is not formed with two antenna stacks (as shown in Figures 1 to 4 ), but with three antenna stacks.

[0059] Thus, Figure 7 and Figure 8 The patch antenna device 21 in

[0060] wherein the dielectric substrate layers 2, 13, 6 are arranged on top of each other and wherein the dielectric substrate layers 2, 13, 6 each comprise a plastic with a predetermined (relative) dielectric constant ε R which is the same or different for the substrate layers.

[0061] Figure 7 and Figure 8 The patch antenna device 21 in

[0062] Instead of each (satellite / positioning) antenna being provided with two feed pins, as shown in Figures 1 to 8 , it is also possible for each antenna (or multiple antennas) to be provided with one feed pin, for example also for cellular mobile network antennas (phone antennas), for example for 2G / 3G / 4G / 5G / 6G.

[0063] The antenna according to the application can in particular be an antenna (or antennas) for one or more of the following applications: communication, for MIMO, for RKE, for WiFi; for GNSS, for preparing for autonomous driving, measuring the distance of a motor vehicle from other objects when parking or driving, SDARS, DAB, V2X.

[0064] According to the application, Figure 9 One of the antennas 1, 12, 5 (for example, which can be designed differently) for the patch antenna device 21 is shown exemplarily.

[0065] Figure 9 The antenna 5 in has two radiators 5a, 5b.

[0066] Figure 9 The two radiators 5a, 5b of the antenna 5 in Fig. 5 are arranged into each other.

[0067] Figure 9 The two radiators 5a, 5b of the antenna 5 in Fig. 5 are each embodied as planar.

[0068] The two radiators 5a, 5b are closed ring surfaces.

[0069] Figure 10 The capacitive feeding of the antenna radiators of the antenna 5 in Fig. 5 is shown exemplarily in perspective. Figure 9

[0070] Figure 9 The two radiators 5a, 5b of the antenna 5 in Fig. 5 can be excited individually, for example, by one of the feed pins 9e, 9f each and / or one radiator can be excited with both feed pins 9e, 9f.

[0071] The (relative) dielectric constant ε of the dielectric substrate layer made of plastic R can be set to a desired value in such a way that

[0072] for example by selecting a plastic or mixing a plurality of plastics (such as polyethylene PE, PP, PVC, PTFE, PVdF, PA, ABS, polystyrene PS, PMMA) having a desired dielectric constant ε R ; and / or

[0073] by mixing a plurality of plastics; and / or

[0074] by selecting a plastic having additives (such as germanium) which produce a desired dielectric constant ε R ; and / or

[0075] by coating (at least the upper or lower or middle plane of the dielectric substrate layer) with a material having a high dielectric constant.

[0076] https: / / de.wikipedia.org / wiki / Permittivit%C3%A4t gives the (relative) dielectric constant ε R of some materials.

[0077] The plastic of the patch antenna device 21 can have a relatively small weight.

[0078] ​The plastic can be prepared or modified by special additives (additives) so that the dielectric constant εR of the material can be precisely defined and a tolerance of, for example, ±0.5% can be achieved. With such a method, the εR value of the plastic can be fixedly set in the range from 2 to 50 and a repeat accuracy of, for example, ±2% for other batches can be achieved.

[0079] Using the plastic of the patch antenna from the known injection molding method, the process can be simplified and the weight can be reduced.

[0080] For example, the desired antenna structure can be made by means of a chemical galvanic coating, wherein the areas that are not to be coated have been covered on the surface, for example, by means of pad printing or screen printing. In a preferred embodiment, the cover is applied by means of a printing or spraying method already during the injection molding process.

[0081] The coating of the metal structure can be carried out both by means of a pure chemical deposition process, preferably with copper. Optionally, the copper layer can be combined with a thin silver layer that is applied chemically (displacement silver). In a preferred form, the coating is carried out by means of a chemical galvanic process, wherein copper and optionally silver is electrolytically deposited after a first layer of nickel.

[0082] The stamped and bent piece for feeding / exciting the antenna can be placed in a mold and overmolded in the plastic body. Subsequently, it is capacitively coupled to a copper surface of a PCB (circuit board) to generate the signal flow.

[0083] In the present method, so-called stacked patch antennas (stack of substrate layers with antennas and / or ground surfaces and / or adhesive layers) with different εR and different geometries can be produced in a single manufacturing process, for example, by means of an interlaced 2K injection mold.

[0084] Here, the ground surfaces between the individual patches can be introduced into the mold in advance as metal plate / foil inserts and subsequently overmolded.

[0085] The antenna structure can also be made, for example, from a structured metal plate - the foil insert is introduced into the matrix and likewise overmolded.

[0086] The dielectric constant εR of the plastic can be precisely influenced and adjusted by special additives (additives) so that the plastic, for example, achieves the εR value of a ceramic or another desired εR value of a certain material. A plurality of different dielectric constants εR can also be achieved in the antenna by means of a multi-component injection mold, the aim being, inter alia, to map a plurality of frequency bands in the antenna.

[0087] Another potential advantage lies in the connection to the circuit board, which is now achieved via a new capacitive coupling, eliminating the need for soldering connections through power supply pins. This can save further manufacturing steps during the fabrication of the connection module. Here, a stamped and bent insert can be placed into a plastic injection mold, subsequently overmolded, and coupled to the copper surface on the circuit board for power supply.

[0088] For example, it can be applied to trucks, trains, passenger vehicles, and commercial vehicles where installation space for the antenna may be limited and weight may be a critical factor.

[0089] In addition to the aforementioned dielectric substrate layer made of plastic, patch antenna devices may also include other antennas and / or dielectric substrate layers that do not contain plastic.

Claims

1. A patch antenna device (21), wherein the multilayer patch antenna device (21) comprises: A lower dielectric substrate layer (6) having a lower antenna (5); An intermediate dielectric substrate layer (13) having an intermediate antenna (12); and an upper dielectric substrate layer (2) having an upper antenna (1), At least three of the dielectric substrate layers (2, 6, 13) are stacked adjacent to each other. Furthermore, the dielectric substrate layers (2, 6, 13) respectively comprise plastic.

2. The patch antenna device (21) according to claim 1, characterized in that, The patch antenna device is used in motor vehicles (24).

3. The patch antenna device (21) according to claim 1, characterized in that, Antennas (1, 5, 12) are arranged on dielectric substrate layers (2, 6, 13), respectively.

4. The patch antenna device (21) according to claim 3, characterized in that, Antennas (1, 5, 12) are arranged in the form of a continuous upper metal layer or interrupted layers to form the antenna structure.

5. The patch antenna device (21) according to any one of claims 1 to 4, characterized in that, The dielectric substrate layers (2, 6, 13) each have an antenna (1, 5, 12) on one side, and a conductive surface (3, 7, 14) on the side of the dielectric substrate layers (2, 6, 13) opposite to the antenna (1, 5, 12).

6. The patch antenna device (21) according to claim 5, characterized in that, The surface is metallic.

7. The patch antenna device (21) according to any one of claims 1 to 4, characterized in that, An adhesive layer (4, 8, 15) and / or an insulating layer are present on the ground layer (3, 7, 14) of one or more dielectric substrate layers (2, 6, 13) and / or on one or more dielectric substrate layers (2, 6, 13), the adhesive layer and / or the insulating layer being disposed or being disposed on the circuit board (10) or another dielectric substrate layer (2, 6, 13) or the antenna (1, 5, 12).

8. The patch antenna device (21) according to claim 7, characterized in that, The adhesive layers (4, 8, 15) are made of adhesive or double-sided adhesive tape.

9. The patch antenna device (21) according to any one of claims 1 to 4, characterized in that, The patch antenna device is arranged or can be arranged on a circuit board (10), the circuit board having at least one conductive contact area (11). The feed pins (9a-f) are respectively connected to the conductive contact area (11) so as to contact exactly one or more of the antennas (1, 5, 12).

10. The patch antenna device (21) according to claim 9, characterized in that, The circuit board (10) has at least one metallic conductive contact area (11).

11. The patch antenna device (21) according to claim 9, characterized in that, The feed pins (9a-f) are capacitively connected to the conductive contact area (11), respectively.

12. The patch antenna device (21) according to any one of claims 1 to 4, Its features are, The patch antenna device has one, two, four or more feed pins (9a-f), The feed pin is capacitively or inductively in contact with exactly one or more of the antennas (1, 5, 12).

13. The patch antenna device (21) according to any one of claims 1 to 4, Its features are, The patch antenna assembly has one, two, three, four, six or more feed pins (9a-f), each feed pin having a region (20a-l) at its end. One of the regions (20a-l) is capacitively or inductively contacted with at least one of the antennas (1, 5, 12), and one of the regions is correspondingly configured to make direct or capacitive contact with the contact area (11) of the circuit board (10).

14. The patch antenna device (21) according to claim 13, characterized in that, The feed needles (9a-f) each have angled or straight regions (20a-l) at their ends.

15. The patch antenna device (21) according to any one of claims 1 to 4, Its features are, The patch antenna device has a feed pin (9a-f). The feed pin extends through a notch (17a-l) in one or more of the dielectric substrate layers (2, 6, 13), and / or a notch (17a-l) in one or more of the antennas (1, 5, 12), and / or a notch (17a-l) in one or more of the ground surfaces (2, 7, 14), and / or a notch (17a-l) in one or more of the adhesive layers (4, 8, 15).

16. The patch antenna device (21) according to any one of claims 1 to 4, Its features are, One or more of the dielectric substrate layers (2, 6, 13) contain one or more additives in the plastic to adjust its dielectric constant.

17. The patch antenna device (21) according to any one of claims 1 to 4, Its features are, Two or more of the dielectric substrate layers (2, 6, 13) have the same or different relative permittivity ε. R .

18. The patch antenna device (21) according to any one of claims 1 to 4, Its features are, The patch antenna device (21) has at least one antenna (1, 5, 12) or at least two antennas (1, 5, 12). The antennas (1, 5, 12) are designed to transmit (S) to and / or receive (R) radio signals (S, R) from and from a cellular mobile radio network for a range of transmit / receive frequencies.

19. The patch antenna device (21) according to claim 5, characterized in that, The antenna size and therefore the transmit / receive frequency range are designed to transmit and / or receive cellular mobile radio signals (S, R) in one or more 2G / 3G / 4G / 5G / 6G frequency bands.

20. The patch antenna device (21) according to any one of claims 1 to 4, characterized in that, One or all of the dielectric substrate layers (2, 6, 13) and / or the antennas (1, 5, 12) have a rectangular external structure.

21. The patch antenna device (21) according to any one of claims 1 to 4, characterized in that, The antenna structure of the antennas (1, 5, 12) is made by chemical electroplating, wherein the areas (20a-l) that do not require coating have been covered on the surface.

22. The patch antenna device (21) according to claim 21, characterized in that, The areas (20a-l) that do not require coating have been covered on the surface by pad printing, screen printing or spraying.

23. The patch antenna device (21) according to any one of claims 1 to 4, characterized in that, The grounding surfaces between the individual patches are metal plate embeddings or foil embeddings and / or are overmolded.

24. An antenna module having a patch antenna device (21) according to any one of claims 1 to 23.

25. The antenna module according to claim 24, characterized in that, The antenna module is used in motor vehicles (24).

26. A motor vehicle (24) having a patch antenna device (21) according to any one of claims 1 to 23.

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