Area array laser detector

Abstract

The utility model belongs to the technical field of high-precision laser positioning, and discloses an area array laser detector, which comprises a detector tube shell, an area array detection circuit chip is arranged in the detector tube shell, an area array photosensitive chip is arranged on one side, deviating from the detector tube shell, of the area array detection circuit chip, and a light window is arranged on the top surface of the detector tube shell. The detector tube shell, the area array detection circuit chip, the area array photosensitive chip and the light window form an integrated packaging body, the detector tube shell comprises a ceramic insulator shell, a metal base and a PCB (Printed Circuit Board), the area array photosensitive chip comprises a plurality of groups of photosensitive elements which are arranged in a dot-matrix manner, the area array detection circuit chip comprises a plurality of groups of detection units which are arranged in a dot-matrix manner, and the light window is arranged on the surface of the area array photosensitive chip. The device is compact and reasonable in structural design, can realize pulse laser detection and high-precision positioning, is small in size after integrated packaging, is good in mechanical property, is high in impact resistance and vibration resistance, is more convenient to use and maintain, and has high practical value.

Description

TECHNICAL FIELD

[0001] The utility model relates to high accuracy laser positioning technical field, concretely is a kind of area array laser detector. BACKGROUND

[0002] Modern laser warning and laser guidance system demand high-precision laser positioning increasingly urgent.Laser warning equipment needs to perceive the direction, frequency and power of laser irradiation in real time;Laser guidance relies on high-precision laser positioning to achieve accurate positioning of target.However, traditional area array laser detector faces multiple technical bottlenecks when meeting the above needs.

[0003] First, high-precision laser positioning relies on the dense array layout of high-sensitivity optoelectronic elements.Such elements (such as avalanche photodiode, focal plane detector) have nanosecond response speed and sub-pixel positioning accuracy, but their physical structure is fragile and easily affected by mechanical impact, vibration and temperature fluctuations.For example, in dynamic application scenarios such as airborne and vehicle-mounted, conventional structure is difficult to withstand complex mechanical environment, resulting in element offset or solder failure, and thus reducing positioning accuracy.

[0004] Second, optoelectronic elements have strict requirements for thermal stability of working environment.During laser detection, if the heat generated by high-power laser incidence or long-time continuous operation of elements cannot be effectively dissipated, it will cause element temperature drift, resulting in decreased response sensitivity or even permanent damage.Meanwhile, the modular design of traditional laser detector is insufficient, resulting in low maintenance efficiency.The core elements (photosensitive chip, processing circuit) are assembled in a decentralized manner and connected through cables or plug-ins.Once a component fails, it needs to be disassembled and checked layer by layer, which is time-consuming and labor-intensive;Some high-precision elements even need to be operated in a dust-free environment, further increasing the difficulty of maintenance.In addition, the existing detector is relatively large in size, which is difficult to adapt to the space limitation of compact platform. UTILITY MODEL CONTENTS

[0005] (I) Technical problem solved: In view of the deficiencies of the prior art, the utility model provides an area array laser detector to solve the problems of poor mechanical performance and difficult maintenance mentioned in the background.

[0006] (II) Technical scheme: To achieve the above purpose, the utility model provides the following technical scheme: an area array laser detector, comprising a detector tube, an area array detection circuit chip is arranged in the detector tube, an area array photosensitive chip is arranged on the side of the area array detection circuit chip away from the detector tube, a light window is arranged on the top surface of the detector tube, the detector tube, the area array detection circuit chip, the area array photosensitive chip and the light window form an integrated packaging body, and the packaging body is fixedly installed through a mounting seat and a mounting fastener.

[0007] Preferably, the detector tube shell comprises a ceramic insulator shell, a metal base and a PCB board, the metal base is arranged on the side of the ceramic insulator shell away from the area array detection circuit chip, the metal base is clamped with the PCB board, the ceramic insulator shell is provided with a convex cap on the side away from the metal base, and the light window is fixedly connected with the convex cap through glue liquid.

[0008] Preferably, the area array photosensitive chip comprises a plurality of groups of lattice arranged photosensitive elements.

[0009] Preferably, the area array detection circuit chip comprises a plurality of groups of lattice arranged detection units, the detection units and the photosensitive elements are one-to-one corresponding, indium columns are arranged between the detection units and the photosensitive elements, and the detection units and the photosensitive elements are electrically connected through the indium columns.

[0010] Preferably, the outer side of the area array detection circuit chip is provided with a plurality of groups of bonding wires, the bonding wires penetrate through the ceramic insulator shell, and the plurality of groups of detection units are electrically connected with the PCB board through the bonding wires.

[0011] Preferably, the metal base comprises a combination plate and an X-shaped protection plate, the ceramic insulator shell is provided with the combination plate on the side away from the light window, the combination plate is fixedly connected with the ceramic insulator shell through brazing, the PCB board is provided with the X-shaped protection plate on the side away from the combination plate, positioning holes are formed in the corner blocks of the X-shaped protection plate, and the positioning holes penetrate through the X-shaped protection plate, the PCB board and the combination plate in sequence.

[0012] Preferably, a plurality of groups of first electrical contacts are arranged on the PCB board at positions corresponding to the gaps of the X-shaped protection plate, and each group of first electrical contacts is electrically connected with each group of photosensitive elements through the bonding wires.

[0013] Preferably, the mounting seat comprises a base and a mounting groove, the base is provided with the mounting groove corresponding to the metal base, a plurality of groups of second electrical contacts corresponding to the first electrical contacts are arranged in the mounting groove, and plug-in holes corresponding to the positioning holes are formed in the mounting groove.

[0014] Preferably, the mounting fastener comprises a ring-shaped buckle plate and a plug-in rod, the packaging clasp is clamped in the mounting groove, the first electrical contacts are in contact with and electrically connected with the second electrical contacts, the ring-shaped buckle plate is sleeved on the ceramic insulator shell, one side of the ring-shaped buckle plate abuts against the metal base, the plug-in rod corresponding to the positioning hole is arranged on the ring-shaped buckle plate, the plug-in rod is connected with the plug-in hole through the positioning hole, and the packaging body is fixedly mounted on the mounting seat through the mounting fastener.

[0015] (Three) beneficial effects: compared with the prior art, the area array laser detector has the following beneficial effects:

[0016] 1. The surface array laser detector is provided with a detector tube shell, a surface array detection circuit chip, a surface array photosensitive chip, a light window, a mounting seat and a mounting fastener, elements are integrated and packaged into one body according to laser warning and laser guidance requirements, pulse laser detection and high-precision positioning can be realized, the device is small in size after integrated packaging, good in mechanical property, strong in impact resistance and vibration resistance, convenient to use and maintain, and high in practical value.

[0017] 2. The mounting seat is arranged, precise elements are integrated and packaged, installation and electrical connection are realized through the mounting seat, the entire packaging body can be directly replaced after device failure, and maintenance is convenient.

[0018] 3. The metal base is arranged, the metal base covers and protects the PCB, the mechanical property of the device can be greatly improved, the impact resistance and vibration resistance are good, the device is not easy to be damaged, and the service life can be greatly improved. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a packaging body structure schematic view of the utility model;

[0020] Figure 2 It is a whole structure schematic view of the utility model;

[0021] Figure 3 It is a photosensitive element, an indium column and a detection unit structure schematic view of the utility model;

[0022] Figure 4 It is a first electrical contact structure schematic view of the utility model;

[0023] Figure 5 It is a mounting seat and mounting fastener structure schematic view of the utility model.

[0024] In the drawing: 1, detector tube shell; 2, surface array detection circuit chip; 3, surface array photosensitive chip; 4, light window; 5, mounting seat; 6, mounting fastener; 7, photosensitive element; 8, indium column; 9, detection unit; 10, ceramic insulator shell; 11, metal base; 12, PCB; 13, convex cap; 14, bonding wire; 15, combination plate; 16, X-shaped protection plate; 17, positioning hole; 18, first electrical contact; 19, base; 20, mounting groove; 21, second electrical contact; 22, plug-in hole; 23, annular buckle plate; 24, plug-in rod. DETAILED DESCRIPTION

[0025] Clearly, the described embodiments are merely a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] Please refer to Figures 1-5 The present application provides a technical scheme:

[0027] The planar array laser detector comprises a detector tube shell 1, a planar array detection circuit chip 2 arranged in the detector tube shell 1, a planar array photosensitive chip 3 arranged on the side, away from the detector tube shell 1, of the planar array detection circuit chip 2, and a light window 4 arranged on the top surface of the detector tube shell 1. The detector tube shell 1, the planar array detection circuit chip 2, the planar array photosensitive chip 3 and the light window 4 form an integrated packaging body, and the packaging body is fixedly installed through a mounting seat 5 and a mounting fastener 6. The packaging body can ensure that the precision components are integrated, and is convenient to use. When used, the entire packaging body can be directly installed.

[0028] Further, the detector tube shell 1 comprises a ceramic insulator shell 10, a metal base 11 and a PCB board 12. The metal base 11 is arranged on the side, away from the planar array detection circuit chip 2, of the ceramic insulator shell 10. The PCB board 12 is clamped in the metal base 11. The ceramic insulator shell 10 is provided with a convex cap 13 on the side, away from the metal base 11. The light window 4 is fixedly connected with the convex cap 13 through glue. The convex cap 13 can be roughened, so that the glue is combined with the light window 4.

[0029] Further, the planar array photosensitive chip 3 comprises a plurality of groups of light-sensitive elements 7 arranged in a dot matrix. The light-sensitive elements 7 can receive light signals and convert the light signals into electrical signals.

[0030] Further, the planar array detection circuit chip 2 comprises a plurality of groups of detection units 9 arranged in a dot matrix. The detection units 9 correspond to the light-sensitive elements 7 one by one. Indium columns 8 are arranged between the detection units 9 and the light-sensitive elements 7. The detection units 9 and the light-sensitive elements 7 are electrically connected through the indium columns 8. When a laser beam passes through the light window 4 and hits the planar array detection circuit chip 2, the laser will trigger a group of light-sensitive elements 7 directly opposite. The light-sensitive elements 7 output electrical signals to the corresponding detection units 9 through the indium columns 8.

[0031] Further, a plurality of groups of bonding wires 14 are arranged on the outside of the planar array detection circuit chip 2. The bonding wires 14 penetrate the ceramic insulator shell 10. The plurality of groups of detection units 9 are electrically connected with the PCB board 12 through the bonding wires 14.

[0032] Further, the metal base 11 comprises a bonding plate 15 and an X-shaped protective plate 16, the bonding plate 15 is arranged on the side of the ceramic insulator shell 10 away from the light window 4 and is fixedly connected with the ceramic insulator shell 10 by brazing, and the X-shaped protective plate 16 is arranged on the side of the PCB 12 away from the bonding plate 15, the corner blocks of the X-shaped protective plate 16 are provided with positioning holes 17, and the positioning holes 17 sequentially penetrate the X-shaped protective plate 16, the PCB 12 and the bonding plate 15. The metal base 11 is used to improve the mechanical properties of the overall device and can greatly improve the service life.

[0033] Further, a plurality of groups of first electrical contacts 18 are arranged on the PCB 12 corresponding to the gaps of the X-shaped protective plate 16, and each group of first electrical contacts 18 is electrically connected with each group of photosensitive elements 7 through the bonding wire 14. The processing of the electrical signal of the surface array detection circuit chip 2 is output to the first electrical contacts 18 on the PCB 12 through the bonding wire 14, and the total signal path is that the photosensitive elements 7 receive the light signal and convert it into an electrical signal, which is transmitted to the first electrical contacts 18 through the indium column 8, the detection unit 9 and the bonding wire 14 in turn. Since the photosensitive elements 7 are arranged in a dot matrix, each contact corresponds to a group of photosensitive elements 7, and the position of the photosensitive element 7 receiving the light signal can be obtained to achieve accurate positioning of the laser.

[0034] Further, the mounting seat 5 comprises a base 19 and a mounting groove 20, the mounting groove 20 corresponding to the metal base 11 is arranged on the base 19, a plurality of groups of second electrical contacts 21 corresponding to the first electrical contacts 18 are arranged in the mounting groove 20, and plug-in holes 22 corresponding to the positioning holes 17 are arranged in the mounting groove 20. The mounting seat 5 can be mounted on the circuit board in the form of a pin or a patch, and the second electrical contacts 21 in the mounting seat 5 can also be electrically connected with the first electrical contacts 18 in the form of an electrical spring or a contact pin, and the plug-in holes 22 are used to cooperate with the positioning holes 17 to improve the stability of the packaged body after installation.

[0035] Further, the mounting buckle 6 comprises a ring-shaped buckle plate 23 and a plug-in rod 24, the packaged body is clamped in the mounting groove 20, the first electrical contacts 18 are in contact with and electrically connected with the second electrical contacts 21, the ring-shaped buckle plate 23 is sleeved on the ceramic insulator shell 10, one side of the ring-shaped buckle plate 23 abuts against the metal base 11, the plug-in rod 24 corresponding to the positioning hole 17 is arranged on the ring-shaped buckle plate 23, the plug-in rod 24 penetrates the positioning hole 17 and is connected with the plug-in hole 22 in plug-in mode, and the packaged body is fixedly installed on the mounting seat 5 through the mounting buckle 6.

[0036] Structural description:

[0037] The detector tube shell 1 is the main body shell structure of the detector, which contains elements such as the surface array detection circuit chip 2 and constitutes an integrated packaged body with the surface array detection circuit chip 2, the surface array light-sensitive chip 3 and the light window 4, thereby providing protection for the internal elements;

[0038] Array detection circuit chip 2: located in the detector tube shell 1, containing a plurality of groups of dot matrix arranged detection unit 9, through the indium column 8 and the photosensitive element 7 of array photosensitive chip 3 electrically connected, for processing the electric signal from photosensitive element 7;

[0039] Array photosensitive chip 3: set on the side of array detection circuit chip 2 away from the detector tube shell 1, containing a plurality of groups of dot matrix arranged photosensitive element 7, can receive optical signal and convert into electric signal, is the key component to realize laser detection;

[0040] Light window 4: installed on the top of the detector tube shell 1, for allowing laser beam to enter the inside of the detector, and the convex cap 13 on the top of the detector tube shell 1 is fixedly connected through glue, which guarantees the stability of optical path;

[0041] Mounting seat 5: a structure for mounting the package, containing base 19 and mounting groove 20, second electrical contact 21 corresponding to the first electrical contact 18 and plug hole 22 corresponding to the positioning hole 17 are arranged in the mounting groove 20, realizing the installation and electrical connection of the package;

[0042] Mounting buckle 6: a structure for fixing the package, containing annular buckle plate 23 and plug rod 24, annular buckle plate 23 is sleeved on the ceramic insulator shell 10, plug rod 24 is connected through plug hole 17 and plug hole 22, so that the package is stably mounted on the mounting seat 5;

[0043] Photosensitive element 7: a component of array photosensitive chip 3, arranged in dot matrix, which can receive optical signal and convert it into electric signal, providing basic data for laser positioning;

[0044] Indium column 8: arranged between the detection unit 9 and the photosensitive element 7, which has the functions of mechanical fixation and low resistance electrical connection, ensuring that the electric signal generated by the photosensitive element 7 can be efficiently transmitted to the detection unit 9;

[0045] Detection unit 9: a component of array detection circuit chip 2, corresponding to the photosensitive element 7, receiving the electric signal from the photosensitive element 7 through the indium column 8 and processing it;

[0046] Ceramic insulator shell 10: a component of the detector tube shell 1, the side away from the array detection circuit chip 2 is provided with metal base 11, and the side away from the metal base 11 is provided with convex cap 13, which can effectively isolate electromagnetic interference due to its insulating property;

[0047] Metal base 11: a component of the detector tube shell 1, containing combination plate 15 and X-shaped protection plate 16, which encloses PCB board 12, used to improve the mechanical properties of the device and prolong the service life;

[0048] PCB board 12: a component of the detector tube 1, located in the metal base 11, and provided with a plurality of groups of first electrical contacts 18 on the surface thereof for receiving the electrical signals processed by the face array detection circuit chip 2 and realizing the connection with the external circuit;

[0049] Convex cap 13: provided on the side of the ceramic insulator shell 10 away from the metal base 11, and the light window 4 is fixedly connected thereto through the glue liquid, and the surface thereof can be roughened to enhance the bonding strength with the light window 4;

[0050] Bonding wire 14: provided on the outer side of the face array detection circuit chip 2, and penetrating through the ceramic insulator shell 10, for connecting the plurality of groups of detection units 9 and the PCB board 12, and realizing the transmission of the electrical signals;

[0051] Bonding plate 15: a component of the metal base 11, and fixedly connected to the ceramic insulator shell 10 through brazing, for connecting the ceramic insulator shell 10 and the X-shaped protective plate 16;

[0052] X-shaped protective plate 16: a component of the metal base 11, located on the side of the PCB board 12 away from the bonding plate 15, and the positioning hole 17 is provided on the corner block thereof, for protecting the PCB board 12 and assisting the positioning of the packaging body;

[0053] Positioning hole 17: provided on the corner block of the X-shaped protective plate 16, and penetrating through the X-shaped protective plate 16, the PCB board 12 and the bonding plate 15 in sequence, and cooperating with the plug-in hole 22 on the mounting seat 5, to ensure the mechanical and electrical alignment accuracy of the packaging body during installation;

[0054] First electrical contact 18: provided on the PCB board 12 corresponding to the gap of the X-shaped protective plate 16, and electrically connected to each group of photosensitive elements 7 through the bonding wire 14, for receiving the electrical signals processed by the face array detection circuit chip 2;

[0055] Base 19: a component of the mounting seat 5, and provided with a mounting groove 20 corresponding to the metal base 11, for providing support for the mounting groove 20;

[0056] Mounting groove 20: a component of the mounting seat 5, provided on the base 19, for mounting the metal base 11 of the packaging body, and provided with the second electrical contact 21 and the plug-in hole 22 in the groove;

[0057] Second electrical contact 21: mounted in the mounting groove 20, corresponding to the first electrical contact 18, and cooperating with the first electrical contact 18 to complete the electrical connection between the packaging body and the external circuit;

[0058] Plug-in hole 22: provided in the mounting groove 20, corresponding to the positioning hole 17, and cooperating with the positioning hole 17 to improve the stability of the packaging body after installation;

[0059] annular buckle plate 23: a component of the mounting buckle 6, sleeved on the ceramic insulator shell 10, one side abutting against the metal base 11, and provided with a plug-in rod 24 on the top for fixing the package;

[0060] plug-in rod 24: a component of the mounting buckle 6, arranged on the annular buckle plate 23, and connected with the plug-in hole 22 through the positioning hole 17 to realize the mechanical locking of the package on the mounting seat 5.

[0061] Working principle: when the laser beam penetrates the light window 4, the light window and the convex cap 13 on the top surface of the detector tube shell 1 are sealed and fixed by glue, and the convex cap is pulled and roughened to enhance the bonding strength and ensure the stability of the optical path. After the laser enters the package, it directly acts on the surface of the area array photosensitive chip 3. The chip is composed of multiple groups of point array arranged photosensitive elements 7. Each group of photosensitive elements uses high-sensitivity photoelectric material and can convert the incident laser energy into an electrical signal instantaneously. Based on the photoelectric effect, the photon excites the electron-hole pair in the photosensitive element to form a weak current signal that can be conducted. The electrical signal is transmitted to the corresponding detection unit 9 of the area array detection circuit chip 2 through the indium column 8. The indium column serves as a high-precision flip interconnection structure, combining mechanical fixation and low-resistance electrical connection functions to ensure efficient signal transmission between chips. The signals processed by the area array detection circuit chip 2 penetrate the ceramic insulator shell 10 through the bonding wire 14 and establish electrical connection with the PCB board 12. The bonding wire is made of gold wire and realizes reliable interconnection between the chip and the substrate through the bonding process. On the PCB board 12, the first electrical contact 18 receives the signals from the detection unit 9 and integrates them into an outputtable electrical signal matrix. The X-shaped protective plate 16 of the metal base 11 and the combination plate cover the PCB board 12, forming a three-dimensional protection for the PCB board 12. The positioning hole 17 cooperates with the plug-in hole 22 of the mounting seat 5 to ensure the mechanical and electrical alignment accuracy during the installation of the package. The second electrical contact 21 in the mounting seat 5 is in close contact with the first electrical contact 18, realizing the electrical conduction between the package and the external circuit. The spatial positioning function is realized based on the array layout of the area array photosensitive chip. Since the photosensitive elements 7 are regularly distributed in point arrays, each element corresponds to a specific azimuth angle in the detection space. When the laser beam hits a group of photosensitive elements, the electrical signal generated by the element is transmitted to the corresponding contact point of the PCB board through a fixed path. The system analyzes the row and column coordinates of the activated contact point, combines the pre-calibrated optical geometric parameters (such as field of view angle and pixel pitch), and uses a triangular positioning algorithm to calculate the incident direction and position of the laser. It realizes ultra-high precision positioning accuracy. During the entire working process, the insulating property of the ceramic insulator shell 10 effectively isolates electromagnetic interference, and the mechanical reinforcement structure of the metal base 11 ensures the signal stability of the system in vibration and impact environment. The ring-shaped buckle plate 23 and the plug-in rod 24 of the mounting buckle 6 combination ensure the double locking (mechanical locking and electrical locking) of the package on the mounting seat 5, further improving the system reliability. Through this multi-level signal link design, the detector realizes the full-process automatic processing from laser perception to spatial positioning, meeting the high-precision application requirements in the fields of laser warning and guidance.

[0062] Although the embodiments of the present application have been shown and described, it should be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A planar laser detector, characterized in that: The detector tube includes a detector housing (1), inside which is a surface array detector circuit chip (2). On the side of the surface array detector circuit chip (2) facing away from the detector tube (1), a surface array photosensitive chip (3) is provided. A light window (4) is provided on the top surface of the detector tube (1). The detector tube (1), the surface array detector circuit chip (2), the surface array photosensitive chip (3) and the light window (4) form an integrated package. The package is fixedly installed by a mounting base (5) and a mounting fastener (6).

2. The area array laser detector according to claim 1, characterized in that: The detector housing (1) includes a ceramic insulator shell (10), a metal base (11) and a PCB board (12). The ceramic insulator shell (10) is provided with a metal base (11) on the side away from the array detector circuit chip (2). The PCB board (12) is sandwiched inside the metal base (11). A convex cap (13) is provided on the side of the ceramic insulator shell (10) away from the metal base (11). The light window (4) and the convex cap (13) are fixedly connected by adhesive.

3. A planar laser detector according to claim 2, characterized in that: The area array photosensitive chip (3) contains multiple sets of dot-matrix arranged photosensitive elements (7).

4. A planar laser detector according to claim 3, characterized in that: The array detection circuit chip (2) includes multiple sets of dot-matrix-arranged detection units (9), and each detection unit (9) corresponds to a photosensitive element (7). An indium pillar (8) is provided between each detection unit (9) and the photosensitive element (7), and the detection unit (9) and the photosensitive element (7) are electrically connected through the indium pillar (8).

5. A planar laser detector according to claim 4, characterized in that: The outer side of the array detection circuit chip (2) is provided with multiple sets of bonding wires (14), which penetrate the ceramic insulator shell (10). Multiple sets of detection units (9) are electrically connected to the PCB board (12) through the bonding wires (14).

6. A planar laser detector according to claim 5, characterized in that: The metal base (11) includes a connecting plate (15) and an X-shaped protective plate (16). The ceramic insulator shell (10) is provided with a connecting plate (15) on the side away from the light window (4). The connecting plate (15) and the ceramic insulator shell (10) are fixedly connected by brazing. The PCB board (12) is provided with an X-shaped protective plate (16) on the side away from the connecting plate (15). The corner block of the X-shaped protective plate (16) is provided with a positioning hole (17). The positioning hole (17) passes through the X-shaped protective plate (16), the PCB board (12) and the connecting plate (15) in sequence.

7. A planar laser detector according to claim 6, characterized in that: Multiple sets of first electrical contacts (18) are provided on the PCB board (12) at the gap corresponding to the X-shaped protective plate (16). Each set of first electrical contacts (18) is electrically connected to each set of photosensitive elements (7) through a bonding wire (14).

8. A planar laser detector according to claim 7, characterized in that: The mounting base (5) includes a base (19) and a mounting groove (20). The base (19) is provided with a mounting groove (20) corresponding to the metal base (11). The mounting groove (20) is provided with multiple sets of second electrical contacts (21) corresponding to the first electrical contact (18). The mounting groove (20) is also provided with a plug hole (22) corresponding to the positioning hole (17).

9. A planar laser detector according to claim 8, characterized in that: The mounting fastener (6) includes an annular fastener plate (23) and a plug-in rod (24). The package is snapped into the mounting groove (20). The first electrical contact (18) contacts and is electrically connected to the second electrical contact (21). The annular fastener plate (23) is sleeved on the ceramic insulator shell (10). One side of the annular fastener plate (23) abuts against the metal base (11). The annular fastener plate (23) is provided with a plug-in rod (24) corresponding to the positioning hole (17). The plug-in rod (24) passes through the positioning hole (17) and is plugged into the plug-in hole (22). The package is fixedly installed on the mounting base (5) by the mounting fastener (6).

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