Full-chip built-in COB (Chip On Board) colorful lamp band

Abstract

The utility model provides a full-chip built-in COB (Chip On Board) fantastic color lamp band, which comprises a band-shaped substrate, the substrate is provided with a first outer surface, a plurality of LED chips are arranged on the first outer surface at intervals along the linear direction, and a bare chip is arranged on one side of each LED chip; a packaging adhesive tape is arranged on the first outer surface in an extending mode in the linear direction, and the LED chip and the bare chip are both arranged in the packaging adhesive tape. The bare chip is directly mounted on the substrate, or the bare chip is indirectly mounted on the substrate through a chip bracket; according to the full-chip built-in COB fantasy color lamp band provided by the utility model, the defects that the chip of the existing COB fantasy color lamp band is externally arranged, so that the COB fantasy color lamp band is easy to oxidize and fall off are overcome.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of lamp strip, especially a full-chip built-in COB color-changing lamp strip. BACKGROUND

[0002] The COB color-changing lamp strip is a strip-shaped lamp body, which is widely used in the decorative lighting market, such as signboards, subtitle advertisements, building contour sketching, indoor ceiling lighting, and car body interior decoration.

[0003] Referring to Figure 1 As shown in the figure, the COB color-changing lamp strip generally includes a strip-shaped circuit board, a plurality of LED chips arranged at intervals along the extension direction of the substrate, and a glue strip for packaging the LED chips. The LED chips are used for light emission. The substrate is installed with a chip on one side of the glue strip. The chip is located outside the glue strip. The chip is used for driving control of the LED chips. The chip is installed with a resistor around it. In the above structure, the chip is externally placed. The pins of the chip are directly in contact with air, which is easy to cause oxidation, and the service life is relatively short. When installing the lamp strip, such as installing it into the gap of a car as an atmosphere lamp, the chip is easy to be touched, increasing the risk of chip falling off and shortening the service life. SUMMARY

[0004] (I) Technical problem to be solved

[0005] The problem to be solved by the utility model is to provide a full-chip built-in COB color-changing lamp strip to overcome the defects of easy oxidation and easy falling off caused by the external placement of the chip of the existing COB color-changing lamp strip.

[0006] (II) Technical scheme

[0007] To solve the technical problem, the utility model provides a full-chip built-in COB color-changing lamp strip, which includes a strip-shaped substrate. The substrate has a first outer surface. A plurality of LED chips are arranged at intervals along the straight line direction on the first outer surface. A bare chip is arranged on one side of the LED chip. A packaging glue strip is arranged along the straight line direction on the first outer surface. The LED chip and the bare chip are built-in in the packaging glue strip. The bare chip is directly installed on the substrate, or the bare chip is indirectly installed on the substrate through a chip support.

[0008] In some embodiments, the bare chip is a flip chip. The flip chip is directly installed on the substrate by using a flip technology.

[0009] In some embodiments, the bare chip is mounted on the chip support, and the chip support is provided with a plurality of pins at two sides thereof; the substrate is provided with connecting portions at two sides of the chip support, and the connecting portions are provided with soldering plates corresponding to the pins; the chip support is used to increase the distance between two adjacent soldering plates so as to reduce the processing difficulty.

[0010] In some embodiments, the first outer surface is provided with a side light emitting structure for enabling the encapsulation strip to emit light from the side, the side light emitting structure comprising a light shielding strip attached to the outer surface of the encapsulation strip, one side or both sides of the light shielding strip being provided with a light emitting gap, the light shielding strip being used to block the front light emission of the encapsulation strip and enable the encapsulation strip to emit light from the side only through the light emitting gap.

[0011] In some embodiments, the light shielding strip is L-shaped, comprising a front light shielding portion attached to the front surface of the encapsulation strip and a side light shielding portion attached to one side surface of the encapsulation strip, the end of the side light shielding portion being connected to the first outer surface; the side light shielding portion is located at one side of the front light shielding portion, and the light emitting gap is located at the other side of the front light shielding portion, and the encapsulation strip emits light from one side only.

[0012] In some embodiments, the bare chip comprises data shaping and processing circuit, addressing control circuit, photosensitive signal extraction and processing circuit, RGB driving circuit, data input port DIN, data output port DOUT, and RGB driving output port R / G / B.

[0013] In some embodiments, the bare chip comprises data shaping and processing circuit, addressing control circuit, photosensitive signal extraction and processing circuit, RGB driving circuit, data input port DIN, data output port DOUT, and RGB driving output port R - / G + / G - / B + / B - .

[0014] The full-chip built-in COB color-changing lamp strip as claimed in any one of the preceding claims, wherein the bare chip further comprises a ground port GND and a power supply port VDD.

[0015] In some embodiments, one side of the bare chip is provided with a resistor, and the resistor is built in the encapsulation strip; the substrate is an FPC substrate.

[0016] In some embodiments, the substrate further has a second outer surface opposite to the first outer surface, and the second outer surface is provided with an adhesive layer, and the adhesive layer is attached with a release paper.

[0017] (III) Beneficial Effects

[0018] The full-chip built-in COB color-changing lamp strip provided by the utility model places the bare chip inside the packaging adhesive tape, the packaging adhesive tape can well protect the bare chip, prevents the bare chip from directly contacting with air, avoids oxidation, and prolongs service life; when the lamp strip is installed, the packaging adhesive tape can protect the bare chip, prevents the bare chip from being bumped, and eliminates the risk of falling off of the bare chip; after the chip is built in, the substrate looks more beautiful and neat; and the bare chip removes the chip shell, black spots do not occur, and use effect is good; the defects of easy oxidation and easy falling off caused by the external chip of the existing COB color-changing lamp strip are overcome. BRIEF DESCRIPTION OF DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0020] Figure 1 It is a structural schematic diagram of the COB color-changing lamp strip in the prior art;

[0021] Figure 2 It is a structural schematic diagram of the full-chip built-in COB color-changing lamp strip of the utility model, in which the bare chip is directly installed on the substrate;

[0022] Figure 3 It is a structural schematic diagram of the full-chip built-in COB color-changing lamp strip of the utility model, in which the bare chip is installed on the substrate through the chip support;

[0023] Figure 4 It is a structural schematic diagram of the full-chip built-in COB color-changing lamp strip of the utility model, in which the bare chip, the chip support and the substrate are connected;

[0024] Figure 5 It is a structural schematic diagram of the full-chip built-in COB color-changing lamp strip of the utility model;

[0025] Figure 6 It is a perspective view of the full-chip built-in COB color-changing lamp strip of the utility model, in which the side light-emitting structure emits light on one side;

[0026] Figure 7 It is a perspective view of the full-chip built-in COB color-changing lamp strip of the utility model, in which the light-shielding strip is shown;

[0027] Figure 8 It is a perspective view of the full-chip built-in COB color-changing lamp strip of the utility model, in which the side light-emitting structure emits light on two sides;

[0028] Figure 9 This is a schematic diagram of the bare chip structure of a fully integrated COB RGB LED strip according to this utility model;

[0029] Figure 10 This is a schematic diagram of the bare chip port of a fully integrated COB RGB LED strip according to this utility model;

[0030] Figure 11 This is a schematic diagram of the bare chip structure of another embodiment of the fully chip-embedded COB RGB LED strip of this utility model;

[0031] Figure 12 This is a schematic diagram of the bare chip port structure of another embodiment of the fully chip-embedded COB RGB LED strip of this utility model;

[0032] The component names corresponding to the various reference numerals in the figure are as follows: 1. Substrate; 101. First outer surface; 102. Second outer surface; 103. Connecting part; 104. Solder plate; 2. LED chip; 3. Bare chip; 4. Encapsulation strip; 5. Chip bracket; 501. Lead; 6. Light-shielding strip; 601. Light-emitting notch; 602. Front light-shielding part; 603. Side light-shielding part; 7. Resistor; 8. Release paper. Detailed Implementation

[0033] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments.

[0034] The following specific examples illustrate the implementation of this application. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. This application can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, in the absence of conflict, the following embodiments and features in the embodiments can be combined with each other. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0035] It should be noted that various aspects of embodiments within the scope of the appended claims are described below. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number and aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.

[0036] It should also be noted that the illustrations provided in the following embodiments are only schematic representations of the basic concept of this application. The illustrations only show the components related to this application and are not drawn according to the number, shape and size of the components in actual implementation. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the layout of the components may also be more complex.

[0037] Additionally, specific details are provided in the following description to facilitate a thorough understanding of the examples. However, those skilled in the art will understand that practice can be carried out without these specific details.

[0038] The technical solutions provided by the various embodiments of this application are described below with reference to the accompanying drawings.

[0039] See Figures 2 to 12 This invention provides a fully integrated COB (Chip-on-Board) RGB LED strip, comprising a strip-shaped substrate 1. The substrate 1 has a first outer surface 101, on which a plurality of LED chips 2 are spaced apart along a straight line. A bare chip 3 is disposed on one side of each LED chip 2; the bare chip 3 is the portion without a chip housing and is used to drive and control the LED chips 2. An encapsulation strip 4 extends along a straight line on the first outer surface 101, and both the LED chips 2 and the bare chip 3 are embedded within the encapsulation strip 4. The encapsulation strip 4 is made of a transparent or semi-transparent material to allow light emitted by the LED chips 2 to pass through. The bare chip 3 is directly mounted on the substrate 1, or indirectly mounted on the substrate 1 via a chip support 5. This structure embeds the bare chip within a sealing strip, which effectively protects the chip, preventing direct contact with air, oxidation, and extending its lifespan. During LED strip installation, the sealing strip protects the chip from impacts, eliminating the risk of chip detachment. The embedded chip also makes the substrate look cleaner and more aesthetically pleasing. Furthermore, by using a bare chip and eliminating the need for a chip casing, black spots are avoided (as would occur if the chip casing were directly embedded), resulting in superior performance.

[0040] In some embodiments, such asFigure 2 As shown, bare chip 3 is a flip chip, which is directly mounted on substrate 1 using a flip-chip process. This direct mounting method simplifies the overall structure.

[0041] In some embodiments, such as Figure 3 and Figure 4 As shown, the bare chip 3 is mounted indirectly. The bare chip 3 is mounted on a chip carrier 5, and multiple pins 501 are spaced apart on both sides of the chip carrier 5. The substrate 1 has connecting portions 103 on both sides of the chip carrier 5, and solder plates 104 corresponding to the pins 501 are provided on the connecting portions 103. The chip carrier 5 is used to increase the spacing between two adjacent solder plates 104, thereby reducing the processing difficulty. The flip-chip process structure is relatively simple, but it requires extremely high processing accuracy and has a high cost of processing equipment. In this structure, by adding a chip carrier 5 for connection, the chip carrier 5 can increase the spacing between two adjacent pins 501, thereby increasing the spacing between two adjacent solder plates 104 on the substrate 1, thus reducing the processing accuracy requirement and saving manufacturing costs.

[0042] In some embodiments, such as Figure 5 As shown, a plurality of LED chips 2 are spaced apart along the length of the substrate 1, and a bare chip 3 is located on one side of the LED chip 2 and is on the same straight line as the plurality of LED chips 2. An encapsulating strip 4 is encapsulated on the LED chip and the bare chip 3.

[0043] In some embodiments, such as Figure 6 and Figure 7 As shown, a side-emitting structure is provided on the first outer surface 101 for enabling the encapsulation strip 4 to emit light from the side. The side-emitting structure includes a light-shielding strip 6 attached to the outer surface of the encapsulation strip 4. A light-emitting notch 601 is provided on one or both sides of the light-shielding strip 6. The light-shielding strip 6 is used to block the front light emission of the encapsulation strip 4 and make the encapsulation strip 4 emit light from the side only through the light-emitting notch 601.

[0044] Preferably, the light-shielding strip 6 is L-shaped, including a front light-shielding portion 602 attached to the front of the encapsulating strip 4 and a side light-shielding portion 603 attached to one side of the encapsulating strip 4. The end of the side light-shielding portion 603 is connected to the first outer surface 101. The side light-shielding portion 603 is located on one side of the front light-shielding portion 602, and the light-emitting notch 601 is located on the other side of the front light-shielding portion 602, allowing the encapsulating strip 4 to emit light from one side. The front light-shielding portion 602 and the side light-shielding portion 603 are an integral structure and can be manufactured using a dammed adhesive. This structure, by setting the light-shielding strip, enables the encapsulating strip 4 to emit light from one side, making it suitable for automotive ambient lighting installation scenarios with good performance.

[0045] In some embodiments, such as Figure 8As shown, the light-shielding strip 6 only blocks the front of the encapsulation strip 4, which enables the encapsulation strip 4 to emit light from both sides.

[0046] In some embodiments, such as Figure 9 and Figure 10 As shown, bare chip 3 includes a data shaping and processing circuit, an addressing control circuit, a photosensitive signal extraction and processing circuit, an RGB driving circuit, a data input port DIN, a data output port DOUT, and three output ports R / G / B for RGB driving. Bare chip 3 also includes a ground port GND and a power supply port VDD. Specifically, port R functions as a constant current drive output, serving as the negative terminal for the red LED; port G functions as a constant current drive output, serving as the negative terminal for the green LED; and port B functions as a constant current drive output, serving as the negative terminal for the blue LED. The operating voltage of bare chip 3 is 5V. In this embodiment, bare chip 3 uses the driver chip from patent number CN216852429U (patent name: A parallel communication LED driving system and driver chip). The specific structure of the driver chip will not be described in detail in this embodiment.

[0047] In some embodiments, such as Figure 11 and Figure 12 As shown, bare chip 3 includes a data shaping and processing circuit, an addressing control circuit, a photosensitive signal extraction and processing circuit, an RGB driver circuit, a data input port DIN, a data output port DOUT, and an RGB driver output port R. - / G + / G - / B + / B - Bare chip 3 also includes a ground port GND and a power port VDD. Among them, R... - The port functions as a constant current drive output, with the red LED at the negative terminal; G + The port functions as a constant current drive output, with the green light indicating positive; G - The port's function is constant current drive output, with the green light at the negative terminal; B + The port's function is constant current drive output, with the blue LED at the positive terminal; B - The port functions as a constant current drive output, with the blue LED as the negative terminal; the operating voltage of bare chip 3 is 9V to 14V, preferably 12V.

[0048] The difference between this embodiment and the 5V bare chip 3 lies in the number of RGB driver output ports and the voltage used. It should be noted that although this invention only provides two embodiments of the bare chip 3 using two voltages (5V and 12V), other voltages such as 24V and 220V should also be within the scope of protection of this application.

[0049] In some embodiments, such as Figure 2 and Figure 3As shown, a resistor 7 is provided on one side of the bare chip 3, and the resistor 7 is built into the encapsulation strip 4; the substrate 1 is an FPC substrate (flexible circuit board).

[0050] In some embodiments, such as Figure 6 As shown, the substrate 1 also has a second outer surface 102 opposite to the first outer surface 101. An adhesive layer is disposed on the second outer surface 102, and release paper 8 is adhered to the adhesive layer. After the release paper is removed, the flexible light strip can be fixed to an external object through the adhesive layer, which facilitates fixing and installation.

[0051] The same or similar parts between the various embodiments in this specification can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments.

[0052] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A fully chip-embedded COB RGB LED strip, characterized in that: The substrate (1) is in the shape of a strip. The substrate (1) has a first outer surface (101). A plurality of LED chips (2) are spaced apart on the first outer surface (101) along a straight direction. A bare chip (3) is disposed on one side of the LED chip (2). An encapsulation strip (4) extends on the first outer surface (101) along a straight direction. The LED chip (2) and the bare chip (3) are both built into the encapsulation strip (4). The bare chip (3) is directly mounted on the substrate (1) or indirectly mounted on the substrate (1) through a chip holder (5).

2. The fully chip-embedded COB RGB LED strip as described in claim 1, characterized in that: The bare chip (3) is a flip chip, which is directly mounted on the substrate (1) using a flip chip process.

3. The fully chip-embedded COB RGB LED strip as described in claim 1, characterized in that: The bare chip (3) is mounted on the chip holder (5), and multiple pins (501) are arranged at intervals on both sides of the chip holder (5); the substrate (1) is provided with connecting parts (103) on both sides of the chip holder (5), and the connecting parts (103) are provided with solder plates (104) corresponding to the pins (501); the chip holder (5) is used to increase the spacing between two adjacent solder plates (104) to reduce the processing difficulty.

4. The fully chip-embedded COB RGB LED strip as described in claim 1, characterized in that: The first outer surface (101) is provided with a side-emitting structure for enabling the encapsulation strip (4) to emit light from the side. The side-emitting structure includes a light-shielding strip (6) attached to the outer surface of the encapsulation strip (4). The light-shielding strip (6) has a light-emitting notch (601) on one or both sides. The light-shielding strip (6) is used to block the front light emission of the encapsulation strip (4) and make the encapsulation strip (4) emit light from the side only through the light-emitting notch (601).

5. The fully chip-embedded COB RGB LED strip as described in claim 4, characterized in that: The light-shielding strip (6) is L-shaped and includes a front light-shielding part (602) attached to the front of the encapsulation strip (4) and a side light-shielding part (603) attached to one side of the encapsulation strip (4). The end of the side light-shielding part (603) is connected to the first outer surface (101). The side light-shielding part (603) is located on one side of the front light-shielding part (602), and the light-emitting notch (601) is located on the other side of the front light-shielding part (602). The encapsulation strip (4) emits light from one side.

6. The fully chip-embedded COB RGB LED strip as described in claim 1, characterized in that: The bare chip (3) includes a data shaping and processing circuit, an addressing control circuit, a photosensitive signal extraction and processing circuit, an RGB driving circuit, a data input port DIN, a data output port DOUT, and three output ports R / G / B for RGB driving.

7. The fully chip-embedded COB RGB LED strip as described in claim 1, characterized in that: The bare chip (3) includes a data shaping and processing circuit, an addressing control circuit, a photosensitive signal extraction and processing circuit, an RGB driving circuit, a data input port DIN, a data output port DOUT, and an RGB driving output port R. - / G + / G - / B + / B - .

8. The fully chip-embedded COB RGB LED strip as described in claim 6 or 7, characterized in that: The bare chip (3) also includes a ground port GND and a power port VDD.

9. The fully chip-embedded COB RGB LED strip as described in claim 1, characterized in that: A resistor (7) is provided on one side of the bare chip (3), and the resistor (7) is built into the encapsulation strip (4); the substrate (1) is an FPC substrate.

10. The fully chip-embedded COB RGB LED strip as described in claim 1, characterized in that: The substrate (1) also has a second outer surface (102) opposite to the first outer surface (101), and an adhesive layer is disposed on the second outer surface (102), on which release paper (8) is attached.

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