COB light source structure capable of enhancing air tightness

Abstract

The utility model relates to the technical field of COB light sources, and particularly discloses a COB light source structure capable of enhancing air tightness, which comprises a mirror surface aluminum substrate provided with a plurality of light-emitting chips and a first box dam surrounding the peripheries of the light-emitting chips. An insulating layer, a circuit copper foil layer, an ink layer and a second box dam are sequentially arranged on the outer side of the first box dam from bottom to top, the insulating layer is adhered to the surface of the mirror surface aluminum substrate through glue, the circuit copper foil layer is electrically connected with a light-emitting chip through a gold wire, and the inner side of the first box dam and the inner side of the second box dam are filled with fluorescent glue. According to the utility model, the first box dam is arranged to block the insulating layer, the circuit copper foil layer, the ink layer and the glue, so that the insulating layer, the circuit copper foil layer, the ink layer and the glue are prevented from dialyzing impurities at a high temperature to influence a plating layer of the mirror surface aluminum substrate, and the fluorescent glue is filled in the inner sides of the first box dam and the second box dam; and two times of dispensing are not needed during production, so that more convenience and higher efficiency are achieved.

Description

Technical Field

[0001] This utility model relates to the field of COB light source technology, and in particular to a COB light source structure that can enhance airtightness. Background Technology

[0002] COB (Chip on Board) is a chip-on-board packaging technology, where semiconductor chips are mounted on a printed circuit board. Electrical connections between the chip and the substrate are achieved using wire bonding, and the board is covered with resin to ensure reliability. Hermeticity is a crucial indicator of COB light source reliability, especially in humid environments where it directly impacts luminous quality and lifespan.

[0003] A search revealed that Chinese utility model patent CN202321699247.8 discloses a structure for preventing COB contamination and sulfurization failure, comprising a mirror aluminum substrate, a first dam, an LED chip, and a second dam. The mirror aluminum substrate has a light-emitting area in the center of its surface. The first dam is placed on the surface of the mirror aluminum substrate and surrounds the edge of the light-emitting area. The LED chip is arranged inside the light-emitting area, and a transparent silicone resin layer is provided on the upper surface of the LED chip. The second dam is attached to the surface of the first dam and is sealed to the transparent silicone resin layer. By superimposing the first and second dams in conjunction with the transparent silicone resin layer, the light-emitting area is covered and protected. The transparent silicone resin layer has smaller molecular gaps than silicone, lower air and moisture permeability, and a higher refractive index, effectively preventing external gases from entering the COB interior. This solves the problem of COB substrate deterioration and the inability to adequately protect the phosphor, ensuring stable COB lighting performance and extending the COB's lifespan.

[0004] While the existing COBs can meet basic anti-contamination requirements, they all require the chip surface to be covered with silicone and resin transparent adhesive, which requires two dispensing processes during production, making production inconvenient and inefficient. Furthermore, gaps exist when the mirror aluminum and the circuit board are glued together, and at high temperatures, impurities from the circuit board and adhesive can easily seep through to the mirror aluminum, affecting the plating of the mirror aluminum substrate and resulting in poor airtightness. Utility Model Content

[0005] The technical problem to be solved by this utility model is to provide a COB light source structure that can enhance airtightness in view of the above-mentioned defects of the prior art. By setting a first dam to block the insulating layer, the copper foil layer of the circuit, the ink layer and the adhesive, it is possible to prevent the insulating layer, the copper foil layer of the circuit, the ink layer and the adhesive from leaching impurities at high temperature and affecting the coating of the mirror aluminum substrate. Furthermore, the fluorescent adhesive is filled inside the first dam and the second dam, eliminating the need for two dispensing processes during production, which is more convenient and efficient.

[0006] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows:

[0007] A COB light source structure with enhanced airtightness includes a mirrored aluminum substrate. A plurality of light-emitting chips are disposed on the mirrored aluminum substrate, and a first dam is disposed around the periphery of the light-emitting chips. An insulating layer, a copper foil layer, an ink layer, and a second dam are disposed sequentially from bottom to top on the outer side of the first dam. The insulating layer is bonded to the surface of the mirrored aluminum substrate with adhesive. The copper foil layer is electrically connected to the light-emitting chips through gold wires. The inner sides of the first dam and the second dam are filled with fluorescent adhesive.

[0008] Preferably, the gold wire passes sequentially through the ink layer and the second dam and is electrically connected to the light-emitting chip.

[0009] Preferably, a die-attach adhesive is disposed between the bottom of the light-emitting chip and the mirror aluminum substrate.

[0010] Preferably, the upper ends of both the first and second cofferdams are provided with arc surfaces, and the second cofferdam is located on the upper right side of the first cofferdam.

[0011] Preferably, the light-emitting chips are evenly distributed in the middle of the mirror aluminum substrate, and the surface of the light-emitting chips is coated with a warm light coating.

[0012] Preferably, the copper foil layer covers the surface of the insulating layer, and the ink layer covers the surface of the copper foil layer.

[0013] By adopting the above technical solution, the COB light source structure provided by this utility model, which enhances airtightness, has the following beneficial effects: The COB light source structure has a plurality of light-emitting chips disposed on a mirror aluminum substrate and a first dam surrounding the light-emitting chips. From bottom to top, an insulating layer, a copper foil layer, an ink layer, and a second dam are sequentially disposed on the outer side of the first dam. The insulating layer is bonded to the surface of the mirror aluminum substrate with adhesive. The copper foil layer is electrically connected to the light-emitting chips via gold wires. The inner sides of both the first and second dams are filled with fluorescent adhesive. By setting the first dam, the insulating layer, copper foil layer, ink layer, and adhesive are blocked, thereby preventing impurities from seeping out at high temperatures and affecting the plating of the mirror aluminum substrate, avoiding incompatible reactions with the fluorescent adhesive, enhancing airtightness, and filling the gap between the mirror aluminum substrate and the copper foil layer. Furthermore, since the fluorescent adhesive is filled inside the first and second dams, two dispensing processes are eliminated during production, making it more convenient and efficient. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of another embodiment of the present invention;

[0016] In the diagram, 1-mirror aluminum substrate, 2-light-emitting chip, 3-first dam, 4-insulating layer, 5-circuit copper foil layer, 6-ink layer, 7-second dam, 8-adhesive, 9-gold wire, 10-fluorescent adhesive, 11-die bond adhesive, 12-arc surface, 13-warm light coating. Detailed Implementation

[0017] The specific embodiments of this utility model will be further described below with reference to the accompanying drawings. It should be noted that these descriptions are for the purpose of aiding understanding of this utility model, but do not constitute a limitation thereof. Furthermore, the technical features involved in the various embodiments of this utility model described below can be combined with each other as long as they do not conflict with each other.

[0018] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0020] like Figure 1 As shown, the COB light source structure that enhances airtightness includes a mirrored aluminum substrate 1. A plurality of light-emitting chips 2 are disposed on the mirrored aluminum substrate 1, and a first dam 3 surrounds the light-emitting chips 2. From bottom to top, the outer side of the first dam 3 is provided with an insulating layer 4, a copper foil layer 5, an ink layer 6, and a second dam 7. The insulating layer 4 is bonded to the surface of the mirrored aluminum substrate 1 by adhesive 8. The copper foil layer 5 is electrically connected to the light-emitting chips 2 by gold wires 9. The inner sides of both the first dam 3 and the second dam 7 are filled with fluorescent adhesive 10. It is understood that the mirrored aluminum substrate 1 can be a general-purpose mirrored aluminum substrate, etc.

[0021] Specifically, the gold wire 9 passes sequentially through the ink layer 6 and the second dam 7 and is electrically connected to the light-emitting chip 2; a die-attach adhesive 11 is disposed between the bottom of the light-emitting chip 2 and the mirror aluminum substrate 1; both the upper ends of the first dam 3 and the second dam 7 are provided with arc surfaces 12, and the second dam 7 is located on the upper right side of the first dam 3; the light-emitting chips 2 are evenly distributed in the middle of the mirror aluminum substrate 1, the copper foil layer 5 covers the surface of the insulating layer 4, and the ink layer 6 covers the surface of the copper foil layer 5. It can be understood that the upper part of the second dam 7 is an arc surface, i.e., in an open state, which can increase the light emission angle, reduce light loss, and also achieve better airtightness.

[0022] like Figure 2 As shown, in another embodiment of this utility model, the surface of the light-emitting chip 2 is coated with a warm light coating 13. It can be understood that the warm light coating 13 can be a high-concentration fluorescent adhesive, and the light used to make the light-emitting chip 2 emit warm light is warm light.

[0023] Understandably, this utility model has a reasonable design and unique structure. By setting the first dam 3 to block the insulating layer 4, the copper foil layer 5, the ink layer 6, and the adhesive 8, it avoids the insulating layer 4, the copper foil layer 5, the ink layer 6, and the adhesive 8 from leaching impurities at high temperatures, which would affect the plating of the mirror aluminum substrate 1. It also avoids these impurities from reacting incompatiblely with the fluorescent adhesive 10, enhances airtightness, and can fill the gap between the mirror aluminum substrate 1 and the copper foil layer 5. Furthermore, the fluorescent adhesive 10 is filled inside the first dam 3 and the second dam 7, eliminating the need for two dispensing processes during production, making it more convenient and efficient.

[0024] The embodiments of this utility model have been described in detail above with reference to the accompanying drawings, but this utility model is not limited to the described embodiments. For those skilled in the art, various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of this utility model, and these variations still fall within the protection scope of this utility model.

Claims

1. A COB light source structure with enhanced airtightness, comprising a mirrored aluminum substrate, wherein a plurality of light-emitting chips are disposed on the mirrored aluminum substrate and a first dam is disposed around the periphery of the light-emitting chips, characterized in that: The outer side of the first dam is provided with an insulating layer, a copper foil layer, an ink layer and a second dam in sequence from bottom to top. The insulating layer is bonded to the surface of the mirror aluminum substrate with adhesive. The copper foil layer is electrically connected to the light-emitting chip through gold wires. The inner sides of the first dam and the second dam are filled with fluorescent adhesive.

2. The COB light source structure with enhanced airtightness according to claim 1, characterized in that: The gold wire passes sequentially through the ink layer and the second dam and is electrically connected to the light-emitting chip.

3. The COB light source structure with enhanced airtightness according to claim 1, characterized in that: A die-bonding adhesive is provided between the bottom of the light-emitting chip and the mirror aluminum substrate.

4. The COB light source structure with enhanced airtightness according to claim 1, characterized in that: Both the first and second cofferdams have arc-shaped surfaces at their upper ends, with the second cofferdam located to the right of the upper end of the first cofferdam.

5. The COB light source structure with enhanced airtightness according to claim 1, characterized in that: The light-emitting chips are evenly distributed in the middle of the mirror aluminum substrate, and the surface of the light-emitting chips is coated with a warm light coating.

6. The COB light source structure with enhanced airtightness according to claim 1, characterized in that: The copper foil layer of the circuit covers the surface of the insulating layer, and the ink layer covers the surface of the copper foil layer of the circuit.

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