Curing device for SMT patch processing

Abstract

The utility model belongs to the technical field of SMT patch curing, and particularly relates to a curing device for SMT patch processing, which comprises a reflow soldering machine, a support frame is mounted at the right end of the reflow soldering machine, and a plurality of electromagnet conveying rollers are mounted in the middle of the support frame; the cleaning roller brush and the cleaning disc brush can effectively remove dust, impurities and the like on the surface of a product, the high-pressure air injection gun further blows off fine particles of solder paste at a welding point, meanwhile, the solder paste at the welding point of a component welded on the PCB is polished to be flat, the high-pressure air injection gun also blows off burrs of the polished solder paste at the welding point, and the product quality is improved. According to the curing device for SMT patch processing, defects such as flying tin burrs, pseudo soldering, offset soldering and continuous tin caused by unevenness of solder paste are avoided, the cleanliness of the surface of a product before curing is guaranteed, the curing quality of the product is improved, a comprehensive cleaning function is achieved, and the problem that defects such as flying tin burrs, pseudo soldering, offset soldering and continuous tin occur to welding spots of an existing curing device for SMT patch processing is solved.

Description

Technical Field

[0001] This utility model belongs to the field of SMT chip curing technology, and in particular relates to a curing device for SMT chip processing. Background Technology

[0002] SMT stands for Surface Mount Technology, also known as surface mount technology or surface mounting. SMT component curing refers to the curing of the adhesive used for component mounting or assembly through heat or other methods, ensuring a strong bond between the components and the PCB board. The curing process is a crucial step in SMT assembly, ensuring the components are stably fixed on the PCB and preventing them from detaching during subsequent processing or use. SMT assembly primarily uses two curing methods: thermosetting and photopolymerization. The SMT assembly steps are as follows: component preparation, PCB fabrication, solder paste printing, component placement, reflow soldering, cleaning, and inspection.

[0003] After SMT placement of components on the PCB, the components are fed into a reflow soldering machine at room temperature. Hot air at a higher temperature blows onto the components on the PCB, causing a chemical reaction between the solder paste and flux during the heating and melting process. The solder paste and flux mix and firmly bond the component leads to the solder joints on the PCB. Then, the solder paste and flux are baked on the placed components at a lower temperature. Cooling with cold air dries and solidifies the solder paste and flux into solid solder joints, thus solidifying the components onto the PCB. Due to the "cold-hot-cold" temperature change process, the "thermal expansion and contraction" of the PCB can easily cause deformation of the solder joints. The solder paste flows when heated, causing misalignment and defects such as splattered solder, cold solder joints, misaligned solder joints, and solder bridging. This increases the defect rate and the workload of reworking defective products. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the defects of the prior art and solve the problems of solder joint defects such as flying solder burrs, cold solder joints, misaligned solder joints, and solder bridging in the existing SMT chip mounting equipment.

[0005] The technical solution adopted by this utility model to solve its technical problem is: a curing device for SMT chip processing, including a reflow soldering machine, a support frame installed at the right end of the reflow soldering machine, multiple electromagnet conveyor rollers installed in the middle of the support frame, and an iron conveyor belt connected to the periphery of the multiple electromagnet conveyor rollers, with the iron conveyor belt placed inside the support frame.

[0006] The inner side of the support frame is equipped with a cleaning roller brush, a cleaning disc brush, a high-pressure jet gun, and a cooling fan, from left to right. A second robotic arm is installed at the right end of the support frame.

[0007] In a preferred embodiment of this invention, a feeding belt is installed on the left side of the reflow soldering machine, and a first robotic arm is installed behind the feeding belt.

[0008] In a preferred embodiment of this invention, a protective cover is provided above the support frame, and the cleaning roller brush, cleaning disc brush, high-pressure jet gun, and cooling fan are located inside the protective cover.

[0009] Compared with the prior art, the beneficial effects achieved by this utility model are as follows:

[0010] The electromagnetic conveyor roller is used in conjunction with the iron conveyor belt to stably place the PCB board with the iron strips on the iron conveyor belt. It can efficiently transport the SMT surface mount products to be cured and ensure the stability of the products during the transport process. It helps to improve the overall efficiency of SMT surface mount processing and curing, and has the characteristics of efficient transport and curing.

[0011] The cleaning roller brush and cleaning disc brush can effectively remove dust, impurities and other contaminants from the product surface. The high-pressure air gun further blows away the fine particles of solder paste from the solder joints, while polishing the solder paste of the components soldered on the PCB board. The high-pressure air gun will also blow away the burrs of the polished solder paste, avoiding defects such as flying solder burrs, cold solder joints, misaligned solder joints and solder bridging due to uneven solder paste. This ensures the cleanliness of the product surface before curing, thereby improving the curing quality of the product and providing comprehensive cleaning function.

[0012] The cooling fan can quickly cool the product after curing, preventing deformation or damage due to high temperature and helping to improve the product yield. The protective cover above the support frame not only protects the internal cleaning roller brush, cleaning disc brush, high-pressure air gun and cooling fan, but also prevents external dust and impurities from entering, maintaining a clean environment inside the device, ensuring stable operation of the equipment, and has the functions of rapid cooling and protection.

[0013] The use of a feeding belt, a first robotic arm, and a second robotic arm together achieves automated loading and unloading of SMT (Surface Mount Technology) products, reducing manual operation, improving production efficiency, lowering labor costs, and also reducing the risk of errors and damage that may be caused by manual operation, thus achieving automated loading and unloading. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0015] Figure 2 This is a left view of the internal structure of this utility model;

[0016] Figure 3 This is a right view of the internal structure of this utility model.

[0017] In the diagram: 1. Reflow soldering machine; 2. First robotic arm; 3. Feeding belt; 4. Iron conveyor belt; 5. Cleaning roller brush; 6. Cleaning disc brush; 7. High-pressure air gun; 8. Cooling fan; 9. Second robotic arm; 10. Support frame; 11. Electromagnetic conveyor roller; 12. Protective cover. Detailed Implementation

[0018] Please see Figure 1-3 This utility model provides a technical solution: a curing device for SMT chip mounting, including a reflow soldering machine 1. A support frame is installed on the right end of the reflow soldering machine 1. Multiple electromagnet conveyor rollers 11 are installed in the middle of the support frame. An iron conveyor belt 4 is externally connected between the multiple electromagnet conveyor rollers 11 and is placed inside the support frame 10. From left to right, a cleaning roller brush 5, a cleaning disc brush 6, a high-pressure air gun 7, and a cooling fan 8 are installed inside the support frame 10. A second robotic arm 9 is installed on the right end of the support frame 10. A feeding belt 3 is installed on the left side of the reflow soldering machine 1. A first robotic arm 2 is installed behind the feeding belt 3. Iron bars are pre-tied on the PCB board after SMT chip mounting. The first robotic arm 2 places the PCB board onto the feeding belt 3 and conveys it into the reflow soldering machine 1. The reflow soldering machine 1 guides the SMT-mounted components on the PCB board. The solder paste firmly bonds the solder joints. After reflow soldering, the PCB board is conveyed by the reflow soldering machine 1 onto the iron conveyor belt 4. The electromagnet conveyor roller 11 has an electromagnet inside, and the electromagnet has an induction coil wound around the iron core. The iron core is connected to the outside of the adjacent electromagnet conveyor roller 11. The outside of the electromagnet conveyor roller 11 contains iron and is magnetic. When the electromagnetic induction coil inside the electromagnet conveyor roller 11 is energized, all the electromagnet conveyor rollers 11 will generate magnetism, and the surface of the iron conveyor belt 4 will generate magnetism. The surface of the iron conveyor belt 4 will attract the iron strips tied to the PCB board. The iron strips hold the PCB board on the iron conveyor. The electromagnet conveyor roller 11 and the iron conveyor belt 4 work together to make the PCB board with the iron strips firmly placed on the iron conveyor belt 4. The iron conveyor belt 4 conveys the PCB board from left to right towards the second robot arm 9. It can efficiently convey the SMT surface mount products to be cured and ensure the stability of the products during the conveying process. It helps to improve the overall efficiency of SMT surface mount processing and curing, and has the characteristics of efficient conveying and curing.

[0019] The cleaning roller brush 5 and cleaning disc brush 6 are electrically driven (powered by a built-in electric motor). The cleaning roller brush 5 and cleaning disc brush 6 can effectively remove dust, impurities, etc. from the product surface. The high-pressure air gun 7 further blows away the fine particles of solder paste on the solder joints, and at the same time polishes the solder paste on the solder joints of the components soldered on the PCB board. The high-pressure air gun 7 will also blow away the burrs and debris of the solder paste that are polished off, so that the solder paste on the surface of the PCB board remains flat, avoiding defects such as flying solder burrs, cold solder joints, misaligned solder joints, and solder bridging due to uneven solder paste. The cooling fan 8 can quickly cool down the product after it has been cured. The cooling fan 8 has the functions of rapid cooling and protection, preventing the product from deforming or being damaged due to high temperature, which helps to improve the product yield.

[0020] A protective cover 12 is installed above the support frame 10. The cleaning roller brush 5, cleaning disc brush 6, high-pressure air gun 7, and cold air cooling fan 8 are installed inside the protective cover 12. The protective cover 12 installed above the support frame 10 can not only protect the internal components such as the cleaning roller brush 5, cleaning disc brush 6, high-pressure air gun 7, and cold air cooling fan 8, but also prevent external dust and impurities from entering, maintain a clean environment inside the device, ensure the cleanliness of the product surface before curing, have a comprehensive cleaning function, improve the curing quality of the product, and ensure the stable operation of the equipment.

[0021] After the SMT components on the PCB are cured, the electromagnet conveyor roller 11 is de-energized, causing the iron conveyor belt 4 to lose its magnetism. The cured PCB is then picked up and removed from the iron conveyor belt 4 by the second robotic arm 9. The first robotic arm 2 then picks up the next PCB and places it on the feeding belt 3. The feeding belt 3 continuously feeds the reflow soldering machine 1 with the SMT-assembled PCBs. The feeding belt 3, the first robotic arm 2, and the second robotic arm 9 work together to achieve automated loading and unloading of SMT products, reducing manual operation, improving production efficiency, and lowering labor costs. It also reduces the risk of errors and damage that may be caused by manual operation, thus achieving automated loading and unloading.

Claims

1. A curing apparatus for SMT chip mounting, comprising a reflow soldering machine (1), characterized in that: The reflow soldering machine (1) is equipped with a support frame on the right end. Multiple electromagnet conveyor rollers (11) are installed in the middle of the support frame. An iron conveyor belt (4) is connected to the multiple electromagnet conveyor rollers (11) in the outer periphery. The iron conveyor belt (4) is placed inside the support frame (10). The inner side of the support frame (10) is equipped with a cleaning roller brush (5), a cleaning disc brush (6), a high-pressure jet gun (7) and a cold air cooling fan (8) from left to right. A second robotic arm (9) is installed at the right end of the support frame (10).

2. The curing apparatus for SMT assembly as described in claim 1, characterized in that: The reflow soldering machine (1) is equipped with a feeding belt (3) on the left side, and a first robotic arm (2) is installed behind the feeding belt (3).

3. The curing apparatus for SMT assembly as described in claim 1, characterized in that: A protective cover (12) is laid on top of the support frame (10), and the cleaning roller brush (5), cleaning disc brush (6), high-pressure jet gun (7) and cold air cooling fan (8) are located inside the protective cover (12).

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