Wafer conveying device
By adding an optical transmitter and receiver to the wafer transport device, the wafer status can be monitored in real time, solving the problem of damage and downtime caused by wafer tilt and achieving safe and reliable wafer transport.
Patent Information
- Application Number
- CN202520435779.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-03-12
AI Technical Summary
Existing wafer transfer devices continue to grip the wafer while it is tilted, which can damage the wafer or transfer components and poses a risk of system downtime.
An optical transmitter and an optical receiver are added to the wafer transfer device and set at the same height. The wafer status is determined by detecting the reflection of light, the operation of the transfer components is controlled to prevent the gripping action when tilted, and an alarm component is equipped to remind technicians to handle the situation.
It effectively prevents damage to wafers and transport components when tilted, reduces the risk of downtime, and ensures the safety and continuity of the transport process.
Smart Images
Figure CN223912843U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer conveying technical field especially relates to a wafer conveying device. BACKGROUND
[0002] Wafer conveying is a crucial link in the semiconductor manufacturing process, which involves the precise, efficient and clean transmission of wafers between different process equipment. In modern semiconductor production, wafers need to go through multiple complex process steps, such as photolithography, etching, chemical vapor deposition and cleaning, etc. These processes are usually distributed in different equipment. Therefore, the transmission of wafers between each equipment not only needs to ensure the accuracy of its position and direction, but also needs to avoid being contaminated or damaged during the transmission process.
[0003] With the continuous development of semiconductor technology, the size of wafers gradually increases, and the process precision requirement is also higher and higher. The traditional manual or simple mechanical transmission method has been unable to meet the needs of modern production. Therefore, the automatic and intelligent wafer transmission system emerges as the times require. These systems usually include conveying components, transmission tracks, pre-alignment devices and clean environment control equipment, etc. Among them, the conveying components are responsible for the grabbing and placing of wafers, the pre-alignment device is used to correct the position and direction of the wafer, and the clean environment control equipment ensures that the wafer is not contaminated by particles during the transmission process.
[0004] However, the wafer conveying device of the prior art still has many problems. SUMMARY
[0005] The technical problem solved by the utility model is to provide a wafer conveying device to prevent the wafer from being damaged by the grabbing action in the inclined state, and to reduce the risk of downtime.
[0006] To solve the above problems, the utility model technical scheme provides a wafer conveying device, which comprises: a conveying component for conveying wafers; an optical emitter for emitting detection light, the detection light irradiating to the surface of the wafer and reflecting; an optical receiver, the optical emitter and the optical receiver being arranged and fixed at the same height, for receiving the detection light; a controller, which is in communication connection with the conveying component, the optical emitter and the optical receiver respectively, for controlling the conveying component to convey the wafer after the optical receiver receives the detection light, or controlling the conveying component to stop conveying the wafer after the optical receiver does not receive the detection light.
[0007] Optionally, it further comprises: an alarm component, the controller being in communication connection with the alarm component, for controlling the alarm component to start after the optical receiver does not receive the detection light.
[0008] Optionally, the optical transmitter is an infrared transmitter.
[0009] Optionally, the optical receiver is an infrared receiver.
[0010] Optionally, the optical transmitter and the optical receiver are arranged in the vacuum coating chamber.
[0011] Optionally, the vacuum coating chamber has a plurality of support rods, and the wafer is supported on the support rods.
[0012] Optionally, the optical transmitter and the optical receiver are arranged above the wafer, and the optical transmitter and the optical receiver are fixed to the top of the vacuum coating chamber.
[0013] Optionally, the angle between the detection light emitted by the optical transmitter and the wafer surface is an acute angle.
[0014] Optionally, the conveying component includes a mechanical arm, and a mechanical hand connected to the end of the mechanical arm, and the mechanical hand is used to support the wafer.
[0015] Optionally, the mechanical hand is U-shaped.
[0016] Compared with the prior art, the technical scheme of the utility model has the following advantages:
[0017] In the wafer conveying device of the technical scheme of the utility model, the optical transmitter and the optical receiver are arranged at the same height, and when the detection light emitted by the optical transmitter is reflected on the wafer surface, the reflected light is received by the optical receiver, at this time, it is indicated that the wafer is in a horizontal state, and the controller controls the conveying component to normally operate the conveying action of the wafer. When the detection light emitted by the optical transmitter is reflected on the wafer surface, the reflected light is not received by the optical receiver, at this time, it is indicated that the wafer is in an inclined state, and the controller controls the conveying component to stop operating, so as to prevent the conveying component from performing a grabbing action when the wafer is in an inclined state, thereby preventing damage to the wafer or the conveying component, and reducing the risk of downtime.
[0018] Further, the technical scheme further comprises an alarm component, the controller is in communication connection with the alarm component, and is used to control the alarm component to start when the optical receiver does not receive the detection light. By adding the alarm component, when the optical receiver does not receive the detection light, it is indicated that the wafer is in an inclined state, at this time, the alarm component starts, which can remind the technical personnel to process, so as to ensure that the wafer conveying process continues.
[0019] Further, the detection light emitted by the optical emitter forms an acute angle with the wafer surface. Avoiding the detection light forming a right angle with the wafer surface, thereby causing the positions of the optical emitter and the optical receiver to coincide and difficult to arrange. BRIEF DESCRIPTION OF DRAWINGS
[0020] Figure 1 is a structure schematic view of the wafer in the horizontal position in the wafer conveying device of the embodiment of the present application;
[0021] Figure 2 is a structure schematic view of the wafer in the inclined position in the wafer conveying device of the embodiment of the present application;
[0022] Figure 3 is a structure schematic view of the conveying component in the wafer conveying device of the embodiment of the present application. DETAILED DESCRIPTION
[0023] As described in the background, the prior art device for eliminating the influence of water hammer effect still has many problems. The following will be described in detail.
[0024] Currently, the process of the mechanical arm grabbing the wafer is to adopt two external optical sensors located in the middle of the wafer transmission, and the wafer is moved along the transmission path. When the edge of the wafer is detected by the sensor, the conveying component manipulator collects the position and speed information of the end effector of the conveying component. When the front and rear edges of the wafer are detected by the sensor, two sets of different data are obtained by the two sensors. These data together with the expected wafer radius and the coordinates of the sensor are used to determine the eccentricity of the wafer, or to detect the bad wafer. Before completing the determination of the trajectory and before placing the wafer, the eccentricity compensation calibration performs additional movement. The eccentricity identification and bad wafer detection algorithm is designed to process wafers of different diameters and wafers with known deviations from the shape of a perfect circle.
[0025] During the conveying process of the wafer, the wafer position may be inclined due to problems such as self-induced roughness of the wafer, conveying components and moving components. However, the current wafer conveying process does not set a device to monitor whether the wafer is inclined in the process cavity in real time. If the conveying component still grabs the wafer after the wafer is inclined in the process cavity, the wafer or other conveying equipment may be damaged.
[0026] On this basis, the wafer conveying device is provided with the optical transmitter and the optical receiver, the optical transmitter and the optical receiver are arranged at the same height, when the detection light emitted by the optical transmitter is irradiated on the wafer surface, the reflected light is received by the optical receiver, at this time, it is indicated that the wafer is in a horizontal state, and the controller controls the conveying component to normally operate the conveying action of the wafer. When the detection light emitted by the optical transmitter is irradiated on the wafer surface, the reflected light is not received by the optical receiver, at this time, it is indicated that the wafer is in an inclined state, and the controller controls the conveying component to stop operating, so that the conveying component is prevented from still performing the grabbing action under the inclined state of the wafer, and damage of the wafer or the conveying component is caused, and the downtime risk can be reduced.
[0027] In order to make the above-mentioned purpose, characteristics and advantages of the utility model more obvious and easy to understand, the technical scheme in the embodiment of the utility model will be clearly and completely described below in combination with the drawings in the embodiment of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.
[0028] In the description of the utility model, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "top surface", "bottom surface" and the like is the orientation or position relationship shown in the drawings, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the indicated position or element must have a particular orientation, constitute and operate in a particular orientation, therefore it cannot be understood as the limitation of the utility model. In addition, the terms "first", "second" are only used to distinguish entities or operations from another entity or operation, and do not require or imply any actual relationship, order or relative importance between these entities or operations.
[0029] Figure 1 It is the structure schematic view of the wafer in the wafer conveying device of the embodiment of the utility model that is in a horizontal state; Figure 2 It is the structure schematic view of the wafer in the wafer conveying device of the embodiment of the utility model that is in an inclined state; Figure 3 It is the structure schematic view of the conveying component in the wafer conveying device of the embodiment of the utility model.
[0030] Please refer to Figures 1 to 3A wafer conveying device, comprising: a conveying component 100 for conveying a wafer 101; an optical emitter 102 for emitting a detection light S, the detection light S irradiating to a surface of the wafer 101 and reflecting; an optical receiver 103, the optical emitter 102 and the optical receiver 103 being arranged fixed at the same height, for receiving the detection light S; a controller (not shown) in communication connection with the conveying component 100, the optical emitter 102 and the optical receiver 103 respectively, for controlling the conveying component 100 to convey the wafer 101 after the optical receiver 103 receives the detection light S, or for controlling the conveying component 100 to stop conveying the wafer 101 after the optical receiver 103 does not receive the detection light S.
[0031] By additionally arranging the optical emitter 102 and the optical receiver 103, the optical emitter 102 and the optical receiver 103 are arranged fixed at the same height, when the detection light S emitted by the optical emitter 102 irradiates on the surface of the wafer 101, the reflected light is received by the optical receiver 103, at this time, it indicates that the wafer 101 is in a horizontal state, the controller controls the conveying component 100 to normally operate the conveying action of the wafer 101. When the detection light S emitted by the optical emitter 102 irradiates on the surface of the wafer 101, the reflected light is not received by the optical receiver 103, at this time, it indicates that the wafer 101 is in an inclined state, the controller controls the conveying component 100 to stop operating, so as to prevent the conveying component 100 from still performing the grabbing action when the wafer 101 is in the inclined state, thereby preventing the wafer 101 or the conveying component 100 from being damaged, and reducing the risk of downtime.
[0032] In the embodiment, the wafer conveying device further comprises: an alarm component 104, the controller is in communication connection with the alarm component 104, for controlling the alarm component 104 to start after the optical receiver 103 does not receive the detection light S.
[0033] By additionally arranging the alarm component 104, when the optical receiver 103 does not receive the detection light S, it indicates that the wafer 101 is in an inclined state, at this time, the alarm component 104 starts, which can remind the technical personnel to process, so as to ensure that the wafer 101 conveying process continues.
[0034] In the embodiment, the optical emitter 102 is an infrared emitter; the optical receiver 103 is an infrared receiver.
[0035] In the embodiment, the optical transmitter 102 and the optical receiver 103 are arranged in the vacuum coating chamber 200. The vacuum coating chamber 200 is used for coating the surface of the wafer 101. After the wafer 101 is coated in the vacuum coating chamber 200, the wafer 101 is delivered out of the vacuum coating chamber 200 by the conveying component 100.
[0036] In the embodiment, the vacuum coating chamber 200 has a plurality of support rods 201.
[0037] Please continue to refer to Figure 1 The wafer 101 is supported on the support rods 201. The support rods 201 have the same height. When the wafer 101 is in contact with the top of each support rod 201, the wafer 101 is supported horizontally by the support rods 201.
[0038] Please continue to refer to Figure 2 When the wafer 101 is in contact with the top of only some of the support rods 201, the wafer 101 will be tilted due to uneven force.
[0039] In the embodiment, the optical transmitter 102 and the optical receiver 103 are arranged above the wafer 101, and the optical transmitter 102 and the optical receiver 103 are fixed to the top of the vacuum coating chamber 200.
[0040] In the embodiment, the detection light S emitted by the optical transmitter 102 forms an acute angle a with the surface of the wafer 101. The detection light S is prevented from forming a right angle with the surface of the wafer 101, so that the positions of the optical transmitter 102 and the optical receiver 103 coincide and are difficult to arrange.
[0041] Please continue to refer to Figure 3 In the embodiment, the conveying component 100 includes a mechanical arm 1001 and a mechanical hand 1002 connected to the end of the mechanical arm 1001. The mechanical hand 1002 is used to support the wafer 101.
[0042] It should be noted that, in the embodiment, the mechanical arm 1001 has multiple degrees of freedom. The degree of freedom of the mechanical arm 1001 refers to the number of independent movements of the mechanical arm 1001, which is a key indicator of the movement ability and flexibility of the mechanical arm 1001. The number of degrees of freedom directly affects the movement range and operation precision of the mechanical arm 1001 in space. Generally, the higher the degree of freedom, the more flexible the mechanical arm 1001 is, and the more complex the tasks it can complete. However, it also brings higher control difficulty and cost.
[0043] In the present embodiment, the robot hand 1002 is U-shaped.
[0044] Although the utility model discloses as above, the utility model is not limited to this. Any person skilled in the art, without departing from the spirit and scope of the utility model, can make various changes and modifications, therefore the protection scope of the utility model should be the range limited by the claims.
Claims
1. A wafer transfer device, characterized by, The application relates to a wafer conveying device, comprising: a conveying component for conveying a wafer; an optical transmitter for transmitting detection light, the detection light irradiating a surface of the wafer and being reflected; an optical receiver, the optical transmitter and the optical receiver being arranged and fixed at the same height, for receiving the detection light; a controller, which is communicatively connected with the conveying component, the optical transmitter and the optical receiver respectively, for controlling the conveying component to convey the wafer after the optical receiver receives the detection light, or for controlling the conveying component to stop conveying the wafer after the optical receiver does not receive the detection light.
2. The wafer transfer device of claim 1, wherein Further comprising: an alarm component, the controller being communicatively connected with the alarm component, for controlling the alarm component to start after the optical receiver does not receive the detection light.
3. The wafer transfer device of claim 1, wherein, The optical transmitter is an infrared transmitter.
4. The wafer transfer device of claim 1, wherein, The optical receiver is an infrared receiver.
5. The wafer transfer device of claim 1, wherein, The optical transmitter and the optical receiver are arranged and fixed in a vacuum coating chamber.
6. The wafer transfer device of claim 5, wherein The vacuum coating chamber has a plurality of support rods, and the wafer is supported on the support rods.
7. The wafer transfer device of claim 5, wherein, The optical transmitter and the optical receiver are arranged above the wafer, and the optical transmitter and the optical receiver are fixed on the top of the vacuum coating chamber.
8. The wafer transfer device of claim 1, wherein, The detection light transmitted by the optical transmitter and the surface of the wafer form an acute angle.
9. The wafer transfer device of claim 1, wherein, The conveying component comprises a mechanical arm and a mechanical hand, the mechanical hand being connected with the end of the mechanical arm, and the mechanical hand being used for supporting the wafer.
10. The wafer transfer device of claim 9, wherein, The mechanical hand is in a U shape.