Sensor module

Abstract

The utility model provides a sensor module, which comprises a mounting seat, a circuit board, a plurality of pressure sensors and a cover plate assembly, and is characterized in that the mounting seat is provided with a plurality of first mounting grooves which are not communicated with each other; the pressure sensor comprises a contact and a sensing element, the sensing element is fixed in the first mounting groove and electrically connected with the circuit board, the contact is arranged on the side, away from the circuit board in the first direction, of the sensing element, and the circuit board is provided with an output interface; and the cover plate assembly is connected with the mounting seat, the circuit board and the plurality of pressure sensors so as to package the plurality of pressure sensors, the mounting seat and the circuit board into a whole. The sensor module provided by the utility model can measure the pressure distribution of a plurality of measuring points simultaneously or respectively, provides more comprehensive pressure information, can form a standard component, and can be used as a standard component, and a user only needs to install the sensor module to a measured object and connect the output interface with external equipment, so that the pressure distribution of the measured object can be measured. Therefore, the pressure change data can be quickly obtained, and the complexity of system integration is reduced.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a sensor module. Background Technology

[0002] In related technologies, the detection range of a single pressure sensor is limited, and it is easily affected by external environmental interference, resulting in limited accuracy and stability, making it difficult to meet the needs of complex application scenarios. Utility Model Content

[0003] In view of this, the present application aims to provide a sensor module that integrates multiple pressure sensors and circuit boards into one unit, which can be installed and measured as a whole module with low assembly difficulty and can meet the measurement needs of multiple measurement points.

[0004] This application provides a sensor module, including:

[0005] The mounting base is provided with multiple non-interconnected first mounting slots;

[0006] The device includes a circuit board and multiple pressure sensors. The circuit board is disposed on one side of the mounting base along a first direction. Each pressure sensor includes a contact and a sensing element. The sensing element is fixed in the first mounting groove and electrically connected to the circuit board. The contact is disposed on the side of the sensing element away from the circuit board along the first direction and is used to transmit pressure to the sensing element. The circuit board has an output interface for connecting to an external device.

[0007] A cover plate assembly is disposed between the mounting base on the other side along the first direction and the circuit board. The cover plate assembly is connected to the mounting base, the circuit board, and the plurality of pressure sensors to encapsulate the plurality of pressure sensors, the mounting base, and the circuit board into a single unit.

[0008] The output interface is exposed on the outer surface of the sensor module, and the contacts are also exposed on the outer surface of the sensor module.

[0009] In some implementations, the sensor module includes a connector that connects the cover plate assembly, the circuit board, and the mounting base.

[0010] In some embodiments, there are multiple connectors, each connector including a first connecting portion and a second connecting portion, with the circuit board, the mounting base, and the cover plate assembly located between the first connecting portion and the second connecting portion.

[0011] In some embodiments, the cover assembly includes a first cover and a second cover, the first cover being disposed on the side of the circuit board away from the pressure sensor along the first direction, the second cover being disposed on the other side of the mounting base along the first direction, and the contact passing through and protruding from the second cover on the side of the mounting base away from the first direction.

[0012] In some implementations, the first cover plate and the second cover plate are separate structures; and / or, the first cover plate is provided with a clearance notch, through which the output interface is exposed on the outer surface of the sensor module.

[0013] In some embodiments, the pressure sensor includes a conductive spring, one end of which abuts against the sensing element and the other end against the circuit board to form a first electrode;

[0014] The mounting base is a metal part, and the sensing element abuts against the wall of the first mounting groove to form a second electrode.

[0015] In some implementations, the mounting base is provided with a plurality of non-communicating second mounting slots, and each of the first mounting slots and each of the second mounting slots corresponds one-to-one along the first direction. The pressure sensor includes an elastic element disposed in the second mounting slot, one end of the elastic element abutting against the contact, and the other end directly or indirectly abutting against the sensing element.

[0016] In some implementations, the first mounting slot and the second mounting slot are interconnected, or the mounting base is provided with a partition wall that separates the first mounting slot and the second mounting slot, and the pressure of the contact is transmitted to the sensing element through the elastic element and the partition wall;

[0017] And / or, the pressure sensor includes a gasket, and the two ends of the elastic element abut against the gasket and the contact, respectively.

[0018] In some embodiments, the cover plate assembly is provided with a through hole communicating with the second mounting groove, and the contact includes a first segment and a second segment. The first segment is disposed in the second mounting groove, and the second segment passes through and protrudes from the through hole. The dimension of the first segment at the junction of the second mounting groove and the through hole is larger than the diameter of the through hole.

[0019] In some implementations, the sensor module includes a seal disposed between the mounting base and the circuit board.

[0020] The sensor module provided in this application embodiment, with its multiple pressure sensors, can simultaneously or separately measure the pressure distribution at multiple measurement points, providing comprehensive pressure information. The multiple pressure sensors are not interconnected; if one pressure sensor fails, the others can still function normally, ensuring high system reliability. Furthermore, the cover plate assembly, circuit board, mounting base, and connections of the multiple pressure sensors are integrated, making the sensor module a standard component. In use, users only need to install the sensor module onto the object being measured and connect the output interface to an external device to quickly obtain pressure change data, reducing system integration complexity. All components of the sensor module are integrated, resulting in a small size suitable for space-constrained applications. The system also offers high stability, reduces the risk of poor contact or signal interference, and provides high measurement accuracy. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a sensor module according to an embodiment of this application;

[0022] Figure 2 for Figure 1 A schematic diagram of the structure shown from another perspective;

[0023] Figure 3 for Figure 1 A schematic diagram of the structure shown from another perspective;

[0024] Figure 4 for Figure 3 The structure shown is a cross-sectional view along the AA direction;

[0025] Figure 5 for Figure 1 An exploded view of the structure shown.

[0026] Figure 6 for Figure 1 The diagram shows a partial structural schematic of the sensor module.

[0027] Explanation of reference numerals in the attached figures

[0028] 100-Sensor Module;

[0029] 10-Mounting base; 10a-First mounting groove; 10b-Second mounting groove; 10c-Annular groove; 101-Spacer wall;

[0030] 11-Pressure sensor; 111-Sensing element; 112-Contact; 1121-First segment; 1122-Second segment; 113-Conductive spring; 114-Elastic element; 115-Gasket;

[0031] 12 - Circuit board; 121 - Output interface;

[0032] 13-Cover plate assembly; 131-First cover plate; 131a-Avoidance notch; 132-Second cover plate; 132a-Through hole; 14-Connector; 141-First connecting portion; 142-Second connecting portion; 15-Seal. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0034] The specific technical features described in the specific embodiments can be combined in any suitable manner without contradiction. For example, different combinations of specific technical features can form different embodiments and technical solutions. To avoid unnecessary repetition, the various possible combinations of the specific technical features in this application will not be described separately.

[0035] In the following description, the terms "first," "second," etc., are used merely to distinguish different objects and do not indicate that the objects have the sameness or relationship. It should be understood that the directional descriptions "above," "below," "outside," and "inside" refer to the orientation under normal use conditions, while "left" and "right" refer to the left and right directions shown in the corresponding diagrams, which may or may not be the left and right directions under normal use conditions.

[0036] It should be noted that the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. "A plurality of" means two or more.

[0037] This application provides a sensor module 100.

[0038] Please see Figures 1 to 6 The sensor module 100 includes a mounting base 10, a circuit board 12, multiple pressure sensors 11, and a cover plate assembly 13.

[0039] The mounting base 10 is provided with multiple non-interconnected first mounting slots 10a.

[0040] The circuit board 12 is disposed on one side of the mounting base 10 along the first direction. The pressure sensor 11 includes a contact 112 and a sensing element 111. The sensing element 111 is fixed in the first mounting groove 10a and electrically connected to the circuit board 12. The contact 112 is disposed on the side of the sensing element 111 away from the circuit board 12 along the first direction and is used to transmit pressure to the sensing element 111. The circuit board 12 has an output interface 121 for connecting to an external device.

[0041] The cover assembly 13 is disposed between the other side of the mounting base 10 along the first direction and the circuit board 12. The cover assembly 13 is connected to the mounting base 10, the circuit board 12, and the multiple pressure sensors 11 to encapsulate the multiple pressure sensors 11, the mounting base 10, and the circuit board 12 into one unit.

[0042] The output interface 121 is exposed on the outer surface of the sensor module 100, and the contact 112 is exposed on the outer surface of the sensor module 100.

[0043] Multiple non-interconnected first mounting slots 10a means that each first mounting slot 10a is set at intervals and has no overlapping or shared parts.

[0044] Multiple first mounting slots 10a can respectively accommodate the sensing elements 111 of multiple pressure sensors 11, so that multiple pressure sensors 11 can simultaneously or separately measure multiple points or areas to obtain a wider range of data.

[0045] The contact 112 is the part that directly contacts the external environment or the object being measured. It can uniformly transmit the pressure applied from the outside to the sensing element 111. The pressure sensor 11 transmits the pressure to the sensing element 111 through the contact 112. The sensing element 111 converts the pressure signal into an electrical signal and outputs it for pressure measurement.

[0046] The contact 112 serves as the first point of contact between the pressure sensor 11 and the external environment. Together with the mounting base 10, it isolates the sensing element 111 within the first mounting groove 10a, reducing the influence of external dust, moisture, etc., on the sensitive sensing element 111. The contact 112 provides a stable and consistent contact surface to maintain measurement consistency and repeatability. Of course, the contact 112 can be designed in various shapes and sizes to adapt to different installation conditions and force distribution methods according to different application requirements.

[0047] The sensing element 111 can be a quartz plate, strain gauge, etc.

[0048] Contact 112 can be made of metal.

[0049] The form of the pressure sensor 11 is not limited; it can be a piezoresistive pressure sensor, a capacitive pressure sensor, a piezoelectric pressure sensor, etc. There are no restrictions here.

[0050] Multiple first mounting slots 10a can be arranged linearly, in a matrix, in a circle, in a spiral, or in an irregular manner, etc., without any restrictions.

[0051] The sensing element 111 of each pressure sensor 11 is electrically connected to the circuit board 12. The circuit board 12 can perform signal conditioning, digital-to-analog conversion, etc. on the electrical signal output by the sensing element 111.

[0052] For example, the circuit board 12 includes an amplifier circuit and a filter circuit. The amplifier circuit can amplify the electrical signal output by the sensing element 111 to increase the signal strength, and the filter circuit can filter the signal output by the sensing element 111 to reduce noise, thereby improving the signal-to-noise ratio and linearity for further processing or transmission.

[0053] For example, the circuit board 12 may also include an analog-to-digital converter circuit to convert electrical signals into digital signals and process them to facilitate signal transmission and improve measurement accuracy and stability.

[0054] The output interface 121 of the circuit board 12 can serve as a communication interface between the circuit board 12 and external devices, transmitting the processed signal to the external devices so that the pressure change data or pressure change waveform can be displayed by the external devices, thereby realizing pressure measurement.

[0055] In this embodiment, the signal processing part and the output interface 121 are integrated on a single circuit board 12, resulting in a simple and compact structure.

[0056] The contact 112 is positioned on the side of the sensing element 111 away from the circuit board 12 along the first direction. This reasonable layout facilitates the even transmission of pressure from the contact 112 to the sensing element 111, reducing the likelihood of interference between the contact 112 and the circuit board 12. The contact 112 can directly contact the sensing element 111 to transmit pressure directly, or it can indirectly contact the sensing element 111 through an intermediate structure; no limitation is imposed here.

[0057] It should be noted that, regardless of whether the contact 112 is in direct or indirect contact with the sensing element 111, the pressure transmission between the contact 112 and the sensing element 111 is linear, that is, it does not involve bending or turning.

[0058] The cover plate assembly 13 is disposed between the mounting base 10 on the other side along the first direction and the circuit board 12. The cover plate assembly 13 can provide mechanical support for the mounting base 10, the circuit board 12 and the pressure sensor 11, and position and fix the mounting base 10, the circuit board 12 and the pressure sensor 11, thereby increasing the positional stability of the mounting base 10, the circuit board 12 and the pressure sensor 11, and facilitating stable pressure measurement and signal transmission.

[0059] The cover plate assembly 13 is connected to the mounting base 10, the circuit board 12, and multiple pressure sensors 11 to encapsulate the multiple pressure sensors 11, the mounting base 10, and the circuit board 12 into a single unit. This means that the cover plate assembly 13, the mounting base 10, the circuit board 12, and the multiple pressure sensors 11 can be integrated into a pre-assembled unit for transportation, installation, and measurement. In other words, in actual measurement scenarios, pressure measurement can be quickly achieved simply by placing this pre-assembled unit on the object being measured and connecting the output interface 121 to an external device, without the need for additional wiring, resulting in high ease of installation and measurement.

[0060] Here, the output interface 121 is exposed on the outer surface of the sensor module 100, and the contact 112 is exposed on the outer surface of the sensor module 100. This means that the output interface 121 and the contact 112 can be seen from the outer surface of the sensor module 100. This facilitates the contact 112 to contact the object being measured and facilitates the connection of the output interface 121 to external devices.

[0061] For example, the contact 112 may protrude from one side of the cover plate assembly 13 along the first direction, and the cover plate assembly 13 may install and limit the contact 112 to fix the position of the contact 112.

[0062] The first direction can be any direction; for example, refer to... Figure 1 As shown, the first direction is the thickness direction of the mounting base 10, and the thickness direction of the mounting base 10 is consistent with the thickness direction of the sensor module 100.

[0063] The sensor module 100 provided in this embodiment, with its multiple pressure sensors 11, can simultaneously or separately measure the pressure distribution at multiple measurement points, providing comprehensive pressure information. The multiple pressure sensors 11 are not interconnected; if one pressure sensor 11 fails, the others can still function normally, ensuring high system reliability. Furthermore, the cover plate assembly 13, circuit board 12, mounting base 10, and multiple pressure sensors 11 are connected, and the multiple pressure sensors 11 and circuit board 12 are encapsulated as a single unit. The sensor module 100 can be formed as a standard component. In use, the user only needs to install the sensor module 100 onto the object being measured and connect the output interface 121 to an external device to quickly obtain pressure change data, reducing the complexity of system integration. All components of the sensor module 100 are integrated, resulting in a small size, making it suitable for applications with limited space. It also offers high system stability, reduces the risk of poor contact or signal interference, and provides high measurement accuracy.

[0064] In some embodiments, please refer to Figures 1 to 5 The sensor module 100 includes a connector 14, which connects the cover plate assembly 13, the circuit board 12 and the mounting base 10.

[0065] In this embodiment, the cover plate assembly 13, the circuit board 12 and the mounting base 10 are connected by the connector 14, thereby connecting the cover plate assembly 13, the circuit board 12, the mounting base 10 and the pressure sensor 11. The positions of the circuit board 12 and the pressure sensor 11 are fixed, which can realize stable pressure transmission and signal transmission, and the overall stability of the sensor module 100 is high.

[0066] The specific construction of the connector 14 is not limited. For example, the connector 14 can be a screw, or a combination of a bolt and a nut.

[0067] The number of connectors 14 can be one or more, and there is no limitation. For example, the number of connectors 14 can be multiple, and multiple connectors 14 can increase the stability of the connection.

[0068] It is understood that the connector 14 can pass through the circuit board 12 and the mounting base 10 from one end of the cover plate assembly 13 and then through the other end of the cover plate assembly 13 to connect the cover plate assembly 13, the circuit board 12 and the mounting base 10. In this embodiment, the connector 14 is relatively long, and the number of connectors 14 can be one or more. Of course, in other embodiments, the number of connectors 14 is multiple, with some connectors 14 passing through and connecting one end of the cover plate assembly 13, the circuit board 12 and the mounting base 10, and other connectors 14 passing through and connecting the other end of the cover plate assembly 13 and the mounting base 10. In this way, the connection of the cover plate assembly 13, the circuit board 12 and the mounting base 10 can be realized. In this embodiment, the connector 14 can be shorter and the connection stability is higher.

[0069] For example, in some embodiments, there are multiple connectors 14, each connector 14 including a first connecting portion 141 and a second connecting portion 142, with the circuit board 12, mounting base 10, and cover plate assembly 13 located between the first connecting portion 141 and the second connecting portion 142.

[0070] In this embodiment, the first connecting portion 141 can pass through and connect one end of the cover plate assembly 13, the circuit board 12 and the mounting base 10, and the second connecting portion 142 can pass through and connect the other end of the cover plate assembly 13 and the mounting base 10. In this way, the first connecting portion 141 and the second connecting portion 142 connect the cover plate assembly 13, the circuit board 12 and the mounting base 10 from two directions in the first direction, respectively. The connection has high stability and reliability, and increases the fixation of the position of the pressure sensor 11 and the circuit board 12.

[0071] It should be noted that in the plane projection perpendicular to the sensor module 100 along the first direction, the first connecting portion 141 and the second connecting portion 142 can be arranged overlappingly or spaced apart, and no restriction is imposed here.

[0072] The specific structure of the cover plate assembly 13 is not limited.

[0073] In some embodiments, please refer to Figures 1 to 2 , Figures 4 to 5 The cover plate assembly 13 includes a first cover plate 131 and a second cover plate 132. The first cover plate 131 is disposed on the side of the circuit board 12 away from the pressure sensor 11 along the first direction, and the second cover plate 132 is disposed on the other side of the mounting base 10 along the first direction. The contact 112 passes through and protrudes from the side of the second cover plate 132 away from the mounting base 10 along the first direction.

[0074] In this embodiment, the first cover plate 131 and the second cover plate 132 can position the mounting base 10 and the circuit board 12 within their defined space. The first cover plate 131 can limit and fix the circuit board 12, and the second cover plate 132 can provide mechanical support for the mounting base 10 and the pressure sensor 11, and limit the contact 112, so that the installation position of the contact 112 is fixed. The first cover plate 131 and the second cover plate 132 limit the mounting base 10 and the circuit board 12 from two directions in the first direction, respectively. The pressure transmission stability is high, the position of the output interface 121 is also relatively stable and will not shake or shift, and the measurement accuracy is high.

[0075] The first cover plate 131 and the second cover plate 132 can be an integral structure or a separate structure. In the embodiment where the first cover plate 131 and the second cover plate 132 are an integral structure, a connecting plate extending along a first direction can be connected between the first cover plate 131 and the second cover plate 132. The first cover plate 131, the second cover plate 132, and the connecting plate are integrally formed, that is, the cover plate assembly 13 can be roughly formed into a frame structure. The cover plate assembly 13 is integrally formed, and the structure of the cover plate assembly 13 is simple and easy to manufacture.

[0076] In other embodiments, please refer to Figure 5 The first cover plate 131 and the second cover plate 132 are separate structures.

[0077] In this embodiment, the first cover plate 131 and the second cover plate 132 are manufactured separately and assembled independently. In this way, there is no need to consider the dimensions of the circuit board 12 and the mounting base 10 along the first direction after assembly. The first cover plate 131 and the second cover plate 132 can abut against the mounting base 10 and the circuit board 12 from both sides of the first direction, which makes the assembly simple and convenient. There is no need to consider the docking error between the circuit board 12 and the mounting base 10, and the assembly reliability of the sensor module 100 is higher.

[0078] In some embodiments, please refer to Figure 5 The first cover plate 131 is provided with a clearance notch 131a, through which the output interface 121 is exposed on the outer surface of the sensor module 100.

[0079] In this embodiment, the clearance notch 131a can avoid the output interface 121 when the first cover plate 131 and the circuit board 12 are connected, so that the output interface 121 can be exposed on the outer surface of the sensor module 100, thereby facilitating connection with external devices. At the same time, the clearance notch 131a can also provide guidance and positioning for the connection between the first cover plate 131 and the circuit board 12, increasing the convenience of connection.

[0080] In some embodiments, please refer to Figure 5The pressure sensor 11 includes a conductive spring 113, one end of which abuts against the sensing element 111 and the other end of which abuts against the circuit board 12 to form a first electrode; the mounting base 10 is a metal part, and the sensing element 111 abuts against the groove wall of the first mounting groove 10a to form a second electrode.

[0081] Mounting base 10 is a metal component, meaning it is conductive. For example, mounting base 10 can be made of materials such as copper and copper alloys, iron and iron alloys, or aluminum and aluminum alloys.

[0082] One end of the conductive spring 113 abuts against the sensing element 111, and the other end abuts against the circuit board 12. The conductive spring 113 can serve as a bridge for the electrical connection between the sensing element 111 and the circuit board 12, increasing the reliability of the electrical connection. No wiring is required, reducing assembly difficulty. At the same time, the conductive spring 113 has a certain elasticity, which allows it to compensate for assembly tolerances by its own elastic deformation energy while realizing the electrical connection between the sensing element 111 and the circuit board 12. Under the action of the conductive spring 113, the conductive spring 113 always maintains a stable connection with the sensing element 111 and the circuit board 12.

[0083] The first and second electrodes work together to form a circuit, enabling efficient charge transfer from the sensing element 111. The polarities of the first and second electrodes are not limited and can be determined based on the polarity of the transferred charge. For example, when a positive charge needs to be output, the first electrode can be positive and the second electrode can be negative. The positive charge generated by the sensing element 111 can be transferred to the circuit board 12 via the conductive spring 113, while the negative charge flows out via the mounting base 10.

[0084] Understandably, the conductive spring 113 does not contact the mounting base 10 to reduce the probability of a short circuit between positive and negative charges.

[0085] In some embodiments, please refer to Figure 5 and Figure 6 The mounting base 10 is provided with a plurality of non-communicating second mounting slots 10b. Each first mounting slot 10a and each second mounting slot 10b correspond one-to-one along the first direction. The pressure sensor 11 includes an elastic element 114, which is disposed in the second mounting slot 10b. One end of the elastic element 114 abuts against the contact 112, and the other end abuts directly or indirectly against the sensing element 111.

[0086] Each first mounting slot 10a and each second mounting slot 10b correspond one-to-one along the first direction, meaning that each first mounting slot 10a has a second mounting slot 10b disposed on the side away from the circuit board 12 along the first direction. In the plane projection perpendicular to the sensor module 100 along the first direction, the first mounting slots 10a and second mounting slots 10b at least partially overlap.

[0087] Multiple non-interconnected second mounting slots 10b refer to the fact that each second mounting slot 10b is set at intervals and has no overlapping or shared parts.

[0088] In this embodiment, the elastic element 114 facilitates the adjustment of the contact surface between the force transmitted from the contact 112 and the sensing element 111, making the contact surface relatively flat. This reduces the probability that assembly and manufacturing errors between the sensing element 111 and the contact 112 will affect the uniformity of force transmission, and facilitates the uniform transmission of the force transmitted from the contact 112 to the sensing element 111 through the elastic element 114, thereby reducing measurement errors.

[0089] The specific structure of the elastic element 114 is not limited; it can be a spring.

[0090] The elastic element 114 can directly or indirectly abut against the sensing element 111. That is, the elastic element 114 can directly abut against the sensing element 111 to transmit pressure, or it can indirectly abut against the sensing element 111 to indirectly transmit pressure.

[0091] In some embodiments, the first mounting slot 10a and the second mounting slot 10b are interconnected.

[0092] In this embodiment, the spaces of the first mounting groove 10a and the second mounting groove 10b are interconnected, thus simplifying the structure of the mounting base 10. The first mounting groove 10a and the second mounting groove 10b can penetrate the mounting base 10 along the first direction.

[0093] In this embodiment, the elastic element 114 can directly contact the sensing element 111.

[0094] In other embodiments, please refer to Figure 6 The mounting base 10 is provided with a partition wall 101, which separates the first mounting groove 10a and the second mounting groove 10b. The pressure of the contact 112 is transmitted to the sensing element 111 through the elastic member 114 and the partition wall 101.

[0095] In this embodiment, the partition wall 101 separates the first mounting groove 10a and the second mounting groove 10b, thus forming a blind groove. In this way, the partition wall 101 can be used to position and install the sensing elements 111, determining the installation position of each sensing element 111, resulting in high installation stability of the sensing elements 111. Simultaneously, the partition wall 101 isolates the sensing elements 111 from the elastic member 114, and also provides installation support for the elastic member 114, reducing damage to the sensing elements 111 and increasing the reliability of pressure transmission.

[0096] For example, a positioning protrusion may be provided on the partition wall 101, and a groove may be provided on the sensing element 111. The groove cooperates with the positioning protrusion to realize the installation and positioning of the sensing element 111.

[0097] In some embodiments, please refer to Figure 5 The pressure sensor 11 includes a gasket 115, and the two ends of the elastic member 114 abut against the gasket 115 and the contact 112 respectively.

[0098] In this embodiment, the pad 115 is provided to fix the elastic element 114 in the second mounting groove 10b. The pad 115 can maintain a flat contact with the sensing element 111 or the partition wall 101, so that the pressure can be transmitted to the sensing element 111 more evenly through the elastic element 114 and the pad 115.

[0099] In some embodiments, please refer to Figures 4 to 6 The cover plate assembly 13 is provided with a through hole 132a, which communicates with the second mounting groove 10b. The contact 112 includes a first segment 1121 and a second segment 1122. The first segment 1121 is disposed in the second mounting groove 10b, and the second segment 1122 passes through and protrudes from the through hole 132a. The size of the first segment 1121 at the junction of the second mounting groove 10b and the through hole 132a is larger than the diameter of the through hole 132a.

[0100] Thus, a stepped structure can be formed at the connection between the first segment 1121 and the second segment 1122. The step structure limits the contact 112, and the first segment 1121 will not come out of the second mounting groove 10b through the through hole 132a, thereby increasing the installation stability of the contact 112.

[0101] In some embodiments, please refer to Figure 5 and Figure 6 The sensor module 100 includes a seal 15, which is disposed between the mounting base 10 and the circuit board 12.

[0102] The seal 15 is disposed between the mounting base 10 and the circuit board 12. The deformation of the seal 15 can reduce the mating gap between the mounting base 10 and the circuit board 12, improve the sealing performance at the joint, reduce the influence of the external environment (such as water, dust, etc.) on the sensing element 111, provide a closed sensing environment for the sensing element 111, and at the same time reduce the probability of oxidation of the sensing element 111.

[0103] For example, please refer to Figure 5 The outer surface of the mounting base 10 is recessed along the first direction to form an annular groove 10c, and the seal 15 is annular in structure and disposed in the annular groove 10c.

[0104] The material of the seal 15 is not limited; for example, the seal 15 can be silicone, rubber, etc.

[0105] It should be noted that in embodiments where the mounting base is made of metal, both the mounting base and the part of the circuit board used for docking are rigid structures. This inevitably results in installation gaps at the joint, allowing water, dust, and other contaminants to enter and affect the normal operation of the sensing element. Therefore, in this embodiment, the sealing element 15 increases the protection of the sensing element 111 and enhances the overall structural reliability of the sensor module 100.

[0106] In the description of this application, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the embodiments of this application. In this application, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine different embodiments or examples described in this application, as well as features of different embodiments or examples.

[0107] The above description is merely a preferred embodiment of this application and is not intended to limit the application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A sensor module, characterized in that, include: The mounting base is provided with multiple non-interconnected first mounting slots; The device includes a circuit board and multiple pressure sensors. The circuit board is disposed on one side of the mounting base along a first direction. Each pressure sensor includes a contact and a sensing element. The sensing element is fixed in the first mounting groove and electrically connected to the circuit board. The contact is disposed on the side of the sensing element away from the circuit board along the first direction and is used to transmit pressure to the sensing element. The circuit board has an output interface for connecting to an external device. A cover plate assembly is disposed between the mounting base on the other side along the first direction and the circuit board. The cover plate assembly is connected to the mounting base, the circuit board, and the plurality of pressure sensors to encapsulate the plurality of pressure sensors, the mounting base, and the circuit board into a single unit. The output interface is exposed on the outer surface of the sensor module, and the contacts are also exposed on the outer surface of the sensor module.

2. The sensor module according to claim 1, characterized in that, The sensor module includes a connector that connects the cover plate assembly, the circuit board, and the mounting base.

3. The sensor module according to claim 2, characterized in that, The number of connectors is multiple, and the multiple connectors include a first connecting portion and a second connecting portion. The circuit board, the mounting base, and the cover plate assembly are located between the first connecting portion and the second connecting portion.

4. The sensor module according to claim 1, characterized in that, The cover plate assembly includes a first cover plate and a second cover plate. The first cover plate is disposed on the side of the circuit board away from the pressure sensor along the first direction, and the second cover plate is disposed on the other side of the mounting base along the first direction. The contact passes through and protrudes from the second cover plate on the side away from the mounting base along the first direction.

5. The sensor module according to claim 4, characterized in that, The first cover plate and the second cover plate are separate structures; and / or, the first cover plate is provided with a clearance notch, and the output interface is exposed on the outer surface of the sensor module through the clearance notch.

6. The sensor module according to claim 1, characterized in that, The pressure sensor includes a conductive spring, one end of which abuts against the sensing element and the other end of which abuts against the circuit board to form a first electrode; The mounting base is a metal part, and the sensing element abuts against the wall of the first mounting groove to form a second electrode.

7. The sensor module according to claim 1, characterized in that, The mounting base is provided with a plurality of non-interconnected second mounting slots, and each of the first mounting slots and each of the second mounting slots corresponds one-to-one along the first direction. The pressure sensor includes an elastic element, which is disposed in the second mounting slot. One end of the elastic element abuts against the contact, and the other end abuts directly or indirectly against the sensing element.

8. The sensor module according to claim 7, characterized in that, The first mounting slot and the second mounting slot are connected to each other, or the mounting base is provided with a partition wall that separates the first mounting slot and the second mounting slot, and the pressure of the contact is transmitted to the sensing element through the elastic element and the partition wall; And / or, the pressure sensor includes a gasket, and the two ends of the elastic element abut against the gasket and the contact, respectively.

9. The sensor module according to claim 7, characterized in that, The cover plate assembly is provided with a through hole, which communicates with the second mounting groove. The contact includes a first segment and a second segment. The first segment is disposed in the second mounting groove, and the second segment passes through and protrudes from the through hole. The size of the first segment at the junction of the second mounting groove and the through hole is larger than the diameter of the through hole.

10. The sensor module according to any one of claims 1-9, characterized in that, The sensor module includes a seal, which is disposed between the mounting base and the circuit board.

Images