Horizontal chip capacitor structure
By introducing heat sinks and protruding electrode designs into surface mount capacitors, the poor heat dissipation and soldering difficulties of surface mount capacitors are solved, resulting in a longer service life and easier soldering.
Patent Information
- Application Number
- CN202520125659.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-20
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-01-20
AI Technical Summary
Existing surface mount capacitors have poor heat dissipation, short lifespan, and are difficult to solder.
The capacitor adopts a horizontal surface mount structure, which includes several layers of film. A heat sink is sandwiched between every two layers of film. The heat sink has a hollow hole in the middle, and thermal conductive sheets are pressed on both sides. The protruding electrode is fixed at both ends. The thermal conductive sheets and the heat sink are made of the same material to dissipate heat. The film and the heat sink are tightly pressed together, and the protruding electrode is connected to the film.
It improves the heat dissipation of the capacitor, extends its service life, and facilitates soldering.
Smart Images
Figure CN223884288U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to patch capacitor technical field, specifically point to a horizontal patch capacitor structure. BACKGROUND
[0002] The manufacturing procedure of the prior art patch capacitor is raw material processing, casting, printing silk screen, lamination, compression, cutting, glue removal, sintering, chamfering, electrode coating, electroplating, testing and sorting, and tape packaging, and most of the structures are film structures compressed tightly, so that the heat dissipation effect is not good, the service life is short, and the electrode end is thin because the electrode end is coated, so it is very difficult to weld the small patch capacitor. SUMMARY
[0003] The utility model wants to solve the technical problems that the prior art patch capacitor has poor heat dissipation effect, short service life, and inconvenient welding.
[0004] To solve the above problems, the utility model adopts the technical scheme of a horizontal patch capacitor structure, which comprises a patch capacitor body, the patch capacitor body comprises a plurality of layers of film sheets, the film sheets are fixed with silk screen layers on the side surfaces, heat dissipation fins are arranged between every two layers of film sheets, hollow holes are formed in the middle of the heat dissipation fins at the silk screen layers, heat conduction fins are compressed on the two sides of the patch capacitor body, and protruding electrode ends are fixed at the two ends of the patch capacitor body.
[0005] As a further scheme of the utility model, the heat conduction fins and the heat dissipation fins are made of the same material and are used to dissipate heat.
[0006] As a further scheme of the utility model, the plurality of layers of film sheets and the heat dissipation fins are tightly compressed.
[0007] As a further scheme of the utility model, the protruding electrode ends are in communication with the plurality of layers of film sheets, and the circuit can be conducted.
[0008] As a further scheme of the utility model, the plurality of layers of silk screen layers can be tightly combined at the hollow holes after compression, and the circuit can work normally.
[0009] Compared with the prior art, the utility model has the advantages that the heat dissipation fins are added, heat inside the capacitor can be dissipated, the service life is improved, the protruding electrode ends are added, and the capacitor can be welded conveniently. BRIEF DESCRIPTION OF DRAWINGS
[0010] The accompanying drawings are used to provide a further understanding of the utility model, constitute a part of the specification, are used together with the embodiments of the utility model to explain the utility model, and do not constitute a limitation on the utility model. In the drawings:
[0011] Figure 1 The utility model provides a whole structure sectional view in horizontal type patch capacitor structure.
[0012] Figure 2 The utility model provides a membrane and radiating fin stacking schematic view in horizontal type patch capacitor structure.
[0013] In the drawings:
[0014] 1, membrane; 2, silk screen layer; 3, radiating fin; 4, heat conduction sheet; 5, protruding electrode end; 3.1, hollow hole. DETAILED DESCRIPTION
[0015] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the utility model.
[0016] The utility model provides a technical scheme: in order to solve the existing problems proposed in the background art.
[0017] In combination with the accompanying drawings Figure 1 , 2 It can be known that the patch capacitor body includes a plurality of layers of membranes 1, the membranes 1 are fixed with silk screen layers 2 on the side surfaces to facilitate correct circuit conduction work, radiating fins 3 are arranged between every two layers of membranes 1 to radiate heat, hollow holes 3.1 are formed in the middle of the radiating fins 3 at the silk screen layers 2, heat conduction sheets 4 are pressed on both sides of the patch capacitor body, and protruding electrode ends 5 are fixed at both ends of the patch capacitor body.
[0018] The heat conduction sheets 4 and the radiating fins 3 are made of the same material to dissipate heat, the plurality of layers of membranes 1 and the radiating fins 3 are tightly pressed together, the protruding electrode ends 5 and the plurality of layers of membranes 1 are communicated to conduct a circuit, and the plurality of silk screen layers 2 can be tightly combined at the hollow holes 3.1 after pressing to normally work a circuit.
[0019] The working principle of the application is as follows: when the patch capacitor body is manufactured, the membranes 1 are first silk-screened to print the silk screen layers 2, then the radiating fins 3 and the membranes 1 are alternately stacked, then pressing, cutting, glue removal are carried out, then the heat conduction sheets 4 are pressed, then sintering, chamfering, electrode dipping to fix the protruding electrode ends 5, electroplating, testing and sorting, and band packaging are carried out.
[0020] The above has described the utility model and its implementation mode, which is not restrictive, and the drawings only show one of the implementation modes of the utility model, and the actual structure is not limited thereto. In summary, if a person skilled in the art is inspired thereby, without departing from the creative purpose of the utility model, similar structural modes and embodiments are not creatively designed, which should belong to the protection scope of the utility model.
Claims
1. A horizontal patch capacitor structure comprising a patch capacitor body, characterized in that: The patch capacitor body comprises a plurality of layers of film sheets (1), the side of the film sheet (1) is fixed with a silk screen layer (2), a heat dissipation sheet (3) is arranged between every two layers of film sheets (1), a hollow hole (3.1) is arranged in the middle of the heat dissipation sheet (3) at the silk screen layer (2), a heat conduction sheet (4) is pressed on both sides of the patch capacitor body, and a protruding electrode end (5) is fixed at both ends of the patch capacitor body.
2. The horizontal patch capacitor structure of claim 1, wherein: The heat conduction sheet (4) and the heat dissipation sheet (3) are made of the same material.
3. The horizontal patch capacitor structure of claim 1, wherein: The plurality of layers of film sheets (1) and the heat dissipation sheet (3) are tightly pressed.
4. The horizontal patch capacitor structure of claim 1, wherein: The protruding electrode end (5) is communicated with the plurality of layers of film sheets (1).
5. The horizontal patch capacitor structure of claim 3, wherein: The plurality of layers of silk screen layers (2) can be tightly combined at the hollow hole (3.1) after being pressed.