Heating bag of liquid heater

Abstract

The utility model belongs to the field of liquid heaters, and particularly relates to a heating bag of a liquid heater. Comprising a chip fixing frame, the chip fixing frame is further provided with a spacing bar, the spacing bar divides the interior of the chip fixing frame into a first containing area and a second containing area, PTC core bodies are arranged in the first containing area and the second containing area, and the PTC chip further comprises a positive electrode plate. The positive electrode plate is located below the PTC core body and connected with the PTC chips in the first containing area and the second containing area at the same time, the first negative electrode plate is located in the first containing area, the first negative electrode plate is located above the PTC core body in the first containing area and connected with the PTC chip in the second containing area, and the second negative electrode plate is located above the PTC core body in the second containing area and connected with the PTC chip in the second containing area. The second negative electrode plate is positioned in the second accommodating area, and the second negative electrode plate is positioned on the PTC core body in the second accommodating area and is connected with the PTC core body; the utility model designs the heating bag of the liquid heater, which is integrally mounted and has few welding steps.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the field of liquid heater, especially relate to a heating package of liquid heater which is simple in structure and convenient to install. BACKGROUND

[0002] The heating package of the liquid heater in prior art is inserted and installed by multiple small heating packages, then parallel power supply is carried out through the adapter plate, each small heating package needs to be welded separately, the working hours are long, and there is the risk of false welding and missed welding. SUMMARY

[0003] In view of the deficiencies in the prior art, the utility model designs a heating package of liquid heater which is integrally installed and has few welding steps.

[0004] The technical scheme of the utility model is as follows:

[0005] The heating package of the liquid heater comprises a chip fixing frame, a spacing strip is further arranged on the chip fixing frame, the spacing strip divides the inside of the chip fixing frame into a first accommodating area and a second accommodating area, PTC cores are arranged in the first accommodating area and the second accommodating area, a positive electrode sheet is further arranged, the positive electrode sheet is arranged below the PTC cores and is connected with the PTC cores in the first accommodating area and the second accommodating area, a first negative electrode sheet and a second negative electrode sheet are further arranged, the first negative electrode sheet is arranged in the first accommodating area, the first negative electrode sheet is arranged above the PTC cores in the first accommodating area and is connected with the PTC cores, the second negative electrode sheet is arranged in the second accommodating area, the second negative electrode sheet is arranged above the PTC cores in the second accommodating area and is connected with the PTC cores.

[0006] Further, the lower end surface of the spacing strip is flush with the surface of the PTC core, the lower surface of the positive electrode sheet is higher than the surface of the chip fixing frame, one end of the positive electrode sheet is provided with a positive pin, the chip fixing frame is provided with a first accommodating slot, and the positive pin is embedded in the first accommodating slot.

[0007] Further, the upper surfaces of the first negative electrode sheet and the second negative electrode sheet are higher than the upper surface of the chip fixing frame, the first negative electrode sheet is provided with a first negative pin, the second negative electrode sheet is provided with a second negative pin, the chip fixing frame is provided with a second accommodating slot and a third accommodating slot, the first negative pin is embedded in the second accommodating slot, and the second negative pin is embedded in the third accommodating slot.

[0008] Further, the utility model further comprises an insulating heat-conducting film, and the insulating heat-conducting film covers the surfaces of the first negative electrode sheet, the second negative electrode sheet and the positive electrode sheet.

[0009] Further, the protective plate includes an upper protective plate, a lower protective plate, and a transition part connecting the upper protective plate and the lower protective plate.

[0010] Further, the lower protective plate is provided with side edge baffle plates extending downward at both ends in the width direction of the chip fixing frame.

[0011] In summary, the utility model has the following beneficial effects:

[0012] The heating bag is a whole, convenient to install, only needs to externally connect the positive electrode sheet, the first negative electrode sheet and the second negative electrode sheet, does not need to carry out a large number of welding, reduces manufacturing difficulty, improves production efficiency, and guarantees the quality of product. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 It is a three-dimensional schematic view of the utility model;

[0014] Fig. 2 It is an explosion schematic view of the utility model;

[0015] Fig. 3 It is an explosion schematic view of the chip fixing frame, the PTC core, the positive electrode sheet, the first negative electrode sheet and the second negative electrode sheet;

[0016] 1 is a chip fixing frame in the drawing,

[0017] 10 is a spacing strip, 11 is a first containing area, 12 is a second containing area, 13 is a first accommodation slot, 14 is a second accommodation slot, 15 is a third accommodation slot,

[0018] 3 is a PTC core,

[0019] 4 is a positive electrode sheet, and 40 is a positive lead,

[0020] 5 is a first negative electrode sheet, and 50 is a first negative lead,

[0021] 6 is a second negative electrode sheet, and 60 is a second negative lead,

[0022] 7 is an insulating heat-conducting film, 8 is a protective plate, 80 is an upper protective plate, 81 is a lower protective plate, 82 is a transition part, and 810 is a side edge baffle plate. DETAILED DESCRIPTION

[0023] The present application will be further described below in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the present application and implement it, but the embodiments are not limiting to the present application.

[0024] It is to be noted that when an element as claimed in "set on", "fixed on" another element, it can be directly on another element or can exist in the middle of the element. When an element is referred to as "fixed on" another element, or "fixedly connected" with another element, it can be detachable or non-detachable. When an element is considered as "connected", "rotatably connected" with another element, it can be directly connected to another element or can exist simultaneously with the middle element. The terms "vertical", "horizontal", "left", "right", "upper", "lower" and similar expressions are only for the purpose of illustration, and do not represent the only implementation.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0026] In the present application, "first", "second", "third" and the like similar terms are not intended to represent a specific number and order, but only for the purpose of distinguishing names.

[0027] Reference is made to Figs. 1 to 3As shown, the heating package of the liquid heater comprises a chip fixing frame 1, which is a frame body processed from heat-resistant material. The frame body can be square, polygonal or circular according to the shape requirement of the actual heater. In the embodiment, the chip fixing frame is square. The chip fixing frame 1 is further provided with a spacing strip 10, which divides the chip fixing frame 1 into a first accommodating area 11 and a second accommodating area 12. The first accommodating area 11 and the second accommodating area 12 are both provided with PTC cores 3, which are arranged by a plurality of PTC chips. In the embodiment, the PTC chips are rectangular. The first accommodating area and the second accommodating area are both provided with three rows of ten columns of PTC chips. The heating package further comprises a positive electrode sheet 4, which is located below the PTC cores and connected with the PTC chips in the first accommodating area and the second accommodating area, i.e. the positive electrode sheet can provide power supply for the PTC cores in the first accommodating area and / or the second accommodating area. The heating package further comprises a first negative electrode sheet 5 and a second negative electrode sheet 6. The first negative electrode sheet 5 is located in the first accommodating area 11 and above the PTC cores in the first accommodating area 11. The second negative electrode sheet 6 is located in the second accommodating area 12 and above the PTC cores in the second accommodating area 12. In the use process, the first negative electrode sheet and / or the second negative electrode sheet can be connected according to the power requirement of the liquid heater, so as to meet the various use requirements of users. The heating package is a whole, which is convenient to install. Only the external wiring of the positive electrode sheet, the first negative electrode sheet and the second negative electrode sheet is needed, without a large amount of welding, so as to reduce the manufacturing difficulty, improve the production efficiency and ensure the product quality.

[0028] The lower end surface of the spacing strip 10 is flush with the surface of the PTC core 3, and the lower surface of the positive electrode sheet 4 is higher than the surface of the chip fixing frame 1. One end of the positive electrode sheet 4 is provided with a positive pin 40. The chip fixing frame 1 is provided with a first accommodation slot 13, and the positive pin 40 is embedded in the first accommodation slot 13. The structure of the chip fixing frame is further limited. When the positive electrode sheet cooperates with the chip fixing frame, the lower surface of the positive electrode sheet is slightly higher than the surface of the chip fixing frame. In the subsequent assembly process, the positive electrode sheet is in a compressed state, so as to ensure the close contact between the positive electrode sheet and the PTC core.

[0029] Further, the upper surfaces of the first negative electrode sheet 5 and the second negative electrode sheet 6 are higher than the upper surface of the chip fixing frame 1, the first negative electrode sheet 5 is provided with a first negative lead 50, the second negative electrode sheet 6 is provided with a second negative lead 60, the chip fixing frame is provided with a second displacement slot 14 and a third displacement slot 15, the first negative lead 50 is embedded in the second displacement slot 14, and the second negative lead 60 is embedded in the third displacement slot 15, wherein the structure of the negative electrode sheet and the chip fixing frame is also limited, the second displacement slot and the third displacement slot are arranged to displace the negative lead of the negative electrode sheet, the negative electrode sheet is prevented from being extruded and deformed in the subsequent installation process, and the connection reliability of the negative electrode sheet and the PTC core body is ensured.

[0030] Further, the upper surfaces of the first negative electrode sheet 5 and the second negative electrode sheet 6 are higher than the upper surface of the chip fixing frame 1, the first negative electrode sheet 5 is provided with a first negative lead 50, the second negative electrode sheet 6 is provided with a second negative lead 60, the chip fixing frame is provided with a second displacement slot 14 and a third displacement slot 15, the first negative lead 50 is embedded in the second displacement slot 14, and the second negative lead 60 is embedded in the third displacement slot 15, wherein the structure of the negative electrode sheet and the chip fixing frame is also limited, the second displacement slot and the third displacement slot are arranged to displace the negative lead of the negative electrode sheet, the negative electrode sheet is prevented from being extruded and deformed in the subsequent installation process, and the connection reliability of the negative electrode sheet and the PTC core body is ensured.

[0031] Further, the upper surfaces of the first negative electrode sheet 5 and the second negative electrode sheet 6 are higher than the upper surface of the chip fixing frame 1, the first negative electrode sheet 5 is provided with a first negative lead 50, the second negative electrode sheet 6 is provided with a second negative lead 60, the chip fixing frame is provided with a second displacement slot 14 and a third displacement slot 15, the first negative lead 50 is embedded in the second displacement slot 14, and the second negative lead 60 is embedded in the third displacement slot 15, wherein the structure of the negative electrode sheet and the chip fixing frame is also limited, the second displacement slot and the third displacement slot are arranged to displace the negative lead of the negative electrode sheet, the negative electrode sheet is prevented from being extruded and deformed in the subsequent installation process, and the connection reliability of the negative electrode sheet and the PTC core body is ensured.

[0032] Further, the upper surfaces of the first negative electrode sheet 5 and the second negative electrode sheet 6 are higher than the upper surface of the chip fixing frame 1, the first negative electrode sheet 5 is provided with a first negative lead 50, the second negative electrode sheet 6 is provided with a second negative lead 60, the chip fixing frame is provided with a second displacement slot 14 and a third displacement slot 15, the first negative lead 50 is embedded in the second displacement slot 14, and the second negative lead 60 is embedded in the third displacement slot 15, wherein the structure of the negative electrode sheet and the chip fixing frame is also limited, the second displacement slot and the third displacement slot are arranged to displace the negative lead of the negative electrode sheet, the negative electrode sheet is prevented from being extruded and deformed in the subsequent installation process, and the connection reliability of the negative electrode sheet and the PTC core body is ensured.

[0033] In summary, the utility model has the following beneficial effects:

[0034] The heating bag of the utility model is a whole, convenient to install, only needs to externally connect the positive electrode sheet, the first negative electrode sheet and the second negative electrode sheet, does not need to carry out a large number of welding, reduces manufacturing difficulty, improves production efficiency and guarantees product quality.

[0035] Based on the described embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the present application.

Claims

1. A heating element for a liquid heater, characterized in that: The device includes a chip mounting frame, which is further provided with a spacer strip that divides the chip mounting frame into a first accommodating area and a second accommodating area. A PTC chip is located in both the first and second accommodating areas. The device also includes a positive electrode plate located below the PTC chip and connected to the PTC chip in both the first and second accommodating areas. Additionally, it includes a first negative electrode plate and a second negative electrode plate. The first negative electrode plate is located in the first accommodating area, above and connected to the PTC chip within that area. The second negative electrode plate is located in the second accommodating area, above and connected to the PTC chip within that area.

2. The heating pack of the liquid heater according to claim 1, characterized in that: The lower end face of the spacer is flush with the surface of the PTC core, the lower surface of the positive electrode sheet is higher than the surface of the chip fixing frame, one end of the positive electrode sheet extends to provide a positive lead, and the chip fixing frame is provided with a first clearance groove, in which the positive lead is fitted.

3. The heating element of the liquid heater according to any one of claims 1 or 2, characterized in that: The upper surfaces of the first negative electrode and the second negative electrode are higher than the upper surface of the chip fixing frame. The first negative electrode has a first negative pin and the second negative electrode has a second negative pin. The chip fixing frame has a second clearance groove and a third clearance groove. The first negative pin is fitted into the second clearance groove and the second negative pin is fitted into the third clearance groove.

4. The heating pack of the liquid heater according to claim 3, characterized in that: It also includes an insulating thermally conductive film, which covers the surfaces of the first negative electrode sheet, the second negative electrode sheet, and the positive electrode sheet.

5. The heating pack of the liquid heater according to claim 4, characterized in that: It also includes a protective plate, which includes an upper protective plate, a lower protective plate, and a transition portion connecting the upper and lower protective plates. The upper protective plate is pressed onto the surface of the insulating thermally conductive film above the first negative electrode sheet and the second negative electrode sheet, and the lower protective plate is pressed onto the surface of the insulating thermally conductive film below the positive electrode sheet.

6. The heating pack of the liquid heater according to claim 5, characterized in that: The lower protective plate has downwardly extending side baffles at both ends of the chip fixing frame in the width direction.

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