Aluminum plating device for CMOS (complementary metal oxide semiconductor) substrate production

Abstract

The utility model discloses an aluminum plating device for production of a CMOS (Complementary Metal Oxide Semiconductor) substrate, relates to the technical field of aluminum plating, and aims to solve the problem that the existing aluminum plating device in the prior art directly puts materials needing to be subjected to aluminum plating into an aluminum plating pool for electroplating, but the materials are stacked when a large amount of materials are put into the aluminum plating pool, so that the materials are not uniformly electroplated. Rectangular limiting strips are fixedly connected to the two sides of the upper end face of the aluminum plating pool correspondingly, a plurality of supporting rods are jointly arranged at the upper ends of the two rectangular limiting strips, a cross-shaped limiting sliding groove is formed in the middle of the interior of each supporting rod, and a plurality of cross-shaped limiting sliding blocks are slidably connected to the interior of each cross-shaped limiting sliding groove. A circular groove is formed in the middle of the cross-shaped limiting sliding block, a threaded rod is rotationally connected into the circular groove, a hook is fixedly connected to the portion, from the lower end of the threaded rod to the interior of the aluminum plating pool, of the threaded rod, and a CMOS substrate is arranged on the hook, so that height adjustment of the CMOS substrate is achieved; the problem that in the prior art, stacking and electroplating are not uniform due to the fact that materials are directly placed in an aluminum plating pool is solved.

Description

Technical Field

[0001] This utility model relates to the field of aluminum plating technology, specifically to an aluminum plating apparatus for CMOS substrate production. Background Technology

[0002] Metallization is a surface treatment technology that deposits a thin layer of aluminum film on the surface of a substrate (such as plastic, paper, or metal), thereby endowing the substrate with a series of excellent properties, such as good reflectivity, barrier properties, conductivity, and decorative properties. This technology mainly utilizes methods such as vacuum evaporation or sputtering deposition, heating aluminum metal to a molten or excited state in a vacuum or specific gas environment, and then depositing it onto the substrate surface. Metallized products are widely used in packaging, construction, electronics, automobiles, and many other fields, not only improving the aesthetics and functionality of products but also extending their service life.

[0003] For example, authorization announcement number CN222160439U relates to a reversible aluminum plating device. Technical problem: In existing aluminum plating devices, during the plating process, the bottom of the substrate to be plated often comes into contact with the bottom of the aluminum plating solution tank. This can easily lead to incomplete reaction between the bottom of the substrate and the aluminum plating solution, resulting in insufficient adhesion between the aluminum plating layer and the substrate, causing the plating layer to peel off and reducing plating efficiency. Technical solution: A reversible aluminum plating device includes a worktable, a container assembly, an adjustment assembly, and a holding assembly. A power supply post is combined with a metal block, allowing the power supply post to provide power to the metal block via a power line. This causes the metal block and the substrate to respectively form the cathode and anode, resulting in an electrolytic reaction in the electrolyte. This dissolves the aluminum material in the electrolyte, allowing it to adhere to the surface of the substrate and complete the aluminum plating process.

[0004] Existing aluminum plating equipment involves directly placing the material to be plated into the aluminum plating bath for electroplating. However, when a large amount of material is placed in, it will pile up, resulting in uneven plating. Therefore, there is an urgent need in the market to develop an aluminum plating equipment for CMOS substrate production to help people solve the existing problems. Utility Model Content

[0005] The purpose of this invention is to provide an aluminum plating apparatus for CMOS substrate production, in order to solve the problem mentioned in the background art that the existing aluminum plating apparatuses all directly put the material to be aluminum plating into the aluminum plating bath for electroplating, but when a large amount of material is put in, it will pile up, resulting in uneven electroplating of the material.

[0006] To achieve the above objectives, this utility model provides the following technical solution: an aluminum plating apparatus for CMOS substrate production, comprising an aluminum plating pool, wherein rectangular limiting strips are fixedly connected to both sides of the upper end face of the aluminum plating pool, and multiple support rods are commonly provided at the upper ends of the two rectangular limiting strips. A cross-shaped limiting groove is provided in the middle of the support rod, and multiple cross-shaped limiting sliders are slidably connected inside the cross-shaped limiting groove. A circular groove is provided in the middle of the cross-shaped limiting slider, and a screw is rotatably connected inside the circular groove. A hook is fixedly connected from the lower end of the screw to the inside of the aluminum plating pool, and a CMOS substrate is provided on the hook.

[0007] Preferably, the upper end of the rectangular limiting strip is provided with multiple rectangular slots at equal intervals, and the two sides of the support rod are respectively inserted into the rectangular slots parallel to the upper end of the rectangular limiting strip.

[0008] Preferably, the upper end of the cross-shaped limiting slider extends out of the upper end face of the support rod and is rotatably connected to a rotating tube, and the rotating tube is fixedly provided with an internal thread.

[0009] Preferably, the upper end of the screw passes through the interior of the rotating tube and extends out of the upper end of the rotating tube, and the screw is threadedly connected to the internal thread portion inside the rotating tube.

[0010] Preferably, a rectangular limiting groove is provided in the middle of the screw, and a rectangular limiting block is fixedly provided in the middle of the circular groove, with the middle of the rectangular limiting block passing through the inside of the rectangular limiting groove.

[0011] Preferably, the CMOS substrate has multiple mounting holes.

[0012] Preferably, the hook passes through the interior of a single mounting hole on the CMOS substrate.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] (1) In this utility model, the height of the CMOS substrate can be adjusted by using a support rod, a cross-shaped limiting groove, a cross-shaped limiting slider, a circular groove, a rotating tube, a screw, and a hook, thus avoiding the problems of stacking and uneven electroplating caused by directly placing the material into the aluminum plating bath in the prior art. This height-adjustable design allows each CMOS substrate to be electroplated independently, ensuring the uniformity and quality of the electroplating.

[0015] (2) In this utility model, the height of the CMOS substrate can be easily adjusted by rotating the rotating tube, which greatly improves production efficiency. At the same time, the design of the support rod and the cross-shaped limiting slider makes the device have good stability and load-bearing capacity, which can meet the needs of large-scale production.

[0016] (3) In this utility model, by adjusting the number and layout of the support rods and hooks, the device can also adapt to CMOS substrates of different sizes and shapes, and has strong flexibility. Attached Figure Description

[0017] Figure 1 This is a front view of an aluminum plating apparatus for CMOS substrate production according to the present invention.

[0018] Figure 2 This is a front sectional view of the cross-shaped limiting slider of this utility model;

[0019] Figure 3 This is a side sectional view of the cross-shaped limiting slider of this utility model;

[0020] Figure 4 This is a detailed enlarged view of part A of the present invention;

[0021] Figure 5 This is a detailed enlarged view of part B of this utility model.

[0022] In the diagram: 1. Aluminum plating tank; 101. Rectangular limiting strip; 102. Rectangular slot; 2. Support rod; 201. Cross-shaped limiting slide groove; 3. Cross-shaped limiting slider; 301. Circular groove; 302. Rectangular limiting block; 303. Rotating tube; 304. Internal thread part; 4. Screw; 401. Rectangular limiting groove; 402. Hook; 5. CMOS substrate; 501. Mounting hole. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] Please see Figure 1-5This utility model provides an embodiment of an aluminum plating apparatus for CMOS substrate production, comprising an aluminum plating tank 1. Rectangular limiting strips 101 are fixedly connected to both sides of the upper surface of the aluminum plating tank 1. Multiple support rods 2 are commonly arranged at the upper ends of the two rectangular limiting strips 101. Multiple rectangular slots 102 are evenly spaced at the upper ends of the rectangular limiting strips 101. The support rods 2 are inserted into the parallel rectangular slots 102 at the upper ends of the two rectangular limiting strips 101 on both sides, thus supporting and limiting the two ends of the support rods 2 through the two rectangular limiting strips 101. A cross-shaped limiting groove 201 is provided in the middle of the support rod 2. Multiple cross-shaped limiting sliders 3 are slidably connected inside the cross-shaped limiting groove 201. The cross-shaped limiting sliders 3 can slide inside the cross-shaped limiting groove 201. A circular groove 301 is provided in the middle of the cross-shaped limiting sliders 3. A screw 4 is rotatably connected to a cross-shaped limiting slider 3. The upper end of the slider 3 extends out of the upper end face of the support rod 2 and is rotatably connected to a rotating tube 303. An internal thread 304 is fixedly provided inside the rotating tube 303. The upper end of the screw 4 passes through the inside of the rotating tube 303 and extends out of the upper end of the rotating tube 303. The screw 4 is threadedly connected to the internal thread 304 inside the rotating tube 303. A rectangular limiting groove 401 is provided in the middle of the screw 4. A rectangular limiting block 302 is fixedly provided in the middle of the circular groove 301. The middle of the rectangular limiting block 302 passes through the inside of the rectangular limiting groove 401, so that the screw 4 can move up and down along the circular groove 301. At the same time, the rectangular limiting block 302 slides along the inside of the rectangular limiting groove 401 to limit the rotation of the screw 4. Then, by rotating the rotating tube 303 and through the threaded connection between the screw 4 and the internal thread 304, the screw 4 can move up and down.

[0025] Please see Figure 1-3 A hook 402 is fixedly connected to the lower end of the screw 4 to the inside of the aluminum plating tank 1. A CMOS substrate 5 is provided on the hook 402. The CMOS substrate 5 is provided with multiple mounting holes 501. The mounting holes 501 are used to fix the CMOS substrate 5 in the mounting position by screws. The hook 402 passes through the inside of a single mounting hole 501 on the CMOS substrate 5. The CMOS substrate 5 is hung up by the hook 402 and lowered into the aluminum plating tank 1. Multiple CMOS substrates 5 are lowered into the aluminum plating tank 1 by multiple hooks 402 for electroplating, while preventing multiple CMOS substrates 5 from contacting each other and causing uneven aluminum plating.

[0026] Working principle: In use, the CMOS substrate 5 is hung on the hook 402 through the mounting hole 501. The hook 402 is fixedly connected to the lower end of the screw 4. Then, the support rod 2 is inserted into the rectangular slot 102 at the upper end of the rectangular limiting block 101. At this time, the hook 402 lifts the CMOS substrate 5 into the aluminum plating tank 1. First, adjust the height of the support rod 2 according to the actual needs. By rotating the rotating tube 303, since the screw 4 is threadedly connected to the internal thread 304 inside the rotating tube 303, and the rectangular limiting block 302 limits the rotation of the screw 4, the screw 4 and the hook 402 drive the CMOS substrate 5 to move up and down along the circular groove 301, thereby adjusting the height of the CMOS substrate 5 inside the aluminum plating tank 1 and preventing it from touching the bottom. Multiple CMOS substrates 5 can be hung on different hooks 402 respectively. By adjusting their respective heights, they can avoid contact and stacking, ensuring uniform electroplating. After electroplating is completed, lift the support rod 2 to lift the CMOS substrate 5 out of the aluminum plating tank 1, completing the entire aluminum plating process.

[0027] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. An apparatus for aluminizing a CMOS substrate, comprising an aluminizing bath (1), characterized in that: Both sides of the upper end face of the aluminize pool (1) are fixedly connected with rectangular limiting strips (101), the upper ends of the two rectangular limiting strips (101) are commonly provided with a plurality of supporting rods (2), the middle part of the inside of the supporting rod (2) is provided with a cross limiting sliding groove (201), the inside of the cross limiting sliding groove (201) is slidably connected with a plurality of cross limiting sliding blocks (3), the middle part of the cross limiting sliding block (3) is provided with a circular groove (301), the circular groove (301) is rotatably connected with a screw rod (4), the lower end of the screw rod (4) is fixedly connected with a hook (402) inside the aluminize pool (1), the hook (402) is provided with a CMOS substrate (5).

2. The apparatus for aluminizing a CMOS substrate as set forth in claim 1, wherein: The upper end of the rectangular limiting strip (101) is provided with a plurality of rectangular clamping grooves (102) at equal intervals, and the two sides of the supporting rod (2) are respectively inserted into the inside of the parallel rectangular clamping grooves (102) at the upper end of the two rectangular limiting strips (101).

3. The apparatus for aluminizing a CMOS substrate as set forth in claim 1, wherein: The upper end of the cross limiting sliding block (3) extends out of the upper end face of the supporting rod (2) and is rotatably connected with a rotating pipe (303), and the inside of the rotating pipe (303) is fixedly provided with an internal thread part (304).

4. The apparatus for aluminizing a CMOS substrate as set forth in claim 3, wherein: The upper end of the screw rod (4) passes through the inside of the rotating pipe (303) and extends out of the upper end of the rotating pipe (303), and the screw rod (4) is screw-connected with the internal thread part (304) in the inside of the rotating pipe (303).

5. The apparatus for aluminizing a CMOS substrate as defined in claim 1, wherein: The middle part of the screw rod (4) is provided with a rectangular limiting groove (401), and the middle part of the inside of the circular groove (301) is fixedly provided with a rectangular limiting block (302), and the middle part of the rectangular limiting block (302) passes through the inside of the rectangular limiting groove (401).

6. The apparatus for aluminizing a CMOS substrate as defined in claim 1, wherein: The CMOS substrate (5) is provided with a plurality of mounting holes (501).

7. The apparatus for aluminizing a CMOS substrate as set forth in claim 6, wherein: The hook (402) passes through the inside of a single mounting hole (501) of the CMOS substrate (5).

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