Brush mechanism for wafer brushing and cleaning machine
By using a servo motor-controlled rotating rod and T-block design, the problems of uneven cleaning and difficult disassembly caused by the fixed height of traditional brush mechanisms are solved, achieving stability and convenient maintenance of the brush mechanism and improving the wafer cleaning effect.
Patent Information
- Application Number
- CN202520420817.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-10
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-03-10
AI Technical Summary
Traditional brush mechanisms lack height adjustment mechanisms, leading to uneven cleaning or damage to the wafer, and their complex structure makes disassembly and replacement difficult.
The rotation of the rotating rod is controlled by a second servo motor. Combined with the sliding fit between the T-block and the T-slot and the tight fit between the rotating rod and the placement slot, the automatic adjustment and stability of the brush height are achieved. The design includes slots, limit slots, mounting slots and snap-fit mechanisms to facilitate the disassembly and replacement of the brush.
It improves wafer cleaning accuracy, reduces vibration, simplifies maintenance and repair processes, and ensures constant pressure and cleaning effect between the brush and the wafer surface.
Smart Images
Figure CN223916039U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer brush cleaning machine technical field especially relates to a kind of brush mechanism for wafer brush cleaning machine. BACKGROUND
[0002] Wafer brush cleaning machine is a kind of precision cleaning equipment for semiconductor manufacturing industry, it is removed on the wafer by rotating brush mechanism to the physical brush washing of wafer surface, particle, residue and contaminant, and brush mechanism for wafer brush cleaning machine is the key component of wafer brush cleaning machine, mainly used in the wafer cleaning in semiconductor manufacturing process.
[0003] Traditional brush mechanism often lacks the mechanism for adjusting the height of brush, which means that they cannot effectively adapt to different thickness or have special cleaning requirements of wafer, and this fixed height setting limits the flexibility in the cleaning process, can cause uneven cleaning or damage to wafer, in addition, the structure of traditional brush mechanism can be more complex, leading to the difficulty of disassembly and replacement of brush body, increase the difficulty and time of maintenance and repair.
[0004] Therefore, the skilled in the art provides a kind of brush mechanism for wafer brush cleaning machine to solve the problems raised in the above background. SUMMARY
[0005] The utility model discloses a kind of brush mechanism for wafer brush cleaning machine to solve the problems raised in the above background, the rotation of rotating rod is controlled by second servo motor, the rotation of brush body on brush shaft is realized, the precision of wafer cleaning is improved, simultaneously, the sliding fit of T block and T slot and the close fit of rotating rod and placement slot, the stability of mechanism is enhanced, reduce the vibration in the cleaning process, and the design of insertion slot, limit slot, installation slot, connecting slot and clamping mechanism makes the extraction of rotating rod become convenient, facilitates the disassembly and replacement of brush shaft and brush body, simplifies maintenance and repair work, in addition, the synchronous height adjustment of first sliding block and second sliding block is realized by the synergies of first servo motor, threaded rod and connecting rod, ensure the uniform automatic adjustment of the height of entire brush mechanism, so that the distance between brush and wafer surface can be controlled, keep constant pressure and ideal cleaning effect.
[0006] To achieve the above object, the utility model provides the following technical scheme:
[0007] The utility model provides a kind of wafer brush cleaning machine with brush mechanism, including mounting plate, clamping mechanism and mounting block, the upper end of the mounting plate one side is provided with first sliding block, the front end and rear end of the lower part of the other side of the first sliding block are opened with T-shaped slot, the upper surface of the mounting block middle part is fixedly connected with T-shaped block, the other side of the T-shaped block inside is fixedly connected with second servo motor, the output end of the second servo motor is through mounting block to the other side of mounting block and is fixedly connected with rotating rod, the outer wall of the rotating rod is fixedly connected with brush shaft, the other side of the upper end of the mounting plate is provided with second sliding block, the lower part of the outer wall of the one side of the second sliding block is opened with placing groove, the other side of the rotating rod is tightly attached with the inner wall of the rear end of placing groove, the front end of one side of the upper surface and the lower surface of the second sliding block is opened with insertion slot, the insertion slot inner wall is tightly attached with insertion block, the upper end outer wall of the insertion block middle part is opened with two limit grooves, the upper end and rear end of the one side of the outer wall of the front end of the second sliding block are opened with mounting groove, the middle part of the one side of the outer wall of the front end of the second sliding block is opened with two connecting grooves, the upper end and lower end of the outer wall of the rear end of the clamping mechanism are fixedly connected with reset spring, the reset spring is located in the inside of mounting groove, the rear end of the reset spring is fixedly connected with the inner wall of the rear end of mounting groove, the middle part of the outer wall of the rear end of the clamping mechanism is fixedly connected with two limit rods, the rear end of the limit rod is through connecting groove and limit groove to the inside of insertion slot, the outer wall of the rear end of the limit rod is slidably attached with the inner wall of connecting groove and limit groove;
[0008] Through the above technical scheme, the rotation of the rotating rod can be controlled by the second servo motor, which can realize the rotation of the brush body on the brush shaft, thereby improving the precision of wafer cleaning. In addition, the sliding fit design of the T-shaped block and the T-shaped slot, as well as the close fit of the rotating rod and the placing groove, increases the stability of the brush mechanism, reduces the vibration during cleaning, and the design of the insertion slot, limit groove, mounting groove, connecting groove and clamping mechanism makes the rotating rod easy to be taken out from the placing groove, so that the brush shaft and the brush body can be easily disassembled and replaced, which is convenient for maintenance and repair.
[0009] Further, the inner bottom surface of the middle part of the one side of the upper end of the mounting plate is fixedly connected with the first servo motor, the output end of the first servo motor is through the mounting plate to the upper end of the mounting plate and is fixedly connected with threaded rod, the lower end of the threaded rod is rotatably connected with the upper surface of the mounting plate, the inner wall of the one side of the first sliding block is threadedly connected with the outer wall of the threaded rod, the middle part of the other side of the upper surface of the mounting plate is fixedly connected with connecting rod, the inner wall of the other side of the second sliding block is slidably attached with the outer wall of the connecting rod;
[0010] By the above technical scheme, through the design of the first servo motor, the threaded rod and the connecting rod, the synchronous height adjustment of the first sliding block and the second sliding block can be realized, and the synchronous adjustment of the first sliding block and the second sliding block ensures that the overall height of the mounting block, the rotating rod, the brush shaft and the brush body can be automatically adjusted uniformly, and then the constant pressure and cleaning effect of the brush and the wafer surface can be controlled by adjusting the distance between the brush and the wafer surface.
[0011] Further, the outer wall of the T-shaped block is in sliding fit with the inner wall of the T-shaped groove.
[0012] By the above technical scheme, the T-shaped block can be prevented from moving in an unintended direction by the limiting effect of the T-shaped groove, ensuring that the brush mechanism will not be offset, and the T-shaped block can be easily inserted into the T-shaped groove without a complex alignment process, simplifying the installation steps of the mounting block.
[0013] Further, one side of the rotating rod is rotatably connected with the outer wall of the other side of the mounting block.
[0014] By the above technical scheme, the connection between the rotating rod and the first mounting block is usually easy to disassemble by the design of the rotating connection, facilitating the maintenance and replacement of the brush body.
[0015] Further, the outer wall of the brush shaft is fixedly connected with a plurality of brush bodies, and the brush bodies are located at the upper end of the mounting plate.
[0016] By the above technical scheme, the plurality of brush bodies are uniformly distributed on the brush shaft, which can ensure that uniform force is applied to the wafer surface during cleaning, avoiding local over-cleaning or insufficient cleaning.
[0017] Further, the outer wall of the rear end of the plug block is closely fitted with the outer wall of the other side of the rotating rod.
[0018] By the above technical scheme, the gap between the plug block and the rotating rod can be reduced by the closely fitted design, thereby reducing the displacement of the components due to vibration or force during brushing, and improving the stability of the entire brush mechanism.
[0019] Further, the front end and the rear end of the upper surface of the mounting plate are provided with mounting holes.
[0020] By the above technical scheme, the mounting holes are used to fix the entire brush mechanism to the hole position of the wafer brush cleaning machine.
[0021] Further, the outer wall of the front end of the mounting block is fixedly connected with a handle.
[0022] By the above technical scheme, the handle is convenient for the operator to install and disassemble the mounting block.
[0023] The utility model has the advantages of the following beneficial effects:
[0024] 1, the utility model discloses a kind of brush mechanism for wafer brush cleaning machine, the rotation of rotating rod can be realized by the second servo motor control, the rotation of brush body on brush shaft can be realized, to improve the precision of wafer cleaning, in addition, the sliding fit design of T-shaped block and T-shaped groove, and rotating rod and the close fit of placement slot, all increase the stability of brush mechanism, reduce vibration in cleaning process, the design of insertion slot, limit slot, installation slot, connecting groove and clamping mechanism makes that rotating rod can be easily taken out from placement slot, so that brush shaft and brush body can be easily disassembled and replaced, easy to maintain and repair.
[0025] 2, the utility model discloses a kind of brush mechanism for wafer brush cleaning machine, by the design of first servo motor, threaded rod and connecting rod, the synchronous height adjustment of first sliding block and second sliding block can be realized, the synchronous adjustment of first sliding block and second sliding block ensures that the overall height of mounting block, rotating rod, brush shaft and brush body can be automatically adjusted evenly, and then the constant pressure and cleaning effect of brush and wafer surface can be controlled by adjusting the distance between brush and wafer surface. BRIEF DESCRIPTION OF DRAWINGS
[0026] Figure 1 It is the isometric view of the brush mechanism for wafer brush cleaning machine proposed in the utility model;
[0027] Figure 2 It is the explosion view of the brush mechanism for wafer brush cleaning machine proposed in the utility model;
[0028] Figure 3 It is the partial structure explosion view of the brush mechanism for wafer brush cleaning machine proposed in the utility model;
[0029] Figure 4 It is Figure 2 Enlarged view of A in the middle.
[0030] LEGEND:
[0031] 1, mounting plate;101, mounting hole;2, first servo motor;201, threaded rod;202, connecting rod;3, first sliding block;301, T-shaped groove;4, second sliding block;401, placement slot;402, insertion slot;403, installation slot;404, connecting groove;5, insertion block;501, limit slot;6, clamping mechanism;601, return spring;602, limit rod;7, mounting block;701, T-shaped block;702, handle;8, second servo motor;801, rotating rod;802, brush shaft;803, brush body. DETAILED DESCRIPTION
[0032] The technical scheme in the specific embodiment of the utility model will be clearly and completely described in the following combined with the drawings in the specific embodiment of the utility model. Obviously, the described specific embodiment is only a part of the specific embodiments of the utility model, rather than all the specific embodiments. Based on the specific embodiment in the utility model, all other specific embodiments obtained by the ordinary skilled in the art without making creative labor belong to the protection scope of the utility model.
[0033] With reference to Figure 2 , Figure 3 and Figure 4The utility model provides a kind of concrete implementation of wafer brush cleaning machine with brush mechanism, including mounting plate 1, clamping mechanism 6 and mounting block 7, the side of mounting plate 1 upper end is provided with first sliding block 3, and the front end and rear end of the lower part of the other side of first sliding block 3 are opened with T slot 301, and the middle part of the upper surface of mounting block 7 is fixedly connected with T block 701, and the inside of the other side of T block 701 is fixedly connected with second servo motor 8, and the output end of second servo motor 8 is fixedly connected with rotating rod 801 to the other side of mounting block 7 and is penetrated, and rotating rod 801 is fixedly connected with brush shaft 802, the other side of mounting plate 1 upper end is provided with second sliding block 4, and the lower part of the outer wall of one side of second sliding block 4 is opened with placing groove 401, and the other side of rotating rod 801 is tightly attached with the inner wall of the rear end of placing groove 401, and the front end of one side of the upper surface and lower surface of second sliding block 4 is opened with insertion groove 402, and the inner wall of insertion groove 402 is tightly attached with insertion block 5, and the middle part of the outer wall of insertion block 5 upper end is opened with two limit grooves 501, and the upper end and rear end of one side of the outer wall of the front end of second sliding block 4 are opened with mounting groove 403, and the middle part of one side of the outer wall of the front end of second sliding block 4 is opened with two connecting grooves 404, and the upper end and lower end of the outer wall of the rear end of clamping mechanism 6 are fixedly connected with reset spring 601, and reset spring 601 is located in the inside of mounting groove 403, and the rear end of reset spring 601 is fixedly connected with the inner wall of the rear end of mounting groove 403, and the middle part of the outer wall of the rear end of clamping mechanism 6 is fixedly connected with two limit rods 602, and the rear end of limit rod 602 is penetrated connecting groove 404 and limit groove 501 to the inside of insertion groove 402, and the outer wall of the rear end of limit rod 602 is slidably attached with the inner wall of connecting groove 404 and limit groove 501, the rotation of rotating rod 801 can be controlled by second servo motor 8, the rotation of the brush body 803 on brush shaft 802 can be realized, so as to improve the precision of wafer cleaning, in addition, the sliding attachment design of T block 701 and T slot 301, and the close attachment of rotating rod 801 and placing groove 401, all increase the stability of brush mechanism, reduce the vibration in the cleaning process, the design of insertion groove 402, limit groove 501, mounting groove 403, connecting groove 404 and clamping mechanism 6 makes that rotating rod 801 can be easily taken out from placing groove 401, so that brush shaft 802 and brush body 803 can be easily disassembled and replaced, convenient for maintenance and repair.
[0034] Refer to Figure 1 And Figure 2The inner bottom surface of the middle part of one side of the upper end of the mounting plate 1 is fixedly connected with a first servo motor 2, the output end of the first servo motor 2 penetrates through the mounting plate 1 to the upper end of the mounting plate 1 and is fixedly connected with a threaded rod 201, the lower end of the threaded rod 201 is rotatably connected with the upper surface of the mounting plate 1, the inner wall of one side of the first sliding block 3 is threadedly connected with the outer wall of the threaded rod 201, the middle part of the other side of the upper surface of the mounting plate 1 is fixedly connected with a connecting rod 202, the inner wall of the other side of the second sliding block 4 is slidingly attached to the outer wall of the connecting rod 202, through the design of the first servo motor 2, the threaded rod 201 and the connecting rod 202, the synchronous height adjustment of the first sliding block 3 and the second sliding block 4 can be realized, and the synchronous adjustment of the first sliding block 3 and the second sliding block 4 ensures that the overall height of the mounting block 7, the rotating rod 801, the brush shaft 802 and the brush body 803 can be automatically and uniformly adjusted, and then the constant pressure and cleaning effect of the brush and the wafer surface can be controlled by adjusting the distance between the brush and the wafer surface.
[0035] With reference to Figure 1 , Figure 2 and Figure 3 , the outer wall of the T-shaped block 701 is slidingly attached to the inner wall of the T-shaped groove 301, and the limiting effect of the T-shaped groove 301 can prevent the T-shaped block 701 from moving in an unintended direction, ensuring that the brush mechanism will not deviate, and the T-shaped block 701 can be easily inserted into the T-shaped groove 301 without a complex alignment process, simplifying the installation steps of the mounting block 7, one side of the rotating rod 801 is rotatably connected with the outer wall of the other side of the mounting block 7, and the design of the rotating connection generally makes the connection between the rotating rod 801 and the first mounting block 7 easy to disassemble, facilitating maintenance and replacement of the brush body 803, the outer wall of the brush shaft 802 is fixedly connected with a plurality of brush bodies 803, and the brush bodies 803 are located at the upper end of the mounting plate 1, and through the uniform distribution of the plurality of brush bodies 803 on the brush shaft 802, it can be ensured that uniform force is applied to the wafer surface during cleaning, avoiding local over-cleaning or insufficient cleaning, the outer wall of the rear end of the plug 5 is closely attached to the outer wall of the other side of the rotating rod 801, and through the design of close attachment, the gap between the plug 5 and the rotating rod 801 can be reduced, thereby reducing the displacement of components due to vibration or force during brushing, and improving the stability of the entire brush mechanism, the front end and the rear end of both sides of the upper surface of the mounting plate 1 are provided with mounting holes 101, and the mounting holes 101 are used to fix the entire brush mechanism to the hole position of the wafer brush cleaning machine, and the outer wall of the front end of the mounting block 7 is fixedly connected with a handle 702, which facilitates the installation and disassembly of the mounting block 7 by the operator.
[0036] Working principle: first, the mounting plate 1 is fixed in the wafer brush cleaning machine in the appropriate position, through the installation hole 101 is fixed, then, the T-shaped block 701 is inserted into the T-shaped groove 301 in the lower part of the first sliding block 3, ensure that the T-shaped block 701 and T-shaped groove 301 sliding fit, thereby fixing the mounting block 7, then, through the cooperation of the first servo motor 2, threaded rod 201 and connecting rod 202, the height of the first sliding block 3 and the second sliding block 4 is adjusted, so as to realize the overall height adjustment of the mounting block 7, rotating rod 801, brush shaft 802 and brush body 803, the synchronous adjustment of the first sliding block 3 and the second sliding block 4 ensures that the overall height of the mounting block 7, rotating rod 801, brush shaft 802 and brush body 803 can be automatically adjusted uniformly during the cleaning process, and then the constant pressure and cleaning effect of the brush and the wafer surface can be controlled by adjusting the distance between the brush and the wafer surface, the brush body 803 is uniformly distributed on the brush shaft 802, which ensures uniform cleaning of the wafer surface, the close fit design of the plug-in block 5 and the rotating rod 801 improves the stability of the mechanism, when maintaining and replacing the brush, the T-shaped block 701 can be pulled out of the T-shaped groove 301 through the handle 702, so that the mounting block 7 can be easily taken out, and the limiting rod 602 can be pulled out of the limiting groove 501 through pulling the clamping mechanism 6, so that the plug-in block 5 can be taken out, then the rotating rod 801 can be taken out from the placing groove 401, so that the brush shaft 802 and the brush body 803 can be easily disassembled and replaced, which is convenient for maintenance and repair.
[0037] Finally, it should be noted that: the above only for the preferred specific embodiments of the present application, and not for limiting the present application, although the foregoing detailed description of the present application, for the person skilled in the art, it still can be modified, or part of the technical features of the equivalent replacement, within the spirit and principles of the present application, any modification, equivalent replacement, improvement, etc., should be included in the scope of protection of the present application.
Claims
1. A brush mechanism for wafer cleaning, comprising a mounting plate (1), a clamping mechanism (6) and a mounting block (7), characterized in that: The upper end of the mounting plate (1) is provided with a first sliding block (3), and the front end and the rear end of the lower part of the other side of the first sliding block (3) are provided with T-shaped grooves (301), and the upper surface of the mounting block (7) is fixedly connected with a T-shaped block (701), and the other side of the T-shaped block (701) is fixedly connected with a second servo motor (8), and the output end of the second servo motor (8) penetrates the mounting block (7) to the other side of the mounting block (7) and is fixedly connected with a rotating rod (801), and the outer wall of the rotating rod (801) is fixedly connected with a brush shaft (802), and the other side of the upper end of the mounting plate (1) is provided with a second sliding block (4), and the lower part of the outer wall of one side of the second sliding block (4) is provided with a placing groove (401), and the other side of the rotating rod (801) is tightly attached to the inner wall of the rear end of the placing groove (401), and the front end of one side of the upper surface and the lower surface of the second sliding block (4) is provided with an insertion groove (402), and the inner wall of the insertion groove (402) is tightly attached to an insertion block (5), and the upper end of the outer wall of the insertion block (5) is provided with two limiting grooves (501), and the upper end and the rear end of one side of the outer wall of the front end of the second sliding block (4) are provided with mounting grooves (403), and the middle part of one side of the outer wall of the front end of the second sliding block (4) is provided with two connecting grooves (404), and the upper end and the lower end of the outer wall of the rear end of the clamping mechanism (6) are fixedly connected with return springs (601), and the return springs (601) are located in the interior of the mounting grooves (403), and the rear end of the return springs (601) is fixedly connected with the inner wall of the rear end of the mounting grooves (403), and the middle part of the outer wall of the rear end of the clamping mechanism (6) is fixedly connected with two limiting rods (602), and the rear end of the limiting rod (602) penetrates the connecting grooves (404) and the limiting grooves (501) to the interior of the insertion groove (402), and the outer wall of the rear end of the limiting rod (602) is slidingly attached to the inner wall of the connecting grooves (404) and the limiting grooves (501).
2. The brush mechanism for wafer cleaning according to claim 1, wherein: The inner bottom surface of the middle part of one side of the upper end of the mounting plate (1) is fixedly connected with a first servo motor (2), the output end of the first servo motor (2) penetrates the mounting plate (1) to the upper end of the mounting plate (1) and is fixedly connected with a threaded rod (201), the lower end of the threaded rod (201) is rotatably connected with the upper surface of the mounting plate (1), the inner wall of one side of the first sliding block (3) is threadedly connected with the outer wall of the threaded rod (201), and the middle part of the other side of the upper surface of the mounting plate (1) is fixedly connected with a connecting rod (202), and the inner wall of the other side of the second sliding block (4) is slidingly attached to the outer wall of the connecting rod (202).
3. The brush mechanism for wafer cleaning according to claim 1, wherein: The outer wall of the T-shaped block (701) is slidingly attached to the inner wall of the T-shaped groove (301).
4. The brush mechanism for wafer cleaning according to claim 1, wherein: One side of the rotating rod (801) is rotatably connected with the outer wall of the other side of the mounting block (7).
5. The brush mechanism for wafer cleaning according to claim 1, wherein: The outer wall of the brush shaft (802) is fixedly connected with a plurality of brush bodies (803), and the brush bodies (803) are located on the upper end of the mounting plate (1).
6. The brush mechanism for wafer cleaning according to claim 1, wherein: The outer wall of the rear end of the plug (5) is tightly attached to the outer wall of the other side of the rotating rod (801).
7. The brush mechanism for wafer cleaning according to claim 1, wherein: The mounting plate (1) is provided with mounting holes (101) at the front end and the rear end of the upper surface of both sides.
8. The brush mechanism for wafer cleaning according to claim 1, wherein: The outer wall of the front end of the mounting block (7) is fixedly connected with a handle (702).