Power supply device and formation and capacity grading equipment

Abstract

The utility model belongs to the field of lithium battery production equipment, and particularly relates to a power supply device and formation and capacity grading equipment. The power supply device provided by the utility model comprises a heat insulation box body, a heat exchange assembly, a power supply module and an air duct bracket, a containing space is formed in the heat insulation box body, the air duct support is arranged in the containing space and forms a containing cavity, and the containing cavity is communicated with the containing space. The heat exchange assembly and the power module are stacked in the first direction at intervals and are both arranged on the air duct support, the power module is arranged in the containing cavity, and at least part of the heat exchange assembly is arranged in the containing space; the heat exchange assembly is used for conducting heat exchange with air in the containing space and enabling air flow obtained after heat exchange to circulate between the containing cavity and the containing space. The power supply device provided by the utility model has a relatively high integration level, so that the occupied space is reduced, and the equipment is more compact and efficient.

Description

[0001] This application is a divisional application of patent application 202422788312.5 entitled "A power supply device and a formation and capacity testing device" filed by the applicant on November 14, 2024. Technical Field

[0002] This application relates to the field of lithium battery production equipment, and in particular to a power supply device and a formation and capacity testing device. Background Technology

[0003] Battery formation and capacity testing are crucial steps in the battery production process. These two processes are usually integrated into a formation and capacity testing unit to achieve efficient and precise battery processing.

[0004] During the battery formation and capacity testing process, the battery is charged and discharged within the press of the formation and capacity testing equipment via positive and negative electrode probes. These probes typically require a DC-DC power module for power. During operation, the power module continuously generates heat through the conversion and transfer of electrical energy within its internal electronic components, causing the power module temperature to rise and consequently affecting its performance and stability. To address this, existing technologies typically employ heat exchange components, such as air cooling or water cooling, placed near the power module to dissipate heat and suppress temperature increases during operation. However, the integration of these heat exchange components with the power module in existing technologies is poor, and power modules with integrated heat exchange components often suffer from excessive space requirements, hindering the compactness and efficiency of the equipment.

[0005] In view of the above, this utility model is hereby proposed. Utility Model Content

[0006] This application provides a power supply device and a formation and capacity testing equipment, aiming to solve the problem that the heat exchange components and power modules in the prior art have poor integration and occupy too much space, which is not conducive to the compactness and efficiency of the equipment.

[0007] One aspect of this application provides a power supply device, including a heat insulation box, a heat exchange component, a power module, and a duct support; the heat insulation box forms an accommodating space, the duct support is arranged in the accommodating space and forms a receiving cavity, the receiving cavity is in communication with the accommodating space; the heat exchange component and the power module are stacked and spaced apart in a first direction and are both arranged on the duct support, and the power module is arranged in the receiving cavity, and at least a portion of the heat exchange component is arranged in the accommodating space; wherein, the heat exchange component is used to exchange heat with the gas in the accommodating space and enable the heat-exchanged airflow to circulate between the receiving cavity and the accommodating space.

[0008] In some embodiments, the heat exchange assembly includes a heat exchanger and a fan; the heat exchanger is arranged within the accommodating space and mounted on a duct support, the fan is arranged within the receiving cavity and mounted on the duct support, and the fan is located between the heat exchanger and the power module in a first direction.

[0009] In some embodiments, the duct support includes a first partition support and a second partition support stacked along a first direction, the first partition support and the second partition support being connected and together forming a receiving cavity; a heat exchanger and a fan are disposed on the end of the second partition support away from the first partition support in the first direction; and a power module is connected to the first partition support and / or the second partition support at both ends in the second direction to be suspended on the duct support.

[0010] In some embodiments, the first partition support has ventilation holes along the second direction to connect the receiving cavity and the accommodating space.

[0011] In some embodiments, the first partition support includes two first air duct partitions spaced apart along a second direction and a second air duct partition connected between the two first air duct partitions; the second partition support includes two third air duct partitions spaced apart along a second direction and a fourth air duct partition connected between the two third air duct partitions, the two third air duct partitions being correspondingly connected to the two first air duct partitions along a first direction; the power module is connected to the corresponding first air duct partitions and / or third air duct partitions at both ends along the second direction, and the heat exchanger and the fan are connected to the fourth air duct partition.

[0012] In some embodiments, the insulated enclosure includes an inner shell and an outer shell, the inner shell forming an accommodating space, and the outer shell disposed outside the inner shell and forming an insulated cavity between the outer shell and the inner shell; the power supply device further includes an insulation layer disposed within the insulated cavity and connected to the inner shell and / or the outer shell; and / or, the insulation layer is disposed within the accommodating space and connected to the inner shell; and / or, the insulation layer is disposed on the outer surface of the outer shell and connected to the outer shell.

[0013] In some embodiments, the power supply device further includes a pair of busbar connectors arranged at intervals along a second direction. One end of the busbar connector in the second direction is disposed on the air duct support and electrically connected to the power module, and the other end extends to the outside of the heat insulation box for electrically connecting positive / negative probes. The power module includes a plurality of DC-DC power supplies arranged at intervals along a third direction, and the two ends of each DC-DC power supply in the second direction are connected between a pair of busbar connectors.

[0014] In some implementations, the heat exchanger is a water-cooled heat exchanger.

[0015] In some embodiments, the heat insulation enclosure is also provided with pipe through holes for pipes of an external cooling medium circulation device to pass through the pipe through holes to connect to a heat exchanger for cooling medium circulation, and / or for external power supply harnesses to pass through the pipe through holes to connect to a power module for power supply.

[0016] Another aspect of this application provides a chemical composition and capacity testing device, including a power supply device as described above.

[0017] Compared with the prior art, the power supply device and the formation and capacity testing equipment provided in this application have at least the following advantages:

[0018] By optimizing the design of the power supply unit structure, the heat exchange components, power modules, and air duct supports are integrated and arranged in the accommodating space formed by the heat insulation box. The receiving cavity formed by the air duct supports is connected to the accommodating space. The heat exchange components and power modules are stacked and spaced apart in the first direction and are all set on the air duct supports. The power modules are arranged in the receiving cavity, and at least part of the heat exchange components are arranged in the accommodating space. This achieves a high degree of integration between the heat exchange components and the power modules, which helps to reduce space occupation and make the equipment more compact and efficient.

[0019] Furthermore, since the heat insulation enclosure can isolate the power module from the high-temperature environment outside the enclosure, the power module is located in the receiving cavity formed by the air duct support. The air duct support, together with the heat insulation enclosure, can provide heat insulation for the power module, ensuring efficient isolation between the power module and the high-temperature environment outside the enclosure. At the same time, the heat exchange components are used to exchange heat with the gas in the receiving space, and the heat-exchanged airflow circulates between the receiving cavity and the receiving space to continuously remove the heat generated by the power module, thereby significantly improving the heat dissipation efficiency of the power module.

[0020] Therefore, the power supply device provided in this application has a high degree of integration, which helps to reduce space occupation and make the equipment more compact and efficient; and through the synergistic heat insulation design of the heat insulation box and air duct support, combined with the heat exchange components to circulate heat dissipation of the power module, the heat dissipation efficiency of the power module can be greatly improved.

[0021] Other features and advantages of the power supply device and the formation and capacity testing equipment provided in this application will be described in detail in the following specific embodiments. Attached Figure Description

[0022] To more clearly illustrate the specific embodiments of this application or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the overall structure of the power supply device provided in the embodiments of this application;

[0024] Figure 2 A cross-sectional view of a power supply device provided in an embodiment of this application;

[0025] Figure 3 This is a schematic diagram of the gas flow direction within the power supply device provided in the embodiments of this application;

[0026] Figure 4 This is a partial structural diagram of the power supply device provided in an embodiment of this application;

[0027] Figure 5 This is a partial structural diagram of the power supply device provided in an embodiment of this application;

[0028] Figure 6 This is an enlarged schematic diagram of a local structure R provided in an embodiment of this application;

[0029] Figure 7 This is a schematic diagram of the modules of the chemical composition and capacity testing device provided in the embodiments of this application.

[0030] The attached figures are labeled as follows:

[0031] 100. Power supply device;

[0032] 10. Insulated enclosure; 10A. Reception space; 11. Inner shell layer; 12. Outer shell layer; 10B. Insulation cavity; 13. Pipe through-hole;

[0033] 20. Heat exchange components; 21. Heat exchanger; 22. Fan;

[0034] 30. Power supply module; 31. DC-DC power supply;

[0035] 40. Air duct support; 40A. Receiving cavity; 41. First partition support; 41A. Ventilation hole; 411. First air duct partition; 412. Second air duct partition; 42. Second partition support; 421. Third air duct partition; 422. Fourth air duct partition;

[0036] 50. Busbar connector; 51. First busbar clamp; 52. Second busbar clamp; 53. Busbar copper busbar;

[0037] 60. Support frame;

[0038] 1000. Formulation and capacity control equipment;

[0039] L1, first direction; L2, second direction; L3, third direction. Detailed Implementation

[0040] To make the above and other features and advantages of this application clearer, the application is further described below with reference to the accompanying drawings. It should be understood that the specific embodiments given herein are for the purpose of explanation to those skilled in the art, and are exemplary only, not restrictive.

[0041] In the following description, numerous specific details are set forth to provide a thorough understanding of this application. However, it will be apparent to those skilled in the art that the specific details are not required to practice this application. In other instances, well-known steps or operations have not been described in detail to avoid obscuring this application.

[0042] In the description of this application, it should be understood that the use of terms such as "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" to indicate orientation or positional relationship, unless otherwise specified, is understood to be based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0043] Furthermore, features specified with "first" or "second" for descriptive purposes only should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Features specified with "first" or "second" may explicitly or implicitly include at least one of the specified features. The description of "multiple" generally means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0044] In this application, unless otherwise explicitly specified and limited, terms such as "installation," "connection," "joining," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can be a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0045] In the description of this specification, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0046] As for the foregoing, the general inventive concept of this application is to provide a power supply device 100. Through structural optimization design of the power supply device 100, the heat exchange component 20, the power module 30, and the air duct support 40 are integrated into the internal accommodating space 10A of the heat-insulated housing 10. The power module 30 is arranged in the receiving cavity 40A formed by the air duct support 40. The receiving cavity 40A is connected to the accommodating space 10A to form a circulating air duct. The air duct support 40 not only provides support for fixing the heat exchange component 20 and the power module 30, but also cooperates with the heat insulation. The enclosure 10 forms a double heat insulation structure to effectively isolate the power module 30 from the high temperature of the external container environment. Furthermore, the heat exchange component 20 can exchange heat with the gas, allowing the gas to circulate between the receiving cavity 40A and the accommodating space 10A after heat exchange, thereby achieving continuous heat dissipation of the power module 30. With this design, the heat exchange component 20 and the power module 30 can be highly integrated within the heat-insulated enclosure 10, which helps to reduce space occupation, make the equipment more compact and efficient, and effectively improve the heat dissipation efficiency of the power module.

[0047] Based on the above concept, and referring to Figures 1-6 As shown in the embodiment of this application, a power supply device 100 includes a heat insulation box 10, a heat exchange component 20, a power module 30, and a duct support 40. The heat insulation box 10 forms an accommodating space 10A, and the duct support 40 is arranged in the accommodating space 10A and forms a receiving cavity 40A, which is connected to the accommodating space 10A. The heat exchange component 20 and the power module 30 are stacked and spaced apart in a first direction L1 and are both arranged on the duct support 40. The power module 30 is arranged in the receiving cavity 40A, and at least a portion of the heat exchange component 20 is arranged in the accommodating space 10A. The heat exchange component 20 is used to exchange heat with the gas in the accommodating space 10A and to allow the heat-exchanged airflow to circulate between the receiving cavity 40A and the accommodating space 10A.

[0048] It is understood that the heat insulation box 10 in this embodiment can be a square box. The heat insulation box 10 is the main structure of the power supply device 100. It has an internal accommodating space 10A, which is used to accommodate key components such as the heat exchange component 20, the power supply module 30 and the air duct support 40. The heat insulation box 10 can be made of a material with heat insulation function to effectively isolate the external high temperature environment and protect the power supply module 30 from the influence of high temperature.

[0049] Furthermore, the air duct support 40 is arranged within the accommodating space 10A. The receiving cavity 40A formed by the air duct support 40 is connected to the accommodating space 10A. One end of the air duct support 40 along the first direction L1 can be directly fixed to the inner wall of the heat insulation box 10, while the remaining part is spaced apart from the inner wall of the heat insulation box 10, so as to facilitate the circulation of gas between the receiving cavity 40A and the accommodating space 10A through the spaced part. The air duct support 40 not only provides support for the fixation of the heat exchange component 20 and the power module 30, but also forms a double heat insulation structure through its structural design in conjunction with the heat insulation box 10, further enhancing the isolation effect of the power module 30 from the external high-temperature environment.

[0050] The heat exchange component 20 and the power module 30 are stacked and spaced apart in the first direction L1 and are both mounted on the air duct support 40. The heat exchange component 20, as a key heat dissipation component in the power device 100, is at least partially arranged in the accommodating space 10A and connected to the air duct support 40 for heat exchange with the gas in the accommodating space 10A. After heat exchange, the gas can circulate between the receiving cavity 40A and the accommodating space 10A. In this way, the heat exchange component 20 can continuously remove the heat generated by the power module 30, achieving an effective heat dissipation effect. The power module 30 is used to provide power to the formation and capacity testing equipment. Since the power module 30 generates heat during operation, the temperature rise of the power module 30 can be effectively suppressed through the heat dissipation effect of the heat exchange component 20 and the double insulation of the air duct support 40 and the heat insulation box 10.

[0051] Therefore, the heat exchange component 20, the power module 30, and the air duct bracket 40 are all integrated into the accommodating space 10A of the heat insulation box 10, achieving a high degree of integration design, which helps to reduce space occupation and makes the power device 100 more compact and efficient. The air duct bracket 40 and the heat insulation box 10 work together to form a double heat insulation structure, which effectively isolates the influence of the external high temperature environment on the power module 30. The heat exchange component 20 exchanges heat with the gas in the accommodating space 10A and makes the airflow after heat exchange circulate between the receiving cavity 40A and the accommodating space 10A, thereby achieving continuous heat dissipation of the power module 30 and ensuring the stability and reliability of the power module 30 during operation.

[0052] It should be noted that the heat exchange component 20 in this embodiment can be spaced apart from the inner wall of the insulation box 10 in the first direction L1 and the second direction L2, providing a passage for gas circulation to facilitate the continuous heat dissipation of the power module 30.

[0053] refer to Figure 2 As shown, in some embodiments, the heat exchange assembly 20 includes a heat exchanger 21 and a fan 22; the heat exchanger 21 is arranged in the accommodating space 10A and mounted on the air duct support 40, the fan 22 is arranged in the receiving cavity 40A and mounted on the air duct support 40, and the fan 22 is located between the heat exchanger 21 and the power module 30 in the first direction L1.

[0054] In this embodiment, the heat exchanger 21, the fan 22, and the power module are arranged sequentially and at intervals along the first direction L1. The upper part of the air duct support 40 is located between the heat exchanger 21 and the fan 22 in the first direction L1. Both the heat exchanger 21 and the fan 22 are fixed on the air duct support 40. The heat exchanger 21, as a heat exchange device, can efficiently exchange heat with the gas in the accommodating space 10A. When the power module 30 generates heat, this heat will be transferred to the heat exchanger 21 through the air duct support 40 and the gas in the accommodating space 10A, realizing heat transfer. After the heat exchanger 21 exchanges heat with the gas, the fan 22 can effectively drive the gas to circulate between the receiving cavity 40A and the accommodating space 10A to continuously remove the heat generated by the power module 30. In this way, the heat exchange component 20 has a compact structure. Through the synergistic effect of the heat exchanger 21 and the fan 22, the heat exchange component 20 can achieve efficient heat dissipation and ensure that the power module 30 maintains a stable temperature during long-term operation.

[0055] It should also be noted that the gas flow direction in this embodiment can be referenced. Figure 3 As shown, the gas in the accommodating space 10A undergoes heat exchange through the heat exchanger 21. After heat exchange, the gas enters the receiving cavity 40A under the action of the fan 22 and flows through the power module 30. Then, it enters the accommodating space 10A from the receiving cavity 40A and undergoes heat exchange again through the heat exchanger 21 to achieve gas circulation. Of course, in some embodiments, the fan 22 can also supply the gas near the power module 30 in the receiving cavity 40A to the heat exchanger 21 for heat exchange. After heat exchange, the gas returns to the receiving cavity 40A after passing through the accommodating space 10A and flows through the power module 30. Then, it is supplied to the heat exchanger 21 again under the action of the fan 22 for heat exchange. All of these methods can achieve continuous heat dissipation of the power module 30.

[0056] Continue to refer to Figure 2In some embodiments, the duct support 40 includes a first partition support 41 and a second partition support 42 stacked along a first direction L1. The first partition support 41 and the second partition support 42 are connected and together form a receiving cavity 40A. The heat exchanger 21 and the fan 22 are disposed on the end of the second partition support 42 away from the first partition support 41 in the first direction L1. The power module 30 is connected to the first partition support 41 and / or the second partition support 42 at both ends in the second direction L2, so as to be suspended on the duct support 40.

[0057] In this embodiment, the duct support 40 is roughly square-shaped and mainly consists of a first partition support 41 and a second partition support 42. The first partition support 41 and the second partition support 42 are stacked along a first direction L1 and connected along the first direction L1 to form a receiving cavity 40A. The end of the first partition support 41 facing away from the second partition support 42 is connected to the inner wall of the heat insulation box 10. The remaining part of the first partition support and the second partition support 42 are connected to the inner wall of the heat insulation box 10. The walls are spaced at certain intervals to allow for gas flow; the end of the second partition bracket 42 away from the first partition bracket 41 is connected to a heat exchanger 21 and a fan 22 along the first direction L1, wherein the fan 22 is located in the receiving cavity 40A, and the heat exchanger 21 is located in the accommodating space 10A and has a certain distance from the inner wall of the heat insulation box 10 to allow for gas flow; the two ends of the power module 30 in the second direction L2 are connected to the first partition bracket 41 to be suspended on the air duct bracket 40 so that gas can flow in the receiving cavity 40A.

[0058] In some embodiments, the two ends of the power module 30 in the second direction L2 can also be connected to the first partition bracket 41 and the second partition bracket 42 at the same time. It is known that if it is only connected to the second partition bracket 42, it can be suspended on the air duct bracket 40, so that the gas can flow in the receiving cavity 40A.

[0059] like Figure 4 As shown, in some embodiments, the first partition bracket 41 has a ventilation hole 41A along the second direction L2 to connect the receiving cavity 40A and the accommodating space 10A, so that gas can flow between the receiving cavity 40A and the accommodating space 10A through the ventilation hole 41A.

[0060] In this embodiment, the first partition bracket 41 has ventilation holes 41A facing the second direction L2 at both ends. Gas enters the accommodating space 10A through the ventilation holes 41A from the receiving cavity 40A, and flows along the first partition bracket 41 toward the heat exchanger 21 on the second partition bracket 42. After heat exchange in the heat exchanger 21, the gas passes through the second partition bracket 42 along the first direction L1 under the action of the fan 22 and enters the receiving cavity 40A. After flowing through the power module 30, the gas enters the accommodating space 10A again through the ventilation holes 41A, thus realizing gas circulation. Of course, depending on the air supply direction of the fan 22, the gas can also circulate in the reverse direction along this path, which can achieve continuous heat dissipation of the power module 30.

[0061] In some embodiments, multiple ventilation holes 41A may be opened at intervals along the third direction L3 to meet the heat dissipation requirements when multiple DC-DC power supplies 31 are installed.

[0062] In some embodiments, the first partition bracket 41 includes two first air duct partitions 411 spaced apart along the second direction L2 and a second air duct partition 412 connected between the two first air duct partitions 411; the second partition bracket 42 includes two third air duct partitions 421 spaced apart along the second direction L2 and a fourth air duct partition 422 connected between the two third air duct partitions 421, the two third air duct partitions 421 being correspondingly connected to the two first air duct partitions 411 along the first direction L1; the power module 30 is connected to the corresponding first air duct partitions 411 and / or third air duct partitions 421 at both ends along the second direction L2, and the heat exchanger 21 and the fan 22 are connected to the fourth air duct partition 422.

[0063] It is understood that, in this embodiment, the heat exchanger 21 and the fan 22 can be arranged along the first direction L1 and connected to both sides of the fourth air duct baffle 422. The fourth air duct baffle 422 can be designed with through holes for gas flow to ensure that the gas can enter the receiving cavity 40A after heat exchange. The two ends of the power module 30 along the second direction L2 are respectively connected to the first air duct baffle 411 (e.g., Figure 2 As shown), ventilation holes 41A are opened on the two first air duct partitions 411 and are located at the end of the power module 30 away from the fan 22; one side of the second air duct partition 412 along the first direction L1 is connected to the inner wall of the heat insulation box 10, and the other side can be used for the control circuit board. After the two first air duct partitions 411 and the two third air duct partitions 421 are connected accordingly, they all maintain a certain distance from the inner wall of the heat insulation box 10 to allow gas to circulate.

[0064] refer to Figure 2As shown, the heat-insulating box 10 in this embodiment can be made of heat-insulating material. In order to improve the heat insulation effect, in some embodiments, the heat-insulating box 10 includes an inner shell layer 11 and an outer shell layer 12. The inner shell layer 11 forms an accommodating space 10A, and the outer shell layer 12 is disposed outside the inner shell layer 11 and forms a heat-insulating cavity 10B between the outer shell layer 11 and the inner shell layer 11. The design of the heat-insulating cavity 10B can further improve the heat insulation performance of the heat-insulating box 10, so as to suppress the temperature in the accommodating space 10A from rising due to the influence of the external high-temperature environment.

[0065] To further enhance the heat insulation effect, the power supply device 100 in some embodiments also includes a heat insulation layer (not shown). The heat insulation layer is made of heat insulation material and can be disposed in the heat insulation cavity 10B and connected to the inner shell layer 11 and / or the outer shell layer 12; and / or, the heat insulation layer is disposed in the accommodating space 10A and connected to the side of the inner shell layer 11 facing the accommodating space 10A; and / or, the heat insulation layer is disposed on the outer surface of the outer shell layer 12 and connected to the outer shell layer 12. This design significantly improves the heat insulation performance of the heat insulation box 10, thereby ensuring efficient isolation between the external high temperature environment and the power supply module 30.

[0066] Considering the power supply function of the power supply unit 100 to the formation and capacity testing equipment 1000, refer to Figure 2 as well as Figure 4-6 As shown, in some embodiments, the power supply device 100 further includes a pair of busbar connectors 50 arranged at intervals along the second direction L2. One end of the busbar connector 50 is disposed on the air duct support 40 and electrically connected to the power module 30 along the second direction L2, and the other end extends to the outside of the heat insulation box 10 for electrically connecting the positive / negative probes. The power module 30 includes a plurality of DC-DC power supplies 31 arranged at intervals along the third direction L3. The two ends of each DC-DC power supply 31 along the second direction L2 are connected between a pair of busbar connectors 50, thereby meeting the power supply requirements of multiple sets of positive / negative probes.

[0067] It should be noted that, in this embodiment of the application, the heat insulation box 10 has mounting holes at both ends along the second direction L2. The mounting holes are adapted to the size of the busbar connector 50, so that after the other end of the busbar connector 50 extends to the outside of the heat insulation box 10, the outer periphery of the busbar connector 50 is tightly connected to the heat insulation box 10, so as to form a sealed accommodating space 10A inside the heat insulation box 10, thereby improving the heat insulation effect of the heat insulation box 10.

[0068] refer to Figure 6As shown, in some embodiments, the busbar connector 50 includes a first busbar clamp 51, a second busbar clamp 52, and a busbar copper busbar 53; one end of the first busbar clamp 51 along the second direction L2 is disposed on the air duct support 40, and the second busbar clamp 52 and the end of the first busbar clamp 51 away from the air duct support 40 form a clamping groove; one end of the busbar copper busbar 52 along the second direction L2 is connected to the power module 30, and the other end extends out of the heat insulation box 10 through the clamping groove.

[0069] In this embodiment, both the first busbar clamp 51 and the second busbar clamp 52 are made of sealed insulating material. One end of the first busbar clamp 51 along the second direction L2 is set on the first air duct partition 411. The second busbar clamp 52 and the end of the first busbar clamp 51 away from the air duct support 40 form a clamping groove. One end of the busbar copper busbar 52 along the second direction L2 is connected to the power module 30, and the other end extends out of the heat insulation box 10 through the mounting hole via the clamping groove to connect to the positive or negative probe, thereby ensuring the power supply function of the power device 100.

[0070] To improve power supply stability, refer to Figure 4 As shown, in some embodiments, the power supply device 100 further includes two support frames 60 arranged at intervals along the second direction L2, and the air duct bracket 40 is arranged between the two support frames 60 along the second direction L2; one end of the support frame 60 along the first direction L1 is connected to the heat insulation box 10, and the other end is connected to the end of the first busbar block 51 away from the air duct bracket 40, so as to provide support for the first busbar block 51, thereby effectively improving the overall structural stability of the busbar connector 50, and thus making the power supply of the power supply device 100 more stable.

[0071] In some embodiments, the heat exchanger 21 is a water-cooled heat exchanger. Compared with traditional air-cooled heat exchangers, water-cooled heat exchangers use water as a cooling medium, have a higher energy efficiency ratio, and can save energy and reduce operating costs.

[0072] To meet the supply and circulation requirements of the cooling medium for heat exchanger 21, refer to Figure 4 As shown, in some embodiments, the heat insulation box 10 is also provided with pipe through holes 13. Two pipe through holes 13 are arranged at intervals along the first direction L1 so that the pipes for the external cooling medium circulation device pass through the pipe through holes 13 to connect the cooling medium inlet and cooling medium outlet of the heat exchanger 21, thereby realizing the circulation of cooling medium.

[0073] In some embodiments, the through-hole 13 is also used for external power supply harnesses to pass through the through-hole 13 to connect to the power module 30 for power supply.

[0074] refer to Figure 7As shown, another embodiment of this application provides a formation and capacity testing device 1000, including a power supply device 100 as described above. The formation and capacity testing device 1000 has a press. One or more power supply devices 100 can be designed to be mounted on the top of the press and electrically connected to the positive and negative probes on the press. Mounting the power supply device 100 on the top of the press can save on the amount of wiring harness used when electrically connecting the power supply device 100 to the positive and negative probes, and is more conducive to reducing the overall size of the formation and capacity testing device 1000. Of course, the power supply device 100 can also be mounted on the side of the press. This design facilitates wiring harness connection and is more conducive to maintenance.

[0075] In summary, the power supply device 100 provided in this application embodiment has a high degree of integration, which helps to reduce space occupation and make the equipment more compact and efficient; and through the synergistic heat insulation design of the heat insulation box 10 and the air duct bracket 40, and in conjunction with the heat exchange component 20 to circulate heat dissipation of the power module 30, the heat dissipation efficiency of the power module 30 can be greatly improved, so as to ensure that the performance of the power module 30 is stable.

[0076] Although embodiments of this application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting this application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of this application.

Claims

1. A power supply device (100), characterized in that, It includes an insulated enclosure (10), a heat exchange assembly (20), and a power module (30); The insulated box (10) forms an accommodating space (10A); The heat exchange assembly (20) and the power module (30) are stacked and spaced apart, and the power module (30) and the heat exchange assembly (20) are arranged in the accommodating space (10A); The heat exchange component (20) is used to exchange heat with the gas in the accommodating space (10A).

2. The power supply device (100) according to claim 1, characterized in that, The power supply device (100) also includes an air duct support (40), which is arranged in the accommodating space (10A) and forms a receiving cavity (40A). The heat exchange assembly (20) includes a heat exchanger (21) which is arranged in the accommodating space (10A) and mounted on the air duct support (40); The power module (30) is mounted on the air duct support (40) and arranged in the receiving cavity (40A).

3. The power supply device (100) according to claim 2, characterized in that, The receiving cavity (40A) is in communication with the accommodating space (10A); One end of the air duct support (40) along the first direction (L1) is fixed to the inner wall of the heat insulation box (10), and the rest is spaced apart from the inner wall of the heat insulation box (10) so that the airflow after heat exchange by the heat exchanger (21) can circulate between the receiving cavity (40A) and the accommodating space (10A) through the gap.

4. The power supply device (100) according to claim 3, characterized in that, The air duct support (40) includes a first partition support (41) and a second partition support (42) stacked along a first direction (L1), wherein the first partition support (41) and the second partition support (42) are connected and together form the receiving cavity (40A). The heat exchanger (21) is disposed in the first direction (L1) at one end of the second partition bracket (42) away from the first partition bracket (41); The power module (30) is connected to the first partition bracket (41) and / or the second partition bracket (42) at both ends in the second direction (L2) so as to be suspended on the air duct bracket (40).

5. The power supply device (100) according to claim 4, characterized in that, The first partition bracket (41) has a ventilation hole (41A) along the second direction (L2) to connect the receiving cavity (40A) and the accommodating space (10A). The gas can enter the receiving space (10A) from the receiving cavity (40A) through the ventilation hole (41A), or it can enter the receiving cavity (40A) from the receiving space (10A) through the ventilation hole (41A).

6. The power supply device (100) according to claim 4, characterized in that, The first partition bracket (41) includes two first air duct partitions (411) arranged at intervals along the second direction (L2) and a second air duct partition (412) connected between the two first air duct partitions (411). The second partition bracket (42) includes two third air duct partitions (421) arranged at intervals along the second direction (L2) and a fourth air duct partition (422) connected between the two third air duct partitions (421). The two third air duct partitions (421) are correspondingly connected to the two first air duct partitions (411) along the first direction (L1). The power module (30) is connected to the corresponding first air duct baffle (411) and / or the third air duct baffle (421) at both ends along the second direction (L2), and the heat exchanger (21) is connected to the fourth air duct baffle (422).

7. The power supply device (100) according to claim 3, characterized in that, The heat exchange assembly (20) also includes a fan (22), which is arranged in the receiving cavity (40A) and mounted on the air duct support (40), and the fan (22) is located between the heat exchanger (21) and the power module (30) in the first direction (L1).

8. The power supply device (100) according to any one of claims 1-7, characterized in that, The heat insulation box (10) includes an inner shell layer (11) and an outer shell layer (12). The inner shell layer (11) forms the accommodating space (10A). The outer shell layer (12) is disposed outside the inner shell layer (11) and forms a heat insulation cavity (10B) between the outer shell layer (11) and the inner shell layer (11). The power supply device (100) further includes a heat insulation layer disposed within the heat insulation cavity (10B) and connected to the inner shell layer (11) and / or the outer shell layer (12); and / or, the heat insulation layer is disposed within the accommodating space (10A) and connected to the inner shell layer (11); and / or, the heat insulation layer is disposed on the outer surface of the outer shell layer (12) and connected to the outer shell layer (12).

9. The power supply device (100) according to any one of claims 2 to 7, characterized in that, The heat exchanger (21) is a water-cooled heat exchanger.

10. A chemical composition and capacity preparation device (1000), characterized in that, Includes the power supply device (100) as described in any one of claims 1 to 9.

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