Transmitting end structure and silicon optical module

Abstract

The utility model discloses a transmitting end structure and a silicon optical module, the transmitting end structure comprises a silicon optical chip, the silicon optical chip comprises at least one input waveguide, the upstream of the optical path of each input waveguide is correspondingly provided with an optical input unit, and the central optical axis of the optical input unit and the central optical axis of the input waveguide are arranged in a non-collinear manner. An optical steering device used for receiving light beams of the light input unit and steering the light beams to the input waveguide is arranged between the light input unit and the silicon optical chip. According to the utility model, by arranging the optical steering device at the input waveguide of the silicon optical chip, the deflection of a coupling optical path is realized, so that mode field matching with the input waveguide of the silicon optical chip is completed, and the coupling loss is effectively reduced.

Description

Technical Field

[0001] This utility model relates to a transmitter structure, belonging to the field of silicon photonics module technology, and particularly to a transmitter structure and a silicon photonics module. Background Technology

[0002] With the rapid development of information technology, the demand for data transmission in fields such as telecommunications, big data, and cloud computing is showing a trend towards high speed and large capacity. Against this backdrop, the demand for high-speed optical modules, a key component for data transmission, has increased dramatically. Currently, the industry widely adopts a multi-path parallel solution based on electro-absorption modulated lasers (EMLs). However, this solution suffers from numerous problems, including large space requirements, high power consumption, and complex coupling processes, which severely restricts its application in future high-speed optical communication.

[0003] Silicon photonics modules, based on silicon photonics technology, have emerged as a novel solution. These modules offer significant advantages such as high speed, high integration, high reliability, and low power consumption, providing a new technological path for the development of high-speed optical modules. However, silicon photonics chips still face several technical challenges in practical applications, the most prominent of which is the coupling loss problem at the input optical port.

[0004] The primary cause of coupling loss at the input port is the significant mode mismatch between the silicon-based waveguide and the optical fiber. Due to the high refractive index of silicon (n≈3.5), the lateral dimensions of silicon-based waveguides are typically only a few hundred nanometers, while the mode field diameter of a standard single-mode fiber reaches 8-10 micrometers. This huge difference in mode field size leads to significant mode mismatch loss when the optical signal couples from the optical fiber into the silicon waveguide. Even with commonly used coupling structures such as grating couplers or inverted conical waveguides, the coupling loss at the input port is generally above 3 dB, and in some cases may even exceed 5 dB.

[0005] This significant coupling loss not only reduces the overall optical efficiency of the silicon photonics chip but also degrades signal quality and increases the difficulty of subsequent optoelectronic signal processing. Simultaneously, the presence of coupling loss places higher demands on chip temperature control, as excessive loss is converted into heat, thus affecting device stability and reliability. Furthermore, high coupling loss reduces the system's power budget, limits transmission distance, and ultimately impacts the performance of the entire optical communication system.

[0006] Therefore, how to effectively reduce the coupling loss at the optical input port of silicon photonics chips has become one of the key technical problems that urgently need to be solved in the field of silicon photonics technology. Utility Model Content

[0007] The technical problem to be solved by this utility model is to provide a transmitter structure and a silicon photonics module that address the technical defects existing in the prior art. By setting an optical steering device at the input waveguide of the silicon photonics chip, the coupled optical path is deflected, thereby achieving mode field matching with the input waveguide of the silicon photonics chip and effectively reducing coupling loss.

[0008] The technical solution adopted by this utility model to solve its technical problem is as follows: This utility model discloses a transmitter structure, including a silicon photonic chip, wherein the silicon photonic chip includes at least one input waveguide, and an optical input unit is correspondingly arranged upstream of the optical path of each input waveguide, wherein the central optical axis of the optical input unit is arranged collinearly with the central optical axis of the input waveguide.

[0009] This utility model also discloses a transmitter structure, including a silicon photonic chip, wherein the silicon photonic chip includes at least one input waveguide, and an optical input unit is correspondingly arranged upstream of the optical path of each input waveguide. The characteristic is that the central optical axis of the optical input unit is not collinear with the central optical axis of the input waveguide, and an optical steering device is provided between the optical input unit and the silicon photonic chip for receiving the light beam of the optical input unit and steering it to the input waveguide.

[0010] In a preferred embodiment of this utility model, the optical steering device is an optical prism or an optical reflector.

[0011] In a preferred embodiment of the present invention, the optical prism includes an incident surface facing the light input unit and an exit surface facing the input waveguide, wherein the incident surface and the exit surface are arranged in a non-parallel manner.

[0012] In a preferred embodiment of the present invention, the optical input unit includes a laser assembly, a collimating lens, an isolator, and a focusing lens arranged in sequence, or the optical input unit includes a laser assembly, a collimating lens, a focusing lens, and an isolator arranged in sequence.

[0013] In a preferred embodiment of this utility model, a first structural member is included. One end of the first structural member is provided with an isolator mounting position and the other end is provided with a focusing lens mounting position. The isolator mounting position and the focusing lens mounting position are interconnected. The isolator is installed in the isolator mounting position and the focusing lens is installed in the focusing lens mounting position.

[0014] In a preferred embodiment of this utility model, a second structural member is included. One end of the second structural member is provided with a focusing lens mounting position and the other end is provided with an optical prism mounting position. The optical prism mounting position and the focusing lens mounting position are interconnected. The focusing lens is mounted in the focusing lens mounting position and the optical prism is mounted in the optical prism mounting position.

[0015] In a preferred embodiment of this utility model, the central optical axis of the optical input unit is parallel to the long side of the silicon photonic chip, or there is an angle between the central optical axis of the optical input unit and the long side of the silicon photonic chip.

[0016] In a preferred embodiment of the present invention, the silicon photonic chip includes at least one output waveguide, and an optical fiber array is disposed downstream of the optical path of the output waveguide.

[0017] This utility model also discloses a silicon photonics module, which includes an emitter structure.

[0018] The beneficial effects of this invention are as follows: By setting a prism at the input waveguide of the silicon photonic chip, the coupled optical path is deflected, thereby achieving mode field matching with the input waveguide of the silicon photonic chip and effectively reducing coupling loss. Therefore, this invention effectively realizes the splitting and modulation of the coupled light, reduces the number of components in the laser assembly, effectively reduces the space occupancy, coupling complexity, and power consumption of optical devices, enhances the reliability of optical devices, and optimizes the PCBA layout space required for the optical module. After using this invention, there is no need to design irregularly shaped PCBAs.

[0019] First, this invention, by placing an optical steering device between the optical input unit and the silicon photonics chip, allows the central optical axis of the optical input unit to be arranged non-collinearly with the central optical axis of the input waveguide, thus overcoming the limitation of traditional optical path designs that require the light source and waveguide to be strictly coaxial. This design significantly improves the arrangement flexibility of the optical input unit and provides greater design space for optimizing the device structure.

[0020] Secondly, this invention employs an optical prism or optical mirror as an optical steering device, which can efficiently redirect the light beam emitted from the optical input unit and precisely couple it into the input waveguide of the silicon photonics chip. This optical path design not only ensures high-quality beam transmission but also effectively reduces coupling loss at the input port, thereby improving the optical efficiency of the system.

[0021] Furthermore, when employing an optical prism scheme, by designing a structure where the incident and exit surfaces are arranged non-parallel, the propagation direction of the light beam can be flexibly adjusted to achieve the optimal incident angle, thereby further optimizing the light coupling efficiency. This structural design also facilitates precise alignment and adjustment during the manufacturing process.

[0022] Furthermore, the optical input unit of this utility model adopts a modular design of laser components, collimating lens, isolator and focusing lens, with each optical element arranged coaxially in sequence. This not only ensures high-quality beam transmission, but also realizes standardized assembly of the device, which is conducive to improving production efficiency and product yield.

[0023] Furthermore, this invention provides a stable mounting structure for the isolator, focusing lens, and optical prism through the design of specialized first and second structural components. This structural design not only ensures the precise positioning of each optical element but also facilitates the assembly and maintenance of the device, while improving the mechanical stability of the entire transmitter structure.

[0024] Furthermore, in the design of laser components, by aligning the light-emitting ridge of the laser with the heat sink end and aligning the photosensitive surface of the backlight detector with the light-emitting ridge, efficient heat dissipation and accurate monitoring of the device are achieved, which helps to improve the working stability and reliability of the laser.

[0025] In summary, the overall design of this utility model balances optical performance and engineering practicality. The modular design of the functional components facilitates mass production and integration. Furthermore, the assembly process of this design is relatively simple, which helps reduce production costs and improve product competitiveness. Attached Figure Description

[0026] The present invention will be further described below with reference to the accompanying drawings and embodiments. In the accompanying drawings:

[0027] Figure 1 A schematic diagram of the structure of Embodiment 1 of this utility model;

[0028] Figure 2 Schematic diagram of embodiment 2 of this utility model;

[0029] Figure 3 Schematic diagram of embodiment 3 of this utility model;

[0030] Figure 4 Schematic diagram of embodiment 4 of this utility model;

[0031] Figure 5 A schematic diagram of the structure of Embodiment 5 of this utility model;

[0032] Figure 6 Schematic diagram of embodiment 6 of this utility model;

[0033] Figure 7 Schematic diagram of embodiment 7 of this utility model;

[0034] Figure 8 Schematic diagram of embodiment 8 of this utility model;

[0035] In the diagram, 10 is the laser assembly; 20 is the focusing lens; 30 isolator; 40 is collimating lens; 50 is the optical prism; 60 is the silicon photonic chip; 70 is the fiber array; 80 is the optical mirror; 11 is the laser; 12 is the heat sink; 13 is the backlight detector; 61 is the input waveguide; 62 is the output waveguide; 91 is the first structural component; 92 is the second structural component. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0037] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0038] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0039] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0040] Example 1

[0041] In one specific embodiment of this utility model, such as Figure 1As shown, a transmitter structure for a silicon photonics module includes a laser assembly 10, a collimating lens 20, an isolator 30, a focusing lens 40, an optical prism 50, a silicon photonics chip 60, and a fiber array 70 arranged sequentially along the optical path. The collimating lens 20 is mainly used to collimate the laser emitted from the laser assembly 10, ensuring the beam propagates in parallel. Subsequently, the beam undergoes unidirectional transmission control via the isolator 30, effectively improving the component's anti-reflection performance. After passing through the isolator 30, the focusing lens 40 converges the collimated laser beam to achieve effective coupling with subsequent optical paths.

[0042] It is worth noting that this invention employs a unique optical path design. Specifically, the optical system comprised of the laser assembly 10, collimating lens 20, isolator 30, and focusing lens 40 has a preset angular deviation between its optical axis and the central axis of the input waveguide 61 of the silicon photonic chip 60. The optical axis is parallel to the long side of the silicon photonic chip 60. This non-collinear design aims to effectively reduce the impact of reflected light from the coupling end face on the system.

[0043] To achieve precise optical path steering, an optical prism 50 is positioned between the focusing lens 40 and the input waveguide 61 of the silicon photonics chip 60. The optical prism 50 has a right-angled trapezoidal structure and includes an incident surface facing the light input unit and an exit surface facing the input waveguide. The incident surface of the optical prism 50 is precisely aligned with the emitted light from the laser, while its exit surface remains aligned with the input waveguide 61 of the silicon photonics chip 60. This design not only achieves effective optical path steering but, more importantly, ensures good mode field matching between the emitted light from the laser and the input waveguide 61 of the silicon photonics chip, thereby significantly reducing the influence of reflected light.

[0044] Inside the silicon photonics chip 60, functional structures such as an input waveguide, a beam splitter, a modulator, and an output waveguide are arranged sequentially along the direction of light propagation. It should be noted that the number of ports on the output waveguide 62 of the silicon photonics chip 60 can be flexibly configured according to actual application requirements, and is not limited to... Figure 1 The number shown can be expanded to 1×N output ports. Correspondingly, the fiber array 70 located at the silicon photonics chip output waveguide 62 can also be configured with a corresponding number of receiving ports, also supporting a 1×N expansion configuration, and not limited to... Figure 1 The 1×4 structure shown.

[0045] Through the above technical solution, this utility model not only solves the problem of reflected light interference in the traditional transmitter structure, but also provides an scalable modular design scheme with good engineering application value.

[0046] Example 2

[0047] like Figure 2 As shown, this embodiment provides another transmitter structure for a silicon photonics module. The main difference from Embodiment 1 lies in the arrangement order of the optical elements, particularly the position of the isolator 30. Specifically, the transmitter structure of this embodiment includes a laser assembly 10, a collimating lens 20, a focusing lens 40, an isolator 30, an optical prism 50, a silicon photonics chip 60, and a fiber array 70 arranged sequentially along the optical path.

[0048] In terms of optical path design, the collimating lens 20 still serves the function of collimating the laser beam, making it a parallel beam. The subsequent focusing lens 40 is used to converge the collimated laser beam for better beam control. The isolator 30, located after the focusing lens 40, ensures the unidirectional transmission of light, effectively improving the anti-reflection performance of the component.

[0049] This embodiment also employs a non-collinear optical path design strategy. Specifically, the optical system comprised of the laser assembly 10, collimating lens 20, focusing lens 40, and isolator 30 has a preset angular deviation between its optical axis and the central axis of the input waveguide 61 of the silicon photonics chip 60. The optical axis is parallel to the long side of the silicon photonics chip 60. This design also aims to reduce the influence of reflected light from the coupling end face.

[0050] To achieve precise optical path steering, an optical prism 50 is positioned between the isolator 30 and the input waveguide 61 of the silicon photonics chip 60. The incident surface of this optical prism 50 is precisely aligned with the emitted light from the isolator 30, while its exit surface maintains good alignment with the input waveguide 61 of the silicon photonics chip 60. This configuration not only achieves effective optical path steering but also realizes mode field matching between the laser's emitted light and the silicon photonics chip's input waveguide 61, thereby significantly reducing the influence of reflected light.

[0051] The internal structure of the silicon photonics chip 60 remains unchanged, with functional units such as an input waveguide, a beam splitter, a modulator, and an output waveguide arranged sequentially along the optical path. It should be noted that the number of ports on the output waveguide 62 of the silicon photonics chip 60 is highly scalable and not limited to the number shown in the diagram; it can be configured to have 1×N output ports according to actual needs. Correspondingly, the fiber array 70 located at the output waveguide 62 of the silicon photonics chip can also be configured with a corresponding number of receiving ports, also supporting a 1×N expansion configuration, and not limited to the 1×4 structure shown in the diagram.

[0052] This embodiment provides an alternative solution for system design by adjusting the arrangement of optical elements, especially by placing the isolator 30 after the focusing lens 40. While ensuring basic functions, it provides greater design flexibility for different application scenarios.

[0053] Example 3

[0054] like Figure 3 As shown, this embodiment mainly discloses an improved structure of the laser assembly 10 in the transmitter structure of a silicon photonics module. The laser assembly 10 mainly includes three parts: a laser 11, a heat sink 12, and a backlight detector 13. The optimized structural design improves the performance and reliability of the device.

[0055] In terms of structural arrangement, the laser 11 is positioned above the heat sink 12. Of particular note is that the light-emitting ridge of the laser 11 is aligned with the right end face of the heat sink 12. This precise alignment design not only improves the output quality of the laser beam but, more importantly, ensures effective heat conduction, thus enhancing the device's heat dissipation performance.

[0056] In terms of monitoring design, the backlight detector 13 is cleverly positioned on the backlight side of the light-emitting ridge of the laser 11. Notably, a precise alignment design is employed between the photosensitive surface of the backlight detector 13 and the light-emitting ridge of the laser 11. Specifically, as... Figure 3 As shown, to further optimize system performance, the central axis of the photosensitive surface of the backlight detector 13 can be set at a certain angle to the emitting ridge of the laser 11. This non-orthogonal design is mainly to effectively reduce the interference of reflected light on the system.

[0057] Through the above structural design, this embodiment not only achieves stable laser operation and effective heat dissipation, but also enables real-time monitoring of optical power through the ingenious arrangement of the backlight detector, providing an important guarantee for the reliable operation of the system. Simultaneously, by introducing the design concept of angular deviation, the system's anti-interference capability is further enhanced. This improved laser component structure can be used in conjunction with other optical elements described in Embodiment 1 or Embodiment 2 to jointly form a silicon photonics module transmitter structure with superior performance.

[0058] Example 4

[0059] like Figure 4 As shown, this embodiment provides an improved structure for the transmitter structure of a silicon photonics module. While maintaining the overall optical path design concept, this embodiment innovatively replaces the optical prism 50 in Embodiment 1 with an optical reflector 80, providing a new technical solution for achieving optical path redirection.

[0060] In terms of specific structure, the transmitter structure of this embodiment still includes a laser assembly 10, a collimating lens 20, an isolator 30, a focusing lens 40 arranged sequentially along the optical path, as well as a silicon photonic chip 60 and a fiber array 70. The optical system from the laser assembly 10 to the focusing lens 40 maintains a certain preset angle deviation from the input waveguide of the silicon photonic chip 60. This non-collinear design effectively reduces the influence of reflected light from the coupling end face.

[0061] The core innovation of this embodiment lies in the use of an optical mirror 80 as a light path steering device. This optical mirror 80 is positioned between the focusing lens 40 and the input waveguide of the silicon photonics chip 60, and its specific position and angle are precisely designed and adjusted. The reflective surface of the optical mirror 80 is treated with a high-reflectivity coating to ensure efficient reflection of the light beam. Its incident surface faces the outgoing light from the focusing lens 40, and the reflective surface, through a specific angle setting, ensures that the reflected light beam can be precisely aligned with the input waveguide of the silicon photonics chip 60.

[0062] In terms of optical path design, the optical reflector 80 not only needs to redirect the direction of the beam, but more importantly, it needs to ensure good mode field matching between the redirected beam and the input waveguide of the silicon photonics chip. To this end, the mounting structure of the optical reflector 80 is designed with a precise angle adjustment mechanism, which can be fine-tuned during assembly to obtain the best coupling effect.

[0063] Compared to the optical prism 50 used in Example 1, the optical reflector 80 has the following advantages:

[0064] 1. The structure is simple, requiring only one reflective surface to achieve light path redirection, thus reducing the number of optical interfaces;

[0065] 2. The assembly process is relatively simple, and the degree of adjustment is relatively large;

[0066] 3. Lower cost, especially with a significant economic advantage in mass production;

[0067] 4. It has high reflection efficiency, which can be further improved by optimizing the coating process.

[0068] In the silicon photonics chip 60, its internal structure remains unchanged, still containing functional units such as the input waveguide, beam splitter, modulator, and output waveguide arranged sequentially along the optical path. Similarly, the number of output waveguide ports of the silicon photonics chip 60 can be flexibly configured to 1×N output ports according to actual needs, and the corresponding fiber array 70 can also be configured to 1×N receiving ports, maintaining the scalability of the system.

[0069] Through the above design, this embodiment not only fulfills the basic functional requirements of the transmitter structure, but also provides a simpler and more economical technical route by adopting an optical reflector, offering a new option for the industrial application of silicon photonics modules.

[0070] Example 5

[0071] like Figure 5As shown, this embodiment discloses a transmitter structure for a silicon photonics module. This embodiment is an improvement on Embodiment 1, with the main innovation being the use of a first structural component 91 to combine the isolator 30 and the focusing lens 40 into a single integrated assembly. This design not only improves the integration of the device but also enhances the protection performance of the optical components.

[0072] Specifically, the transmitter structure in this embodiment still includes a laser assembly 10, a collimating lens 20, an isolator 30, a focusing lens 40, an optical prism 50, a silicon photonic chip 60, and a fiber array 70 arranged sequentially along the optical path. The collimating lens 20 functions to collimate the laser emitted from the laser assembly 10, ensuring the beam propagates in parallel.

[0073] The core improvement of this embodiment lies in the introduction of a first structural component 91, which is specially designed to simultaneously accommodate and fix the isolator 30 and the focusing lens 40. The first structural component 91 has the following characteristics:

[0074] 1. Dedicated mounting positions were designed for the isolator 30 and the focusing lens 40 to ensure that the two optical elements maintain an accurate relative positional relationship;

[0075] 2. It provides robust mechanical support, reducing the impact of external vibrations on optical components;

[0076] 3. It has excellent sealing performance, which can effectively prevent dust and other impurities from affecting the performance of optical components.

[0077] In terms of optical path design, this embodiment still adopts a non-collinear design scheme. The optical system composed of the laser assembly 10, the collimating lens 20, and the optical elements in the first structural component 91 maintains a preset angular deviation between its optical axis and the central axis of the input waveguide 61 of the silicon photonics chip 60. The optical path is precisely turned by the optical prism 50, ensuring effective coupling with the input waveguide 61 of the silicon photonics chip 60.

[0078] The structure of the silicon photonics chip 60 remains unchanged, with internal functional units such as the input waveguide, beam splitter, modulator, and output waveguide arranged sequentially along the optical path. Similarly, the number of output waveguide ports 62 of the silicon photonics chip 60 can be configured to 1×N output ports according to actual needs, and the matching fiber array 70 also supports the corresponding 1×N expansion configuration.

[0079] This embodiment, through the combined design of the first structural component 91, has the following advantages:

[0080] 1. Improved assembly precision of the isolator and focusing lens;

[0081] 2. Enhanced the environmental adaptability of optical components;

[0082] 3. It simplifies the assembly process and improves production efficiency;

[0083] 4. It is beneficial to the long-term reliability of the product.

[0084] This improved structural design provides a more reliable technical solution for the transmitter structure of silicon photonics modules, and is particularly suitable for application scenarios that require high stability.

[0085] Example 6

[0086] like Figure 6 As shown, this embodiment discloses a transmitter structure for a silicon photonics module. This embodiment... Figure 1 The embodiment shown is an improvement upon the previous one, with the main innovation being the integration of the focusing lens 40 and the optical prism 50 into a single unit via the second structural component 92. This design not only enhances the integrity of this part of the device but also protects the optical elements and simplifies the lens coupling process.

[0087] Specifically, the transmitter structure of this embodiment includes a laser assembly 10, a collimating lens 20, an isolator 30, a combined assembly consisting of a focusing lens 40 and an optical prism 50, a silicon photonic chip 60, and a fiber array 70 arranged sequentially along the optical path. The collimating lens 20 is used to collimate the laser emitted from the laser assembly 10, ensuring the beam propagates in parallel. The isolator 30 controls the unidirectional transmission of light, improving the anti-reflection performance of the assembly.

[0088] The core improvement of this embodiment lies in the introduction of a second structural component 92, which is precisely designed to simultaneously accommodate and fix the focusing lens 40 and the optical prism 50. The second structural component 92 has the following characteristics:

[0089] 1. Precise alignment: Special mounting positions are designed for the focusing lens 40 and the optical prism 50 to ensure precise alignment of the optical paths between them and reduce assembly errors.

[0090] 2. Integrated protection: The two optical elements are encapsulated into a whole by the second structural component 92, which effectively prevents external factors such as dust and vibration from interfering with the optical elements.

[0091] 3. Passive setting: This assembly can be set passively, without the need for additional adjustment mechanisms, which simplifies the lens coupling process and improves assembly efficiency.

[0092] In terms of optical path design, this embodiment still adopts a non-collinear design scheme. The optical system composed of laser assembly 10, collimating lens 20, isolator 30, and combined components maintains a preset angular deviation between its optical axis and the central axis of the input waveguide 61 of silicon photonic chip 60. Precise optical path steering is achieved through optical prism 50, ensuring good mode field matching between the laser's output light and the input waveguide 61 of silicon photonic chip 60, thereby significantly reducing the influence of reflected light.

[0093] The internal structure of the silicon photonics chip 60 remains unchanged, with functional units such as an input waveguide, a beam splitter, a modulator, and an output waveguide arranged sequentially along the optical path. The number of output waveguide ports 62 of the silicon photonics chip 60 can be flexibly configured to 1×N output ports according to actual needs, and the corresponding fiber array 70 also supports a 1×N expansion configuration.

[0094] Through the above design, this embodiment has the following advantages:

[0095] 1. Improved integration: Combining the focusing lens 40 and the optical prism 50 into a single integrated component simplifies the optical path structure and improves the system's compactness.

[0096] 2. Enhanced stability: The second structural component 92 provides a solid mechanical support for the optical element, reducing the impact of external vibrations on the optical path.

[0097] 3. Simplified assembly: The passive modular design reduces assembly difficulty and improves production efficiency, making it particularly suitable for large-scale industrial applications.

[0098] This embodiment, through the combination design of the second structural component 92, provides a more efficient and stable technical solution for the transmitter structure of the silicon photonics module, and has broad application prospects.

[0099] Example 7,

[0100] This embodiment discloses a transmitter structure for a silicon photonics module. This embodiment, for example... Figure 7 As shown, the difference from embodiments 1-6 is that, in this embodiment, while meeting some structural design requirements, the angle between the central axis of the optical input unit and the edge L1 of the silicon photonic chip 60 is not 0°. Depending on the beam deflection angle of different optical prisms 50, to address the issue of refractive index change when light enters at the optical prism 50 and input waveguide 61, the angle between the central axis of the optical input unit and the input waveguide 61 can be 0° or not 0°, and the isolator 30 can be placed in front of or behind the focusing lens 40.

[0101] Example 8

[0102] This embodiment discloses a transmitter structure for a silicon photonics module. This embodiment, for example... Figure 8As shown, when meeting some structural design requirements, the optical prism 50 can be omitted, and a structure in which the central axis of the optical input unit is collinear with the input waveguide can also be adopted. To address the issue of refractive index change when light is incident at free space and the input waveguide 61, the angle between the central axis of the optical input unit and the input waveguide 61 can be non-0° to achieve better mode field matching. The isolator 30 can be placed in front of or behind the focusing lens 40. This technical solution has the advantages of simple structure and lower component cost, but it has higher requirements for component mounting and coupling processes.

[0103] It should be noted that the lens of the present invention includes all materials, such as silicon lens, glass lens, and plastic lens; the lens can be any shape, such as round, square, etc.

[0104] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0105] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A transmitter structure comprising a silicon photonic chip (60), the silicon photonic chip (60) comprising at least one input waveguide (61), and an optical input unit correspondingly disposed upstream of the optical path of each input waveguide (61), characterized in that, The central optical axis of the optical input unit is not collinear with the central optical axis of the input waveguide (61). An optical steering device is provided between the optical input unit and the silicon photonic chip (60) for receiving the light beam of the optical input unit and steering it to the input waveguide (61).

2. The transmitter structure according to claim 1, characterized in that, The optical steering device is an optical prism (50) or an optical reflector (80).

3. The transmitter structure according to claim 2, characterized in that, The optical prism (50) includes an incident surface facing the light input unit and an exit surface facing the input waveguide (61), and the incident surface and the exit surface are arranged non-parallel to each other.

4. The transmitter structure according to any one of claims 1-3, characterized in that, Alternatively, the optical input unit may include a laser assembly (10), a collimating lens (20), a focusing lens (40), and an isolator (30) arranged in sequence.

5. The transmitter structure according to claim 4, characterized in that, Includes a first structural component (91), one end of which is provided with an isolator mounting position and the other end with a focusing lens mounting position. The isolator mounting position and the focusing lens mounting position are connected to each other. The isolator (30) is installed in the isolator mounting position and the focusing lens (40) is installed in the focusing lens mounting position.

6. The transmitter structure according to claim 4, characterized in that, Includes a second structural component (92), one end of which is provided with a focusing lens mounting position and the other end is provided with an optical prism mounting position. The optical prism mounting position and the focusing lens mounting position are connected to each other. The focusing lens (40) is installed in the focusing lens mounting position and the optical prism (50) is installed in the optical prism mounting position.

7. The transmitter structure according to claim 1, characterized in that, The central optical axis of the optical input unit is parallel to the long side of the silicon photonic chip (60), or there is an angle between the central optical axis of the optical input unit and the long side of the silicon photonic chip (60).

8. The transmitter structure according to claim 1, characterized in that, The silicon photonic chip (60) includes at least one output waveguide (62), and an optical fiber array (70) is disposed downstream of the optical path of the output waveguide (62).

9. A silicon photonics module, characterized in that, Includes the transmitter structure as described in any one of claims 1-8.

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