Mainboard auxiliary heat dissipation mechanism for electronic equipment
By designing an auxiliary heat dissipation mechanism that includes a heat sink body, aluminum fins, heat-conducting copper pipes, and a fan, the problem that traditional heat dissipation methods cannot meet the requirements of efficient heat dissipation and motherboard fixation and protection is solved, achieving efficient and stable heat dissipation and motherboard protection.
Patent Information
- Application Number
- CN202520030284.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-07
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-01-07
AI Technical Summary
Traditional heat dissipation methods cannot meet the demand for efficient heat dissipation, resulting in unstable operation of electronic devices, performance degradation, or even hardware damage. At the same time, the motherboard fixing and protection measures are inadequate.
An auxiliary heat dissipation mechanism was designed, which includes a heat dissipation body, heat dissipation aluminum fins, heat conduction copper pipes, heat dissipation fan and mounting bracket. Heat is conducted through heat conduction plate, heat dissipation is accelerated by multi-layer heat dissipation aluminum fins and fan, and stability and motherboard protection are ensured by the mounting structure.
It improves heat dissipation, enhances the stability of the heat dissipation mechanism, protects the motherboard, avoids damage caused by vibration, and achieves the function of quickly reducing the motherboard temperature.
Smart Images

Figure CN223912754U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to a heat dissipation technical field, concretely is a kind of mainboard auxiliary heat dissipation mechanism for electronic equipment. BACKGROUND
[0002] In today's high-speed development of electronic equipment technology, the performance of electronic equipment is continuously improved, and its running speed and processing capacity are increasingly strong.However, high-performance electronic mainboard will generate a large amount of heat during operation, which will lead to high temperature of the mainboard and affect the performance of the mainboard if the heat cannot be effectively dissipated in time.
[0003] The traditional heat dissipation method only relies on the heat dissipation fin or simple fan heat dissipation of the mainboard, and the heat dissipation effect is often poor. With the continuous improvement of electronic hardware integration, the electronic components on the mainboard are arranged more closely, and the heat is more concentrated. The traditional heat dissipation method cannot meet the demand of efficient heat dissipation, which is easy to cause unstable operation of electronic equipment, performance decline and even hardware damage and other problems. Moreover, the current heat dissipation mechanism is not perfect in fixing and protecting the mainboard while dissipating heat, and the mainboard may be damaged due to vibration and other factors in the electronic case. Therefore, the above problems need to be improved. SUMMARY
[0004] In order to overcome the defects of the prior art, the utility model provides a mainboard auxiliary heat dissipation mechanism for electronic equipment, which can improve the heat dissipation effect of the mainboard, ensure the stability of the heat dissipation structure, protect the mainboard and avoid damage during use.
[0005] The utility model discloses a kind of mainboard auxiliary heat-dissipation mechanisms for electronic equipment, it includes heat-dissipation main body, the front, rear two sides of heat-dissipation main body are all transversely installed with multiple heat-dissipation aluminum sheets from top to bottom, the middle part of heat-dissipation aluminum sheet is fixed in heat-dissipation main body, and its both end parts are suspended, defined as suspended part, the suspended part is also connected with the heat-conducting copper pipe vertically arranged, the lower end of heat-conducting copper pipe is connected with heat-dissipation main body, fixed column is from top to bottom and is connected with heat-dissipation main body by penetrating heat-dissipation main body and heat-dissipation aluminum sheet, so that heat-dissipation aluminum sheet is firmly fixed on heat-dissipation main body;The left, right two sides of heat-dissipation main body are provided with heat-dissipation fan, one side is air inlet fan, and the other side is air outlet fan;Heat-dissipation main body bottom periphery is also connected with fixed frame, the upper end of this fixed frame is connected with heat-dissipation main body, and the lower end is connected with fixed frame;The fixed frame is also provided with mainboard mounting hole for being connected with mainboard, and heat-dissipation main body bottom is also connected with heat-conducting plate for being attached with mainboard to dissipate heat, and the heat-dissipation mechanism is fixed to the mainboard of electronic equipment through mainboard mounting hole, and heat-conducting plate is closely attached with mainboard to dissipate heat. Heat-conducting plate has good heat conduction characteristics, can quickly absorb the heat generated by mainboard work and transmit to heat-dissipation main body, heat-conducting copper pipe is connected with heat-dissipation main body, so that heat is conducted to heat-conducting copper pipe, the connection of heat-conducting copper pipe and heat-dissipation aluminum sheet is cooperated, so that heat is conducted to heat-dissipation aluminum sheet, multiple heat-dissipation aluminum sheets are arranged in layers, and heat-dissipation aluminum sheet has larger surface area, can increase the contact surface with air, so as to improve the heat dissipation effect. The heat-dissipation fan on both sides of heat-dissipation main body can accelerate the heat dissipation process, and further improve the heat dissipation effect.
[0006] The aforementioned mainboard auxiliary heat-dissipation mechanism for electronic equipment, the bottom of the fixed frame is also provided with an anti-wear soft pad.
[0007] The aforementioned mainboard auxiliary heat-dissipation mechanism for electronic equipment, the middle part of the front, rear two sides of the heat-dissipation main body is connected with a protrusion, and the side of the protrusion is provided with multiple transverse clamping grooves from top to bottom for installing and fixing the middle part of the heat-dissipation aluminum sheet. The heat-dissipation aluminum sheet is clamped in the clamping groove of the front, rear two sides of the heat-dissipation main body, improving the stability of the installation of the heat-dissipation aluminum sheet.
[0008] Further, the suspended part at both ends of the heat-dissipation aluminum sheet is also provided with a U-shaped groove for clamping on the heat-conducting copper pipe vertically arranged and interference fit with the heat-conducting copper pipe, further ensuring the stability of the heat-dissipation aluminum sheet and the heat transfer effect between the heat-dissipation aluminum sheet and the heat-conducting copper pipe. The suspended parts between the two heat-dissipation aluminum sheets adjacent to each other form a heat-dissipation space, which is helpful for heat dissipation.
[0009] The aforementioned mainboard auxiliary heat-dissipation mechanism for electronic equipment, the top of the heat-dissipation main body is also provided with a dust cover.
[0010] Further, the upper end of the heat-conducting copper pipe is higher than the top of the heat-dissipating main body, and the dust cover is located above the heat-dissipating main body and the heat-conducting copper pipe after installation and does not contact the top of the heat-dissipating main body, which is beneficial to heat dissipation of the top of the heat-dissipating main body.
[0011] Further, the fixing column penetrates the dust cover, the heat-dissipating main body and the heat-dissipating aluminum sheet from top to bottom and is in interference fit with the dust cover and the heat-dissipating main body, so that the heat-dissipating aluminum sheet is firmly fixed on the heat-dissipating main body, and the problem that the heat-dissipating aluminum sheet is not firmly installed due to shaking during use of the electronic device and affects heat dissipation can be avoided.
[0012] The foregoing main board auxiliary heat-dissipating mechanism for electronic devices has at least two fixing frames, and two or more fixing frames are symmetrically distributed.
[0013] The foregoing main board auxiliary heat-dissipating mechanism for electronic devices has that the upper end of the fixing frame is fixed on the outer periphery of the bottom of the heat-dissipating main body through a bolt, and the lower end of the fixing frame is provided with a fixing buckle, and the fixing frame is installed on the bottom of the fixing frame through the fixing buckle.
[0014] The foregoing main board auxiliary heat-dissipating mechanism for electronic devices has that the heat-dissipating fan includes an air inlet fan and an air outlet fan, the air inlet fan includes an air inlet fan frame and air inlet fan blades, and the air outlet fan includes an air outlet fan frame and air outlet fan blades, and the circumferential surface of the air inlet fan blades and the circumferential surface of the air outlet fan blades are perpendicular to the axial direction of the heat-dissipating aluminum sheet.
[0015] Compared with the prior art, the utility model has obvious advantages and beneficial effects. By the above technical scheme, the utility model can achieve considerable technical progress and practicality, and has wide utilization value, and at least has the following advantages:
[0016] The utility model discloses a main board auxiliary heat-dissipating mechanism for electronic devices, which comprises a heat-dissipating main body, a heat-conducting copper pipe, a dust cover, a fixing column and a heat-dissipating aluminum sheet.
[0017] The utility model discloses a horizontal clamping groove is set up on the heat dissipation main part, and the heat dissipation aluminum sheet is installed in the clamping groove, and fixed column is set up simultaneously, and the fixed column penetrates the heat dissipation main part and is used for clamping the convex part of heat dissipation aluminum sheet and heat dissipation aluminum sheet, makes heat dissipation aluminum sheet firmly install on the heat dissipation main part, can avoid the problem that electronic equipment concussion influences heat dissipation aluminum sheet stability and then influences the heat dissipation effect, has improved the stability of heat dissipation mechanism. Through the fixed frame, the fixed frame is convenient for fixing the heat dissipation mechanism on electronic equipment, and the stability of the whole structure is ensured. Meanwhile, the utility model discloses an antiwear soft pad is set up in the fixed frame bottom, avoids the abrasion to the mainboard, plays the role of protecting the mainboard. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 It is the front view of the utility model.
[0019] Figure 2 It is the perspective view of the utility model.
[0020] Figure 3 It is the rear view of the utility model.
[0021] Figure 4 It is Figure 3 The left view of.
[0022]
Element and symbol explanation
[0023] 1-heat dissipation main part;
[0024] 2-convex part;
[0025] 3-heat dissipation aluminum sheet;
[0026] 3.1-hangs empty;
[0027] 4-heat conducting copper pipe;
[0028] 5-dust cover;
[0029] 6-fixed column;
[0030] 7-into the wind fan frame;
[0031] 8-into the wind fan blade;
[0032] 9-out of the wind fan frame;
[0033] 10-out of the wind fan blade;
[0034] 11-fixed frame;
[0035] 12-fixed frame;
[0036] 13-fixed buckle;
[0037] 14-heat conducting plate;
[0038] 15-mainboard mounting hole;
[0039] 16-anti-wear soft pad;
[0040] 17-heat dissipation space. DETAILED DESCRIPTION
[0041] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme of the utility model will be described clearly and completely below in combination with specific embodiments and drawings. Obviously, the described features are only part of the embodiments of the utility model, not all the embodiments. Therefore, the following detailed description of the utility model provided in the drawings is not intended to limit the scope of protection, but only to represent the selected embodiments of the utility model. Based on the embodiments described below, all other embodiments obtained by those skilled in the art without creative labor belong to the scope of protection of the utility model.
[0042] It should be noted that the "top", "bottom", "front", "rear", "left", "right" and other orientation terms described in the utility model are only based on the orientation shown in the drawings, and do not represent a limitation on the utility model.
[0043] The utility model provides a kind of mainboard auxiliary heat dissipation mechanism for electronic equipment, including heat dissipation main body 1, the middle part of heat dissipation main body front, rear side is connected with convex part 2, the side of convex part is provided with multiple horizontal clamping grooves from top to bottom for installing heat dissipation aluminum sheet 3. The middle part of heat dissipation aluminum sheet is clamped in the clamping groove, and the both ends are suspended, defined as suspended part 3.1. Form heat dissipation space 17 between the suspended part of two adjacent heat dissipation aluminum sheets. U-shaped groove is further provided on the suspended part of heat dissipation aluminum sheet for and vertically arranged heat conduction copper pipe 4 adaptive connection. The lower end of heat conduction copper pipe 4 is connected with the heat dissipation main body 1, and the upper end is higher than the top of heat dissipation main body, dust cover is installed after being located above heat dissipation main body and heat conduction copper pipe and not being in contact with the top of heat dissipation main body, which helps the top of heat dissipation main body to dissipate heat. The position of U-shaped groove provided on the suspended part of the both ends of heat dissipation aluminum sheet corresponds to heat conduction copper pipe 4, after heat dissipation aluminum sheet is clamped in clamping groove, the U-shaped groove of the two suspended parts is clamped on corresponding heat conduction copper pipe and is interference fit with heat conduction copper pipe.
[0044] In one embodiment, the lower end of heat conduction copper pipe 4 is welded with heat dissipation main body 1, but this description is not considered as a limitation on the utility model.
[0045] The middle part of heat dissipation aluminum sheet is further provided with a plurality of mounting holes, and the mounting holes correspond to the fixing column mounting hole on the dust cover. The fixing column 6 penetrates the dust cover, the convex part of heat dissipation main body and heat dissipation aluminum sheet from top to bottom, and is interference fit with the convex part of heat dissipation main body and dust cover, so as to firmly fix heat dissipation aluminum sheet on heat dissipation main body, to prevent heat dissipation aluminum sheet from being not firmly connected with heat dissipation main body due to vibration of electronic equipment during use.
[0046] The left and right sides of the heat dissipation body are provided with heat dissipation fans, one side of which is an air inlet fan and the other side is an air outlet fan.
[0047] In an embodiment, as shown in Figure 1 the left side of the heat dissipation body is provided with an air inlet fan frame 7 and air inlet fan blades 8, and the right side of the heat dissipation body is provided with an air outlet fan frame 9 and air outlet fan blades 10. The circumferential surface of the air inlet fan blades and the circumferential surface of the air outlet fan blades are perpendicular to the axial direction of the heat dissipation aluminum sheet. After the two heat dissipation fans are started, cold air is brought in by the air inlet fan and flows through the heat dissipation aluminum sheet, becomes hot air after taking away heat, and is blown out by the air outlet fan.
[0048] As shown in Figure 1 the bottom periphery of the heat dissipation body is also connected with several fixing frames 11, the upper end of the fixing frame 11 is connected with the heat dissipation body 1, and the lower end is connected with a fixed frame 12. In order to balance the connection, the fixing frame 11 has at least two, and the two or more fixing frames are symmetrically distributed.
[0049] In an embodiment, the upper end of the fixing frame 11 is fixed on the outer periphery of the bottom of the heat dissipation body by a bolt, and the lower end is provided with a fixing buckle 13, and the fixed frame 12 is installed at the bottom of the fixing frame through the fixing buckle.
[0050] Figure 1 In the example shown in , the fixing frame has four, the upper end of two fixing frames is fixed on the left and right sides of the bottom of the heat dissipation body by a bolt respectively, and the upper end of the other two fixing frames is fixed on the front and rear sides of the bottom of the heat dissipation body by a bolt respectively. The frame of the fixed frame 12 is clamped in the fixing buckle 13 of the fixing frame.
[0051] In a preferred embodiment, the bottom of the fixed frame is also provided with a recess, and an anti-wear soft pad 16 is installed in the recess. Through the anti-wear soft pad, the integrity of the mainboard can be protected, and the mainboard can be prevented from being worn during installation and use.
[0052] The bottom of the heat dissipation body 1 is also connected with a heat conduction plate 14, the bottom of the heat conduction plate 14 is basically flush with the anti-wear soft pad 16, that is, it is installed and fixed before the mainboard, and the bottom surface of the heat conduction plate is slightly higher than the bottom of the anti-wear soft pad in the direction towards the mainboard. The fixed frame is also provided with a mainboard mounting hole 15, and the heat dissipation mechanism is fixed to the mainboard of the electronic equipment through the mainboard mounting hole, and the heat conduction plate 14 is tightly attached to the mainboard. The mainboard and the fixed frame are separated by the anti-wear soft pad 16, and the anti-wear soft pad 16 plays a protective role on the mainboard.
[0053] The utility model discloses a heat dissipation principle is: through the mainboard mounting hole 15 of fixed frame installs this heat dissipation mechanism to electronic equipment mainboard, makes the mainboard and the heat dissipation mechanism heat dissipation main body bottom's heat conduction plate 14 close fitting. The heat conduction plate has good heat conduction characteristics, can absorb the heat that the mainboard works produces and conducts to the heat dissipation main body connected with the heat conduction plate, by the heat dissipation main body simultaneously conduction to the heat conduction copper pipe connected with the heat dissipation main body, and the heat conduction copper pipe is connected with the heat dissipation aluminum sheet, and by the excellent heat conduction capacity of itself, the heat is conducted to the heat dissipation aluminum sheet, and the heat dissipation aluminum sheet has larger surface area, can increase the contact surface with air, is favorable to heat dissipation, and the heat that the mainboard produces is scattered in time through the heat dissipation aluminum sheet. Meanwhile, the air inlet fan and the air outlet fan of heat dissipation main body both sides start after, accelerate air flow, and cold air enters from the air inlet fan, and after flowing through the heat dissipation aluminum sheet and the heat conduction copper pipe, heat is taken away, and hot air is blown out from the air outlet fan, to heat dissipation mechanism heat dissipation is accelerated, and the temperature of mainboard and periphery is reduced fast, and the heat dissipation efficiency is improved.
[0054] The above is only the embodiment of the utility model, and does not limit the utility model in any form, and the utility model can also have other forms of embodiment according to the above structure and function, and does not list one by one. Therefore, any skilled person in the art, without departing from the technical scheme range of the utility model, according to the technical essence of the utility model, any simple modification, equivalent change and modification of the above embodiment, still belongs to the range of the technical scheme of the utility model.
Claims
1. A mainboard auxiliary heat dissipation mechanism for electronic equipment, characterized in that The heat dissipation main body (1) is provided with a plurality of heat dissipation aluminum sheets (3) installed horizontally from top to bottom on the front and rear sides of the heat dissipation main body (1), the middle part of the heat dissipation aluminum sheet (3) is fixed in the heat dissipation main body, and the two end parts are suspended, which are defined as suspended parts, the suspended parts are connected with the vertically arranged heat conduction copper pipes (4), the lower end of the heat conduction copper pipe (4) is connected with the heat dissipation main body, and the fixing column (6) penetrates the heat dissipation main body and the heat dissipation aluminum sheet from top to bottom and is connected with the heat dissipation main body; the left and right sides of the heat dissipation main body are provided with heat dissipation fans, one side is an air inlet fan, and the other side is an air outlet fan; the outer periphery of the bottom of the heat dissipation main body is further connected with a fixing frame (11), the upper end of the fixing frame (11) is connected with the heat dissipation main body (1), and the lower end is connected with a fixed frame (12); the fixed frame is further provided with a mainboard mounting hole (15) for connecting with a mainboard, and the bottom of the heat dissipation main body (1) is further connected with a heat conduction plate (14) for being attached to the mainboard to dissipate heat.
2. The mainboard auxiliary heat dissipation mechanism for electronic equipment according to claim 1, characterized in that The bottom of the fixed frame (12) is further provided with an anti-wear soft pad (16).
3. The mainboard auxiliary heat dissipation mechanism for electronic equipment according to claim 1, characterized in that The middle part of the front and rear sides of the heat dissipation main body is connected with a convex part (2), and the side surface of the convex part is provided with a plurality of horizontal clamping grooves from top to bottom for installing and fixing the middle part of the heat dissipation aluminum sheet (3).
4. The mainboard auxiliary heat dissipation mechanism for electronic equipment according to claim 1 or 3, characterized in that The suspended part of the two ends of the heat dissipation aluminum sheet is provided with a U-shaped groove for clamping on the heat conduction copper pipe (4) and interference fit with the heat conduction copper pipe (4).
5. The mainboard auxiliary heat dissipation mechanism for electronic equipment according to claim 1, characterized in that The top of the heat dissipation main body is further provided with a dustproof cover (5).
6. The mainboard auxiliary heat dissipation mechanism for electronic equipment according to claim 5, characterized in that The upper end of the heat conduction copper pipe is higher than the top of the heat dissipation main body, and the dustproof cover is installed above the heat dissipation main body and the heat conduction copper pipe and does not contact the top of the heat dissipation main body.
7. The mainboard auxiliary heat dissipation mechanism for electronic equipment according to claim 5, characterized in that The fixing column (6) penetrates the dustproof cover, the heat dissipation main body and the heat dissipation aluminum sheet from top to bottom and interference fits with the dustproof cover and the heat dissipation main body.
8. The mainboard auxiliary heat dissipation mechanism for electronic device according to claim 1, wherein The fixing frame (11) has at least two, and two or more fixing frames are symmetrically distributed.
9. The mainboard auxiliary heat dissipation mechanism for electronic equipment according to claim 1 or 8, characterized in that The upper end of the fixing frame (11) is fixed on the outer periphery of the bottom of the heat dissipation main body by bolts, and the lower end is provided with a fixing buckle (13), and the fixed frame (12) is installed at the bottom of the fixing frame through the fixing buckle.
10. The mainboard auxiliary heat dissipation mechanism for electronic device according to claim 1, wherein The heat dissipation fan includes an air inlet fan and an air outlet fan, the air inlet fan includes an air inlet fan frame and air inlet fan blades, the air outlet fan includes an air outlet fan frame and air outlet fan blades, and the circumferential surface of the air inlet fan blades and the circumferential surface of the air outlet fan blades are perpendicular to the axial direction of the heat dissipation aluminum sheet.