Electronic component heat dissipation structure

Abstract

An electronic component heat radiation structure comprises an electronic component, a heat radiator and a circuit board, wherein the heat radiator is used for conducting heat to the electronic component; the electronic component is provided with a packaging shell, a plurality of pins and an overhead radiating fin, the circuit board is provided with a plurality of first copper foils for bonding the plurality of pins and a second copper foil for bonding the radiator, and the second copper foil is divided into at least one first part for bonding the radiator and a second part connected with the first part. When the electronic component is arranged on the circuit board, the second part is in contact with the packaging shell of the electronic component but does not form a bonding relationship with the packaging shell of the electronic component, so that the heat dissipation benefit of the electronic component is improved. Furthermore, the utility model is not limited to be implemented by a single electronic component in practical application, and can also be implemented by a plurality of electronic components which are arranged in parallel.

Description

TECHNICAL FIELD

[0001] The utility model relates to a heat dissipation structure, especially a heat dissipation structure for electronic components. BACKGROUND

[0002] With the development of technology, the current circuit board generally has the characteristics of high power density, and electronic components on the circuit board are densely arranged. When the product is running, the temperature of the electronic components rises, and the accompanying running error caused by temperature, commonly known as "hot" in the field, occurs.

[0003] In view of this, the published patents China Taiwan TW M339199U and China Taiwan TW M258342U propose technical solutions to improve the heat dissipation of electronic components. For example, China Taiwan TW M339199U arranges a heat conduction layer around the electronic component and welds the electronic component pins and the heat conduction layer to dissipate heat from the electronic component using the heat conduction layer. At the same time, the case further provides a heat sink on the circuit board, which corresponds to the heat conduction layer on the circuit board and dissipates heat from the electronic component.

[0004] However, the above-mentioned technology limits the electronic components to be in an upright structure, and in fact only teaches the use of electronic component pins to transfer heat energy to the circuit board. However, with the evolution of technology, when electronic components are implemented in a horizontal structure, the horizontal electronic components still only use pins as heat energy transmitters, and the heat energy accumulated on the package shell cannot be quickly transferred, resulting in that this type of electronic component cannot obtain the best heat dissipation benefit. In addition, in the actual operation of the electronic component, heat energy is generally accumulated on the package shell, which further leads to running errors of the electronic component, and the above-mentioned technology cannot solve the problem of poor heat dissipation of the electronic component. SUMMARY

[0005] The main purpose of the utility model is to solve the problem of poor heat dissipation of the conventional electronic component.

[0006] To achieve the above-mentioned purpose, the utility model provides an electronic component heat dissipation structure, which comprises an electronic component, a heat sink and a circuit board. The electronic component has a package shell, a plurality of pins exposed to the package shell, and a top-mounted heat dissipation fin exposed to the package shell. The heat sink cooperates with the electronic component to form a heat conduction relationship, the circuit board is provided with a plurality of first copper foils and a second copper foil, the plurality of first copper foils are provided for bonding the plurality of pins of the electronic component, the second copper foil is provided for bonding the heat sink, the second copper foil is divided into at least a first part for bonding the heat sink and a second part connected to the first part, and the second part is in contact with the package shell of the electronic component when the electronic component is arranged on the circuit board but does not form a bonding relationship.

[0007] In one embodiment, the heat sink is disposed across the electronic component, the heat sink includes two adhesive feet, the second copper foil includes two first portions, and the second portions of the second copper foil are located between the two first portions.

[0008] In one embodiment, at least one of the first portions includes a heat sink bonding area and an auxiliary heat dissipation area connected to the heat sink bonding area.

[0009] In one embodiment, the plurality of first copper foils are divided into two groups arranged at intervals, and at least three sides of each of the two groups are provided with the second copper foil, and the second portions of the second copper foil are located between the two groups.

[0010] In one embodiment, each of the two first portions includes a heat sink bonding area and an auxiliary heat dissipation area connected to the heat sink bonding area.

[0011] In one embodiment, the top heat sink directly contacts the heat sink.

[0012] In one embodiment, the electronic component heat dissipation structure further includes an auxiliary heat conduction member located between the electronic component and the heat sink, and the auxiliary heat conduction member contacts the top heat sink.

[0013] In one embodiment, the electronic component heat dissipation structure includes at least two electronic components, the heat sink is disposed across the at least two electronic components, the heat sink and the at least two electronic components form a heat conduction relationship, the second copper foil is divided into a plurality of first portions and a plurality of second portions, and each of the plurality of second portions is connected to two of the plurality of first portions arranged adjacent to each other.

[0014] In one embodiment, each of the plurality of first portions includes a heat sink bonding area and an auxiliary heat dissipation area connected to the heat sink bonding area.

[0015] According to the above-mentioned utility model content, compared with the prior art, the utility model has the following characteristics: the utility model is provided with the top heat sink on the electronic component, which can assist the electronic component in heat dissipation. At the same time, when the electronic component is arranged on the circuit board, the package shell of the electronic component contacts the second portion of the second copper foil but does not form a bonding relationship, thereby improving the heat dissipation effect of the electronic component. In addition, according to the utility model, the electronic component can also be implemented in a plurality of parallel arrangement schemes in actual application. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a three-dimensional schematic view of the first embodiment of the utility model;

[0017] Figure 2 It is a cross-sectional schematic view of the first embodiment of the utility model;

[0018] Figure 3 is a three-dimensional schematic view of the second embodiment of the utility model;

[0019] Figure 4 is an exploded schematic view of the second embodiment of the utility model;

[0020] Figure 5 is a sectional schematic view of the second embodiment of the utility model;

[0021] Figure 6 is a top view schematic view of the second embodiment of the utility model;

[0022] Figure 7 is a three-dimensional schematic view of the third embodiment of the utility model.

[0023]

Symbol explanation

[0024] 20: electronic component heat dissipation structure

[0025] 21: electronic component

[0026] 211: package shell

[0027] 212: pin

[0028] 213: top heat dissipation fin

[0029] 22: heat sink

[0030] 221: adhesive pin

[0031] 23: circuit board

[0032] 231: first copper foil

[0033] 232: second copper foil

[0034] 233: first part

[0035] 234: second part

[0036] 235: heat sink adhesive area

[0037] 236: auxiliary heat dissipation area

[0038] 237: group

[0039] 24: auxiliary heat conduction piece DETAILED DESCRIPTION

[0040] The utility model detailed explanation and technical content, now cooperate with the following description of drawings:

[0041] Please refer to Figures 1 to 6The utility model provides a kind of electronic component heat dissipation structure 20, including an electronic component 21, a radiator 22 and a circuit board 23.The electronic component 21 has a package shell 211, multiple pins 212 exposed in the package shell 211 and a top fin 213 exposed in the package shell 211.The electronic component 21 is a surface mount device, and the multiple pins 212 are welded on the circuit board 23 when the electronic component 21 is subjected to surface mount process.It should be understood that although the electronic component 21 is shown in wafer form in the drawings, in fact, the electronic component 21 can also be a MOS switch or other component implemented by surface mount technology, and the multiple pins 212 can be located on both sides of the package shell 211 as shown in the drawings, or can be located on the same side of the package shell 211 as in a MOS switch.The top fin 213 is located on the top surface of the package shell 211, and when the electronic component 21 is running, it will generate heat energy, causing the temperature of the package shell 211 to rise, and the top fin 213 provides heat dissipation for the package shell 211.In addition, the radiator 22 cooperates with the electronic component 21 to form a heat conduction relationship.The radiator 22 and the electronic component 21 are not limited in the connection relationship, as long as they can form a heat conduction relationship.For example, the radiator 22 and the electronic component 21 can be in direct contact, and the radiator 22 directly contacts the top fin 213 of the electronic component 21, so that the heat energy on the electronic component 21 can be transferred to the radiator 22 through the top fin 213.In another example, the radiator 22 and the electronic component 21 use an additional auxiliary heat conduction member 24 to conduct heat, and the auxiliary heat conduction member 24 is located between the radiator 22 and the electronic component 21 and directly contacts the top fin 213 to transfer the heat energy from the top fin 213 to the radiator 22.The auxiliary heat conduction member 24 can be a heat conduction pad, cement or the like. Figures 3 to 6

[0042] ​The circuit board 23 is provided with a plurality of first copper foils 231 and a second copper foil 232, the electronic component 21 and the heat sink 22 are provided on the circuit board 23 by automatic surface adhesion technology, the plurality of first copper foils 231 and the second copper foil 232 are printed on the positions of the circuit board 23 to be adhered to the electronic component 21 and the heat sink 22, after the electronic component 21 and the heat sink 22 enter the automatic material belt, the plurality of first copper foils 231 provide the plurality of pins 212 of the electronic component 21 to be adhered, and the second copper foil 232 provides the heat sink 22 to be adhered. The plurality of first copper foils 231 and the plurality of pins 212 are adhered to form an electrical connection relationship, and the electrical signal of the electronic component 21 can be transmitted, the second copper foil 232 is divided into at least a first part 233 for adhering the heat sink 22, and a second part 234 connected to the first part 233, the first part 233 can form a heat conduction relationship with the heat sink 22, the second part 234 is below the package shell 211 of the electronic component 21 when the electronic component 21 is provided on the circuit board 23, and is in contact with the package shell 211 of the electronic component 21, but does not form an adhering relationship, to provide heat dissipation for the package shell 211.

[0043] As known from the foregoing, when the electronic component 21 operates, the plurality of pins 212 transmit electrical signals through the plurality of first copper foils 231. When the temperature of the electronic component 21 rises, the heat energy on the package shell 211 can be transmitted to the heat sink 22 by the top heat dissipation fin 213, or can be transmitted to the second part 234 of the second copper foil 232 from the package shell 211, thereby accelerating the dissipation of heat energy on the electronic component 21, and thus obtaining good heat dissipation effect of the electronic component 21.

[0044] Compared with the prior art, the top heat dissipation fin 213 and the second part 234 of the second copper foil 232 accelerate the heat dissipation of the package shell 211, so that the electronic component 21 reduces the operation errors caused by heat energy.

[0045] As mentioned above, please refer to Figures 1 to 6The heat spreader 22 is arranged on the electronic component 21, and the arrangement means that the heat spreader 22 comprises two adhesive feet 221 located on both sides of the electronic component 21, so that the heat spreader 22 forms a posture across the electronic component 21. At this time, the second copper foil 232 comprises two first portions 233, and the second portion 234 of the second copper foil 232 is located between the two first portions 233. In an embodiment, at least one of the two first portions 233 comprises a heat spreader bonding area 235 and an auxiliary heat dissipation area 236, the heat spreader bonding area 235 provides bonding of one of the two adhesive feet 221, and the auxiliary heat dissipation area 236 is connected to the heat spreader bonding area 235 and is not bonded to the heat spreader 22. The auxiliary heat dissipation area 236 is provided, so that the area of the two first portions 233 is greater than the area of the two adhesive feet 221, so as to assist the heat dissipation of the heat spreader 22.

[0046] In another embodiment, the plurality of pins 212 is located on both sides of the packaging shell 211, the plurality of first copper foils 231 is divided into two groups 237 arranged at intervals, at least three sides of each of the two groups 237 are provided with the second copper foil 232, and the second portion 234 of the second copper foil 232 is located between the two groups 237. When the electronic component 21 is arranged on the circuit board 23, the packaging shell 211 is located above the second portion 234 of the second copper foil 232, and the two groups 237 are respectively located on both sides of the packaging shell 211 and respectively provide arrangement of the plurality of pins 212. In other words, in this embodiment, the second copper foil 232 is configured in the shape of an "H" character, and the two groups 237 are respectively located on opposite sides of the "H" character. Further, each of the two first portions 233 of the second copper foil 232 comprises the heat spreader bonding area 235 and the auxiliary heat dissipation area 236.

[0047] For reference Figures 5 to 7 In an embodiment, the electronic component 21 can be designed in multiple ways according to the implementation. Specifically, the electronic component heat dissipation structure 20 comprises at least two electronic components 21 arranged in parallel and having the same potential. The heat spreader 22 is arranged across the at least two electronic components 21, the heat spreader 22 and the at least two electronic components 21 form a heat conduction relationship, the second copper foil 232 is divided into a plurality of first portions 233 and a plurality of second portions 234, and each of the plurality of second portions 234 is connected to two of the plurality of first portions 233 arranged adjacent to each other. Further, each of the plurality of first portions 233 comprises the heat spreader bonding area 235 and the auxiliary heat dissipation area 236, so as to improve the heat dissipation effect of the heat spreader 22.

Claims

1. A heat dissipation structure for an electronic component, characterized in that, Include: An electronic component having a package housing, a plurality of pins exposed in the package housing, and a top heat sink exposed in the package housing; A heat sink, which works in conjunction with the electronic component to establish a heat conduction relationship; and A circuit board has a plurality of first copper foils and a second copper foil. The plurality of first copper foils provide bonding for the plurality of pins of the electronic component, and the second copper foil provides bonding for the heat sink. The second copper foil is divided into at least a first portion for bonding the heat sink and a second portion connecting the first portion. When the electronic component is disposed on the circuit board, the second portion contacts the package housing of the electronic component but does not form an adhesive relationship.

2. The heat dissipation structure for electronic components as described in claim 1, characterized in that, The heat sink is mounted across the electronic component. The heat sink includes two adhesive feet. The second copper foil includes two of the first portions, and the second portion of the second copper foil is located between the two first portions.

3. The heat dissipation structure for electronic components as described in claim 2, characterized in that, The first part includes at least one of a heat sink bonding area and an auxiliary heat dissipation area connected to the heat sink bonding area.

4. The heat dissipation structure for electronic components as described in claim 2, characterized in that, The plurality of first copper foils are divided into two groups spaced apart, and each of the two groups has a second copper foil on at least three sides, with the second portion of the second copper foil located between the two groups.

5. The heat dissipation structure for electronic components as described in claim 4, characterized in that, Each of the first parts includes a heat sink bonding area and an auxiliary heat dissipation area connected to the heat sink bonding area.

6. The heat dissipation structure for electronic components as described in claim 1 or 2, characterized in that, The top-mounted heat sink is in direct contact with the radiator.

7. The heat dissipation structure for electronic components as described in claim 1 or 2, characterized in that, The heat dissipation structure of the electronic component also includes an auxiliary heat-conducting component located between the electronic component and the heat sink, which contacts the top heat sink.

8. The heat dissipation structure for electronic components as described in claim 1, characterized in that, The heat dissipation structure of the electronic component includes at least two electronic components, the heat sink spans the at least two electronic components, the heat sink and the at least two electronic components form a thermal conduction relationship, the second copper foil is divided into a plurality of first parts and a plurality of second parts, each of the plurality of second parts is respectively connected to two of the plurality of adjacent first parts.

9. The heat dissipation structure for electronic components as described in claim 8, characterized in that, Each of the plurality of the first portions includes a heat sink bonding area and an auxiliary heat dissipation area connected to the heat sink bonding area.

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