Corrugated manifold micro-channel cold plate with cold and hot channel shunting function and use method of corrugated manifold micro-channel cold plate

Abstract

The invention discloses a corrugated manifold micro-channel cold plate with a cold and hot channel shunting function and a use method, and belongs to the technical field of semiconductors, the corrugated manifold micro-channel cold plate comprises a shell, heat sinks arranged on opposite surfaces, a cold plate inlet, an inlet manifold, a cold plate outlet, an outlet manifold and a shunting manifold arranged in the shell, the cold plate inlet and the inlet manifold are connected with the shell and are oppositely arranged, and the cold plate outlet and the outlet manifold are connected with the shell and are oppositely arranged. A closed space is formed by the shell, the heat sink, the cold plate inlet and the inlet manifold, and the cold plate outlet and the outlet manifold. In the working process, cooling fluid enters the closed space of the cold plate through the cold plate inlet and the inlet manifold, then the cooling fluid is precisely conveyed to different cooling areas through the flow dividing manifold, independent cold and hot channels are constructed by combining the different cooling areas formed by the heat sink, and the heat exchange process is completed. The invention provides a structural design of separating a cold channel from a hot channel, and overcomes the defects in the prior art.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of semiconductor, and particularly relates to a corrugated manifold micro-channel cold plate with cold and hot channel shunting and a use method. BACKGROUND

[0002] Under the dual waves of global digital transformation and new energy revolution, electronic devices are accelerating towards the direction of integration, miniaturization and high power. This trend directly drives the heat flux density index to rise exponentially. From the core mechanism, the essence of this phenomenon is the intensification of the contradiction between "power density improvement" and "heat dissipation space compression": on the one hand, Moore's Law continues to exert force, and the chip integration doubles every 18-24 months. The power density of high-performance processors is constantly breaking through the upper limit, and the heat dissipation capacity has become a key factor restricting its performance release. On the other hand, the trend of device miniaturization leads to the extreme compression of heat dissipation space. Whether it is a data center server, a vehicle-mounted electric drive module, or an aerospace load and a consumer electronic chip, the heat generation rate per unit area has increased sharply. In some extreme scenarios, the heat flux density has broken through 1000W / cm², and the heat flux density of advanced data center servers has reached more than 500W / cm².

[0003] The manifold micro-channel (MMC) has the advantages of low pressure drop, high heat exchange density, embeddable integration and uniform temperature, which perfectly meets the current industry demand for high heat flux, high energy efficiency and high integration. Therefore, it has broad application prospects in chip liquid cooling, new energy vehicles and other key fields. In the future, with the continuous maturity of MMC manufacturing process and the continuous optimization of system integration scheme, its application scenarios will further expand, providing efficient heat dissipation solutions for more high heat flux scenarios.

[0004] Disadvantages and deficiencies of the prior art: The existing manifold microchannels often adopt high aspect ratio on the side of the channel, the purpose is to obtain the maximum heat dissipation area as much as possible under the limited bottom area, this design can improve the unit volume heat exchange efficiency, but it aggravates the core problem: the mixing phenomenon of cold and hot deionized water in the channel. The flow structure of high aspect ratio channel limits the directional transport of fluid, after the low temperature deionized water enters the channel, it is easy to mix with the high temperature water flow along the wall, which leads to the increase of the average temperature of the cooling fluid contacting the wall, greatly weakens the heat exchange advantage brought by the temperature difference, and the overall cooling efficiency decreases significantly. More importantly, with the increasing demand for energy consumption in data centers and other scenarios, the traditional way of increasing flow to improve cooling effect has been difficult to continue - large flow will lead to a substantial increase in flow pressure drop, and the pump power consumption will increase dramatically, which is contrary to the energy saving demand and the development trend of "low power consumption and high efficiency". At present, many studies adjust the aspect ratio to overcome this difficulty, but low aspect ratio will reduce the overall specific area, thereby reducing the heat flux density. From this point of view, can we solve this problem under the premise of not changing the aspect ratio and reducing the heat exchange surface area, combined with the core demand of "small flow and large temperature difference" for high efficiency and energy saving. Therefore, the structure design of cold and hot channel separation becomes the key to solving the above difficulties. SUMMARY

[0005] The present application provides a wave-shaped manifold microchannel cold plate with cold and hot channel separation and a use method, aiming at overcoming the shortcomings of the prior art In order to achieve the above purpose, the technical scheme is as follows: A wave-shaped manifold microchannel cold plate with cold and hot channel separation, comprising a shell, a heat sink arranged on the opposite side, a cold plate inlet and an inlet manifold and a cold plate outlet and an outlet manifold connected with the shell and arranged oppositely, and a shunt manifold arranged in the shell, the shell, the heat sink, the cold plate inlet and the inlet manifold and the cold plate outlet and the outlet manifold form a closed space.

[0006] The further improvement of the present application is that the shell comprises an upper cover plate, and a front cover plate and a rear cover plate connected with the upper cover plate in the same direction and arranged oppositely.

[0007] The further improvement of the present application is that the heat sink adopts a corrugated channel.

[0008] The further improvement of the present application is that the channel wall thickness of the corrugated channel is 0.5mm-1mm, the channel width is 0.5mm-2mm, and the channel height is 3mm-7mm. By blocking the 0.75 to 2 times period of the sinusoidal function corrugated channel, independent cooling space is divided.

[0009] The further improvement of the present application is that the shunt manifold is divided into two parts, which are the inlet and outlet shunt part and the channel internal blocking shunt part.

[0010] The further improvement of the present application is that the inlet and outlet diversion part is divided into a transverse part and an inclined part, the transverse part coincides with the channel blocking part, and the lower part of the inclined part is connected with the channel inner blocking diversion part.

[0011] The further improvement of the present application is that the channel inner blocking diversion part adopts an array type blocking structure, the distance between two of the array type blocking structures is equal to the distance between the periodic blocking structures, the thickness of the array type blocking structure accounts for 20% of the length of the entire cooling area, the size of the array type blocking structure projected to the width of the channel is consistent with the width of the channel, which ensures that the cooling area is completely separated into two completely independent cold and hot channels, and the extension length accounts for 60%-90% of the height of the entire cooling area.

[0012] The further improvement of the present application is that the inlet and outlet diversion part and the channel inner blocking diversion part of the diversion manifold are integrally completed by 3D printing or machining, and there is no gap.

[0013] The further improvement of the present application is that the diversion manifold has two functions, one is to accurately send the cooling fluid to different cooling areas, and the other is to combine the different cooling areas formed by the heat sink through the extended blocking structure to construct independent cold and hot channels.

[0014] A use method of a corrugated manifold micro-channel cold plate with cold and hot channel diversion, comprising: The cooling fluid enters the closed space of the cold plate through the cold plate inlet and the inlet manifold, then the diversion manifold accurately sends the cooling fluid to different cooling areas, combines the different cooling areas formed by the heat sink to construct independent cold and hot channels, and completes the heat exchange process.

[0015] Compared with the prior art, the present application has at least the following beneficial technical effects: The application proposes to extend downward at the manifold of the manifold microchannel to form a longitudinal partition, which divides the channel into independent cold fluid transport channels and hot fluid discharge channels, and has the following advantages: first, it completely blocks the mixing of cold and hot deionized water, ensures that the low-temperature fluid always contacts the high-heat-flux wall surface at a low temperature, maximizes the heat transfer temperature difference, and still maintains high-efficiency heat exchange under small-flow conditions, avoiding the efficiency decay caused by mixing in traditional structures; second, the independent hot fluid channel can quickly discharge the high-temperature water flow after absorbing heat, avoiding the wall surface temperature rise caused by heat accumulation, while reducing fluid backflow and flow interference, and improving the actual heat transfer temperature difference of the system; third, excellent cooling effect can be achieved without relying on large flow, greatly reducing pump power consumption, perfectly meeting the small pressure drop and low energy consumption requirements of data centers and other scenes, and further improving the performance coefficient (COP) of the cooling system; fourth, the high specific surface area advantage of the high aspect ratio structure is retained, and the inherent mixing defect is solved by channel separation, realizing the synergistic optimization of "high specific surface area-low mixing-low energy consumption". BRIEF DESCRIPTION OF DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the specific embodiments or prior art of the present application, the drawings needed in the specific embodiments or prior art description will be briefly introduced as follows. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0017] Figure 1 is a structural schematic diagram of the present application; Figure 2 is an enlarged view of the front view of the heat sink; Figure 3 is an enlarged view of the axis measurement of the flow distribution manifold; Figure 4 is a temperature cloud map and a velocity vector partial enlarged view of the cross section of the traditional wave-shaped microchannel without the blocking flow distribution structure, wherein Figure 4 (a) is a local temperature cloud map and a velocity vector diagram in the channel of the conventional structure, Figure 4 (b) is a temperature cloud map of a typical channel cross section of the conventional structure; Figure 5 is a temperature cloud map and a velocity vector partial enlarged view of the cross section of the wave-shaped microchannel with the blocking flow distribution structure, wherein Figure 5 (a) is a local temperature cloud map and a velocity vector diagram in the channel of the present application, Figure 5 (b) is a temperature cloud map of a typical channel cross section of the present application; Figure 6 is a temperature cloud map of the microchannel side wall surface at the same position.

[0018] BRIEF DESCRIPTION OF DRAWINGS: 1, cold plate inlet and inlet manifold; 2, front cover plate; 3, split manifold; 4, heat sink; 5, cold plate outlet and outlet manifold; 6, rear cover plate; 7, upper cover plate. DETAILED DESCRIPTION

[0019] Hereinafter, only certain exemplary embodiments are simply described. As those skilled in the art can recognize, the described embodiments can be modified in various different ways without departing from the spirit or scope of the present application. Therefore, the drawings and description are considered to be exemplary in nature rather than limiting.

[0020] In the description of the present application, it needs to be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0021] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise explicitly specified and limited.

[0022] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection", "fixing" and the like should be broadly understood, for example, it can be fixed connection, or detachable connection, or integral; it can be mechanical connection, or electrical connection, or communication; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0023] In the present application, unless otherwise explicitly specified and limited, "on" or "under" of a first feature to a second feature can include that the first and second features are in direct contact, or can include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "over" of a first feature to a second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the first feature is horizontally higher than the second feature. "Under", "below" and "underneath" of a first feature to a second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the first feature is horizontally lower than the second feature.

[0024] It should be understood that the terms used in the specification of the present application are only for the purpose of describing specific embodiments and are not intended to limit the present application. As used in the specification and the appended claims of the present application, unless otherwise clearly indicated by the context, the singular forms "a", "an" and "the" are intended to include the plural forms as well.

[0025] It should be further understood that the term "and / or" used in the specification and the appended claims of the present application means any combination of one or more of the associated listed items and all possible combinations thereof, and includes these combinations.

[0026] Various structural diagrams according to the disclosed embodiments of the present application are shown in the accompanying drawings. These drawings are not drawn to scale, in which certain details are exaggerated for the purpose of clear expression, and certain details can be omitted. The shapes of various regions, layers and their relative sizes and positional relationships shown in the drawings are only exemplary, and in actuality can be deviated due to manufacturing tolerances or technical limitations, and regions / layers with different shapes, sizes and relative positions can be additionally designed by those skilled in the art according to actual needs.

[0027] The embodiments of the present application are described in detail below in conjunction with the accompanying drawings.

[0028] Embodiment 1 As Figure 1 shown, the present application provides a corrugated manifold micro-channel cold plate with cold and hot channel shunting, which comprises a shell, a heat sink 4 arranged on the opposite side, a cold plate inlet and an inlet manifold 1 and a cold plate outlet and an outlet manifold 5 connected with the shell and arranged oppositely, and a shunting manifold 3 arranged in the shell, the shell, the heat sink 4, the cold plate inlet and the inlet manifold 1 and the cold plate outlet and the outlet manifold 5 constitute a closed space.

[0029] In this embodiment, the shell comprises an upper cover plate 7, and a front cover plate 2 and a rear cover plate 6 connected vertically in the same direction with the upper cover plate 7 and arranged oppositely.

[0030] In the embodiment, the heat sink 4 adopts a corrugated channel.

[0031] In the embodiment, the channel wall thickness of the corrugated channel is 0.5-1 mm, the channel width is 0.5-2 mm, and the channel height is 3-7 mm. By blocking the corrugated channel for 0.75-2 times of the period, independent cooling spaces are divided, which can effectively reduce the resistance loss (pressure drop) by reducing the length of the entire fluid flow path.

[0032] In the embodiment, the flow distribution manifold 3 is divided into two parts, namely an inlet and outlet flow distribution part and an in-channel blocking flow distribution part.

[0033] In the embodiment, the inlet and outlet flow distribution part is divided into a horizontal part and an inclined part, and the horizontal part coincides with the channel blocking part, and the inclined part is connected to the in-channel blocking flow distribution part.

[0034] In the embodiment, the in-channel blocking flow distribution part adopts an array type blocking structure, the distance between two blocking structures is equal to the distance between the periodic blocking structures, the thickness of the blocking structure accounts for 20% of the length of the entire cooling area, the projection of the blocking structure to the channel width is consistent with the channel width, and the cooling area is completely separated into two completely independent cold and hot channels, and the extension length accounts for 60-90% of the height of the entire cooling area. The purpose is to reduce the mixing of fluid in the narrow channel. If the extension length is too small, the mixing degree is still high.

[0035] In the embodiment, the inlet and outlet flow distribution part and the in-channel blocking flow distribution part of the flow distribution manifold 3 are integrally completed by 3D printing or machining, without gaps.

[0036] In the embodiment, the flow distribution manifold 3 has two functions, one is to accurately send the cooling fluid to different cooling areas, and the other is to construct independent cold and hot channels by the blocking structure extending from the flow distribution manifold 3 and the different cooling areas formed by the heat sink 4.

[0037] Embodiment 2 As shown in Figure 1 The application provides a use method of a corrugated manifold micro-channel cold plate with cold and hot channel flow distribution, which comprises the following steps: The cooling fluid enters the closed space of the cold plate through the cold plate inlet and the inlet manifold 1, and then the flow distribution manifold 3 accurately sends the cooling fluid to different cooling areas, and constructs independent cold and hot channels by combining the different cooling areas formed by the heat sink 4, to complete the heat exchange process.

[0038] Embodiment 3 As shown in Figure 1As shown, the present application provides a corrugated manifold micro-channel cold plate with cold and hot channel shunting, which is composed of a cold plate inlet and an inlet manifold 1, a cold plate outlet and an outlet manifold 5, a heat sink 4 and a shunt manifold 3, and a front cover plate 2 and a rear cover plate 6, and an upper cover plate 7, wherein the heat sink 4 adopts a corrugated channel, and an independent cooling space is divided by blocking every few periods, such as Figure 2 As shown, the enlarged front view of the heat sink shows that the independent cooling area and the periodic blocking structure can be clearly seen. Figure 3 The partial enlarged axonometric view of the shunt manifold shows that the inlet and outlet shunt parts, the transverse part, the inclined part, and the channel blocking shunt part can be clearly seen, Figure 4 And Figure 5 The simulation results of the present application and the traditional wave-shaped manifold micro-channel cold plate under the conditions of an inlet temperature of 289.15K, an inlet flow rate of 1.87m / s, and a chip heat flux of 250W / cm² using Fluent2023R1 are compared. From the temperature cloud map, the present application effectively suppresses the mixing inside the channel. From the local velocity vector diagram, the backflow and local turbulence in the flow field are significantly improved. The highest temperature and temperature difference are shown in Table 1. Compared with the traditional wave-shaped manifold micro-channel, the maximum temperature difference of the present application decreases by 5.908K, which is 8.1%, and the pressure drop decreases by 6.3%. Table 2 shows the lowest pressure drop under the conditions of a heat flux of 250W / cm², an inlet temperature of 289.15K, and a bottom plate maximum temperature of about 358.15K. Compared with the traditional cold plate, the present application reduces the pressure drop by 61.09%. Figure 6 Then, in order to illustrate that the increased surface area does not effectively participate in heat exchange, the effect is to reduce fluid mixing.

[0039] The different structures of the present application can be connected by welding.

[0040] Table 1 compares the effects of the present application and the traditional wave-shaped manifold micro-channel:

[0041] Table 2 shows the lowest pressure drop under the conditions of a heat flux of 250W / cm², an inlet temperature of 289.15K, and a bottom plate maximum temperature of about 358.15K:

[0042] In summary, the application ensures that the low-temperature cooling fluid always contacts the high-heat-flux wall surface at a lower temperature by separating the channels into independent cold fluid transport channels and hot fluid discharge channels at the manifold, maintaining the maximum heat transfer temperature difference. This allows high-efficiency heat exchange to be maintained under small flow conditions, avoiding the heat transfer efficiency decay caused by cold and hot mixing in traditional structures. The independent hot fluid channel can quickly discharge the high-temperature fluid after absorbing heat, preventing heat accumulation near the wall and reducing the risk of wall temperature rising. At the same time, fluid backflow and flow interference are reduced, further improving the actual heat transfer temperature difference. The application can achieve excellent cooling effect with large flow, significantly reducing the required pumping power of the system. This feature is particularly suitable for data centers and other sensitive scenarios, helping to improve the performance coefficient (COP) of the cooling system and achieve energy-saving operation. The application retains the high specific surface area advantage of high aspect ratio microchannels, while overcoming the fluid mixing problem that easily occurs in traditional high aspect ratio channels through cold and hot channel separation, achieving "high specific surface area low mixing low energy consumption", multiple performance optimization, improving overall cooling efficiency and system reliability.

[0043] The application points protected by the application are: 1. Periodic blocking structures are arranged at certain distances in the channels, and separate cooling areas are divided between the two blocking structures.

[0044] 2. The blocking structure is formed by extending the shunt manifold next to the channel side downward, and the cold and hot channels are formed in different cooling areas by combining the blocking structure in the channel and the blocking structure on the manifold side.

[0045] 3. The inlet and outlet manifolds are arranged flat, which can ensure that the middle area obtains more flow distribution and the heat accumulation area can obtain better cooling effect.

[0046] 4. All structures are assembled by front and rear cover plates and upper cover plates, and the gap is connected by welding.

[0047] The above shows and describes the basic principles and main features of the application and the advantages of the application. For those skilled in the art, it is obvious that the application is not limited to the details of the above exemplary embodiments, and the application can be implemented in other specific forms without departing from the spirit or essential characteristics of the application. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting, and the scope of the application is defined by the appended claims rather than the above description, and therefore all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be included in the application. Any reference signs in the claims should not be considered as limiting the claims involved.

[0048] Furthermore, it should be understood that although the specification is described in terms of embodiments, each of which contains only one independent technical solution, the specification is described in this way only for the sake of clarity, and the skilled person should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that the skilled person can understand. The above is only to illustrate the technical idea of the present application, and cannot limit the protection scope of the present application. Any modification made on the basis of the technical solutions according to the technical idea of the present application falls within the protection scope of the claims of the present application.

Claims

1. A corrugated manifold microchannel cold plate with hot and cold channel diversion, characterized in that, The enclosure includes a housing, a heat sink (4) located on opposite sides, a cold plate inlet and inlet manifold (1) and a cold plate outlet and outlet manifold (5) connected to and located opposite to the housing, and a branch manifold (3) located inside the housing. The housing, heat sink (4), cold plate inlet and inlet manifold (1) and cold plate outlet and outlet manifold (5) together form a sealed space.

2. The corrugated manifold microchannel cold plate with hot and cold channel diversion according to claim 1, characterized in that, The housing includes an upper cover plate (7), and a front cover plate (2) and a rear cover plate (6) that are perpendicularly connected to the upper cover plate (7) in the same direction and disposed opposite to each other.

3. The corrugated manifold microchannel cold plate with hot and cold channel diversion according to claim 1, characterized in that, The heat sink (4) adopts a corrugated channel.

4. A corrugated manifold microchannel cold plate with hot and cold channel diversion according to claim 3, characterized in that, The corrugated channel has a wall thickness of 0.5mm-1mm, a channel width of 0.5mm-2mm, and a channel height of 3mm-7mm. By designing a blocking effect of 0.75 to 2 times the period for the sinusoidal corrugated channel, an independent cooling space is created.

5. A corrugated manifold microchannel cold plate with hot and cold channel diversion according to claim 1, characterized in that, The diversion manifold (3) is divided into two parts: the inlet and outlet diversion part and the channel obstruction diversion part.

6. A corrugated manifold microchannel cold plate with hot and cold channel diversion according to claim 5, characterized in that, The inlet and outlet diversion section is divided into a horizontal section and an oblique section. The horizontal section overlaps with the channel blocking section, and the lower part of the oblique section is connected to the channel blocking diversion section.

7. A corrugated manifold microchannel cold plate with hot and cold channel diversion according to claim 5, characterized in that, The channel's flow-diverting section adopts an array-type blocking structure, with the distance between each pair equal to the distance between the periodic blocking sections. Its thickness accounts for 20% of the entire cooling area's length, and the dimension between its projection onto the channel width is consistent with the channel width, ensuring that the cooling area is completely separated into two completely independent hot and cold channels. The extension length is 60%-90% of the entire cooling area's height.

8. A corrugated manifold microchannel cold plate with hot and cold channel diversion according to claim 5, characterized in that, The inlet and outlet diversion parts and the obstruction diversion parts inside the channel of the diversion manifold (3) are completed in one piece by 3D printing or machining, without gaps.

9. A corrugated manifold microchannel cold plate with hot and cold channel diversion according to claim 5, characterized in that, The manifold (3) has two functions: first, to accurately deliver the cooling fluid to different cooling areas; and second, to construct independent hot and cold channels by combining the different cooling areas formed by the heat sink (4) through its extended blocking structure.

10. A method of using a corrugated manifold microchannel cold plate with hot and cold channel diversion as described in any one of claims 1 to 9, characterized in that, include: Cooling fluid enters the sealed space of the cold plate through the cold plate inlet and the inlet manifold (1). Then, the branch manifold (3) accurately delivers the cooling fluid to different cooling areas and, together with the heat sink (4), forms different cooling areas to construct independent hot and cold channels and complete the heat exchange process.

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