Lamp bead structure capable of improving brightness

Abstract

The utility model discloses a lamp bead structure capable of improving brightness, which belongs to the technical field of LED lamp beads and comprises a lamp bead support arranged on a substrate, a lamp bead end foot is arranged at the bottom of the lamp bead support, the upper end face of the lamp bead support is half-etched to form a bonding pad protruding upwards, an LED chip is arranged on the bonding pad, and the LED chip is connected with the lamp bead support. A bowl cup is arranged on the lamp bead support, and the bonding pad is located in an area defined by the bowl cup; the distance between the bonding pad and the upper end face of the bowl cup is 0.3-0.5 mm, and the opening angle of the bowl cup ranges from 90 degrees to 95 degrees. By lifting the height of the lamp bead support, the distance between the bonding pad and the upper end face of the bowl cup is reduced, then the depth of the original bowl cup is reduced, meanwhile, the light-emitting angle of the bowl cup is enlarged, and the brightness of the lamp beads is improved.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of LED lamp pearl, and relates to a lamp pearl structure of improving brightness. BACKGROUND

[0002] In the early development of LED display screen products, due to technical limitations, manufacturers often cover up the defects in display effect such as uneven chroma and poor flatness by improving brightness. With the progress of technology, the competition in brightness in the industry is increasingly fierce, and the current high brightness can reach 7500 cd / m2 to 12000 cd / m2. However, in actual application, 5000 cd / m2 is sufficient in the outdoor sunlight-free environment, and 7000-8000 cd / m2 is required under direct sunlight to ensure clear display.

[0003] Under the existing packaging technology, high-brightness segment chips and high-refractive-index glue must be used to improve brightness, and the brightness is indeed improved, but the cost is also greatly increased. Or high-brightness high-reflective brackets are used, and it is generally more difficult to weld than conventional brackets, and the PPA reliability yellowing or attenuation of part of the initial high brightness will be larger. The surface of the lamp pearl is roughened, and the process is difficult. Increasing the lighting current, the chip is overloaded, and the service life will be greatly affected.

[0004] Therefore, it is necessary to improve the prior art to overcome the defects in the prior art. INVENTION CONTENTS

[0005] The utility model aims at providing a lamp pearl structure of improving brightness, improving the brightness of the lamp pearl by improving the existing lamp pearl structure.

[0006] The utility model aims at providing a lamp pearl structure of improving brightness, improving the brightness of the lamp pearl by improving the existing lamp pearl structure.

[0007] A lamp pearl structure of improving brightness, including the lamp pearl support that sets up on the substrate, the bottom of lamp pearl support is provided with the lamp pearl end foot, the upper end face half etching of lamp pearl support forms the pad that protrudes upwards, the pad is provided with LED chip, the bowl cup is provided with on lamp pearl support, the pad is located in the region that bowl cup surrounds, the interval of pad and the upper end face of bowl cup is 0.3-0.5mm, the opening angle of bowl cup is between 90 between 95.

[0008] As a further improvement of the utility model one embodiment, wherein the interval of pad and the upper end face of bowl cup is 0.4mm, the opening angle of bowl cup is between 92.79.

[0009] As a further improvement of the utility model one embodiment, wherein the lamp pearl support is composed of the substrate and the side plate, the side plate is inclined outward and is arranged around the edge of the substrate.

[0010] As a further improvement of the embodiment of the utility model, wherein, the substrate, side plate and lamp bead end foot are integrally formed by stamping.

[0011] As a further improvement of the embodiment of the utility model, wherein, the back of the substrate is provided with a heat dissipation structure.

[0012] As a further improvement of the embodiment of the utility model, wherein, the heat dissipation structure is a heat dissipation groove distributed on the back of the substrate, and the lamp bead end foot abuts on the heat dissipation groove.

[0013] The above technical scheme has the following beneficial effects: by lifting the height of the lamp bead support, the spacing between the solder pad and the upper end surface of the bowl cup is reduced, thereby reducing the depth of the original bowl cup, expanding the light emitting angle of the bowl cup, and improving the brightness of the lamp bead. The improved lamp bead structure not only improves the brightness of the lamp bead, but also reduces the use amount of packaging materials, saving material costs. BRIEF DESCRIPTION OF DRAWINGS

[0014] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description are only exemplary, and for those skilled in the art, other implementation drawings can be derived from the provided drawings without creative labor.

[0015] The structures, proportions, sizes, etc. shown in the specification are only used to cooperate with the content disclosed in the specification, for understanding and reading by those skilled in the art, and are not used to limit the implementation conditions of the utility model, so they do not have technical significance. Any modification of structure, change of proportion relationship or adjustment of size, without affecting the effects and purposes that the utility model can produce, should still fall within the scope of the technical content disclosed by the utility model.

[0016] Figure 1 It is a schematic diagram of the existing lamp bead structure.

[0017] Figure 2 It is a schematic diagram of the structure provided by the utility model.

[0018] In the figure:

[0019] 1-substrate;

[0020] 2-lamp bead support; 21-substrate; 22-side plate;

[0021] 3-lamp bead end foot;

[0022] 4-bowl cup;

[0023] 100-upper end surface. DETAILED DESCRIPTION

[0024] It should be noted that the embodiments and features in the embodiments of the present application can be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0025] It should be noted that, unless otherwise specified, all technical and scientific terms used in the present application have the same meaning as generally understood by those skilled in the art to which the present application belongs.

[0026] In the present application, unless otherwise specified, the orientation words such as "upper, lower, top, bottom" are generally directed to the direction shown in the drawings, or are directed to the vertical, perpendicular or gravity direction of the components themselves. Similarly, for the convenience of understanding and description, "inner, outer" refers to the inner and outer relative to the contour of each component itself, but the above orientation words are not used to limit the present application.

[0027] EMBODIMENT

[0028] Referring to Figure 2 The structure of the lamp bead structure for improving brightness is characterized by reasonable design of the lamp bead support. The lamp bead structure comprises a lamp bead support 2 arranged on a substrate 1, and the bottom of the lamp bead support 2 is provided with a lamp bead pin 3 for electrical connection. The upper end surface 100 of the lamp bead support 2 is half-etched to form a solder pad protruding upward, which is used to carry an LED chip. A bowl cup 4 is arranged above the lamp bead support 2, and the solder pad is located in the area enclosed by the bowl cup 4, so as to ensure that the LED chip can be effectively packaged.

[0029] Compared with the existing lamp bead structure (as shown in Figure 1 Compared with the existing lamp bead structure (as shown in

[0030] The lamp bead support 2 in the embodiment is similar in basic structure to the existing lamp bead support, and is also composed of a substrate 21 and a side plate 22. The side plate 22 is inclined outward and closely surrounds the edge of the substrate 21 to be arranged in a ring shape. Such design is helpful to the stability and packaging effect of the lamp bead structure. However, compared with the prior art, the height of the lamp bead support 2 in the embodiment is adjusted, which is specifically manifested in that the overall height of the lamp bead support 2 is greater than that of the corresponding structure in the prior art.

[0031] In the premise of keeping the overall lamp bead structure height unchanged, we raise the height of the lamp bead support 2 to effectively reduce the depth of the bowl cup 4. This change not only optimizes the internal structure of the lamp bead, but also reduces the distance between the solder pad and the upper end surface of the bowl cup 4, thereby promoting better light distribution and improving the brightness performance of the lamp bead. This design adjustment not only ensures the stability of the lamp bead structure, but also significantly improves the performance.

[0032] Specifically, the distance D between the solder pad and the upper end surface of the bowl cup 4 is precisely controlled between 0.3-0.5mm, with an optimal value of 0.4mm. This distance selection ensures structural stability while maximizing brightness improvement. In addition, the opening angle W of the bowl cup 4 is also optimized to between 90°-95°, with an optimal selection of 92.79°. This design maintains the compactness of the lamp bead structure while further widening the light emitting angle, allowing light to be more evenly distributed and improving the visual effect of the lamp bead.

[0033] The lamp bead support 2 in this embodiment adopts an integrated design, with the substrate 21, side plate 22 and lamp bead end foot 3 being integrally formed by precision stamping process, ensuring the stability and reliability of the structure, while simplifying the manufacturing process and improving production efficiency.

[0034] To improve the overall heat dissipation performance and ensure the stability of the lamp bead structure under long-time high-load work, prolonging the service life, the back surface of the substrate 1 is specially designed with a heat dissipation structure. The heat dissipation structure is specifically manifested as multiple heat dissipation grooves distributed on the back surface of the substrate 1 for improving heat dissipation efficiency.

[0035] The lamp bead end foot 3 is cleverly arranged to abut against these heat dissipation grooves in the design. This design not only ensures the stability of electrical connection, but also allows the lamp bead end foot 3 to participate in the heat dissipation process, effectively conducting the heat generated during lamp bead operation to the back surface of the substrate 1, and then dissipating it through the heat dissipation grooves.

[0036] Compared with the existing lamp bead structure (such as Figure 1 The distance between the solder pad and the upper end surface of the bowl cup is successfully reduced from the original 0.95mm to 0.4mm. This improvement significantly reduces the reflection and loss of light inside the lamp bead. At the same time, we have also increased the opening angle of the cup opening, further improving the light exit efficiency. Experimental results show that compared with the brightness of the improved lamp bead, the optimized R(red) light brightness is improved by 14.94%, the G(green) light brightness is improved by 6.76%, and the B(blue) light brightness is as high as 22.4% growth.

[0037] The utility model discloses a height of lamp pearl support is cleverly lifted, and we realize the effective reduction of the spacing between the pad and the upper end surface of bowl cup. This design adjustment not only makes the depth of the original bowl cup reduce, thereby reduces the loss of light in the bowl cup, but also significantly expands the light emitting angle of the bowl cup, so that the light can be more evenly radiated outward, and the overall brightness of the lamp pearl is improved. The improved lamp pearl structure not only improves the brightness of the lamp pearl, but also reduces the use amount of packaging materials, and saves the material cost.

[0038] Obviously, the above-described embodiments are only a part of the embodiments of the utility model, and are not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the person skilled in the art without creative labor should belong to the protection scope of the utility model.

[0039] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0040] It should be noted that the terms "first", "second", and the like, as used in the specification, are intended to modify any one of the identified objects, but do not necessarily indicate a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances, so that the embodiments of the application described herein can be implemented in an order other than that illustrated or described herein.

[0041] The above only describes the preferred embodiments of the utility model, and does not limit the utility model, and the utility model can have various changes and changes for the person skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A light-emitting diode (LED) lamp bead structure for improving brightness, comprising a lamp bead support arranged on a substrate, a bottom of the lamp bead support being provided with a lamp bead pin, an upper end surface of the lamp bead support being semi-etched to form an upwardly protruding pad, an LED chip being arranged on the pad, and a bowl cup being arranged on the lamp bead support, the pad being located in an area enclosed by the bowl cup. The distance between the soldering pad and the upper end surface of the bowl cup is 0.3-0.5 mm, and the opening angle of the bowl cup is between 90° and 95°.

2. The lamp bead structure of claim 1, wherein: The distance between the soldering pad and the upper end surface of the bowl cup is 0.4 mm, and the opening angle of the bowl cup is between 92.79°.

3. The lamp bead structure of claim 1, wherein: The lamp bead support is composed of a base plate and a side plate, and the side plate is outwardly inclined and arranged around the edge of the base plate.

4. The lamp bead structure of claim 3, wherein: The base plate, the side plate and the lamp bead end foot are integrally stamped and formed.

5. The lamp bead structure of claim 1, wherein: The back surface of the base plate is provided with a heat dissipation structure.

6. The lamp bead structure of claim 5, wherein: The heat dissipation structure is a heat dissipation groove distributed on the back surface of the base plate, and the lamp bead end foot abuts onto the heat dissipation groove.

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