Power supply device and electronic apparatus

Abstract

The utility model discloses a power supply device and electronic equipment. The power supply device comprises a shell, a power circuit board, a magnetic device assembly, a heat dissipation assembly and a control circuit board, the shell is provided with a first cavity and a second cavity which are spaced from each other, and the first cavity and the second cavity are filled with a first heat conduction layer and a second heat conduction layer respectively; the power circuit board and the magnetic device assembly are respectively arranged on the first heat conduction layer and the second heat conduction layer; the heat dissipation assembly is arranged on the power circuit board; the control circuit board is arranged on the heat dissipation assembly. By means of the mode, the power supply device can effectively simplify material types and grading, improve the device layout density and integration degree, reduce the occupied space and simplify the production process, so that the production and manufacturing cost can be effectively reduced, and the production efficiency is improved; and the heat dissipation assembly is arranged between the power circuit board and the control circuit board for double-sided heat dissipation, so that the heat dissipation area and the heat dissipation efficiency can be greatly improved, and a better heat dissipation effect is achieved.

Description

Technical Field

[0001] This application relates to the field of power supply technology, and more particularly to a power supply device and electronic device. Background Technology

[0002] Today, power supply devices, as an important component of electronic devices, are receiving increasing attention in the actual research and development and manufacturing of electronic products. For the performance of power supply devices, their heat dissipation, integration, and size are usually factors that cannot be ignored.

[0003] However, the power supply devices in related technologies have a wide variety of materials and classifications, complex manufacturing processes, low device layout density, and low integration, resulting in a large size and poor heat dissipation. Utility Model Content

[0004] The power supply device and electronic device provided in this application can solve the comprehensive problems of existing power supply devices, such as the large variety and classification of materials, complex manufacturing process, low device layout density and low integration, resulting in large size and poor heat dissipation.

[0005] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide a power supply device, wherein the power supply device includes: a housing, having a first cavity and a second cavity spaced apart from each other, the first cavity and the second cavity being filled with a first heat-conducting layer and a second heat-conducting layer respectively; a power circuit board and a magnetic device assembly, respectively disposed on the first heat-conducting layer and the second heat-conducting layer; a heat dissipation assembly, disposed on the power circuit board and / or the magnetic device assembly; and a control circuit board, disposed on the heat dissipation assembly.

[0006] The gap between the heat dissipation component and the power circuit board and / or the magnetic component is filled with a third thermally conductive layer; and / or the gap between the heat dissipation component and the control circuit board is filled with a fourth thermally conductive layer.

[0007] The housing is provided with a first heat conduction pipe corresponding to the first cavity and the second cavity, and the heat dissipation component is provided with a second heat conduction pipe. The first heat conduction pipe and the second heat conduction pipe are connected. The first heat conduction layer is provided in the gap between the first heat conduction pipe and the power circuit board, and the second heat conduction layer is provided in the gap between the first heat conduction pipe and the magnetic device component.

[0008] The shell is also equipped with a heat pipe, and the heat dissipation component is also equipped with a heat pipe sleeve corresponding to the heat pipe. The heat pipe sleeve is connected to the second heat pipe and is sleeved on the outer wall of the heat pipe. The heat pipe is connected to the first heat pipe.

[0009] The magnetic component assembly also includes a plug-in post, and the control circuit board has a corresponding plug-in hole. The plug-in post is embedded in the plug-in hole to detachably connect the magnetic component assembly and the control circuit board.

[0010] The power supply unit also includes a screw connection assembly, through which the power circuit board is connected to the magnetic component assembly.

[0011] The power supply device also includes a cover, which is connected to the housing to form a cavity. The power circuit board, magnetic components, heat dissipation components and the power circuit board are all located in the cavity.

[0012] The magnetic component assembly includes a charger main transformer and a voltage conversion main transformer, which share the same magnetic core.

[0013] The magnetic component assembly also includes a circuit board, a power factor correction inductor, and a voltage conversion output differential mode inductor. The power factor correction inductor, the voltage conversion output differential mode inductor, the charger main transformer, and the windings of the voltage conversion main transformer are all located in the circuit board.

[0014] To solve the above-mentioned technical problems, another technical solution adopted in this application is: to provide an electronic device, wherein the electronic device includes a housing and a power supply device connected to the housing; wherein the power supply device is the power supply device as described in any of the preceding claims.

[0015] The beneficial effects of this application are as follows: Unlike existing technologies, the power supply device provided in this application has a housing with a first cavity and a second cavity spaced apart from each other. The first cavity and the second cavity are respectively filled with a first heat-conducting layer and a second heat-conducting layer. The power circuit board and the magnetic component assembly are respectively disposed on the first heat-conducting layer and the second heat-conducting layer. The heat dissipation assembly is disposed on the power circuit board. The control circuit board is disposed on the heat dissipation assembly. This allows for the integration of various power electronic components onto the power circuit board, and the integration of devices involved in the transmission and transformation of electromagnetic energy, such as transformers and inductors, onto the magnetic component assembly. Signal control is achieved using the same control circuit board, effectively realizing charging and discharging... The number of circuit boards for the power conversion function has been reduced to three, which significantly reduces the number of circuit boards and effectively simplifies the types and classifications of materials, improves the layout density and integration of components, thereby reducing their footprint and simplifying the production process to effectively reduce manufacturing costs and improve production efficiency. Furthermore, by placing the heat dissipation component between the power circuit board and / or magnetic component assembly and the control circuit board for double-sided heat dissipation, and utilizing the first and second thermal conductive layers to dissipate heat on the side of the power circuit board and / or magnetic component assembly away from the control circuit board, the overall heat dissipation area and efficiency can be greatly improved to achieve better heat dissipation effect. Attached Figure Description

[0016] Figure 1 This is an exploded schematic diagram of one embodiment of the power supply device of this application;

[0017] Figure 2 yes Figure 1 A schematic diagram of the combined power supply unit;

[0018] Figure 3 This is a schematic diagram of one embodiment of the electronic device of this application. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0020] The terms "first," "second," and "third" in this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. All directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationships and movements between components in a specific orientation (as shown in the figures). If the specific orientation changes, the directional indications also change accordingly. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0021] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0022] The present application will now be described in detail with reference to the accompanying drawings and embodiments.

[0023] Please see Figure 1 and Figure 2 ,in, Figure 1 This is an exploded view of one embodiment of the power supply device of this application. Figure 2 yes Figure 1 A schematic diagram of the power supply unit assembly. In this embodiment, the power supply unit 10 includes: a housing 11, a power circuit board 12, a magnetic component assembly 13, a heat dissipation assembly 14, and a control circuit board 15.

[0024] Specifically, the power supply device 10 provided in this application can be applied to new energy electric vehicles to convert AC power from the power grid into DC power to charge the power battery of the new energy electric vehicle. Simultaneously, it can also convert the power battery's electrical energy into AC power to provide power to external electrical loads. Of course, in other embodiments, the power supply device 10 can also be used in any other reasonable electrically powered electromechanical device, such as drones, intelligent robots, or industrial robotic arms; this embodiment does not impose any limitations on this application.

[0025] Specifically, the housing 11 is used to provide physical support and protection. The material selection should take into account mechanical strength, corrosion resistance and thermal conductivity. The housing 11 has a first cavity 101 and a second cavity 102 spaced apart inside. The first cavity 101 and the second cavity 102 are respectively filled with a first thermally conductive layer (not shown) and a second thermally conductive layer (not shown) for efficient heat conduction.

[0026] The power circuit board 12 is used to carry power electronic components for signal functions such as charging and discharging, and power conversion.

[0027] The magnetic device assembly 13 includes transformers, inductors, etc., for the transfer and conversion of electromagnetic energy, in order to manage the heat generated and prevent overheating from affecting performance.

[0028] The power circuit board 12 is disposed on the first heat-conducting layer to ensure that the heat generated by the power circuit board 12 can be quickly conducted to the first heat-conducting layer; the magnetic device assembly 13 is disposed on the second heat-conducting layer to conduct the heat generated by the magnetic device assembly 13 to the second heat-conducting layer.

[0029] The heat dissipation component 14 is disposed on the power circuit board 12 and / or the magnetic component assembly 13, and the control circuit board 15 is further disposed on the side of the heat dissipation component 14 away from the power circuit board 12; and the heat dissipation component 14 can be in direct contact with the power circuit board 12 and / or the magnetic component assembly 13, and the control circuit board 15 or connected to them through a thermally conductive material; and the heat dissipation component 14 can be a heat sink, a fan, a heat pipe, or a liquid cooling system, etc., to dissipate heat from the power circuit board 12 and / or the magnetic component assembly 13, and the control circuit board 15 from both sides, thereby ensuring that the heat generated by the power circuit board 12 and the control circuit board 15 can be dissipated through the heat dissipation component 14, which is not limited in this application.

[0030] The control circuit board 15 is used to monitor and control the working status of the power circuit board 12 and the magnetic device assembly 13, so as to adjust one or more of any reasonable electrical signals such as voltage, current and control signals, thereby realizing signal functions such as charging and discharging and power conversion.

[0031] Furthermore, the magnetic core of the magnetic device assembly 13 can be filled with high-performance thermally conductive material to connect to the thermally conductive layer and transfer heat to the water channel.

[0032] The above method integrates various power electronic components on the power circuit board 12 and integrates devices involved in the transmission and transformation of electromagnetic energy, such as transformers and inductors, on the magnetic device assembly 13. Signal control is achieved using the same control circuit board 15. This effectively reduces the number of circuit boards for charging, discharging, and energy conversion to three, thereby significantly reducing the number of circuit boards and effectively simplifying the types and classifications of materials. It also improves the device layout density and integration, thereby reducing its volume and simplifying the production process to effectively reduce manufacturing costs and improve production efficiency. Furthermore, by placing the heat dissipation assembly 14 between the power circuit board 12 and / or the magnetic device assembly 13 and the control circuit board 15 for double-sided heat dissipation, and by using the first and second heat-conducting layers to dissipate heat on the side of the power circuit board 12 and / or the magnetic device assembly 13 away from the control circuit board 15, the overall heat dissipation area and efficiency can be significantly improved to achieve better heat dissipation.

[0033] In some embodiments, a third thermally conductive layer (not shown) is also filled in the gap between the heat dissipation component 14 and the power circuit board 12 and / or the magnetic device component 13. Specifically, the third thermally conductive layer may be obtained by filling the gap between the heat dissipation component 14 and the power circuit board 12 and / or the magnetic device component 13 with any reasonable material with high thermal conductivity, such as thermal grease or thermal pad, to ensure that the heat generated by the power circuit board 12 and / or the magnetic device component 13 can be quickly conducted from the heat-generating element to the heat dissipation component 14. This application does not limit this.

[0034] In some embodiments, without changing the overall shape of the product, the length and width of the power circuit board 12 and the control circuit board 15 can be appropriately modified according to the application requirements. Specifically, the magnetic core of the magnetic device assembly 13 can also be filled with high-performance thermally conductive material to connect to the thermally conductive layer and transfer heat to the water channel for dissipation; this application does not limit this.

[0035] In some embodiments, a fourth thermally conductive layer (not shown) is also filled in the gap between the heat dissipation component 14 and the control circuit board 15. This fourth thermally conductive layer may be the same as or different from the third thermally conductive layer. It is obtained by filling the gap between the heat dissipation component 14 and the control circuit board 15 with any reasonable material with high thermal conductivity, such as thermal grease or thermal pad, to ensure that the heat generated by the control circuit board 15 can be quickly conducted from the heat-generating element to the heat dissipation component 14. This application does not limit this.

[0036] In another embodiment, the heat dissipation component 14 may be disposed at intervals with the power circuit board 12 and the control circuit board 15 respectively, that is, it uses air to dissipate heat without filling a heat-conducting layer. This is determined by the actual application scenario and is not limited in this application.

[0037] In some embodiments, the bottom of the housing 11 corresponding to the first cavity 101 and the second cavity 102 is further provided with a first heat conduction pipe 111, which penetrates the first cavity 101 and the second cavity 102 of the housing 11 and is used to guide the flow of heat generated by the power circuit board 12 and the magnetic device assembly 13; the heat dissipation assembly 14 is provided with a second heat conduction pipe, and the first heat conduction pipe 111 is connected to the second heat conduction pipe to form a complete heat conduction path and further improve the heat conduction efficiency.

[0038] Specifically, the first thermal conductive layer is disposed in the gap between the first thermal conductive pipe 111 and the power circuit board 12; the second thermal conductive layer is disposed in the gap between the first thermal conductive pipe 111 and the magnetic device assembly 13; the first and second thermal conductive layers can be made of materials with high thermal conductivity, such as thermal grease or thermal pads, to ensure that heat can be quickly conducted from the heating element to the thermal conductive layer and the thermal conductive pipe 112.

[0039] In some embodiments, the first heat-conducting pipe 111 and the second heat-conducting pipe are used to contain coolant or cold water and are connected to an external water pump and a circulation or drainage pipe, so that when the coolant or cold water in the first heat-conducting pipe 111 and the second heat-conducting pipe is circulated by the water pump and discharged from the circulation or drainage pipe, the heat generated by the power circuit board 12, the magnetic device assembly 13 and the control circuit board 15 can be effectively removed, so as to ensure that the power circuit board 12, the magnetic device assembly 13 and the control circuit board 15 can work well.

[0040] The housing 11 is also provided with an inlet pipe 105 and an outlet pipe 106. The first heat-conducting pipe 111 is connected to the outlet pipe 106 and the inlet pipe 105, so as to be connected to the external water pump and circulation or drainage pipe through the inlet pipe 105 and the outlet pipe 106 respectively, thereby forming a heat dissipation channel of sequentially connected water pump, inlet pipe 105, part of the first heat-conducting pipe 111, second heat-conducting pipe, another part of the first heat-conducting pipe 111, outlet pipe 106, and circulation or drainage pipe, so that the power circuit board 12, magnetic device assembly 13 and control circuit board 15 can be circulated and cooled through the heat dissipation channel.

[0041] In some embodiments, the first heat conduction pipe 111 may be configured in any reasonable linear shape, such as a curve or a broken line, corresponding to the side of the power circuit board 12 or the magnetic device assembly 13 facing the housing 11, in order to maximize its heat dissipation area and improve its heat dissipation efficiency. Similarly, the second heat conduction pipe may also be configured in any reasonable linear shape, such as a curve or a broken line, corresponding to the side of the control circuit board 15 facing the housing 11, in order to maximize its heat dissipation area and improve its heat dissipation efficiency. The specific configuration is determined by the actual heat dissipation scenario, and this application does not limit it.

[0042] Understandably, through the reasonable spatial arrangement of the first heat conduction pipe 111 and the second heat conduction pipe, heat can be effectively dissipated from the opposite sides of the power circuit board 12 and / or the magnetic device assembly 13, and heat can be dissipated from the control circuit board 15 at the same time. That is, the double-layer planar water channel design achieves three-sided heat dissipation of the heat source, which greatly increases the heat dissipation area and efficiency, thereby ensuring better heat dissipation effect and greatly reducing the size of the whole machine.

[0043] In other embodiments, the second heat-conducting pipe may be replaced by a liquid storage cavity of any reasonable shape, such as a cuboid or an irregular cube with a uniform thickness and a hollow interior, for the flow of coolant or cold water to dissipate heat from the power circuit board 12 and / or the magnetic device assembly 13, as well as the control circuit board 15. The specific application scenario will determine the specific application scenario, and this application does not limit it.

[0044] In some embodiments, the housing 11 is further provided with a heat pipe 112, which is connected to the first heat pipe 111. The heat dissipation assembly 14 is also provided with a heat pipe sleeve 141 corresponding to the heat pipe 112. The heat pipe sleeve 141 is connected to the second heat pipe and is sleeved on the outer wall of the heat pipe 112 so as to connect the first heat pipe 111 and the second heat pipe through the heat pipe 112 and the heat pipe sleeve 141.

[0045] Understandably, the heat pipe 112 and the heat-conducting sleeve 141 can be perpendicular to the bottom of the housing 11 to pass through the plane of the power circuit board 12 and / or the magnetic device assembly 13 and communicate with the second heat-conducting pipe in the heat dissipation assembly 14, thereby enabling further heat dissipation inside the housing 11 in the three-dimensional direction; and the heat pipe 112 can be installed at a suitable position on the housing 11, especially in areas where heat accumulates and is not easily dissipated, to enhance the heat conduction path.

[0046] In some embodiments, in order to ensure the airtightness of the connection between the heat-conducting sleeve 141 and the heat-conducting pipe 112, a sealing ring 1411 is also provided at the connection position between the heat-conducting sleeve 141 and the heat-conducting pipe 112. That is, the sealing ring 1411 is further fitted onto the outer wall of the heat-conducting sleeve 141 to effectively ensure the airtightness of the connection position of the entire heat dissipation channel.

[0047] In some embodiments, the magnetic device assembly 13 is further provided with a plug post 131, and specifically, at least two plug posts 131 may be provided on the outer edge of the side of the magnetic device assembly 13 facing the control circuit board 15. The control circuit board 15 is further provided with a plug hole 151 corresponding to each plug post 131. The plug post 131 is embedded in the plug hole 151 to achieve a detachable connection between the magnetic device assembly 13 and the control circuit board 15, thereby simplifying the production process.

[0048] In some embodiments, the plug post 131 and the plug hole 151 may be conductive materials, so as to provide strength support while enabling a detachable physical connection between the magnetic device assembly 13 and the control circuit board 15, and also to provide an electrical connection between the magnetic device assembly 13 and the control circuit board 15, so as to provide an electrical path for signal interaction between the two. The plug post 131 and the plug hole 151 may also be non-conductive materials, and the electrical connection between the magnetic device assembly 13 and the control circuit board 15 may be achieved through other conductive lines. The specific connection is determined by the actual application scenario, and this application does not limit it.

[0049] In some embodiments, the power supply device 10 further includes a screw assembly 17, and the power circuit board 12 is detachably connected to the magnetic device assembly 13 via the screw assembly 17.

[0050] Specifically, the screw assembly 17 can be a conductive or non-conductive material. When it is a conductive material, the connection method achieved by the screw assembly 17 is suitable for high-current electrical connections. It can not only achieve good electrical connections, but also provide good structural support strength.

[0051] In some embodiments, the magnetic device assembly 13 is further detachably connected to the housing 11 via a screw assembly 17 to provide strength support through the housing 11.

[0052] In some embodiments, the power supply device 10 further includes a cover 16, which is connected to the housing 11 to form an internally enclosed accommodating cavity. That is, the combination of the housing 11 and the cover 16 constitutes the overall sealing of the device. The power circuit board 12, the magnetic device assembly 13, the heat dissipation assembly 14 and the power circuit board 12 are all disposed in the accommodating cavity to protect each functional unit through the housing 11 and the cover 16.

[0053] In some embodiments, the magnetic device assembly 13 may further include a charger main transformer (not shown in the figure) and a voltage conversion main transformer (not shown in the figure), and the charger main transformer and the voltage conversion main transformer share the same magnetic core. That is, the charger main transformer and the voltage conversion main transformer are integrated together using magnetic integration technology and planar transformer technology, sharing the same transformer core, which reduces the number of magnetic devices and significantly reduces the volume of magnetic devices, and the power density of the whole machine can also be greatly improved.

[0054] In some embodiments, the magnetic device assembly 13 further includes a circuit board (not shown), a power factor correction inductor (not shown), and a voltage conversion output differential mode inductor (not shown). The power factor correction inductor, the voltage conversion output differential mode inductor, the charger main transformer, and the windings of the voltage conversion main transformer are all located in the circuit of the circuit board. That is, the power factor correction inductor, the voltage conversion output differential mode inductor, the charger main transformer, and the windings of the voltage conversion main transformer are all formed by using copper foil in the circuit board to form a circuit, so as to further reduce the space occupied by the magnetic device, increase the power density, and make the magnetic core surface area in the magnetic device assembly 13 large and the heat dissipation better.

[0055] In some embodiments, the magnetic device assembly 13 may also make appropriate changes to the shape of the magnetic core and the shape of the circuit board according to the circuit performance, and may also use Litz wire to replace the copper foil in the circuit board to form the winding of a transformer or inductor. This application does not limit this.

[0056] In some embodiments, the power circuit board 12 further includes power semiconductor devices (not shown) and their associated circuitry. The power circuit board 12 is mounted on the bottom of the housing 11 to facilitate heat conduction from the power semiconductor devices to the housing 11.

[0057] The power circuit board 12 mainly includes the secondary output circuit of the voltage conversion main transformer, which occupies a significantly smaller area in the housing 11. The power circuit board 12 is connected to the housing 11 and the magnetic device assembly 13 respectively through the screw assembly 17.

[0058] Furthermore, the semiconductor devices on the power circuit board 12 can be added or removed depending on the output power and voltage level requirements.

[0059] In some specific embodiments, the power supply device 10 can be a vehicle power supply in a new energy electric vehicle, and specifically, it can be a combination of a vehicle charger and a vehicle DC-DC (Direct Current) power supply to improve integration and integrate them into a complete product. This complete product is sealed by the combination of housing 11 and cover 16, providing protection performance of IP67 (Ingress Protection Rating) or higher, meeting the protection level requirements of vehicle power supplies.

[0060] The power supply device 10 also has an independent heat dissipation channel, that is, the first heat conduction pipe 111, the second heat conduction pipe, the heat conduction pipe 112, the heat conduction sleeve 141 and the heat dissipation component 14 form a three-dimensional heat conduction channel. This three-dimensional heat conduction channel is used to circulate coolant to dissipate the heat generated by the power circuit board 12, the magnetic device assembly 13 and the control circuit board 15.

[0061] The magnetic component assembly 13 includes a power factor correction inductor, a charger main transformer, a voltage conversion main transformer, and a voltage conversion output differential mode inductor. The power factor correction inductor and the voltage conversion output differential mode inductor are independent magnetic components, while the charger main transformer and the voltage conversion main transformer are integrated magnetic components. The magnetic components of the magnetic component assembly 13 are connected to the control circuit board 15 via a plug-in connection, and to the housing 11 via a screw connection.

[0062] The magnetic component assembly 13 has an electrical connection section, in which the voltage conversion output differential mode inductor is electrically connected to the power circuit board 12 via a screw connection. Screw connections are suitable for high-current electrical connections. Screw connections not only achieve good electrical connections but also provide good structural support strength.

[0063] The output side of the voltage conversion main transformer is directly connected to the voltage conversion output differential mode inductor on the magnetic component assembly 13. Specifically, the low-voltage output of the voltage conversion main transformer is directly connected to the voltage conversion output differential mode inductor through the copper foil inside the magnetic component assembly 13. The two ends of the power factor correction inductor are connected to the control circuit board 15 by a plug-in connection, simplifying the production process.

[0064] In some embodiments, the power supply device 10 further includes a connector 18, which includes an AC (Alternating Current) input connector (not shown), an HV (Horizontal) output connector (not shown), a DC-DC positive output connector (not shown), a signal connector (not shown), and a vent valve (not shown). The connector 18 is mounted on the housing 11, and the position of the connector 18 on the housing can be appropriately changed according to the application scenario. It also includes a water inlet and a water outlet to realize the electrical connection between the inside of the whole machine, namely the power circuit board 12, the magnetic device assembly 13, and the control circuit board 15, and the outside, as well as the sealing performance of the connector 18.

[0065] In some embodiments, the control circuit board 15 includes a main power circuit for an on-board charger (not shown), a main power circuit for an on-board DC-DC power supply (not shown), an EMC (Electromagnetic Compatibility) filter unit (not shown), a control circuit (not shown), and an auxiliary power supply circuit (not shown). It has a high degree of integration and does not require separate AC input filter boards and HV output filter boards to improve power density, thereby effectively improving production efficiency and PCBA board layout density.

[0066] Specifically, the housing 11 is provided with a third cavity 103 and a fourth cavity 104 corresponding to the EMC filter unit. Different filter components of the EMC filter unit are respectively disposed in the third cavity 103 and the fourth cavity 104. The bottom of the housing 11 is also provided with a surrounding plate, and the first cavity 101, the second cavity 102, the third cavity 103 and the fourth cavity 104 are separated by the surrounding plate.

[0067] The circuit board is fixed to the first cavity 101 by screws. The bottom magnetic core of the charger main transformer and the voltage conversion main transformer is filled with thermally conductive material between itself and the first cavity 101 to conduct heat dissipation to the housing 11. The top magnetic core of the charger main transformer and the voltage conversion main transformer is filled with thermally conductive material between itself and the heat dissipation component 14 to conduct heat dissipation to the heat dissipation component 14. The semiconductor power devices in the power circuit board 12 are filled with thermally conductive material to conduct heat dissipation to the heat dissipation component 14.

[0068] The heat dissipation assembly 14 is inserted into the heat pipe 112 via a heat-conducting sleeve 141. A sealing ring 1411 is installed on the heat-conducting sleeve 141 to achieve a seal at the connection. The power circuit board 12 is installed in the first cavity 101 by screws. The bottom of the first cavity 101 is filled with a heat-conducting material to conduct heat to the housing 11 for heat dissipation.

[0069] The above solution effectively reduces the number of PCBA boards by combining the on-board charger and the on-board DC-DC converter into one, thereby reducing the structural complexity and manufacturing difficulty of the whole machine. The power circuit board 12 and the magnetic component assembly 13 are located on the bottom surface of the whole machine housing 11, and the power circuit board 12 and the magnetic component assembly 13 are located below the control circuit board 15. The whole structure is a two-layer structure.

[0070] Furthermore, the housing 11 adopts a double-layer planar water channel design, enabling heat dissipation from three sides for the heat source, namely the power circuit board 12, the magnetic component assembly 13, and the control circuit board 15, significantly increasing the heat dissipation area and efficiency. The circuit boards include the power circuit board 12, the circuit board in the magnetic component assembly 13, and the control circuit board 15, reducing the number of PCBA boards to three, greatly reducing the number of PCBA boards and improving production efficiency. The magnetic component assembly 13 adopts magnetic integration technology and planar transformer technology. The windings in the magnetic component assembly 13 are constructed using copper foil from the circuit board. The charger main transformer and the DC-DC power supply main transformer are integrated together, sharing the same magnetic core, significantly reducing the size of the magnetic components, thereby enabling the entire machine to significantly increase power density.

[0071] This application also provides an electronic device, please refer to... Figure 3 , Figure 3 This is a schematic diagram of one embodiment of the electronic device of this application. In this embodiment, the electronic device 20 includes a housing 21 and a power supply device 22 connected to the housing 21.

[0072] In some embodiments, the electronic device may be any reasonable electromechanical device such as a new energy electric vehicle, a drone, or an intelligent robot, and this application does not limit it.

[0073] Specifically, the power supply device 22 is the power supply device 10 as described in any of the preceding items; please refer to [link / reference needed]. Figures 1-2 The relevant textual content will not be repeated here.

[0074] The beneficial effects of this application are as follows: Unlike existing technologies, the power supply device provided in this application has a housing with a first cavity and a second cavity spaced apart from each other. The first cavity and the second cavity are respectively filled with a first heat-conducting layer and a second heat-conducting layer. The power circuit board and the magnetic component assembly are respectively disposed on the first heat-conducting layer and the second heat-conducting layer. The heat dissipation assembly is disposed on the power circuit board. The control circuit board is disposed on the heat dissipation assembly. This allows for the integration of various power electronic components onto the power circuit board, and the integration of devices involved in the transmission and transformation of electromagnetic energy, such as transformers and inductors, onto the magnetic component assembly. Signal control is achieved using the same control circuit board, effectively realizing charging and discharging... The number of circuit boards for the power conversion function has been reduced to three, which significantly reduces the number of circuit boards and effectively simplifies the types and classifications of materials, improves the layout density and integration of components, thereby reducing their footprint and simplifying the production process to effectively reduce manufacturing costs and improve production efficiency. Furthermore, by placing the heat dissipation component between the power circuit board and / or magnetic component assembly and the control circuit board for double-sided heat dissipation, and utilizing the first and second thermal conductive layers to dissipate heat on the side of the power circuit board and / or magnetic component assembly away from the control circuit board, the overall heat dissipation area and efficiency can be greatly improved to achieve better heat dissipation effect.

[0075] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A power supply device, characterized in that, The power supply device includes: The housing has a first cavity and a second cavity spaced apart from each other, and the first cavity and the second cavity are respectively filled with a first heat-conducting layer and a second heat-conducting layer; The power circuit board and the magnetic device assembly are respectively disposed on the first heat-conducting layer and the second heat-conducting layer; A heat dissipation component is disposed on the power circuit board and / or the magnetic device assembly; The control circuit board is mounted on the heat dissipation assembly.

2. The power supply device according to claim 1, characterized in that, A third thermally conductive layer is further filled in the gap between the heat dissipation component and the power circuit board and / or the magnetic device component; and / or, a fourth thermally conductive layer is further filled in the gap between the heat dissipation component and the control circuit board.

3. The power supply device according to claim 1, characterized in that, The housing is further provided with a first heat conduction pipe corresponding to the first cavity and the second cavity, and the heat dissipation assembly is provided with a second heat conduction pipe. The first heat conduction pipe is connected to the second heat conduction pipe. The first heat conduction layer is disposed in the gap between the first heat conduction pipe and the power circuit board, and the second heat conduction layer is disposed in the gap between the first heat conduction pipe and the magnetic device assembly.

4. The power supply device according to claim 3, characterized in that, The housing is also provided with a heat-conducting pipe, and the heat dissipation assembly is also provided with a heat-conducting sleeve corresponding to the heat-conducting pipe. The heat-conducting sleeve is connected to the second heat-conducting pipe and is sleeved on the outer wall of the heat-conducting pipe. The heat-conducting pipe is connected to the first heat-conducting pipe.

5. The power supply device according to claim 1, characterized in that, The magnetic device assembly is further provided with a plug-in post, and the control circuit board is provided with a plug-in hole corresponding to the plug-in post. The plug-in post is embedded in the plug-in hole to detachably connect the magnetic device assembly and the control circuit board.

6. The power supply device according to claim 1, characterized in that, The power supply device further includes a screw connection assembly, through which the power circuit board is connected to the magnetic device assembly.

7. The power supply device according to claim 1, characterized in that, The power supply device also includes a cover, which is connected to the housing to form a cavity, in which the power circuit board, the magnetic component assembly, the heat dissipation assembly, and the power circuit board are all disposed.

8. The power supply device according to any one of claims 1-7, characterized in that, The magnetic device assembly includes a charger main transformer and a voltage conversion main transformer, and the charger main transformer and the voltage conversion main transformer share the same magnetic core.

9. The power supply device according to claim 8, characterized in that, The magnetic device assembly also includes a circuit board, a power factor correction inductor, and a voltage conversion output differential mode inductor. The power factor correction inductor, the voltage conversion output differential mode inductor, the charger main transformer, and the windings of the voltage conversion main transformer are all located in the circuit of the circuit board.

10. An electronic device, characterized in that, The electronic device includes a housing and a power supply connected to the housing; The power supply device is the power supply device as described in any one of claims 1-9.

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