Wiring device and dimmer

Abstract

The utility model provides a wiring device and a dimmer, and the wiring device comprises a first circuit board assembly which comprises a first circuit board, and the first circuit board is provided with a plurality of heating elements which are vertically arranged; the heat dissipation mechanism comprises a heat conduction plate and a heat dissipation plate, the heat conduction plate extends from the heat dissipation plate and is bent, the heat conduction plate is attached to the surfaces of the multiple heating elements, and the multiple heating elements are arranged at intervals in the length direction of the heat conduction plate; and the shell comprises an inner cavity, and the first circuit board assembly and the heat dissipation mechanism are at least partially arranged in the inner cavity.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of dimmer, especially a wiring device and dimmer. BACKGROUND

[0002] The dimmer is a kind of device that changes the luminous flux of light source in lighting device and adjusts illumination, and its basic principle is to change the current effective value of input light source to achieve the purpose of dimming.The dimmer is provided with dimming element, for example, thyristor or relay.The dimming element generates a lot of heat in work, and the temperature of dimmer is increased.When the generated heat is not effectively dissipated, the safety and life of dimmer are reduced. SUMMARY

[0003] One purpose of the utility model is to solve at least one aspect of the above problems and defects in the prior art.

[0004] In view of the above problems, the utility model discloses a wiring device, including first circuit board assembly, including first circuit board, be equipped with multiple straight up setting heat generating element on the first circuit board, and heat dissipation mechanism, including heat conduction plate and heat dissipation plate, the heat conduction plate extends from the heat dissipation plate and is bent, the surface of the heat conduction plate and the multiple heat generating elements are attached, and the multiple heat generating elements are arranged along the length direction of the heat conduction plate, and shell, the shell includes inner chamber, and the first circuit board assembly and the heat dissipation mechanism are at least partially arranged in the inner chamber.

[0005] According to an exemplary embodiment of the utility model, the middle part of the heat dissipation plate is sunken and presents a U-shaped structure, and the ratio of the length of the heat conduction plate to the length of the middle part of the heat dissipation plate is between 7:10 and 9:10.

[0006] According to an exemplary embodiment of the utility model, the heat conduction plate includes multiple plate-shaped structures, and the multiple plate-shaped structures are arranged corresponding to the positions of the multiple heat generating elements.

[0007] According to an exemplary embodiment of the utility model, the multiple heat generating elements are located on the same side of the heat conduction plate.

[0008] According to an exemplary embodiment of the utility model, the multiple heat generating elements are located on different sides of the heat conduction plate.

[0009] According to an exemplary embodiment of the utility model, a heat conduction layer is filled between the heat conduction plate and the multiple heat generating elements, and the heat conduction layer includes one or more of heat-conducting silicone grease, heat-conducting gel and heat-conducting silica gel.

[0010] According to an exemplary embodiment of the utility model,

[0011] According to an exemplary embodiment of the present invention, the side of the housing is provided with heat dissipation holes, and the position of the heat dissipation holes corresponds to the position of the heat-conducting plate.

[0012] According to an exemplary embodiment of the present invention, the heating element is located between the heat-conducting plate and the side wall of the housing.

[0013] This utility model also discloses a dimmer, including an adjustment device and a wiring device as described in any embodiment of this utility model. The adjustment device includes any one of a rocker structure, a rotating torsion bar, a push-pull switch, and a touch device.

[0014] In the foregoing exemplary embodiments of this utility model, the circuit board assembly of the wiring device includes a plurality of heating elements erected on the circuit board. The heat dissipation mechanism includes a heat sink and a heat-conducting plate bent in an L-shape from the heat sink. The heat-conducting plate is in contact with the surfaces of the plurality of heating elements, and the plurality of heating elements are spaced apart along the length of the heat-conducting plate. The heat-conducting plate contacts the heating elements on the side of the wiring device, which can improve the heat dissipation efficiency of the heating elements, thereby reducing the temperature rise of the wiring device and ensuring its service life. Attached Figure Description

[0015] The features, advantages, and other aspects of the various embodiments of this utility model will become more apparent from the accompanying drawings and the following detailed description. Several embodiments of this utility model are shown herein by way of example and not limitation, in the drawings:

[0016] Figure 1 This is an exploded perspective view of a wiring device according to an embodiment of the present invention;

[0017] Figure 2 This is a schematic diagram of the circuit board assembly according to one embodiment of the present invention;

[0018] Figure 3 This is a structural schematic diagram of the wiring device in an assembled state according to an embodiment of the present invention; and

[0019] Figure 4 This is an exploded perspective view of a dimmer according to an embodiment of the present invention. Detailed Implementation

[0020] The implementation and use of the embodiments are discussed in detail below. However, it should be understood that the specific embodiments discussed are merely illustrative of specific ways of implementing and using this application, and are not intended to limit the scope of this application. The descriptions of the structural positions of various components, such as upper, lower, top, bottom, etc., are not absolute but relative. These directional descriptions are appropriate when the various components are arranged as shown in the figures, but they change accordingly when the positions of the various components in the figures change.

[0021] A dimmer can be electrically connected to a lighting fixture to adjust the illuminance of the fixture. Typically, a dimmer includes a housing, a circuit board assembly, a heat sink, and a dimming mechanism. The circuit board assembly can be housed within an internal cavity of the housing. The circuit board assembly can contain various components, such as one or more of a dimming element, a rectifier, a switch, and terminals. Some of these components, such as the dimming element and the rectifier, generate significant heat during operation due to their high power.

[0022] In some examples, terminals are distributed around the perimeter of the circuit board, while other components are located on the remaining portion of the board. In this layout, heat generated by hot components cannot be effectively dissipated, resulting in a reduced product lifespan.

[0023] To address the aforementioned problems, one embodiment of this utility model provides a wiring device and a dimmer. The wiring device includes a first circuit board assembly, a heat dissipation mechanism, and a housing. The first circuit board assembly includes a first circuit board on which a plurality of vertically arranged heating elements are disposed. The heat dissipation mechanism includes a heat-conducting plate and a heat dissipation plate, the heat-conducting plate extending from and bending from the heat dissipation plate, the heat-conducting plate and the surfaces of the plurality of heating elements being in contact, and the plurality of heating elements being spaced apart along the length direction of the heat-conducting plate. The housing includes an inner cavity, in which the first circuit board assembly and the heat dissipation mechanism are at least partially disposed.

[0024] Figure 1 An exploded perspective view of a wiring device 100 according to an embodiment of the present invention is shown.

[0025] Figure 2 It shows Figure 1 A schematic diagram of the circuit board assembly is shown. The wiring device 100 includes a first circuit board assembly 10, a heat dissipation mechanism 20, and a housing 30. The first circuit board assembly 10 includes a first circuit board 101 and multiple components disposed on the first circuit board 101, including heat-generating elements 102a and 102b, multiple terminals 103, and a switch 104. Figure 2As shown, the plane of circuit board 101 is approximately rectangular, including two opposite long sides a1, a2 and two opposite short sides b1, b2. In other examples, the shape of circuit board 101 is not limited to this; for example, it can be approximately square or polygonal, where polygons include rectangles or squares with missing corners, as well as pentagons, hexagons, etc.

[0026] Heating elements 102a and 102b are components that dissipate heat during operation, such as dimming elements or rectifiers. In some examples, the dimming element includes one or more of a triac and a relay. For example, heating element 102a is a triac, and heating element 102b is a rectifier. Multiple terminals 103 are used to connect the power supply wires of the lighting device. It is understood that... Figures 1-2 The number of heating elements and terminals shown is merely an example. In other examples, the number of heating elements and terminals may be different. The terminals may be push-button terminals or other types of terminals. In some examples, switch 104 is a mechanical switch, which, when triggered, enables forced switching control, thereby forcibly cutting off the power supply to avoid accidents.

[0027] Figure 1 The circuit board assembly 10 has a heat dissipation mechanism 20 on one side and a housing 30 on the other side. The housing 30 has an inner cavity, and the circuit board assembly 10 and the heat dissipation mechanism 20 can be at least partially disposed within the inner cavity of the housing 30. The housing 30 can be made of a plastic material with low thermal conductivity. The side of the housing 30 has three receiving slots for accommodating three wiring terminals respectively.

[0028] The heat dissipation mechanism 20 is used to absorb and transfer the heat generated by the heating elements 102a and 102b. Specifically, the heat dissipation mechanism 20 may include a plate-like structure that can be attached to the surface of the heating elements 102a and 102b, conducting the heat generated by the heating elements 102a and 102b to the rest of the heat dissipation mechanism 20, and ultimately conducting the heat to the outside of the wiring device. In some examples, the heat dissipation mechanism may be made of a metal material with a high thermal conductivity, such as copper, aluminum, or an alloy. In some examples, the heat dissipation mechanism may be a ceramic plate with high thermal conductivity.

[0029] Figure 1The heat dissipation mechanism 20 includes a heat-conducting plate 201 and a heat sink 202. The heat-conducting plate is used to adhere to and absorb heat from the heat-generating elements on the circuit board, while the heat sink dissipates the heat absorbed by the heat-conducting plate. The heat-conducting plate 201 extends from the heat sink 202 and is L-shaped. The heat sink 202 can serve as the top of the wiring device 100. The heat-conducting plate 201 bends downwards along the side of the housing 30 from its edge, i.e., along the direction of insertion into the inner cavity of the housing 30. The heat-conducting plate 201 is plate-shaped and can adhere to the surfaces of the heat-generating elements 102a and 102b, which are spaced apart along the length of the heat-conducting plate. The adhesion of the heat-conducting plate 201 to the surfaces of the heat-generating elements allows for rapid heat transfer to the heat sink 202.

[0030] In some examples, the heating element can be mounted horizontally on the circuit board and can be attached to a horizontally positioned heat-conducting plate at the top. In the wiring device 100, the heating elements 102a and 102b are mounted vertically on the circuit board 101, with their sides attached to the vertically positioned heat-conducting plate 201. This arrangement not only optimizes the layout of the circuit board assembly but also allows for faster heat dissipation as the heat-conducting surface is close to the edge of the housing 30. It can be understood that "vertical mounting" here can also refer to the heating element being rotated 90 degrees within a plane parallel to the heat-conducting plate.

[0031] Figure 1 The wiring device 100 includes a circuit board assembly comprising multiple heating elements erected on the circuit board. The heat dissipation mechanism includes a heat sink and a heat-conducting plate bent in an L-shape from the heat sink. The heat-conducting plate is in contact with the surfaces of the multiple heating elements, which are spaced apart along the length of the heat-conducting plate. The heat-conducting plate contacts the heating elements on the side of the wiring device, improving heat dissipation efficiency and reducing the temperature rise of the wiring device, thus ensuring its service life.

[0032] exist Figure 1 In this configuration, the heat-conducting plate 201 is a single plate-like structure, and the heating elements 102a and 102b are spaced apart along the heat-conducting plate on the circuit board 101. This arrangement, where multiple dispersed heating elements are attached to a single heat-conducting plate, increases the heat dissipation surface area, thereby improving heat dissipation efficiency. The heat-conducting plate may extend through the length of the cavity within the housing 30. In some examples, when the wiring device includes multiple heating elements, the heat-conducting plate may comprise multiple individual plate-like structures. These multiple plate-like structures are positioned corresponding to the locations of different heating elements, and each plate-like structure is spaced apart.

[0033] like Figures 1-2As shown, the terminals 103 are concentrated on the first edge of the circuit board 101, i.e., the first long side a1. The heating elements 102a and 102b are located on the second edge of the circuit board 101, i.e., the second long side a2. Here, the first edge and the second edge are the long sides of the circuit board that are opposite each other. The terminals are neatly arranged, which facilitates wiring.

[0034] Understandable. Figure 1 The layout of the heating elements and terminals shown is merely an example. In other examples, the heating elements and terminals may be located on adjacent sides of the circuit board, or on different, spaced-apart edges. In some examples, the location of multiple terminals and multiple heating elements may not be limited to a single edge. For example... Figure 1 Some terminals can be located on the first long side a1, while other terminals can be located on the first short side b1 adjacent to the first long side a1. For example, Figure 1 The heating element 102a can be located on the second long side a2, and the heating element 102b can be located on the second short side b2 adjacent to the second long side a2.

[0035] In some examples, a thermally conductive sheet may be provided between the heat-conducting plate and the heating element to improve heat dissipation. In some examples, a thermally conductive layer (not shown in the figure) may be provided between the heat-conducting plate 201 and the heating elements 102a, 102b. The thermally conductive layer is used to fill the gap between the heat-conducting plate and the heating element. The thermally conductive layer has good interfacial wettability and is thinly coated, enabling thermal expansion in conjunction with the heat-conducting plate. The thermally conductive layer does not require fixing with mechanical parts such as bolts as the thermally conductive sheet. The thermally conductive layer includes a phase change material or thermal paste. The thermal paste can be one or more of thermal grease, thermal gel, and thermal silicone. The thickness of the thermally conductive layer is relatively thin; in some examples, the thickness of the thermally conductive layer may not exceed 0.1 mm, for example, 0.05 mm, 0.06 mm, or 0.1 mm. In some examples, the thermal conductivity of the thermally conductive layer can be greater than 4 W / (m·K).

[0036] Figure 1 In this design, the heat sink 202 is generally plate-shaped, but its middle section is recessed, forming a U-shape. Compared to a single flat heat sink, the U-shape increases the surface area for heat dissipation. Furthermore, the U-shape increases the convection area with air. Specifically, when the surface temperature of the heat sink rises, the surrounding cool air is heated and rises, creating natural convection. The U-shaped heat sink guides this airflow, accelerating heat dissipation. Additionally, the left and right ends of the heat sink 202 extend beyond the housing 30. The heat sink absorbs heat and transfers it to the outside of the wiring device. In some examples, the ratio of the length of the heat-conducting plate to the length of the middle section of the heat sink ranges from 7:10 to 9:10.

[0037] In some examples, the heat dissipation mechanism 20, in addition to its heat dissipation function, can also serve as a grounding mechanism. For example, the heat dissipation mechanism 20 may be provided with a pin hole ( Figure 4 (203) The pin hole can be used to connect to the grounding wire.

[0038] Figure 3 It shows Figure 1 A structural diagram of the wiring device in its assembled state. (From...) Figure 3 It can be seen that the heating elements 102a and 102b are located on the outside of the heat-conducting plate 201, that is, the heating elements are located between the heat-conducting plate and the side wall of the housing 30. Figure 3 In the example, since the heating element is located on the outside of the heat-conducting plate, some of the heat it generates can be directly exchanged with the air, which is more conducive to heat dissipation.

[0039] The relative positions of the heating element and the heat-conducting plate can be set according to specific circumstances. In some examples, the heating element can be located on the inner side of the heat-conducting plate, that is, the outer surface of the heating element is in contact with the inner surface of the heat-conducting plate. Besides the case where multiple heating elements are located on the same side of the heat-conducting plate, in some examples, heating element 102a and heating element 102b can be located on different sides of the heat-conducting plate. For example, heating element 102a is located on the inner side of the heat-conducting plate, while heating element 102b is located on the outer side of the heat-conducting plate. Figure 3 The diagram also shows that the heating element and the heat-conducting plate can be fixed together by screws 105, which can increase the fastening force between the two.

[0040] like Figure 1 and Figure 3 As shown, in the wiring device 100, the side of the housing 30 is provided with heat dissipation holes 301, the positions of which correspond to the positions of the heat-conducting plate 201 and the heating elements 102a and 102b. The arrangement of the heat dissipation holes helps to accelerate heat dissipation. When the heating elements are working, some of the heat generated is conducted out through the heat-conducting plate, and some heat is directly dissipated to the outside of the housing through the heat dissipation holes. In other examples, the heat dissipation holes can be provided in other positions on the housing and can be in other appropriate numbers.

[0041] Furthermore, in the circuit board assembly 10, the heating elements 102a, 102b and the plurality of terminals 103 are located on the same surface of the circuit board 101, i.e. Figure 1The upper surface of the circuit board 101. Thus, in the assembled state of the wiring device 100, the heat dissipation structure 20 and the circuit board assembly 10 are disposed within the cavity of the housing 30, saving internal space in the housing 30 and thus facilitating miniaturization of the wiring device 100. In some examples, the heating elements 102a, 102b and multiple terminals 103 are located on different surfaces of the circuit board 101. For example, the heating elements 102a, 102b are located on the upper surface of the circuit board 101, while the multiple terminals are located on the lower surface of the circuit board.

[0042] One embodiment of this utility model provides a dimmer 1. Figure 4 An exploded perspective view of the dimmer 1 is shown. The dimmer 1 includes a wiring device and an adjustment device. The wiring device is the wiring device of any of the above embodiments of the present invention, such as the wiring device 100 including a circuit board assembly 10, a heat dissipation mechanism 20 and a housing 30.

[0043] Figure 4 The dimmer 1 adjusts the luminous flux and illuminance of the lighting device via a rocker mechanism. Specifically, the adjustment mechanism includes a small rocker 90, a large rocker 80, a rocker bracket 70, a pressing circuit board assembly (second circuit board) 60, and a circuit board bracket 50. The small rocker 90 and the large rocker 80 can be assembled into the rocker bracket 70. The user can press the plus and minus symbols on the rocker structure, which presses the circuit board assembly. The pressing circuit board assembly 60 can be snapped into the circuit board bracket 50. The shape of the circuit board bracket 50 matches the housing 30, and the two can be connected by screws. In addition, the grounding wire 40 can be riveted into the heat dissipation mechanism 20.

[0044] It is understood that the structure of the dimmer of this utility model is not limited to... Figure 4 The structure is shown. In other examples, the adjustment device in the dimmer may include any of the following: a rotary lever, a push-pull switch, or a touch device.

[0045] It is worth noting that the wiring device of this invention is not limited to dimmers. In some examples, the wiring device of this invention can also be applied to switches or sockets.

[0046] The above description is merely an optional embodiment of the present utility model and is not intended to limit the embodiments of the present utility model. For those skilled in the art, the embodiments of the present utility model can have various modifications and variations. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of the present utility model should be included in the protection of the embodiments of the present utility model.

[0047] While embodiments of the present invention have been described with reference to several specific examples, it should be understood that the embodiments of the present invention are not limited to the specific embodiments disclosed. The embodiments of the present invention are intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. The scope of the appended claims is to be interpreted in the broadest sense, thereby encompassing all such modifications and equivalent structures and functions.

Claims

1. A wiring device, characterized in that, include: The first circuit board assembly includes a first circuit board on which a plurality of vertically arranged heating elements are provided; A heat dissipation mechanism includes a heat-conducting plate and a heat dissipation plate. The heat-conducting plate extends from the heat dissipation plate and is bent. The heat-conducting plate and the surfaces of the plurality of heating elements are attached to each other. The plurality of heating elements are spaced apart along the length direction of the heat-conducting plate. as well as The housing includes an inner cavity in which the first circuit board assembly and the heat dissipation mechanism are at least partially disposed.

2. The wiring device according to claim 1, characterized in that, The middle portion of the heat sink plate is recessed and has a U-shaped structure, and the ratio of the length of the heat-conducting plate to the length of the middle portion of the heat sink plate is between 7:10 and 9:

10.

3. The wiring device according to claim 1, characterized in that, The heat-conducting plate includes multiple plate-shaped structures, which are arranged corresponding to the positions of the multiple heating elements.

4. The wiring device according to claim 1, characterized in that, The heat-conducting plate is a single plate structure.

5. The wiring device according to claim 1, characterized in that, The plurality of heating elements are located on the same side of the heat-conducting plate.

6. The wiring device according to claim 1, characterized in that, The plurality of heating elements are located on different sides of the heat-conducting plate.

7. The wiring device according to claim 1, characterized in that, A thermally conductive layer is filled between the heat-conducting plate and the plurality of heating elements. The thermally conductive layer includes one or more of thermally conductive grease, thermally conductive gel, and thermally conductive silicone.

8. The wiring device according to claim 1, characterized in that, The side of the housing is provided with heat dissipation holes, and the position of the heat dissipation holes corresponds to the position of the heat conduction plate.

9. The wiring device according to claim 8, characterized in that, The heating element is located between the heat-conducting plate and the side wall of the housing.

10. A dimmer, characterized in that, It includes an adjustment device and a wiring device as described in any one of claims 1 to 9, wherein the adjustment device includes any one of a rocker structure, a rotating torsion bar, a push-pull switch, and a touch device.

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