Brain-computer interface equipment based on flexible fabric substrate

Abstract

The utility model provides brain-computer interface equipment based on a flexible fabric substrate. The brain-computer interface equipment comprises a fabric electrode, a flexible acquisition circuit and the flexible fabric substrate, the flexible acquisition circuit is connected with the fabric electrode; the flexible acquisition circuit is compounded with the flexible fabric substrate; the fabric electrode comprises a fabric electrode composite layer and a hollow packaging layer, and one side of the fabric electrode composite layer is compounded with the flexible fabric substrate; compared with a traditional device, the size and the weight of the fabric electrode composite layer are greatly reduced, and therefore good wearing comfort is achieved, and meanwhile high collection precision is achieved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of flexible electronics, and in particular to a flexible brain-computer interface device. BACKGROUND

[0002] Electroencephalogram is an electrophysiological phenomenon generated by brain nerve activity. The electroencephalogram signals collected from the cerebral cortex can directly reflect the intention decision of human movement. By recording and analyzing the electroencephalogram signals, the state of the human body (such as fatigue, tension, relaxation, etc.) or brain diseases (such as epilepsy, sleep disorders, depression, etc.) can be diagnosed and monitored. The acquisition of electroencephalogram signals requires sensor electrodes to contact the scalp to lead out the electrical signals of brain activity, and then capture and digitize through the acquisition circuit, so that it can be analyzed and processed.

[0003] With the deepening of the study of electroencephalogram and the development of flexible electronics, the defects of traditional electroencephalogram acquisition devices are increasingly apparent: ① inconvenient operation. For example, for wet electrodes, before measurement, the scalp needs to be treated with keratolytic, conductive glue, and hair cleaning, which is time-consuming and tedious. ② Low comfort. The treatment of the user's scalp before measurement will make them feel uncomfortable, and the wearing of the electroencephalogram cap will also cause discomfort due to its weight and mismatch with the head shape. ③ Infection risk. Hard dry electrodes usually use microneedle or finger array structure to pass through the hair for electroencephalogram measurement, which can easily cause skin damage and infection. ④ Large volume. Traditional electroencephalogram cap has a large number of electrodes, and needs to be connected to external processing modules through cables, with poor integration.

[0004] The invention patent with publication number CN114869286A discloses a full-flexible electrode for electroencephalogram acquisition, which is characterized by including: a flexible electrode shell for supporting; a flexible gel for contacting the skin to obtain bioelectric signals, the flexible gel being pasted inside the flexible electrode shell; a conductive cloth for leading out electronic current, the conductive cloth being in contact with the flexible gel, the conductive cloth being placed in the flexible electrode shell; and a flexible conductive wire for conducting the electronic current from the conductive cloth to an external electroencephalogram device, one end of the flexible conductive wire being connected with the conductive cloth, and the other end of the flexible conductive wire being connected with the external electroencephalogram device. This invention has the advantages of high flexibility, good moisturizing ability, high skin-fitting degree, and low contact impedance. However, this method uses flexible gel to fit the skin, which has poor air permeability, poor comfort and fitting degree, a complex preparation process, and poor signal stability of the other end of the flexible conductive wire connected with the external electroencephalogram device, with poor integration. SUMMARY

[0005] In view of the technical problems of poor comfort, insufficient stability of electrical signals and poor integration of existing brain-computer interface devices, the application provides a brain-computer interface device based on a flexible fabric substrate, which adopts flexible electronic technology to prepare a flexible fabric-based electrode patch, realizes conformal contact with human skin, improves contact area and stability, and obtains higher sensor sensitivity. Signal acquisition and processing are based on a flexible circuit system, which has the ability of multi-channel synchronous acquisition and wireless data transmission. Compared with traditional devices, the size and weight of the device are greatly reduced, thereby bringing better wearing comfort and higher acquisition accuracy.

[0006] In order to achieve the above-mentioned purpose, the technical scheme of the application is as follows:

[0007] A brain-computer interface device based on a flexible fabric substrate, comprising a fabric electrode, a flexible acquisition circuit and a flexible fabric substrate; the flexible acquisition circuit is connected with the fabric electrode; the flexible acquisition circuit is compounded with the flexible fabric substrate; the fabric electrode comprises a fabric electrode composite layer and a hollow packaging layer, one side of the fabric electrode composite layer is compounded with the flexible fabric substrate; the other side of the fabric electrode composite layer is compounded with the hollow packaging layer.

[0008] Preferably, the fabric electrode composite layer comprises a hollow fabric layer, a fabric electrode layer and a fabric layer I, which are compounded in sequence by a hot pressing process or a sewing process.

[0009] Preferably, the fabric electrode composite layer comprises a fabric electrode layer and a fabric layer I, which are compounded by an integrated weaving method.

[0010] Preferably, an FPC interface is arranged on the flexible acquisition circuit, the FPC interface is connected with an electrode lead wire welding point area through a flexible flat cable, and the electrode lead wire welding point area is connected with the fabric electrode.

[0011] The fabric electrode layer comprises a plurality of fabric electrode pieces and a plurality of fabric connecting wires, the plurality of fabric electrode pieces and the plurality of fabric connecting wires are connected and matched, and the plurality of fabric connecting wires are connected with the electrode lead wire welding point area; the fabric electrode piece and the fabric connecting wire are both knitted by conductive fibers.

[0012] The hollow fabric layer and the hollow packaging layer both contain through holes, and the shape and number of the through holes are matched with the shape and number of the fabric electrode pieces.

[0013] Preferably, one side of the fabric layer I is compounded with one side of a shielding layer I, the other side of the shielding layer I is compounded with the flexible fabric substrate, and the shielding layer I is a conductive fabric knitted by conductive yarns.

[0014] Preferably, one side of the fabric layer I is compounded with one side of an elastic layer, and the other side of the elastic layer is compounded with the shielding layer I.

[0015] Preferably, the fabric connection wire is a shielding fabric connection wire woven by a plurality of lacquered copper wires wrapped around conductive fibers.

[0016] Preferably, one side of the hollow fabric layer is combined with one side of the hollow shielding layer, the other side of the hollow shielding layer is combined with the hollow packaging layer, the hollow shielding layer is a conductive fabric woven by conductive yarns, and the hollow shielding layer contains through holes, the shape and number of the through holes being matched with the shape and number of the fabric electrode sheet.

[0017] The elastic layer includes a plurality of elastic sheets, the number of the elastic sheets being the same as that of the fabric electrode sheets, and the size of the elastic sheets being larger than that of the fabric electrode sheets.

[0018] Preferably, one side of the fabric electrode layer is combined with one side of the hollow shielding layer, and the other side of the hollow shielding layer is combined with the hollow packaging layer.

[0019] The flexible fabric substrate is a polyester flexible fabric substrate, a polyurethane flexible fabric substrate or a nylon flexible fabric substrate.

[0020] The elastic sheet is a polyurethane sponge elastic sheet or a rubber elastic sheet.

[0021] Preferably, a microstructure is formed on the surface of the fabric electrode sheet by using a photolithography method, a laser processing method, an electrospinning method or a chemical vapor deposition method.

[0022] The flexible acquisition circuit includes an analog end acquisition module, a digital end communication module, an accelerometer and a power supply module; one end of the analog end acquisition module is connected with the FPC interface, the other end of the analog end acquisition module is connected with the digital end communication module, and the digital end communication module is connected with the accelerometer; the analog end acquisition module, the digital end communication module and the accelerometer are all connected with the power supply module; the analog end acquisition module, the digital end communication module, the accelerometer, the power supply module and the FPC interface are all arranged on a flexible circuit board made of a flexible material, and the flexible circuit board is combined with the flexible fabric substrate.

[0023] The brain-computer interface device based on the flexible fabric substrate has the following advantages:

[0024] The brain-computer interface device based on the flexible fabric substrate is used for measuring brain electrical signals, and a flexible electrode is used instead of a traditional rigid electrode to realize acquisition of the brain electrical signals.

[0025] The brain electrical electrode and the acquisition circuit are prepared by using flexible electronic technology, so that the internal structure of the connector is simplified, and the size and weight of the product are greatly reduced.

[0026] The application adopts a fabric base electrode, can be attached to the forehead to measure brain electricity, and does not need to clean the measurement part in advance.

[0027] The application puts the fabric electrode and the collection circuit on the same flexible base, reduces the product volume, improves the integration, has good air permeability, is soft and skin-friendly, and is more comfortable to wear.

[0028] The application adopts a flexible flat cable, instead of a traditional external cable, has better signal transmission effect, and simplifies the product structure.

[0029] The application adopts a fabric electrode, through simulation analysis, the structure has less influence on the electrical performance when the product is deformed, such as extrusion and stretching, and will not cause impedance mutation. BRIEF DESCRIPTION OF DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only show some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0031] Figure 1 It is a schematic diagram of the overall structure of the present application.

[0032] Figure 2 It is a schematic diagram of the structure of embodiment 1 of the present application.

[0033] Figure 3 It is a schematic diagram of the structure of embodiment 2 of the present application.

[0034] Figure 4 It is a schematic diagram of the structure of embodiment 3 of the present application.

[0035] Figure 5 It is a schematic diagram of the structure of embodiment 4 of the present application.

[0036] Figure 6 It is a schematic diagram of the structure of embodiment 5 of the present application.

[0037] Figure 7 It is a schematic diagram of the structure of the flexible collection circuit of the present application.

[0038] In the figure, 1 is a fabric electrode, 2 is a flexible acquisition circuit, 3 is a flexible flat cable, 4 is an electrode lead soldering area, 5 is an FPC interface, 11, 12, 13, 14, 15 are flexible fabric substrates; 21, 23, 25 are shielding layers I; 31, 32, 33, 34 are elastic layers; 41, 42, 43, 44, 45 are fabric layers I; 51, 52, 53, 54, 55 are fabric electrode layers; 61, 64, 65 are hollow fabric layers; 71, 73, 75 are hollow shielding layers; 81, 82, 83, 84, 85 are hollow packaging layers. DETAILED DESCRIPTION

[0039] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0040] Embodiment 1

[0041] A brain-computer interface device based on a flexible fabric substrate, as shown in the figure, comprises a fabric electrode 1, a flexible acquisition circuit 2 and a flexible fabric substrate (not shown in the figure); the flexible acquisition circuit 2 is connected with the fabric electrode 1; the flexible acquisition circuit 2 is compounded with the flexible fabric substrate; the fabric electrode 1 comprises a fabric electrode composite layer and a hollow packaging layer (not shown in the figure), one side of the fabric electrode composite layer is compounded with the flexible fabric substrate, and the other side of the fabric electrode composite layer is compounded with the hollow packaging layer. An adjustable length magic tape is arranged on the outside of the brain-computer interface device to meet the wearing requirements of most people. Figure 1 Figure 1 As shown in the figure, the flexible acquisition circuit 2 is provided with an FPC interface 5, the FPC interface 5 is connected with an electrode lead soldering area 4 through a flexible flat cable 3, and the electrode lead soldering area 4 is connected with the fabric electrode 1. Figure 1 As shown in the figure, the fabric electrode 1 comprises a fabric electrode composite layer, one side of the fabric electrode composite layer is compounded with the flexible fabric substrate 11, and the other side of the fabric electrode composite layer is compounded with the hollow packaging layer 81; the fabric electrode and the flexible acquisition circuit adopt the same flexible fabric substrate 11.

[0042] Figure 1 The fabric electrode composite layer comprises a hollow fabric layer 61, the hollow fabric layer 61, a fabric electrode layer 51 and a fabric layer I 41 are compounded in sequence.

[0043] The fabric electrode composite layer comprises a hollow fabric layer 61, the hollow fabric layer 61, a fabric electrode layer 51 and a fabric layer I 41 are compounded in sequence. Figure 2 The fabric electrode composite layer comprises a hollow fabric layer 61, the hollow fabric layer 61, a fabric electrode layer 51 and a fabric layer I 41 are compounded in sequence.

[0044] The fabric electrode composite layer comprises a hollow fabric layer 61, the hollow fabric layer 61, a fabric electrode layer 51 and a fabric layer I 41 are compounded in sequence.

[0045] ​​The method for sequentially compounding the hollow fabric layer 61, the fabric electrode layer 51 and the fabric layer I 41 comprises the following steps: according to the preset fabric electrode sheet shape and fabric connecting wire shape, the conductive fibers are woven into fabric electrode sheets and fabric connecting wires, the six fabric electrode sheets and the six fabric connecting wires are connected and matched, the hollow fabric layer 61 is prepared, the six fabric electrode sheets and the six fabric connecting wires are fixed on the fabric layer I 41 through an adhesive layer, and the fabric electrode composite layer is formed.

[0046] The fabric electrode layer 51 comprises six fabric electrode sheets and six fabric connecting wires, the six fabric electrode sheets and the six fabric connecting wires are connected and matched, and the six fabric connecting wires are connected with the electrode lead wire welding point area 4; the fabric electrode sheet and the fabric connecting wire are both obtained by weaving conductive fibers; the fabric electrode sheet has a diameter of 1 cm, and the fabric connecting wire has a line width of 0.1 mm; the conductive fibers are silver-plated aramid fibers, and in addition, silver-plated nylon, stainless steel fiber conductive fabric, copper fiber conductive fabric, carbon black doped conductive fabric, polyaniline conductive fabric and polyacrylonitrile-based carbon fiber conductive fabric can also be used.

[0047] The shape and the number of the through holes in the hollow fabric layer 61 are matched with the shape and the number of the fabric electrode sheets.

[0048] The fabric electrode composite layer is compounded on one side with the flexible fabric substrate 11, which comprises that the fabric layer I 41 is compounded on one side away from the fabric electrode layer 51 with the elastic layer 31, and the other side of the elastic layer 31 is compounded with the flexible fabric substrate 11; the elastic layer 31 comprises six elastic sheets, the number of the elastic sheets is the same as that of the fabric electrode sheets, the size of the elastic sheets is larger than that of the fabric electrode sheets, the elastic sheets are made of polyurethane sponge or rubber, in the embodiment, the elastic sheets are circular and have a diameter of 1.1 cm, and the elastic sheets are made of polyurethane sponge; the compounding is performed by using a hot pressing process.

[0049] The other side of the elastic layer 31 is compounded with the flexible fabric substrate 11, which comprises that the other side of the elastic layer 31 is compounded with one side of the shielding layer I 21, and the other side of the shielding layer I 21 is compounded with the flexible fabric substrate 11; the compounding is performed by using an adhesive layer, and the adhesive layer is hot melt adhesive or other adhesive that can be used for fabric.

[0050] The size of the elastic sheet is slightly larger than that of the fabric electrode sheet, which facilitates ensuring that the sea sheet can completely cover and wrap the edge of the fabric electrode sheet, ensuring that a more uniform and stable contact area is formed between the electrode sheet and the skin, and preventing poor contact caused by movement or deformation during use.

[0051] The other side of the fabric electrode composite layer is combined with the hollow packaging layer 81, including that the side of the hollow fabric layer 61 away from the fabric electrode layer 51 is combined with the side of the hollow shielding layer 71, the other side of the hollow shielding layer 71 is combined with the hollow packaging layer 81, and the combination is achieved by using an adhesive layer.

[0052] The materials of the shielding layer I 21 and the hollow shielding layer 71 are both conductive fabrics knitted by conductive yarns, and the material of the conductive yarns is yarns mixedly spun by graphene and polymer fibers, and the polymer fibers are aramid fibers or polyamide fibers.

[0053] The shape and number of the through holes in the hollow shielding layer 71 are matched with the shape and number of the fabric electrode pieces.

[0054] As shown in Figure 7 The flexible acquisition circuit 2 includes an analog end acquisition module (ADC), a digital end communication module (MCU), an accelerometer, and a power supply module; one end of the analog end acquisition module is connected with the FPC interface 5, the other end of the analog end acquisition module is connected with the digital end communication module, and the digital end communication module is connected with the accelerometer; the analog end acquisition module, the digital end communication module, and the accelerometer are all connected with the power supply module; the analog end acquisition module (ADC), the digital end communication module (MCU), the accelerometer, the power supply module, and the FPC interface 5 are all arranged on a flexible circuit board mainly made of PI, and the flexible circuit board is combined with the flexible fabric base 11 through an adhesive layer.

[0055] In use, the brain electrical signals detected by the fabric electrode pieces are transmitted into the flexible acquisition circuit 2 through the FPC interface 5, first pass through the analog end acquisition module, which includes a filter circuit, an amplifier circuit, and an analog-to-digital conversion circuit connected in sequence, for filtering out noise, signal amplification, and converting digital signals; then the digital signals are transmitted by the Bluetooth circuit in the digital end communication module to realize wireless signal transmission; the accelerometer uses the accelerometer sensor to detect the action of picking up and wearing the device to realize the function of automatic on-off; the power supply module is responsible for converting the power voltage into the voltage value required by each device; in order to ensure good contact between the electrode and the skin, an impedance detection function is set to monitor the impedance at the electrode, and when the impedance is high, the wearing position should be adjusted.

[0056] The fabric electrode of the embodiment adopts the fabric electrode as shown in Figure 2 The preparation method is as follows:

[0057] 1: fabric selection nylon material, fabric heat setting treatment to eliminate the stress within the fabric fiber, improve the dimensional stability of fabric. Using heat setting machine for fabric heating, pressure treatment, in 180~200℃, 0.1 to 0.5Mpa environment for 30 seconds to 2 minutes, followed by rapid cooling, fixed shape of the fabric, get fabric base layer 1, fabric layer I 4. Subsequently using laser cutting or mechanical cutting hole to get hollow fabric layer 6, hollow packaging layer 8;

[0058] 2: the conductive fabric is woven into a conductive fabric, and finally the shielding layer I 2 is obtained after shape cutting. Subsequently using laser cutting or mechanical cutting hole to get hollow shielding layer 7;

[0059] 3: the fabric base layer 1 and the shielding layer I 2 are compounded. The fabric base layer 1 and the shielding layer I 2 are compounded by the adhesive layer by hot pressing process, and the fabric base layer 1 and the shielding layer I 2 can also be compounded by sewing process; in this embodiment, the adhesive layer is used for compounding;

[0060] 4: using laser cutting or mechanical cutting to get electrode shape polyurethane sponge sheet, its size is slightly larger than the electrode size, get elastic layer 3; the elastic layer 3 is compounded on the shielding layer I 2 through the adhesive layer, and the elastic layer 3 is compounded under the fabric layer I 4 through the adhesive layer, in this embodiment, the compounding of the elastic layer 3 and the shielding layer I 2 and the fabric layer I 4 respectively uses the same adhesive layer.

[0061] 5: silver plated aramid fabric, according to the preset fabric electrode shape and fabric connecting wire shape, the fabric electrode and the fabric connecting wire are woven into fabric electrode and fabric connecting wire, forming fabric electrode sheet and fabric connecting wire, the fabric electrode sheet corresponds to the polyurethane sponge sheet one by one, getting fabric electrode layer 5. The electrode is generally circular, the diameter is 1cm, and the wire width is 0.1mm;

[0062] 6 laser cutting or mechanical cutting is adopted to cut holes in the adhesive layer and the hollow fabric layer 6, and the holes are respectively corresponding to the fabric electrode sheet. The hollow fabric layer 6 fixes the fabric electrode layer 5 on the fabric layer I 4 through the adhesive layer, forming a fabric electrode composite layer;

[0063] 7: laser cutting or mechanical cutting is adopted to cut holes in the adhesive layer and the hollow shielding layer 7, and the holes are respectively corresponding to the fabric electrode sheet. The hollow shielding layer 7 is compounded on the hollow fabric layer 6 through the adhesive layer;

[0064] 8: laser cutting or mechanical cutting is adopted to cut holes in the adhesive layer and the hollow packaging layer 8, and the holes are respectively corresponding to the fabric electrode sheet. The hollow packaging layer 8 is compounded on the hollow shielding layer 7 through the adhesive layer;

[0065] 9: cutting to obtain the final product fabric electrode.

[0066] The head circumference of an adult is generally 50-60 cm, the forehead range is 8-15 cm, and the forehead width is 4-10 cm. In order to meet the wearing needs of most people, the magic tape arranged on both sides of the electrode can adjust the length.

[0067] The final fabric electrode is shown in Figure 7 The electrode length is 700 mm, the electrode width is 45 mm, the electrode is circular, and the diameter is 1 cm. The lengths of the magic tapes on both sides are 100 mm and 150 mm, respectively.

[0068] Example 2

[0069] A brain-computer interface device based on a flexible fabric substrate includes a fabric electrode 1.

[0070] As shown in Figure 3 The fabric electrode 1 includes a fabric electrode composite layer, one side of which is combined with a flexible fabric substrate 12; the other side of the fabric electrode composite layer is combined with a hollow packaging layer 82.

[0071] The fabric electrode composite layer includes a fabric electrode layer 52, which is combined with a fabric layer I 42.

[0072] The method for combining the fabric electrode layer 52 with the fabric layer I 42 is as follows: according to a preset fabric electrode shape and a fabric connection wire shape, silver-plated aramid fibers are woven into a plurality of fabric electrode pieces on the fabric layer I 42 using a weaving machine integration method, and a conductive shielding fiber prepared by wrapping silver-plated aramid fibers with a plurality of enameled copper wires is woven into a plurality of fabric connection wires on the fabric layer I 42 using the weaving machine integration method. The plurality of fabric electrode pieces and the plurality of fabric connection wires are connected and matched, and finally a fabric electrode composite layer is formed. Since the weaving machine integration method is used, a fabric electrode pattern is finally formed on one side of the fabric electrode composite layer, and there is no fabric electrode pattern on the other side of the fabric electrode composite layer.

[0073] The fabric electrode layer 52 includes a plurality of fabric electrode pieces and a plurality of fabric connection wires, which are connected and matched; the fabric electrode pieces are woven from conductive fibers; the fabric electrode pieces have a diameter of 2 cm; the conductive fibers use silver-plated aramid fibers, and in addition, silver-plated nylon, stainless steel fiber conductive fabric, copper fiber conductive fabric, carbon black doped conductive fabric, polyaniline conductive fabric, and polyacrylonitrile-based carbon fiber conductive fabric can also be used. The shape and number of the through holes in the hollow packaging layer 82 are matched with the shape and number of the fabric electrode pieces.

[0074] The fabric connection wire is a shielding fabric connection wire woven from conductive fibers prepared by wrapping silver-plated aramid fibers with a plurality of enameled copper wires, and the fabric connection wire has a wire width of 1.5 mm.

[0075] The fabric electrode composite layer is compounded on one side with the flexible fabric base 12, and the fabric electrode composite layer without fabric electrode pattern (i.e. fabric layer I 42) is compounded on one side with the elastic layer 32, and the other side of the elastic layer 32 is compounded with the flexible fabric base 12; the elastic layer 32 comprises a plurality of elastic pieces, the number of the elastic pieces is the same as that of the fabric electrode pieces, the size of the elastic pieces is larger than that of the fabric electrode pieces, the elastic pieces are circular with a diameter of 2.2 cm, and the elastic pieces are polyurethane sponge; and the hot pressing process is used for compounding.

[0076] The other side of the fabric electrode composite layer with fabric electrode pattern (i.e. fabric electrode layer 52) is compounded with the hollow packaging layer 82, and the hot pressing process or the sewing process is used for compounding.

[0077] The flexible fabric base 12, the fabric layer I 42 and the hollow packaging layer 82 are used as the support structure of the fabric electrode, and the fiber material nylon with good elasticity and smooth surface is selected, and in addition, polyester or polyurethane can be used to provide good moisture absorption and wearing comfort.

[0078] The final fabric electrode has a length of 800 mm, a width of 45 mm, and a circular shape with a diameter of 2 cm. The lengths of the two sides of the magic tape are 120 mm and 130 mm, respectively.

[0079] The other structures and principles are the same as those of embodiment 1.

[0080] Embodiment 3

[0081] A brain-computer interface device based on a flexible fabric base, comprising a fabric electrode 1.

[0082] As shown in Figure 4 The fabric electrode 1 comprises a fabric electrode composite layer, and one side of the fabric electrode composite layer is compounded with the flexible fabric base 13; and the other side of the fabric electrode composite layer is compounded with the hollow packaging layer 83.

[0083] The fabric electrode composite layer comprises a fabric electrode layer 53, and the fabric electrode layer 53 is compounded with the fabric layer I 43.

[0084] The method for compounding the fabric electrode layer 53 with the fabric layer I 43 is as follows: according to the preset fabric electrode shape and fabric connecting wire shape, the silver-plated aramid fiber is woven into a plurality of fabric electrode pieces on the fabric layer I 43 using the weaving machine integration method, the silver-plated aramid fiber is woven into a plurality of fabric connecting wires on the fabric layer I 43 using the weaving machine integration method, the plurality of fabric electrode pieces and the plurality of fabric connecting wires are connected and matched, and finally the fabric electrode composite layer is formed. Since the weaving machine integration method is used, the fabric electrode pattern is formed on one side of the fabric electrode composite layer, and there is no fabric electrode pattern on the other side.

[0085] The fabric electrode layer 53 includes a plurality of fabric electrode pieces and a plurality of fabric connection wires, the plurality of fabric electrode pieces and the plurality of fabric connection wires are connected and matched, and the plurality of fabric connection wires are connected with the flexible acquisition circuit; the fabric electrode pieces and the fabric connection wires are knitted by conductive fibers; the diameter of the fabric electrode piece is 1.5 cm, and the width of the fabric connection wire is 1 mm; the conductive fibers are silver-plated aramid fibers, and in addition, silver-plated nylon, stainless steel fiber conductive fabric, copper fiber conductive fabric, carbon black doped conductive fabric, polyaniline conductive fabric, and polyacrylonitrile-based carbon fiber conductive fabric can also be used.

[0086] The fabric electrode composite layer is composed of a flexible fabric substrate 13 on one side, including a fabric electrode composite layer without fabric electrode pattern on one side and an elastic layer 33 on the other side, and the other side of the elastic layer 33 is combined with the flexible fabric substrate 13; the elastic layer 33 includes a plurality of elastic pieces, the number of elastic pieces is the same as that of fabric electrode pieces, the size of the elastic piece is larger than that of the fabric electrode piece, and the elastic piece is made of elastic rubber; the composite is composed of a hot pressing process.

[0087] The other side of the elastic layer 33 is combined with the flexible fabric substrate 13, including the other side of the elastic layer 33 with fabric electrode pattern combined with one side of the shielding layer I 23, and the other side of the shielding layer I 23 combined with the flexible fabric substrate 13, and the composite is composed of an adhesive layer, which is a hot melt adhesive or other adhesive suitable for fabric.

[0088] The other side of the fabric electrode composite layer is combined with the hollow packaging layer 83, including the other side of the fabric electrode composite layer combined with one side of the hollow shielding layer 73, and the other side of the hollow shielding layer 73 combined with the hollow packaging layer 82, and the composite is composed of an adhesive layer.

[0089] The materials of the shielding layer I 23 and the hollow shielding layer 73 are both conductive fabric knitted from conductive yarn, and the material of the conductive yarn is yarn spun from a mixture of graphene and polymer fibers, and the polymer fibers are aramid fibers or polyamide fibers.

[0090] The shape and number of the through holes in the hollow shielding layer 73 are matched with the shape and number of the fabric electrode pieces.

[0091] The final fabric electrode has a length of 900 mm, a width of 60 mm, and a circular shape with a diameter of 1.5 cm. The lengths of the two sides of the magic tape are 150 mm and 180 mm, respectively.

[0092] The other structures and principles are the same as those of embodiment 1.

[0093] Embodiment 4

[0094] A brain-computer interface device based on a flexible fabric substrate, including a fabric electrode 1.

[0095] As shown in Figure 5 The fabric electrode 1 includes a fabric electrode composite layer, one side of which is compounded with a flexible fabric substrate 14; the other side of which is compounded with a hollow packaging layer 84.

[0096] The fabric electrode composite layer includes a hollow fabric layer 64, a fabric electrode layer 54 and a fabric layer I 44 compounded in sequence.

[0097] The method for compounding the hollow fabric layer 64, the fabric electrode layer 54 and the fabric layer I 44 in sequence is as follows: according to the preset fabric electrode shape and fabric connection wire shape, conductive fibers are woven into fabric electrode pieces, silver-plated aramid fibers are wrapped with multiple enameled copper wires to prepare conductive shielding fibers, and the conductive shielding fibers are woven into fabric connection wires, multiple fabric electrode pieces and multiple fabric connection wires are connected and matched, the hollow fabric layer 64 is prepared, and the multiple fabric electrode pieces and the multiple fabric connection wires are fixed on the fabric layer I 44 through an adhesive layer.

[0098] The shape and number of the through holes in the hollow fabric layer 64 are matched with the shape and number of the fabric electrode pieces.

[0099] The fabric electrode layer 54 includes multiple fabric electrode pieces and multiple fabric connection wires, the multiple fabric electrode pieces and the multiple fabric connection wires are connected and matched, and the multiple fabric connection wires are connected with a flexible acquisition circuit; the fabric electrode piece is obtained by weaving conductive fibers; the diameter of the fabric electrode piece is 1.2 cm; and the conductive fibers are silver-plated aramid fibers.

[0100] The fabric connection wire is a fabric connection wire with shielding function obtained by weaving conductive fibers prepared by wrapping silver-plated aramid fibers with multiple enameled copper wires, and the width of the fabric connection wire is 0.5 mm.

[0101] One side of the fabric electrode composite layer is compounded with the flexible fabric substrate 14, including that one side of the fabric layer I 44 away from the fabric electrode layer 54 is compounded with one side of the elastic layer 34, and the other side of the elastic layer 34 is compounded with the flexible fabric substrate 14; the elastic layer 34 includes multiple elastic pieces, the number of the elastic pieces is the same as that of the fabric electrode pieces, the size of the elastic piece is greater than that of the fabric electrode piece, and the elastic piece is polyurethane sponge; and the compounding is performed by using a hot pressing process.

[0102] The other side of the fabric electrode composite layer is compounded with the hollow packaging layer 84, including that one side of the hollow fabric layer 64 away from the fabric electrode layer 54 is compounded with the hollow packaging layer 84, and the compounding is performed by using a hot pressing process or a sewing process.

[0103] The final fabric electrode has a length of 800 mm, a width of 50 mm, and a circular shape with a diameter of 1.2 cm. The two sides of the magic tape have lengths of 120 mm and 110 mm, respectively.

[0104] The other structures and principles are the same as those of Embodiment 1.

[0105] Embodiment 5

[0106] A flexible fabric-based brain-computer interface device includes a fabric electrode 1.

[0107] As shown in Figure 6 , the fabric electrode 1 includes a fabric electrode composite layer, one side of which is combined with a flexible fabric substrate 15, and the other side of which is combined with a hollow packaging layer 85.

[0108] The fabric electrode composite layer includes a hollow fabric layer 65, a fabric electrode layer 55, and a fabric layer I 45, which are sequentially combined.

[0109] The method for sequentially combining the hollow fabric layer 65, the fabric electrode layer 55, and the fabric layer I 45 is as follows: according to the preset fabric electrode shape and fabric connection wire shape, the conductive fibers are woven into fabric electrode pieces by patterning, silver-plated aramid conductive materials are prepared into nanofibers by electrospinning, and the nanofibers are deposited on the surface of the fabric electrode pieces. The conductive fibers are woven into fabric connection wires, and the plurality of fabric electrode pieces and the plurality of fabric connection wires are connected and matched to prepare the hollow fabric layer 65. The plurality of fabric electrode pieces and the plurality of fabric connection wires are fixed on the fabric layer I 45 by the adhesive layer.

[0110] The fabric electrode layer 55 includes a plurality of fabric electrode pieces and a plurality of fabric connection wires, which are connected and matched. The plurality of fabric connection wires are connected to the flexible acquisition circuit. The fabric electrode pieces and the fabric connection wires are both woven from conductive fibers. The diameter of the fabric electrode pieces is 1 cm, and the line width of the fabric connection wires is 0.5 mm. The conductive fibers are silver-plated aramid fibers, and in addition, silver-plated nylon, stainless steel fiber conductive fabric, copper fiber conductive fabric, carbon black doped conductive fabric, polyaniline conductive fabric, and polyacrylonitrile-based carbon fiber conductive fabric can also be used.

[0111] The surface of the fabric electrode piece is formed with microstructures by photolithography, laser processing, electrospinning, or chemical vapor deposition. The microstructures can form more conductive channels on the surface of the fabric electrode piece, thereby increasing the conductive area, which helps to reduce the resistance and improve the current transmission efficiency. The microstructures can increase the overall strength of the fabric electrode piece, making it more resistant to wear and tear. The microstructures can increase the contact area between the fabric electrode piece and the skin, thereby improving the fit and comfort.

[0112] The fabric electrode composite layer is combined with the flexible fabric substrate 15 on one side, including the combination of the fabric layer I 45 on the side away from the fabric electrode layer 55 with the side of the shielding layer I 25, and the combination of the other side of the shielding layer I with the flexible fabric substrate 15.

[0113] The other side of the fabric electrode composite layer is combined with the hollow packaging layer 85, including the combination of the hollow fabric layer 65 on the side away from the fabric electrode layer 55 with the side of the hollow shielding layer 75, and the combination of the other side of the hollow shielding layer 75 with the hollow packaging layer 85, and the combination is achieved by using an adhesive layer.

[0114] The final fabric electrode has a length of 700 mm, a width of 50 mm, and a circular shape with a diameter of 1 cm. The lengths of the two sides of the magic tape are 140 mm and 120 mm, respectively.

[0115] The other structure and principle are the same as those of Embodiment 1.

[0116] The above only describes the preferred embodiments of the present application and is not intended to limit the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A flexible fabric substrate based brain computer interface device, characterized in that, The application relates to a flexible fabric electrode, which comprises a fabric electrode (1), a flexible acquisition circuit (2) and a flexible fabric substrate; the flexible acquisition circuit (2) is connected with the fabric electrode (1); the flexible acquisition circuit (2) is compounded with the flexible fabric substrate; the fabric electrode (1) comprises a fabric electrode composite layer and a hollow packaging layer; one side of the fabric electrode composite layer is compounded with the flexible fabric substrate; and the other side of the fabric electrode composite layer is compounded with the hollow packaging layer.

2. The flexible fabric substrate-based brain-machine interface device of claim 1, wherein, The fabric electrode composite layer comprises a hollow fabric layer, a fabric electrode layer and a fabric layer I, and the hollow fabric layer, the fabric electrode layer and the fabric layer I are compounded in sequence through a hot-pressing process or a sewing process.

3. The flexible fabric substrate-based brain-machine interface device of claim 1, wherein, The fabric electrode composite layer comprises a fabric electrode layer and a fabric layer I, and the fabric electrode layer and the fabric layer I are compounded through an integrated weaving method.

4. The flexible fabric substrate-based brain-machine interface device of claim 2, wherein, An FPC interface (5) is arranged on the flexible acquisition circuit (2), the FPC interface (5) is connected with an electrode lead wire welding point area (4) through a flexible flat cable (3), the electrode lead wire welding point area (4) is connected with the fabric electrode (1); The fabric electrode layer comprises a plurality of fabric electrode pieces and a plurality of fabric connecting wires, the plurality of fabric electrode pieces and the plurality of fabric connecting wires are connected and matched, the plurality of fabric connecting wires are connected with the electrode lead wire welding point area (4); the fabric electrode piece and the fabric connecting wire are both knitted from conductive fibers; The hollow fabric layer and the hollow packaging layer both contain through holes, the shape and the number of the through holes are matched with the shape and the number of the fabric electrode pieces.

5. The flexible fabric substrate-based brain-machine interface device of claim 4, wherein, One side of the fabric layer I is compounded with one side of a shielding layer I, the other side of the shielding layer I is compounded with the flexible fabric substrate, and the shielding layer I is a conductive fabric knitted from conductive yarns.

6. The flexible fabric substrate-based brain-machine interface device of claim 5, wherein, One side of the fabric layer I is compounded with one side of an elastic layer, and the other side of the elastic layer is compounded with the shielding layer I.

7. The flexible fabric substrate-based brain-machine interface device of claim 4, wherein, The fabric connecting wire is a fabric connecting wire with a shielding function knitted from a plurality of enameled copper wires wrapped conductive fibers.

8. The flexible fabric substrate-based brain-machine interface device of claim 6, wherein, One side of the hollow fabric layer is compounded with one side of a hollow shielding layer, the other side of the hollow shielding layer is compounded with the hollow packaging layer, the hollow shielding layer is a conductive fabric knitted from conductive yarns, the hollow shielding layer contains through holes, and the shape and the number of the through holes are matched with the shape and the number of the fabric electrode pieces. The elastic layer comprises a plurality of elastic pieces, the number of the elastic pieces is the same as that of the fabric electrode pieces, and the size of the elastic piece is larger than that of the fabric electrode piece.

9. The flexible fabric substrate-based brain-machine interface device of claim 8, wherein, One side of the fabric electrode layer is compounded with one side of the hollow shielding layer, and the other side of the hollow shielding layer is compounded with the hollow packaging layer. The flexible fabric substrate is a polyester flexible fabric substrate, a polyurethane flexible fabric substrate or a nylon flexible fabric substrate. The elastic piece is a polyurethane sponge elastic piece or a rubber elastic piece.

10. The flexible fabric substrate-based brain-machine interface device of claim 5, wherein, A microstructure is formed on the surface of the fabric electrode piece through a photoetching method, a laser processing method, an electrospinning method or a chemical vapor deposition; The flexible acquisition circuit (2) comprises an analog end acquisition module, a digital end communication module, an accelerometer and a power supply module. One end of the analog end acquisition module is connected with the FPC interface (5), the other end of the analog end acquisition module is connected with the digital end communication module, the digital end communication module is connected with the accelerometer; the analog end acquisition module, the digital end communication module and the accelerometer are all connected with the power supply module; the analog end acquisition module, the digital end communication module, the accelerometer, the power supply module and the FPC interface (5) are all arranged on the flexible circuit board prepared from flexible material, and the flexible circuit board is compounded with the flexible fabric base.

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