Wafer expanding ring and die bonding equipment

Abstract

The utility model relates to the technical field of semiconductor production equipment, and discloses a wafer expanding ring and a wafer fixing device, the wafer expanding ring comprises an inner ring, an outer ring and a wafer expanding film, the wafer expanding film covers the top surface of the inner ring, the outer ring is sleeved outside the inner ring, the outer ring and the inner ring are concentrically arranged, the outer ring and the inner ring cooperate to clamp the wafer expanding film, and the wafer expanding film is fixed on the outer ring. Wherein a first chamfer surface is arranged at the bottom of the inner periphery of the inner ring. According to the utility model, the positioning and assembling efficiency of the wafer expanding ring on the die bonder can be improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing equipment technology, and in particular to a die expansion ring and die bonding equipment. Background Technology

[0002] During the Mini LED manufacturing process, factors such as equipment flatness, cavity pressure differences, usage time of the expansion ring, and thickness of the expansion film can cause the expansion ring to easily deform into an ellipse after the expansion film has expanded. Because the robotic arm cannot adjust the shape of the deformed expansion ring to fit the die bonding stage when installing the expanded ring, it frequently encounters situations where the robotic arm cannot effectively press the expansion ring with the expansion film onto the die bonding stage, further triggering equipment alarms.

[0003] Currently, in cases where robotic arms cannot effectively press-fit the expansion rings, manual labor is required to remove the expansion rings from the robotic arms, manually adjust their shape, and then press them onto the die bonding stage, which affects the production process and efficiency. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a die expander ring to improve the positioning and assembly efficiency of the die expander ring on the die bonder.

[0005] To solve the above-mentioned technical problems, this utility model provides a crystal expansion ring, including an inner ring, an outer ring, and a crystal expansion film. The crystal expansion film covers the top surface of the inner ring, and the outer ring is sleeved outside the inner ring. The outer ring and the inner ring are concentrically arranged, and the outer ring and the inner ring cooperate to clamp the crystal expansion film. The bottom of the inner periphery of the inner ring is provided with a first chamfer surface.

[0006] As an improvement to the above solution, the first chamfered surface is open to the bottom end of the inner ring.

[0007] As an improvement to the above scheme, the first chamfered surface is an inner conical toroidal surface.

[0008] As an improvement to the above solution, the inner ring protrudes to the bottom of the outer ring, and the bottom of the inner ring has slots arranged in a circumferential array.

[0009] As an improvement to the above solution, the top of the outer side wall of the inner ring is provided with a second chamfered surface.

[0010] As an improvement to the above scheme, the second chamfered surface is an outer conical toroidal surface.

[0011] As an improvement to the above solution, the inner sidewall of the outer ring is provided with a wedge-shaped protrusion for abutting against the second chamfered surface.

[0012] In addition, this utility model also provides a die bonding device, which includes a die bonding stage and the aforementioned die expansion ring. The die bonding stage is provided with a support cylinder, and the inner ring is sleeved on the support cylinder.

[0013] Implementing this utility model has the following beneficial effects:

[0014] This utility model discloses a die expansion ring. By setting a chamfer on the inner ring of the die expansion ring, specifically setting a first chamfer surface at the bottom of the inner periphery of the inner ring, the die expansion ring can be easily pressed onto the die bonding stage by a robotic arm even when deformed into an ellipse with a larger eccentricity, i.e., the deformation amount of the die expansion ring is larger and the deformed ellipse is flatter. When assembling the die expansion ring holding the die expansion film onto the die bonding machine, the robotic arm can more easily press the die expansion ring onto the die bonding stage, the operation is smoother, the automatic positioning and assembly efficiency of the die expansion ring on the die bonding machine is improved, equipment alarms are greatly reduced, the workload of employees is reduced, and the equipment uptime is improved. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of the first embodiment of the crystal expansion ring of this utility model;

[0016] Figure 2 yes Figure 1 A magnified structural diagram of part A;

[0017] Figure 3 This is a schematic diagram of the second embodiment of the crystal expansion ring of this utility model;

[0018] Figure 4 This is a schematic diagram of the installation structure of the expansion ring on a crystal expansion device according to this utility model;

[0019] Figure 5 yes Figure 4 A magnified structural diagram of part B. Detailed Implementation

[0020] To make the objectives, technical solutions and advantages of this utility model clearer, the utility model will be described in further detail below with reference to the accompanying drawings.

[0021] like Figure 1 and Figure 2 As shown, this utility model discloses a first embodiment of a crystal expansion ring, including an inner ring 1, an outer ring 2 and a crystal expansion film 3. The crystal expansion film 3 covers the top surface of the inner ring 1, and the outer ring 2 is sleeved on the outside of the inner ring 1. The outer ring 2 is concentrically arranged with the inner ring 1, and the outer ring 2 and the inner ring 1 cooperate to clamp the crystal expansion film 3. The bottom of the inner periphery of the inner ring 1 is provided with a first chamfered surface 11.

[0022] In this embodiment, by setting a chamfer on the inner ring 1 of the die expansion ring, specifically by setting a first chamfer surface 11 at the bottom of the inner periphery of the inner ring 1, when the die expansion ring holding the die expansion film 3 is assembled onto the die bonder, the robot arm can more easily press the die expansion ring onto the die bonder stage, the operation is smoother, the automatic positioning and assembly efficiency of the die expansion ring on the die bonder is improved, equipment alarms are greatly reduced, the workload of employees is reduced, and the equipment utilization rate is improved.

[0023] After the die expansion film 3 on the die expansion ring completes the die expansion, the die expansion film 3 is tightly stretched on the top surface of the inner ring 1. The wafers on the die expansion film 3 are evenly distributed on the top surface of the die expansion film 3, and the outer ring 2 and the inner ring 1 cooperate to clamp the die expansion film 3. When the existing die expansion ring undergoes slight deformation during the die expansion process, that is, when the inner ring 1 and the outer ring 2 are deformed into an elliptical shape with a small eccentricity during the die expansion process, it is difficult to directly press onto the die bonding stage by a robot. By setting a chamfer at the bottom of the inner sidewall of the inner ring 1, even if the inner ring 1 and the outer ring 2 are deformed into an ellipse with a larger eccentricity, that is, the deformation of the inner ring 1 and the outer ring 2 is greater and the deformation is flatter, the first chamfer surface 11 is set at the bottom of the inner periphery of the inner ring 1. The first chamfer surface 11 increases the positioning area between the inner ring 1 and the die bonding stage, which helps the inner ring 1 to better match the die bonding stage. It can be successfully pressed onto the die bonding stage by a robot alone.

[0024] In addition, such as Figure 4 and Figure 5 As shown, this utility model also discloses an embodiment of a die bonding apparatus, which includes a die bonding stage and the aforementioned die expansion ring. The die bonding stage is provided with a support cylinder 4 for mounting the die expansion ring, and the inner ring 1 is sleeved on the support cylinder 4 to fix the wafer on the die expansion film 3 in the die bonding area.

[0025] Specifically, the first chamfered surface 11 is open towards the bottom end of the inner ring 1 to allow the die expander ring to quickly fit into the support cylinder 4 of the die bonder, while reducing the resistance of the die expander ring during overall pressing. The first chamfered surface 11 can be configured as a polygonal planar annular array arranged at an angle downwards. Since the support cylinder 4 used to mount the die expander ring on the die bonder is generally cylindrical, in this embodiment, the first chamfered surface 11 is preferably configured as an inner conical annular surface to reduce friction between the inner ring 1 and the support cylinder 4, making it easier to press the die expander ring into place. The top of the inner conical annular surface can fit into the outer wall of the support cylinder 4, and the bottom of the inner conical annular surface expands outwards towards the outer wall of the support cylinder 4. The angle between the first chamfered surface 11 and the axial direction of the inner ring 1 is preferably 30 to 75°.

[0026] Better, such as Figure 3 As shown, the inner ring 1 protrudes towards the bottom of the outer ring 2, and the bottom of the inner ring 1 has slots 13 arranged in a circumferential array. The outer ring 2 body between adjacent slots 13 expands outward, making it easier to fit with the support cylinder 4 during the press-fitting process.

[0027] Furthermore, this embodiment also provides a second chamfered surface 12 on the top of the outer side wall of the inner ring 1 to facilitate the fitting and assembly of the inner ring 1 and the outer ring 2 when clamping the expansion film 3, especially when the thickness of the expansion film 3 is large, the outer ring 2 can also be smoothly fitted from the top of the inner ring 1. The second chamfered surface 12 is an outer conical annular surface, which can significantly reduce the frictional force when the inner ring 1 and the outer ring 2 are fitted and assembled. The inner side wall of the outer ring 2 is provided with a wedge-shaped protrusion 21 for abutting against the second chamfered surface 12. When the wedge-shaped protrusion 21 abuts against the second chamfered surface 12, the top surfaces of the outer ring 2 and the inner ring 1 are flush, and the force on the inner ring 1 and the outer ring 2 is more even during the process of the robot pressing the expansion ring.

[0028] The inner ring 1 and outer ring 2 of the die expansion ring provided in this embodiment are easy to assemble, and even if the die expansion ring is deformed during the die expansion process, the robot arm can easily press the die expansion ring onto the support cylinder 4 of the die bonder, reducing human intervention, helping to improve the smooth operation of the equipment and increase production efficiency.

[0029] The above-disclosed embodiment is merely a preferred embodiment of the present utility model and should not be construed as limiting the scope of the present utility model. Therefore, any equivalent variations made in accordance with the claims of the present utility model shall still fall within the scope of the present utility model.

Claims

1. A crystal expansion ring, characterized in that, It includes an inner ring, an outer ring, and a crystal expansion film. The crystal expansion film covers the top surface of the inner ring, and the outer ring is sleeved outside the inner ring. The outer ring and the inner ring are concentrically arranged, and the outer ring and the inner ring cooperate to clamp the crystal expansion film. The bottom of the inner periphery of the inner ring is provided with a first chamfer surface.

2. The crystal expansion ring as described in claim 1, characterized in that, The first chamfered surface is open to the bottom end of the inner ring.

3. The crystal expansion ring as described in claim 1 or 2, characterized in that, The first chamfered surface is an inner conical toroidal surface.

4. The crystal expansion ring as described in claim 1 or 2, characterized in that, The inner ring protrudes towards the bottom of the outer ring, and the bottom of the inner ring has slots arranged in a circumferential array.

5. The crystal expansion ring as described in claim 2, characterized in that, The top of the outer wall of the inner ring is provided with a second chamfered surface.

6. The crystal expansion ring as described in claim 5, characterized in that, The second chamfered surface is an outer conical toroidal surface.

7. The crystal expansion ring as described in claim 5 or 6, characterized in that, The inner wall of the outer ring is provided with a wedge-shaped protrusion for abutting against the second chamfered surface.

8. A die bonding apparatus, characterized in that, It includes a die bonding stage and a die expansion ring as described in any one of claims 1 to 7, wherein the die bonding stage is provided with a support cylinder and the inner ring is sleeved on the support cylinder.

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