Semiconductor packaging structure

Abstract

The utility model relates to a semiconductor packaging structure, and the structure comprises a circuit board which comprises a main line substrate and an auxiliary line substrate, the chip is arranged on the main line substrate, and the surface of the chip is covered with a plastic packaging layer; and the external electronic device is arranged on the auxiliary line substrate, and the main line substrate is electrically connected with the auxiliary line substrate. According to the semiconductor packaging structure provided by the invention, the chip and the external electronic device are arranged on different circuit substrates, so that when the chip is subjected to plastic packaging, the external electronic device is not influenced, after the chip is subjected to plastic packaging, the auxiliary circuit substrate is assembled to the main circuit substrate, a specific mold does not need to be formed through mold opening, and material waste is not caused.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor, in particular to a semiconductor packaging structure. BACKGROUND

[0002] The packaging technology is a technology of packing integrated circuits with insulating plastic or ceramic material. The packaging technology is necessary and crucial for chips, because chips must be isolated from the outside world to prevent impurities in the air from corroding the chip circuit and causing electrical performance to decline.

[0003] The connector element or sensor element in need of external contact in the packaging structure needs to be exposed to connect with external elements. For the packaging structure in which part of the element needs to be exposed, a special-shaped mold is generally used for packaging. The special-shaped mold is designed as a protrusion in the part that needs to be exposed to block the plastic sealing material from being filled in. However, the development cost of the special-shaped mold is high, and the cycle is long. The part that needs to be sealed is sealed by using the dispensing method, and the exposed part is not dispensed. However, the dispensing height, dispensing size and flatness after dispensing are very difficult to control in this process.

[0004] In order to solve this technical problem, the related technology sets a protective shell on the circuit board to cover the sensor element in need of external contact. After the chip is packaged by using the plastic sealing layer, the protective shell is cut off to expose the sensor element in need of external contact. This brings the metal problem that the protective shell needs to be set on the circuit board, and the protective shell needs to be removed by cutting to expose the sensor element, which causes complex process and material waste. UTILITY MODEL CONTENT

[0005] The present application provides a semiconductor packaging structure, which can solve the technical problem of complex packaging process and material waste of the existing semiconductor packaging structure.

[0006] A semiconductor packaging structure comprises:

[0007] A circuit board comprising a main circuit substrate and an auxiliary circuit substrate arranged independently;

[0008] A chip arranged on the main circuit substrate, and a surface of the chip being covered with a plastic sealing layer; and

[0009] An external electronic device arranged on the auxiliary circuit substrate, and the main circuit substrate and the auxiliary circuit substrate being electrically connected.

[0010] In one embodiment, the main circuit substrate is provided with a groove, and the auxiliary circuit substrate is arranged in the groove.

[0011] In one embodiment, the thickness of the auxiliary circuit substrate is consistent with the depth of the groove.

[0012] In one of the embodiments, the groove is opened from the edge to the middle region; or

[0013] The groove is opened in the central region of the main circuit substrate.

[0014] In one of the embodiments, the main circuit substrate and the auxiliary circuit substrate are spliced.

[0015] In one of the embodiments, the main circuit substrate is a flexible circuit substrate, and the auxiliary circuit substrate is a hard circuit board.

[0016] In one of the embodiments, the main circuit substrate is provided with main pins, and the auxiliary circuit substrate is provided with auxiliary pins, and the main pins and the auxiliary pins are connected one by one.

[0017] In one of the embodiments, the auxiliary circuit substrate and the main circuit substrate are arranged with a spacing, and the spacing is filled with a thermosetting glue for fixing the auxiliary circuit substrate and the main circuit substrate.

[0018] In one of the embodiments, the surface of the external electronic device is coated with a heat-conducting glue, and the surface of the heat-conducting glue is attached with a heat dissipation fin.

[0019] In one of the embodiments, the auxiliary circuit substrate and the main circuit substrate are detachably connected. The semiconductor packaging structure provided by the application can achieve the following technical effects:

[0020] 1. The scheme provided by the application sets the chip on the main circuit substrate, sets the connector element connected with the outside on the auxiliary circuit substrate, fixes the auxiliary circuit substrate and the main circuit substrate after the main circuit substrate is packaged, thereby avoiding the increase of the packaging process complexity caused by setting an additional metal shell to protect the connector element, and saving the material and preventing the waste of the material due to the absence of the need to set the metal shell.

[0021] 2. The main circuit substrate adopts a flexible material, which can provide better adaptability in different use environments, especially in occasions requiring bending or deformation; and the auxiliary circuit substrate is a hard material, which provides stable support and ensures the efficient connection of the external electronic device and the circuit. DETAILED DESCRIPTION

[0022] Figure 1 is a structure schematic view of a semiconductor packaging structure provided by the first embodiment of the application;

[0023] Figure 2 is still another structure schematic view of a semiconductor packaging structure provided by the first embodiment of the application.

[0024] Explanation of reference signs: 100, semiconductor package structure; 10, main circuit substrate; 12, auxiliary circuit substrate; 1, circuit board; 2, chip; 3, external electronic device; 101, groove; 5, thermosetting glue; 4, plastic encapsulation layer; 6, heat dissipation fin. DETAILED DESCRIPTION

[0025] The following description will be made in conjunction with the accompanying drawings. Figures 1-2 The semiconductor package structure provided in the present application is further described in detail.

[0026] Embodiment 1

[0027] Please refer to Figure 1 The semiconductor package structure 100 provided in the embodiment of the present application includes a circuit board 1, a chip 2 and an external electronic device 3.

[0028] The circuit board 1 is composed of a main circuit substrate 10 and an auxiliary circuit substrate 12 which are independently arranged; the chip 2 is arranged on the main circuit substrate 10, and the surface of the chip 2 is covered with a plastic encapsulation layer 4. The external electronic device 3 is arranged on the auxiliary circuit substrate 12, and the main circuit substrate 10 and the auxiliary circuit substrate 12 are electrically connected.

[0029] The external electronic device 3 includes resistors, inductors and capacitors which are used in sensors, connectors and auxiliary connectors, as well as passive filters, resonators, converters and switches which are composed of these elements. These elements have many important functions, such as bias, decoupling, switching noise suppression, filtering, tuning, etc., which are not limited herein.

[0030] Specifically, the main circuit substrate 10 can be a flexible board made of flexible material or a hard substrate made of hard material. The flexible part is made of polyimide or polyester film, which has good flexibility and high temperature resistance, and is suitable for complex installation environment, such as bending or folding.

[0031] The hard part is made of FR-4 epoxy glass cloth copper clad plate, which has high mechanical strength and electrical insulation performance, and is suitable for carrying high-power devices and high-frequency signal transmission modules. The main circuit substrate 10 and the auxiliary circuit substrate 12 can be spliced by welding, pressing or other mechanical connection methods to form an integral structure.

[0032] The main circuit substrate 10 is provided with a plurality of grooves 101 for accommodating the auxiliary circuit substrate 12. The grooves 101 can be opened at different positions of the main circuit substrate 10, such as gradually from the edge to the middle area or located in the center area, as shown in Figure 2 The shape of the groove 101 can be rectangular, circular or elliptical to adapt to different sizes of the auxiliary circuit substrate 12.

[0033] The thickness of the auxiliary circuit board 12 is consistent with the depth of the groove 101, ensuring that the two are closely fitted, reducing air gap, and improving heat dissipation efficiency. The material of the auxiliary circuit board 12 can be a ceramic substrate or a metal matrix composite, which has good thermal conductivity and mechanical stability.

[0034] The main circuit board 10 and the auxiliary circuit board 12 can also be filled with a thermosetting glue 5 to further enhance the fixing effect of the two, preventing loosening caused by vibration or temperature changes. The thermosetting glue 5 can be selected from two-component epoxy resin or silicone rubber, which has excellent adhesion and temperature resistance.

[0035] The main circuit board 10 is also provided with main pins (not shown in the figure), and the auxiliary circuit board 12 is provided with auxiliary pins (not shown in the figure), which are connected one by one to realize electrical communication. The main pins can be made of gold fingers, copper pillars or other conductive materials to ensure good conductivity and corrosion resistance. The auxiliary pins also use gold fingers, copper pillars or other conductive materials, and are connected one by one with the main pins to realize reliable electrical communication. The main circuit board 10 and the auxiliary circuit board 12 are spaced apart, and the space is filled with fixed thermosetting glue 5. Preferably, the thermosetting glue 5 is in contact with the sidewall of one of the chips to seal the sidewall of the chip 2. The thermosetting glue 5 is a heat-conducting glue that can not only fix the main circuit board 10 and the auxiliary circuit board 12 but also be used for heat dissipation of the chip 2.

[0036] The implementation principle of the embodiment is to separate the main circuit board 10 and the auxiliary circuit board 12, and precisely dock them through the groove 101 and the pins, achieving high-density packaging while maintaining good reliability and heat dissipation performance. This method not only improves space utilization but also reduces manufacturing costs to some extent, and is suitable for various high-density and high-performance electronic devices. In addition, when the main circuit board 10 provided with the chip 2 is molded, the additional metal shell for protecting the external electronic device 3 can be avoided, which increases the complexity of the packaging process. Since there is no need to set up a metal shell, this part of the material is saved, and waste of materials is avoided.

[0037] Embodiment 2

[0038] The difference between this embodiment and the above-mentioned embodiments is that the connection method between the main circuit board 10 and the auxiliary circuit board 12 adopts a magnetic attraction type connection. Specifically, a placement hole (not shown in the figure) is provided on the main circuit board 10 and the auxiliary circuit board 12, respectively, and a plurality of permanent magnets are arranged in the placement hole. The two are tightly combined together through magnetic attraction. This connection method is not only simple and convenient to operate, but also can be quickly disassembled and replaced, which is convenient for maintenance and upgrading.

[0039] Specifically, the magnetic connection design is as follows: The permanent magnet is made of high-strength magnetic materials such as neodymium iron boron and samarium cobalt alloy, possessing strong magnetic force and a long service life. The shape and size of the permanent magnet can be flexibly selected according to actual needs, commonly including round, square, and rectangular shapes. Soft magnetic material: To avoid excessive magnetic force that makes separation difficult, a layer of soft magnetic material, such as ferrite or nickel-zinc alloy, can be wrapped around the permanent magnet to adjust the magnetic force.

[0040] In a further embodiment, the surface of the external electronic device 3 is coated with thermally conductive adhesive (not shown), and heat dissipation fins 6 are attached to the surface of the thermally conductive adhesive. The heat dissipation fins 6 are used to dissipate heat from the external electronic device 3 in a timely manner, ensuring the reliability of the operation of the external electronic device 3.

[0041] Example 2

[0042] The difference between this embodiment and the previous embodiment is that the connection between the main circuit board 10 and the auxiliary circuit board 12 is a magnetic connection. Specifically, mounting holes (not shown) are respectively provided on the main circuit board 10 and the auxiliary circuit board 12, and multiple sets of permanent magnets are arranged in the mounting holes. The two are tightly connected by magnetic attraction. This connection method is not only simple and convenient to operate, but also allows for quick disassembly and replacement, facilitating maintenance and upgrades.

[0043] Specifically, the magnetic connection design is as follows: The permanent magnet is made of high-strength magnetic materials such as neodymium iron boron and samarium cobalt alloy, possessing strong magnetic force and a long service life. The shape and size of the permanent magnet can be flexibly selected according to actual needs, commonly including round, square, and rectangular shapes. Soft magnetic material: To avoid excessive magnetic force that makes separation difficult, a layer of soft magnetic material, such as ferrite or nickel-zinc alloy, can be wrapped around the permanent magnet to adjust the magnetic force.

[0044] In a further embodiment, the surface of the external electronic device 3 is coated with thermally conductive adhesive (not shown), and heat dissipation fins 6 are attached to the surface of the thermally conductive adhesive. The heat dissipation fins 6 are used to dissipate heat from the external electronic device 3 in a timely manner, ensuring the reliability of the operation of the external electronic device 3.

[0045] Example 3

[0046] The difference between this embodiment and the previous embodiment is that the connection between the main circuit board 10 and the auxiliary circuit board 12 is a detachable connection. For example, connectors (such as slots and plugs) are used to connect the two boards. The connectors can be designed with standardized interfaces for easy connection and disassembly. This connection method facilitates maintenance and upgrades and reduces the complexity of the packaging process.

[0047] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A semiconductor packaging structure, characterized in that, include: The circuit board (1) includes an independently set main circuit board (10) and an auxiliary circuit board (12); A chip (2) is disposed on the main circuit substrate (10), and the surface of the chip (2) is covered with a molding compound (4); and An external electronic device (3) is disposed on the auxiliary circuit board (12), and the auxiliary circuit board (12) is fixed and electrically connected to the main circuit board (10).

2. The semiconductor packaging structure according to claim 1, characterized in that: The main circuit board (10) has a groove (101), and the auxiliary circuit board (12) is disposed in the groove (101).

3. A semiconductor packaging structure according to claim 2, characterized in that: The thickness of the auxiliary circuit board (12) is the same as the depth of the groove (101).

4. A semiconductor packaging structure according to claim 2, characterized in that: The groove (101) is formed from the edge towards the center; or The groove (101) is formed in the central region of the main circuit board (10).

5. A semiconductor packaging structure according to claim 1, characterized in that: The main circuit board (10) and the auxiliary circuit board (12) are spliced ​​together to form the main circuit board (10).

6. A semiconductor packaging structure according to any one of claims 1-5, characterized in that: The main circuit board (10) is a flexible circuit board, and the auxiliary circuit board (12) is a rigid circuit board; or Both the main circuit board (10) and the auxiliary circuit board (12) are rigid circuit boards; or The main circuit board (10) is a multilayer circuit board.

7. A semiconductor packaging structure according to claim 6, characterized in that: The main circuit board (10) is provided with main pins, and the auxiliary circuit board (12) is provided with auxiliary pins. The main pins and auxiliary pins are connected in a one-to-one correspondence.

8. A semiconductor packaging structure according to claim 7, characterized in that: The auxiliary circuit board (12) and the main circuit board (10) are spaced apart, and the space is filled with thermosetting adhesive (5) that fixes the auxiliary circuit board (12) and the main circuit board (10).

9. A semiconductor packaging structure according to claim 8, characterized in that: The surface of the external electronic device (3) is coated with thermally conductive adhesive, and heat dissipation fins (6) are attached to the surface of the thermally conductive adhesive.

10. A semiconductor packaging structure according to claim 7, characterized in that: The auxiliary circuit board (12) is detachably connected to the main circuit board (10).

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