Turnover device and upside-down machine

Abstract

The utility model provides a turnover device and an upside-down machine. The turnover device comprises a turnover module and an adjusting module. Wherein the overturning module is used for picking up a chip and driving the chip to overturn; the adjusting module comprises a first driving part and an adjusting assembly, the first driving part is in transmission connection with the overturning module and used for driving the overturning module to move in the first direction, and the adjusting assembly is used for installing the first driving part and driving the first driving part to move in the direction perpendicular to the first direction. According to the turnover device, the positions of the turnover module and the first driving part are adjusted through the adjusting assembly, so that the shape and the size of the turnover device are adjustable, the application requirements of various different turnover machines can be met, and the flexibility and the applicability of the turnover device are improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to a flipping device and a flipping machine. Background Technology

[0002] Semiconductor die-loading machines are core equipment in packaging and testing lines, and are widely used in forward packaging processes. To meet the demands for high density and high precision, flip-chip packaging technology emerged, leading to the development of flip-chip machines. One of the key aspects of flip-chip machines is the chip flipping module. However, limited by the internal mounting space of the flip-chip machine, the position of the flipping module in existing technologies is fixed, resulting in poor flexibility and applicability. Utility Model Content

[0003] Therefore, it is necessary to provide a flipping device and a flipping machine to address the problems of fixed position of existing flipping modules in the flipping machine, resulting in poor flexibility and applicability.

[0004] The technical solution is as follows:

[0005] On the one hand, a flipping device is provided for use in a flipping machine, comprising:

[0006] The flip module is used to pick up and flip the chip.

[0007] The adjustment module includes a first driving component and an adjustment assembly. The first driving component is connected to the flipping module and is used to drive the flipping module to move along a first direction. The adjustment assembly is used to install the first driving component and drive the first driving component to move along a direction perpendicular to the first direction.

[0008] The technical solution will be further explained below:

[0009] In one embodiment, the adjustment assembly includes a mounting body, a first adjustment member, and a second adjustment member. The first adjustment member is movably connected to the mounting body along a second direction, and the second adjustment member is movably connected to the first adjustment member along a third direction. The first driving member is mounted on the second adjustment member, and the second direction intersects with the third direction and is perpendicular to the first direction.

[0010] In one embodiment, one end of the first adjusting member is movablely connected to the mounting body along the second direction, and the other end is movablely connected to the second adjusting member along the third direction.

[0011] In one embodiment, the first adjustment member and the second adjustment member are located on adjacent sides of the mounting body, respectively.

[0012] In one embodiment, the second adjusting member has a movable part on one side along the first direction, the movable part extends along the third direction and is movably connected to one end of the first adjusting member away from the mounting body, and the first driving member is mounted on the side of the second adjusting member where the movable part is provided.

[0013] In one embodiment, the adjustment assembly further includes a second driving member, which is convexly connected to the first adjustment member and is used to drive the first adjustment member to move along the second direction;

[0014] And / or, the adjustment assembly further includes a third drive member, which is pultrusively connected to the second adjustment member and is used to drive the second adjustment member to move along the third direction.

[0015] In one embodiment, the first driving member includes a magnet and a coil sleeved on the outer side wall of the magnet. One of the magnet and the coil is mounted on the adjustment assembly, and the other is connected to the flipping module and can drive the flipping module to move along a first direction under the action of Ampere force.

[0016] In one embodiment, the flipping module includes a fourth driving member driven by the first driving member, a flipping member driven by the fourth driving member, and a pickup member mounted on the flipping member for picking up the chip. The fourth driving member is used to drive the flipping member to flip the pickup member.

[0017] In one embodiment, the flipping module further includes a connector that is drively connected to the first drive member, and the fourth drive member is mounted on the connector.

[0018] On the other hand, a flip chip machine is provided, including a placement soldering head device and the flipping device, wherein the placement soldering head device is located on one side of the flipping device, and the flipping device is used to flip the chip and transfer the flipped chip to the placement soldering head device.

[0019] In the above embodiments, the flipping device and flip chip machine, during use, adjust the position of the flipping module and the first driving component by moving and adjusting the components according to the shape and size of the internal mounting space of the flip chip machine. This ensures that the flipping device can be installed inside the flip chip machine. In other words, by adjusting the position of the flipping module and the first driving component, the shape and size of the flipping device are adjustable, thereby meeting the application requirements of various different flip chips and improving the flexibility and applicability of the flipping device. When the chip needs to be flipped, the first driving component drives the flipping module to move along the first direction to pick up the chip from the wafer. The flipping module then drives the chip to flip 180°. The first driving component drives the flipped chip to move along the first direction through the flipping module, so that the flipped chip can be transferred to the mounting head device. The mounting head device then mounts the flipped chip onto the substrate for chip testing. Attached Figure Description

[0020] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain this application and do not constitute an undue limitation of this application.

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of a flipping device according to one embodiment.

[0023] Figure 2 for Figure 1 A schematic diagram of the adjustment module.

[0024] Figure 3 for Figure 1 A schematic diagram of the flip module in the diagram.

[0025] Explanation of reference numerals in the attached figures:

[0026] 10. Flipping device; 100. Flipping module; 111. Fourth driving component; 112. Flipping component; 113. Picking component; 114. Connecting component; 200. Adjustment module; 211. First driving component; 220. Adjustment assembly; 221. Mounting body; 222. First adjustment component; 223. Second adjustment component; 2231. Moving part. Detailed Implementation

[0027] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0028] like Figure 1 and Figure 2 As shown, in one embodiment, a flipping device 10 is provided for use in a flip chip machine. The flipping device 10 includes a flipping module 100 and an adjustment module 200. The flipping module 100 is used to pick up and flip a chip. The adjustment module 200 includes a first driving member 211 and an adjustment assembly 220. The first driving member 211 is drively connected to the flipping module 100 and is used to drive the flipping module 100 to move along a first direction. The adjustment assembly 220 is used to mount the first driving member 211 and drive the first driving member 211 to move in a direction perpendicular to the first direction.

[0029] In the above embodiment, the flipping device 10, when in use, adjusts the position of the flipping module 100 and the first driving member 211 by moving the adjustment component 220 according to the shape and size of the internal mounting space of the flip machine, thereby ensuring that the flipping device 10 can be installed inside the flip machine. In other words, by adjusting the position of the flipping module 100 and the first driving member 211 through the adjustment component 220, the shape and size of the flipping device 10 are adjustable, thereby meeting the application requirements of various different flip machines and improving the flexibility and applicability of the flipping device 10. When the chip needs to be flipped, the first driving member 211 drives the flipping module 100 to move along the first direction to pick up the chip from the wafer. Then, the flipping module 100 drives the chip to flip 180°. The first driving member 211 drives the flipped chip to move along the first direction through the flipping module 100, so that the flipped chip can be transferred to the placement bonding head device, thereby achieving the effect of flipping the chip.

[0030] like Figure 2As shown, the adjustment assembly 220 further includes a mounting body 221, a first adjustment member 222, and a second adjustment member 223. The first adjustment member 222 is movably connected to the mounting body 221 along a second direction. The second adjustment member 223 is movably connected to the first adjustment member 222 along a third direction. A first drive member 211 is mounted on the second adjustment member 223. The second direction intersects with the third direction and is perpendicular to the first direction. Thus, the position of the first drive member 211 and the flipping module 100 in the second direction can be adjusted by moving the first adjustment member 222 along the second direction, and the position of the first drive member 211 and the flipping module 100 in the third direction can be adjusted by moving the second adjustment member 223 along the third direction. The structure is simple, the operation is convenient, and the practicality of the flipping device 10 is improved.

[0031] The first direction can be flexibly adjusted according to actual usage needs. Specifically, in this embodiment, the first direction can be set to a vertical direction. The first direction, the second direction, and the third direction are all perpendicular to each other.

[0032] It should be noted that both the first adjusting component 222 and the second adjusting component 223 in this application can be adjusted manually. This reduces the number of parts and minimizes the size of the adjusting module 200, thereby meeting the application requirements of more types of flipping machines and improving the applicability of the flipping device 10.

[0033] In one embodiment, when the internal installation space of the inverted machine is sufficient, the first adjusting member 222 and the second adjusting member 223 can also be adjusted automatically. Specifically, the adjusting assembly 220 further includes a second driving member and a third driving member. The second driving member is drivenly connected to the first adjusting member 222 and is used to drive the first adjusting member 222 to move along a second direction. The adjusting assembly 220 also includes a third driving member, which is drivenly connected to the second adjusting member 223 and is used to drive the second adjusting member 223 to move along a third direction.

[0034] The first driving component 211, the second driving component, and the third driving component can all be configured as any linear driving structure in the prior art.

[0035] Specifically, in this embodiment, the first driving component 211 is configured as a voice coil motor. The first driving component 211 includes a magnet and a coil sleeved on the outer wall of the magnet. One of the magnet and the coil is mounted on the adjustment assembly 220, and the other is connected to the flip module 100 via a transmission connection and can drive the flip module 100 to move along the first direction under the action of Ampere force. Thus, while the first driving component 211 can drive the flip module 100 to move stably and reliably along the first direction, it can also effectively control the position and force of the flip module 100, enabling the first driving component 211 to provide effective buffering, preventing the flipped chip from being damaged during transfer, and improving the reliability of the flipping device 10.

[0036] The mounting body 221 can be configured as a mounting bracket, mounting base, mounting plate, or other mounting structure. Both the first adjusting member 222 and the second adjusting member 223 can be configured as adjusting plates, adjusting brackets, or other adjusting structures. The first adjusting member 222 can be moved and connected to the mounting body 221 along a second direction via a slide rail and slider, a slide groove and slide base, or other means. The second adjusting member 223 can be moved and connected to the first adjusting member 222 along a third direction via a slide rail and slider, a slide groove and slide base, or other means.

[0037] like Figure 2 As shown, optionally, one end of the first adjusting member 222 is movably connected to the mounting body 221 along the second direction, and the other end is movably connected to the second adjusting member 223 along the third direction. In this way, the mounting body 221, the first adjusting member 222, and the second adjusting member 223 are connected in sequence, and there is no interference between the three, thereby improving the reliability of the flipping device 10.

[0038] like Figure 2 As shown, optionally, the first adjusting member 222 and the second adjusting member 223 are located on adjacent sides of the mounting body 221, respectively. In this way, the mounting body 221, the first adjusting member 222 and the second adjusting member 223 are integrated, so that the size of the adjusting module 200 is as small as possible, thereby meeting the application requirements of more types of flipping machines and improving the applicability of the flipping device 10.

[0039] like Figure 2 As shown, optionally, the second adjusting member 223 has a movable part 2231 on one side along the first direction. The movable part 2231 extends along a third direction and is movably connected to the end of the first adjusting member 222 away from the mounting body 221. The first driving member 211 is mounted on the side of the second adjusting member 223 where the movable part 2231 is located. In this way, the first driving member 211, the first adjusting member 222, and the second adjusting member 223 are integrated, making the size of the adjusting module 200 as small as possible, thereby meeting the application requirements of more flipping machines and improving the applicability of the flipping device 10.

[0040] The flip module 100 can be configured as any of the existing flip structures capable of chip flipping.

[0041] like Figure 2 and Figure 3 As shown, in one embodiment, the flipping module 100 includes a fourth driving member 111 driven by a first driving member 211, a flipping member 112 driven by the fourth driving member 111, and a pickup member 113 mounted on the flipping member 112 for picking up a chip. The fourth driving member 111 drives the flipping member 112 to flip the pickup member 113. Thus, when the pickup member 113 is controlled to move along a first direction to pick up a chip, the fourth driving member 111 drives the pickup member 113 to flip through the flipping member 112, and the pickup member 113 drives the chip to flip accordingly, achieving the effect of flipping the chip.

[0042] Specifically, in this embodiment, the fourth driving component 111 can be a servo motor. The flipping component 112 can be a flipping rod, one end of which is connected to the output end of the servo motor. The pickup component 113 can be a pickup nozzle, which is detachably mounted on the end of the flipping rod away from the servo motor. The number and size of the pickup nozzles can be flexibly adjusted according to actual usage needs.

[0043] like Figure 2 and Figure 3 As shown, optionally, the flipping module 100 also includes a connector 114, which is connected to the first drive member 211 in a transmission manner. The fourth drive member 111 is mounted on the connector 114. In this way, the fourth drive member 111 can be pre-installed on the connector 114, and then connected to the first drive member 211 in a transmission manner through the connector 114, thereby improving the ease of assembly of the flipping device 10.

[0044] The connector 114 can be configured as a connecting plate, a connecting frame, or other connecting structure.

[0045] In one embodiment, a flip chip machine is provided, including a placement soldering head device and a flipping device 10 as described in any of the above embodiments. The placement soldering head device is located on one side of the flipping device 10, which is used to flip the chip and transfer the flipped chip to the placement soldering head device.

[0046] In the flip chip machine described in the above embodiments, during use, the adjustment component 220 is moved according to the shape and size of the internal mounting space of the flip chip machine, thereby adjusting the position of the flip module 100 and the first driving component 211 to ensure that the flip device 10 can be installed inside the flip chip machine. In other words, by adjusting the position of the flip module 100 and the first driving component 211 through the adjustment component 220, the shape and size of the flip device 10 are adjustable, thereby meeting the application requirements of various different flip chips and improving the flexibility and applicability of the flip device 10. When the chip needs to be flipped, the first driving component 211 drives the flip module 100 to move along the first direction to pick up the chip from the wafer. Then, the flip module 100 drives the chip to flip 180°. The first driving component 211 drives the flipped chip to move along the first direction through the flip module 100 so that the flipped chip can be transferred to the mounting head device. The mounting head device then mounts the flipped chip onto the substrate for chip testing.

[0047] The mounting head device can be configured as any existing structure capable of mounting chips onto a substrate.

[0048] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0049] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0050] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0051] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0052] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0053] It should also be understood that, in interpreting the connection or positional relationships of components, although not explicitly described, connection and positional relationships are interpreted to include a range of error, which should be within the acceptable deviation range of a specific value as determined by a person skilled in the art. For example, "approximately," "about," or "substantially" can mean within one or more standard deviations, without limitation herein.

[0054] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A flipping device, applied to a flipping machine, characterized in that, include: The flip module is used to pick up and flip the chip. The adjustment module includes a first driving component and an adjustment assembly. The first driving component is connected to the flipping module and is used to drive the flipping module to move along a first direction. The adjustment assembly is used to install the first driving component and drive the first driving component to move along a direction perpendicular to the first direction.

2. The flipping device according to claim 1, characterized in that, The adjustment assembly includes a mounting body, a first adjustment member, and a second adjustment member. The first adjustment member is movably connected to the mounting body along a second direction, and the second adjustment member is movably connected to the first adjustment member along a third direction. The first driving member is mounted on the second adjustment member. The second direction intersects with the third direction and is perpendicular to the first direction.

3. The flipping device according to claim 2, characterized in that, One end of the first adjusting member is movablely connected to the mounting body along the second direction, and the other end is movablely connected to the second adjusting member along the third direction.

4. The flipping device according to claim 2, characterized in that, The first adjustment member and the second adjustment member are respectively located on adjacent sides of the mounting body.

5. The flipping device according to claim 2, characterized in that, The second adjusting member has a movable part on one side along the first direction. The movable part extends along the third direction and is movably connected to the end of the first adjusting member away from the mounting body. The first driving member is installed on the side of the second adjusting member where the movable part is located.

6. The flipping device according to claim 2, characterized in that, The adjustment assembly further includes a second driving member, which is pulsatorically connected to the first adjustment member and is used to drive the first adjustment member to move along the second direction; And / or, the adjustment assembly further includes a third drive member, which is pultrusively connected to the second adjustment member and is used to drive the second adjustment member to move along the third direction.

7. The flipping device according to claim 1, characterized in that, The first driving component includes a magnet and a coil sleeved on the outer wall of the magnet. One of the magnet and the coil is mounted on the adjustment assembly, and the other is connected to the flipping module and can drive the flipping module to move along a first direction under the action of Ampere force.

8. The flipping device according to any one of claims 1 to 7, characterized in that, The flipping module includes a fourth driving component that is driven by the first driving component, a flipping component that is driven by the fourth driving component, and a pickup component mounted on the flipping component for picking up the chip. The fourth driving component is used to drive the flipping component to flip the pickup component.

9. The flipping device according to claim 8, characterized in that, The flipping module also includes a connector, which is connected to the first driving component, and the fourth driving component is mounted on the connector.

10. A reverse-loading machine, characterized in that, The device includes a mounting head assembly and a flipping device as described in any one of claims 1 to 9, wherein the mounting head assembly is located on one side of the flipping device, and the flipping device is used to flip the chip and transfer the flipped chip to the mounting head assembly.

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