Bimetal coating copper foil adhesive tape

Abstract

The utility model provides a double-metal-coating copper foil adhesive tape. The double-metal-coating copper foil adhesive tape comprises a second metal coating, a first metal coating, a copper foil layer, an adhesive layer and a release layer which are sequentially arranged, the second metal coating is a chromium coating; and the first metal coating is a nickel coating. The single-sided double-metal coating copper foil is used as a base material, and the untreated surface of the double-metal coating copper foil is glued, so that the influence of interface difference on the mechanical property of the adhesive tape is avoided, and the adhesive tape still has excellent corrosion resistance, oxidation resistance and electromagnetic shielding performance under the conditions of high temperature, high humidity and high salt mist.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of adhesive tape, and relates to a bimetallic plated copper foil adhesive tape. BACKGROUND

[0002] With the continuous upgrading of mobile phones, computers, smart watches and other 3C digital products, copper foil adhesive tape is widely used in these products, mainly playing the roles of electromagnetic shielding, heat conduction and dissipation, grounding and anti-static, and can prevent screen from overheating and resist electromagnetic wave interference.

[0003] Traditional copper foil adhesive tape is prone to oxidation in high-salt mist, high-temperature and high-humidity environments and complex spaces. CN101693817A discloses a super-conductive copper foil adhesive tape, which is coated with a conductive adhesive having super-low resistance, and the copper foil is convenient to bend and curl, has super-high conductivity and direct welding function, is not prone to cracking, and is suitable for electronic parts and punching processing characteristics. However, the tin-plated copper foil is prone to oxidation.

[0004] Therefore, it is urgent to develop a bimetallic plated copper foil adhesive tape with excellent corrosion resistance, oxidation resistance and electromagnetic shielding performance under high-temperature and high-humidity, high-salt mist conditions to prolong the service life of the product. CONTENT OF THE UTILITY MODEL

[0005] In view of the deficiencies in the prior art, the utility model aims to provide a bimetallic plated copper foil adhesive tape, which uses single-sided bimetallic plated copper foil as a base material and still has excellent corrosion resistance, oxidation resistance and electromagnetic shielding performance under high-temperature and high-humidity, high-salt mist conditions, meeting the application in display modules.

[0006] To achieve this purpose, the utility model adopts the following technical solutions:

[0007] The utility model provides a bimetallic plated copper foil adhesive tape, which comprises a second metal plating layer, a first metal plating layer, a copper foil layer, an adhesive layer and a release layer arranged in sequence.

[0008] The second metal plating layer is a chromium plating layer.

[0009] The first metal plating layer is a nickel plating layer.

[0010] The double-metal plating copper foil adhesive tape disclosed by the utility model comprises a second metal plating layer, a first metal plating layer, a copper foil layer, a glue layer and a release layer which are sequentially arranged, the single-face double-metal plating copper foil is used as a base material, and then the untreated surface of the double-metal plating copper foil is glued, the influence of interface difference on the mechanical property of the adhesive tape is avoided, the double-metal plating copper foil adhesive tape still has excellent oxidation resistance, corrosion resistance and electromagnetic shielding performance under the conditions of high temperature and high humidity and high salt fog without affecting the mechanical property, and the application in display modules is met.

[0011] As the preferred technical scheme of the utility model, the thickness of the second metal plating layer is 10-50nm.

[0012] As the preferred technical scheme of the utility model, the thickness of the first metal plating layer is 50-600nm.

[0013] As the preferred technical scheme of the utility model, the copper foil layer is a calendered copper foil layer or an electrolytic copper foil layer.

[0014] As the preferred technical scheme of the utility model, the thickness of the copper foil layer is 10-50mu m.

[0015] As the preferred technical scheme of the utility model, the glue layer is an acid-free glue layer.

[0016] As the preferred technical scheme of the utility model, the thickness of the glue layer is 12-40mu m.

[0017] As the preferred technical scheme of the utility model, the release layer is a PET release layer.

[0018] As the preferred technical scheme of the utility model, the thickness of the release layer is 25-50mu m.

[0019] Compared with the prior art, the utility model has the following beneficial effects:

[0020] The double-metal plating copper foil adhesive tape disclosed by the utility model comprises a second metal plating layer, a first metal plating layer, a copper foil layer, a glue layer and a release layer which are sequentially arranged, the single-face double-metal plating copper foil is used as a base material, and then the untreated surface of the double-metal plating copper foil is glued, the influence of interface difference on the mechanical property of the adhesive tape is avoided, the double-metal plating copper foil adhesive tape still has excellent oxidation resistance, corrosion resistance and electromagnetic shielding performance under the conditions of high temperature and high humidity and high salt fog without affecting the mechanical property; wherein the appearance is free from corrosion and oxidation discoloration after being placed in a 35 DEG C, 5% NaCl solution environment for 1 day and in a 85 DEG C, 85% humidity environment for 10 days. BRIEF DESCRIPTION OF DRAWINGS

[0021] Figure 1is a structural schematic diagram of the double-metal plated copper foil adhesive tape provided in Embodiment 1;

[0022] Wherein, 1-second metal plating layer, 2-first metal plating layer, 3-copper foil layer, 4-gel layer, 5-release layer. DETAILED DESCRIPTION

[0023] It should be understood that, in the description of the present application, the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0024] It should be noted that, in the description of the present application, unless otherwise specified and limited, the terms "provided", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication between two elements inside. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0025] The embodiment of the present application provides a double-metal plated copper foil adhesive tape, the double-metal plated copper foil adhesive tape comprises a second metal plating layer, a first metal plating layer, a copper foil layer, a gel layer and a release layer which are sequentially arranged.

[0026] The second metal plating layer is a chromium plating layer;

[0027] The first metal plating layer is a nickel plating layer.

[0028] It should be noted that the preparation method of the double-metal plated copper foil adhesive tape provided by the present application is not specially limited. It can also be carried out according to the following method: 1) providing an adhesive; 2) coating the adhesive on the release layer; 3) bonding the copper surface of the double-metal plated copper foil on the adhesive, and then winding the double-metal plated surface outward, and aging at a temperature of 40 DEG C for 3-7 days to obtain the double-metal plated copper foil adhesive tape.

[0029] It should be noted that the materials of each layer in the double-metal plated copper foil adhesive tape provided by the present application are all existing materials, which can be directly purchased on the market, or the raw materials can be purchased and then prepared according to the existing formula.

[0030] It should be further explained that if the double-sided double-metal plated copper foil is used as the base material, the adhesive formula needs to be further improved, and the conventional adhesive formula may affect the mechanical properties of the adhesive tape.

[0031] In some embodiments of the present application, the thickness of the second metal plating layer is 10-50 nm, for example, it can be 15 nm, 20 nm, 25 nm, 30 nm, 35 nm, 40 nm, 45 nm, or 48 nm, etc., but is not limited to the listed values, and other values not listed in this range are also applicable.

[0032] In some embodiments of the present application, the thickness of the first metal plating layer is 50-600 nm, for example, it can be 100 nm, 150 nm, 200 nm, 250 nm, 300 nm, 350 nm, 400 nm, 450 nm, 500 nm, or 550 nm, etc., but is not limited to the listed values, and other values not listed in this range are also applicable.

[0033] In the present application, the process of the first metal plating layer or the second metal plating layer includes chemical plating or electroplating. For example, a copper foil layer can be used as a base material, and nickel and chromium are plated in sequence on one surface of the copper foil layer by electroplating to obtain a double-metal plated copper foil.

[0034] In some embodiments of the present application, the copper foil layer is a calendered copper foil layer or an electrolytic copper foil layer.

[0035] In some embodiments of the present application, the thickness of the copper foil layer is 10-50 μm, for example, it can be 15 μm, 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, or 48 μm, etc., but is not limited to the listed values, and other values not listed in this range are also applicable.

[0036] In some embodiments of the present application, the adhesive layer is an acid-free adhesive layer.

[0037] It should be noted that the present application uses an acid-free adhesive layer to reduce the corrosion of copper in contact with the adhesive surface.

[0038] In the present application, the acid-free adhesive layer is an acid-free acrylic adhesive layer, and the specific materials used include acid-free acrylic hard monomer, acid-free acrylic soft monomer, acrylic initiator, tackifying resin, etc., and conventional additives such as tackifying resin can also be added. The entire formula is the existing formula, and the specific ratio can be referred to CN114149534A.

[0039] In some embodiments of this utility model, the thickness of the adhesive layer is 12-40μm, for example, it can be 14μm, 15μm, 16μm, 18μm, 20μm, 22μm, 25μm, 26μm, 28μm, 30μm, 32μm, 35μm, 36μm or 38μm, etc., but is not limited to the listed values, and other unlisted values ​​within this range are also applicable.

[0040] In some embodiments of this utility model, the release layer is a PET release layer.

[0041] As a preferred technical solution of this utility model, the thickness of the release layer is 25-50μm, for example, it can be 26μm, 28μm, 30μm, 32μm, 35μm, 36μm, 38μm, 40μm, 42μm, 45μm, 46μm or 48μm, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0042] In this invention, the total thickness of the bimetallic coated copper foil tape is 55-120μm, for example, it can be 60μm, 65μm, 70μm, 75μm, 80μm, 85μm, 90μm, 95μm, 100μm, 105μm, 110μm or 115μm, but is not limited to the listed values. Other unlisted values ​​within this range are also applicable.

[0043] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0044] Example 1

[0045] This embodiment provides a bimetallic coated copper foil tape, the bimetallic coated copper foil tape (structural schematic diagram shown below) Figure 1 (As shown) includes a second metal plating layer 1, a first metal plating layer 2, a copper foil layer 3, an adhesive layer 4, and a release layer 5 arranged sequentially;

[0046] The second metal plating layer 1 is a chromium plating layer with a thickness of 40 nm;

[0047] The first metal plating layer 2 is a nickel plating layer with a thickness of 300 nm;

[0048] The copper foil layer 3 is an electrolytic copper foil layer with a thickness of 18μm;

[0049] The adhesive layer 4 is an acid-free acrylic adhesive layer with a thickness of 12μm; the raw material formula of the acid-free acrylic adhesive layer is the proportion and composition disclosed in Example 1 of CN114149534A.

[0050] The release layer 5 is a PET release layer with a thickness of 30μm.

[0051] Example 2

[0052] The embodiment provides a double-metal-plated copper foil adhesive tape, which comprises a second metal plating layer, a first metal plating layer, a copper foil layer, an adhesive layer and a release layer arranged in sequence.

[0053] The second metal plating layer is a chromium plating layer with a thickness of 20 nm.

[0054] The first metal plating layer is a nickel plating layer with a thickness of 100 nm.

[0055] The copper foil layer is an electrolytic copper foil layer with a thickness of 25 mu m.

[0056] The adhesive layer is an acid-free acrylic adhesive layer with a thickness of 24 mu m; the raw material formula of the acid-free acrylic adhesive layer is the ratio composition disclosed in Example 1 of CN114149534A.

[0057] The release layer is a PET release layer with a thickness of 40 mu m.

[0058] Example 3

[0059] The embodiment provides a double-metal-plated copper foil adhesive tape, which comprises a second metal plating layer, a first metal plating layer, a copper foil layer, an adhesive layer and a release layer arranged in sequence.

[0060] The second metal plating layer is a chromium plating layer with a thickness of 50 nm.

[0061] The first metal plating layer is a nickel plating layer with a thickness of 400 nm.

[0062] The copper foil layer is an electrolytic copper foil layer with a thickness of 30 mu m.

[0063] The adhesive layer is an acid-free acrylic adhesive layer with a thickness of 35 mu m; the raw material formula of the acid-free acrylic adhesive layer is the ratio composition disclosed in Example 1 of CN114149534A.

[0064] The release layer is a PET release layer with a thickness of 45 mu m.

[0065] Comparative Example 1

[0066] The comparative example provides a nickel-plated copper foil adhesive tape, which is identical to Example 1 except that no second metal plating layer is arranged.

[0067] Comparative Example 2

[0068] The comparative example provides a copper foil adhesive tape, which is identical to Example 1 except that no first metal plating layer and no second metal plating layer are arranged.

[0069] The copper foil adhesive tapes obtained in the above examples and comparative examples were subjected to performance tests, and the test results are shown in Table 1.

[0070] The performance tests specifically included:

[0071] (1) Normal temperature peeling force test: Under room temperature conditions (23±2℃), a 25mm×140mm (length×width) copper foil adhesive tape was attached to a SUS steel plate, and after 3 passes of back-and-forth rolling with a 2kg roller, it was left to stand for 20min, and then a 180° peeling force test was performed on a universal testing machine, with a tensile speed of 300mm / min, and the average value of the force in the 40-140mm interval was taken;

[0072] (2) Elastic modulus test: Under room temperature conditions (23±2℃), the copper foil raw material of the copper foil adhesive tape was cut into a 10mm×100mm (length×width) sample, and a tensile strength test was performed on a Shimadzu tensile testing machine, with a tensile speed of 50mm / min.

[0073] (3) Surface resistance test: A 50mm×75mm (length×width) copper foil adhesive tape sample was placed on a horizontal surface (insulated), and then a 500g jig was placed on the surface of the sample, and the surface resistance of the sample was measured with a micro-resistance tester.

[0074] (4) High temperature and high humidity 10d appearance: The copper foil adhesive tape was placed in an environment of 85℃ and 85% humidity for 10 days, and the color change in appearance was observed.

[0075] (5) Appearance after salt spray: The copper foil adhesive tape was placed in a 5% NaCl solution and a salt spray environment of 35℃ for 1 day, and the color change in appearance was observed.

[0076] Table 1

[0077]

[0078] From Table 1, it can be seen that:

[0079] The bimetallic plated copper foil adhesive tapes provided in Examples 1-3 had no corrosion or oxidation changes in appearance under high temperature and high humidity and high salt spray conditions, and also had excellent electrical conductivity, with a surface resistance of less than 0.01Ω, and the normal temperature peeling force and elastic modulus were comparable to those of the acid-free copper foil adhesive tape provided in Comparative Example 2; thus, it was shown that the bimetallic plated copper foil adhesive tapes provided in Examples 1-3 had excellent corrosion resistance, oxidation resistance and adhesion;

[0080] From the comprehensive example 1 and the comparative example 1-2, if only single-sided nickel-plated copper foil is used as the substrate, the nickel-plated copper foil tape still has good performance in high temperature and high humidity conditions due to the good corrosion resistance and oxidation resistance of the metal nickel, but its salt spray resistance is slightly poor, and there is slight oxidation and corrosion. If single-sided chromium-plated nickel-plated copper foil is used as the substrate, the chromium plating layer brings oxidation resistance to the material, and increases the color resistance and corrosion resistance of the material, so the material has excellent performance in the salt spray environment. If there is no plating layer on the surface of the copper foil, after 1 day of salt spray environment treatment, the appearance shows obvious oxidation, corrosion and discoloration, which indicates that the oxidation resistance and corrosion resistance of the acid-free copper foil tape provided in the comparative example 2 are poor.

[0081] The applicant declares that the above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. It should be understood by those skilled in the art that any changes or replacements within the technical scope disclosed by the present application can be easily thought of by any person skilled in the art, and all fall within the protection scope and disclosure scope of the present application.

Claims

1. A double metal plated copper foil tape, characterized by, The double-metal-plated copper foil adhesive tape comprises a second metal plating layer, a first metal plating layer, a copper foil layer, an adhesive layer and a release layer arranged in sequence. The second metal plating layer is a chromium plating layer. The first metal plating layer is a nickel plating layer.

2. The bimetallic coated copper foil tape of claim 1, wherein, The thickness of the second metal plating layer is 10-50 nm.

3. The bimetallic coated copper foil tape of claim 1, wherein, The thickness of the first metal plating layer is 50-600 nm.

4. The bimetallic coated copper foil tape of claim 1, wherein, The copper foil layer is a calendered copper foil layer or an electrolytic copper foil layer.

5. The bimetallic coated copper foil tape of claim 1, wherein, The thickness of the copper foil layer is 10-50 μm.

6. The bimetallic coated copper foil tape of claim 1, wherein, The adhesive layer is an acid-free adhesive layer.

7. The bimetallic coated copper foil tape of claim 1, wherein, The thickness of the adhesive layer is 12-40 μm.

8. The bimetallic coated copper foil tape of claim 1, wherein, The release layer is a PET release layer.

9. The bimetallic coated copper foil tape of claim 1, wherein, The thickness of the release layer is 25-50 μm.

Images