Multi-column SOP electroplating mold

By using separators to control the plating solution range and assembly rods for quick assembly and disassembly in multi-row SOP electroplating molds, the problem of uneven plating solution exchange speed between nozzles and lead frames was solved, achieving stable plating solution flow rate and quick mold assembly and disassembly.

CN223879874UActive Publication Date: 2026-02-06JIANGMEN FUSHENG ELECTROMECHANICAL CO LTD
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Patent Information

Application Number
CN202520520948.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-24
Publication Date
2026-02-06
Estimated Expiration
2035-03-24

AI Technical Summary

Technical Problem

In the existing platen selective electroplating method, the uneven exchange rate of plating solution between the nozzle and the lead frame leads to uneven silver color, and the mold assembly and disassembly efficiency is low.

Method used

The plating solution range is controlled by using a separator bar in conjunction with the nozzle, and the upper and lower mold bases can be quickly assembled and disassembled by an assembly rod. The connection stability is improved by combining a T-shaped rod and a spring structure.

Benefits of technology

This achieves stability in the plating solution flow rate, avoids color differences on the silver surface, and improves the efficiency of mold assembly and disassembly.

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Abstract

The utility model discloses a multi-column SOP electroplating mold, and relates to the technical field of electroplating molds. The die comprises an upper die base and a lower die base located at the notch position of the lower end of the lower die base. An anode plate is arranged between the upper die base and the lower die base, a lead frame is fixed to the upper end face of the upper die base, a plurality of separation strips which are linearly arranged left and right and fixed to the inner side of the upper die base are arranged on the lower end face of the lead frame, and a plurality of conical barrels which are located between every two separation strips one by one are fixed to the upper end face of a connecting plate. Nozzles located on the inner side of the lower die base are fixed to the upper end faces of the conical barrels correspondingly, and assembling rods with the ends inserted into the assembling holes are arranged in the inserting holes. According to the utility model, the separation strip and the spray head are matched for use, so that the range of a plating solution sprayed by the spray nozzle is controlled, the stable flow rate of the plating solution is ensured, chromatic aberration of a silver coating surface of the lead frame is avoided, and meanwhile, the upper die holder and the lower die holder can be conveniently disassembled and assembled by using the assembly rod.
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Description

TECHNICAL FIELD

[0001] The utility model belongs to electroplating mould technical field, especially relates to a multi-row SOP electroplating mould. BACKGROUND

[0002] The pressure plate type selective electroplating method clamps the lead frame by the silicon rubber structure pressure plate in the mould opening device, the anode and the nozzle are arranged in the mould, the plating solution is sprayed from the nozzle at high speed to achieve the purpose of high-speed electroplating, the method has high precision in the electroplating range, the mould cost is low, and the method is suitable for continuous electroplating and short-size intermittent piece type independent electroplating.

[0003] But the distance between the nozzle and the lead frame is close in the production process, so that the plating solution AG ion exchange speed in the circular area directly above the nozzle is faster than that in the surrounding plating area, thereby silver surface color unevenness easily occurs, product appearance is poor, and normal production cannot be carried out, and meanwhile, the electroplating mould group used is bolted and assembled by using a plurality of bolts each time, and the assembly mode can greatly improve the disassembly and assembly efficiency of the mould. UTILITY MODEL CONTENTS

[0004] The utility model discloses a kind of multi-row SOP electroplating moulds, by the cooperation of partition strip and spray head, to control the plating solution range that nozzle sprays, guarantee plating solution flow rate stability, avoid the color difference of the silver surface coated to lead frame, simultaneously, after the use of assembly rod, it can be convenient to disassemble and assemble upper die holder and lower die holder.

[0005] To solve the above technical problems, the utility model is realized by the following technical schemes:

[0006] The utility model discloses a kind of multi-row SOP electroplating moulds, including upper die holder and lower die holder at the lower end recess position of lower die holder;Anode plate is arranged between upper die holder and lower die holder, the upper end surface of upper die holder is fixed with lead frame, the lower end surface of lead frame is provided with a plurality of partition strips, which are linearly arranged left and right and fixed in the inner side position of upper die holder, the lower end surface of lower die holder is provided with connecting plate, the upper end surface of connecting plate is fixed with a plurality of conical barrels, which are respectively arranged between two partition strips, the upper end surface of conical barrel is fixed with nozzle at the inner side position of lower die holder, the left and right parts of upper die holder are all provided with insertion hole, the left and right side walls of lower die holder are all provided with assembly hole at the position corresponding to insertion hole, and assembly rod is arranged in the inner side position of assembly hole.

[0007] The utility model further sets up, the upper end surface of lower die holder is provided with positioning hole, and the T-shaped rod is inserted into the inner side position of positioning hole in the T-shaped hole corresponding to positioning hole in upper die holder.

[0008] The utility model further sets up, the lower end surface of lower die seat is provided with recess, the connecting plate is inlayed in recess, the tapered cylinder is set up in the inside position of lower die seat through the tapered mouth inside provided with in lower die seat.

[0009] The utility model further sets up, the anode plate is through the orifice of end surface and is sleeved on the nozzle.

[0010] The utility model further sets up, the end surface of assembly rod through the insertion hole is all fixed with the baffle of with upper die seat side wall meets, the left and right side wall of upper die seat all is fixed with U shaped board at the position of insertion hole, the position of insertion hole is all provided with moving hole on the side wall of U shaped board.

[0011] The utility model further sets up, the end surface of baffle opposite upper die seat is all fixed with spring, and another end of spring all is with the inside wall of similar U shaped board abuts.

[0012] The utility model further sets up, the end surface of baffle opposite upper die seat is all fixed with moving rod, and the end surface of moving rod through spring and moving hole inside is all fixed with the pull plate of with U shaped board side wall meets.

[0013] The utility model has the advantages of following:

[0014] 1, the utility model sets up the lead frame in the upper end surface position of upper die seat, makes a part of lead frame end surface with the inside of upper die seat meets, therefore, after nozzle is sprayed into the plating solution in upper die seat, the plating solution will be sprayed in a part position of lead frame, and is separated by the separation strip to the sprayed plating solution and is handled, to control the plating solution range of nozzle spray, control the height between nozzle and lead frame, guarantee the plating solution flow rate stability, avoid the color difference of the silver surface of lead frame coating.

[0015] 2, the utility model inserts the assembly rod into insertion hole and assembly hole, makes upper die seat and lower die seat closely assembled, and the assembly rod is quickly taken out in assembly hole, makes upper die seat and lower die seat quickly separate and dismount, realizes quick dismounting. BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical scheme of the embodiment of the utility model, the following will be to the embodiment description needed to use the drawing briefly introduces.

[0017] Figure 1 It is the overall structure diagram in the utility model.

[0018] Figure 2 It is the structure diagram of upper die seat in the utility model.

[0019] Figure 3 It is the structure diagram of lower die seat in the utility model.

[0020] Figure 4 The structural combination drawing of the connecting plate and the nozzle in the utility model.

[0021] Figure 5 The structural drawing of the assembly rod in the utility model.

[0022] In the drawings, the component list represented by each sign is as follows:

[0023] 1 - upper die holder, 101 - lead frame, 102 - insertion hole, 103 - U-shaped plate, 104 - partition strip, 105 - moving hole, 2 - lower die holder, 201 - notch, 202 - conical port, 203 - anode plate, 204 - positioning hole, 205 - assembly hole, 3 - connecting plate, 301 - conical cylinder, 302 - nozzle, 4 - assembly rod, 401 - baffle, 402 - spring, 403 - moving rod, 404 - pull plate, 5 - T-shaped rod. DETAILED DESCRIPTION

[0024] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model.

[0025] Embodiment 1

[0026] Please refer to Figures 1 to 5 The utility model discloses a kind of multi-column SOP electroplating moulds, by the cooperation of partition strip 104 and spray head, to control the plating solution range that nozzle 302 sprays, ensure plating solution flow rate stability, avoid the color difference of the silver surface coated on lead frame 101, simultaneously, after using assembly rod 4, it can be convenient to disassemble and assemble upper die holder 1 and lower die holder 2.

[0027] Specifically, upper die holder 1 and lower die holder 2 at the notch 201 position of lower die holder 2 lower end;Anode plate 203 is provided between upper die holder 1 and lower die holder 2, the upper end surface of upper die holder 1 is fixed with lead frame 101, the lower end surface of lead frame 101 is provided with a plurality of partition strips 104, which are linearly arranged left and right and fixed inside the position of upper die holder 1, the lower end surface of lower die holder 2 is provided with connecting plate 3, the upper end surface of connecting plate 3 is fixed with a plurality of conical cylinders 301, which are respectively arranged between two partition strips 104, the upper end surface of conical cylinder 301 is fixed with nozzle 302 inside the position of lower die holder 2, the left and right parts of upper die holder 1 are provided with insertion hole 102, the left and right side walls of lower die holder 2 are provided with assembly hole 205 at the position corresponding to insertion hole 102, assembly rod 4 is provided inside insertion hole 102, and the end of assembly rod 4 is inserted into the inside position of assembly hole 205, anode plate 203 is sleeved on nozzle 302 through the orifice provided on the end surface.

[0028] The operation process of the embodiment is as follows: through the use of the above structure, the upper die holder 1 and the lower die holder 2 are combined in an up-down manner, the upper die holder 1 and the lower die holder 2 clamp the anode plate 203, the lead frame 101 is arranged at the upper end surface position of the upper die holder 1, a part of the end surface of the lead frame 101 is in contact with the inner side of the upper die holder 1, therefore, after the nozzle 302 sprays the plating solution into the upper die holder 1, the plating solution is sprayed on a part of the lead frame 101, so that the part of the end surface of the lead frame 101 is coated with a silver surface, the assembly rod 4 is inserted into the plug-in hole 102 and the assembly hole 205, the upper die holder 1 and the lower die holder 2 are tightly assembled, the assembly rod 4 is quickly taken out of the assembly hole 205, the upper die holder 1 and the lower die holder 2 are quickly disassembled, and the quick disassembly is realized.

[0029] Embodiment 2

[0030] Please refer to Figure 2 and Figure 3 , on the basis of embodiment 1, the T-shaped rod 5 is inserted into the positioning hole 204, the upper die holder 1 and the lower die holder 2 can be pre-positioned.

[0031] Specifically, the upper end surface of the lower die holder 2 is provided with a positioning hole 204, the T-shaped hole corresponding to the positioning hole 204 of the upper die holder 1 is provided with a T-shaped rod 5 inserted into the inner position of the positioning hole 204, the lower end surface of the lower die holder 2 is provided with a notch 201, the connecting plate 3 is embedded in the notch 201, and the conical cylinder 301 is arranged at the inner position of the lower die holder 2 by penetrating through the conical hole 202 arranged in the inner part of the lower die holder 2.

[0032] The operation process of the embodiment is as follows: when the upper die holder 1 and the lower die holder 2 are combined in an up-down manner, the T-shaped rod 5 is inserted into the positioning hole 204, which can preliminarily ensure the stability of the connection between the upper die holder 1 and the lower die holder 2, and can align the plug-in hole 102 on the side wall of the upper die holder 1 with the assembly hole 205 on the side wall of the lower die holder 2.

[0033] Embodiment 3

[0034] Please refer to Figure 2 , Figure 3 and Figure 5 , on the basis of embodiment 1, the pull plate 404 is used to control the assembly rod 4, and the spring 402 is used to push the baffle 401, so as to ensure that the assembly rod 4 is stably inserted into the assembly hole 205.

[0035] Specifically, the end surface of the assembly rod 4 penetrating through the insertion hole 102 is fixed with a baffle plate 401 connected with the side wall of the upper die holder 1, the left and right side walls of the upper die holder 1 are fixed with U-shaped plates 103 corresponding to the position of the insertion hole 102, the side wall of the U-shaped plate 103 is provided with a moving hole 105 corresponding to the position of the insertion hole 102, the end surface of the baffle plate 401 opposite to the upper die holder 1 is fixed with a spring 402, and the other end of the spring 402 is in abutment with the inner side wall of the adjacent U-shaped plate 103, the end surface of the baffle plate 401 opposite to the upper die holder 1 is fixed with a moving rod 403, and the end surface of the moving rod 403 penetrating through the spring 402 and the moving hole 105 is fixed with a pull plate 404 connected with the side wall of the U-shaped plate 103.

[0036] The operation process of the embodiment is as follows: when it is needed to control the assembly rod 4 to move out of the assembly hole 205, the pull plate 404 can be directly controlled to move away from the upper die holder 1, so that the pull plate 404 drives the moving rod 403 to move in the moving hole 105 and pulls the baffle plate 401 to move away from the insertion hole 102, thereby the baffle plate 401 directly drives the assembly rod 4 to be pulled out of the assembly hole 205, and when the baffle plate 401 moves, the spring 402 is compressed, so that when the pull plate 404 is released, the spring 402 pushes the baffle plate 401, so as to ensure that the assembly rod 4 is stably inserted into the assembly hole 205.

[0037] In the description of the present specification, the description of the terms "one embodiment", "example", "specific example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are contained in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily mean the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A multi-column SOP electroplating mold, comprising an upper mold base (1) and a lower mold base (2) located in the position of the lower end recess (201) of the lower mold base (2); characterized in that: The upper die seat (1) and the lower die seat (2) are provided with an anode plate (203), the upper end surface of the upper die seat (1) is fixed with a lead frame (101), the lower end surface of the lead frame (101) is provided with a plurality of partition strips (104) which are linearly arranged left and right and are fixed at the inner side of the upper die seat (1), the lower end surface of the lower die seat (2) is provided with a connecting plate (3), the upper end surface of the connecting plate (3) is fixed with a plurality of conical barrels (301) which are respectively arranged between the two partition strips (104), the upper end surface of the conical barrel (301) is fixed with a nozzle (302) which is arranged at the inner side of the lower die seat (2), the left and right parts of the upper die seat (1) are both provided with a plug-in hole (102), the left and right side walls of the lower die seat (2) are both provided with an assembly hole (205) at the position corresponding to the plug-in hole (102), and the plug-in hole (102) is provided with an assembly rod (4) which is inserted into the inner side of the assembly hole (205).

2. The multi-column SOP plating mold according to claim 1, wherein, The upper end surface of the lower die seat (2) is provided with a positioning hole (204), and the T-shaped hole of the upper die seat (1) corresponding to the positioning hole (204) is provided with a T-shaped rod (5) which is inserted into the inner side of the positioning hole (204).

3. The multi-column SOP plating mold according to claim 1, wherein, The lower end surface of the lower die seat (2) is provided with a notch (201), the connecting plate (3) is embedded in the notch (201), and the conical barrel (301) is arranged at the inner side of the lower die seat (2) by penetrating through the conical hole (202) arranged in the inner side of the lower die seat (2).

4. The multi-column SOP plating mold according to claim 1, wherein, The anode plate (203) is sleeved on the nozzle (302) through the orifice arranged on the end surface.

5. The multi-column SOP plating mold according to claim 1, wherein, The end surface of the assembly rod (4) penetrating through the plug-in hole (102) is fixed with a baffle (401) which is connected with the side wall of the upper die seat (1), the left and right side walls of the upper die seat (1) are both fixed with a U-shaped plate (103) at the position corresponding to the plug-in hole (102), and the side wall of the U-shaped plate (103) is provided with a moving hole (105) at the position corresponding to the plug-in hole (102).

6. A multi-column SOP plating mold according to claim 5, wherein, The end surface of the baffle (401) opposite to the upper die seat (1) is fixed with a spring (402), and the other end of the spring (402) is abutted against the inner side wall of the adjacent U-shaped plate (103).

7. A multi-column SOP plating mold according to claim 6, wherein The end surface of the baffle (401) opposite to the upper die seat (1) is fixed with a moving rod (403), and the end surface of the moving rod (403) penetrating through the spring (402) and the moving hole (105) is fixed with a pull plate (404) which is connected with the side wall of the U-shaped plate (103).