Protection circuit board and battery module

Abstract

The embodiment of the utility model provides a protection circuit board and a battery module. The protection circuit board comprises a circuit board main body and a fusing assembly connected with the circuit board main body, the fusing assembly comprises a fuse, a cover body and a carrier substrate, the cover body and the carrier substrate form an accommodating cavity, the fuse is arranged in the accommodating cavity, and at least one of the cover body and the carrier substrate is provided with a through hole communicated with the accommodating cavity; the plastic package colloid wraps the fusing assembly and the circuit board main body; and the through hole is plugged by the hole plugging structure. Therefore, when the plastic packaging glue is used for plastic packaging, under the action of the hole blocking structure, the plastic packaging glue body with pressure flows in the mold cavity and cannot enter the accommodating cavity formed by the cover body and the carrier substrate, so that the fuse is prevented from being damaged by the plastic packaging glue body, the fuse is protected, and the fusing effect of the fuse is ensured.

Description

Technical Field

[0001] This utility model relates to the field of battery manufacturing technology, and in particular to a protective circuit board and battery module. Background Technology

[0002] As smart products continue to develop, their battery capacities are also increasing. With this increase in capacity comes increased weight, making the protective circuit board at the battery tip more susceptible to damage during drops.

[0003] Based on this, in related technologies, the service life of the protection circuit board at the battery end is improved by encapsulating it with plastic and installing a fuse.

[0004] However, when the protective circuit board is encapsulated, the encapsulating material can flow into the fuse through the through-holes on the periphery of the fuse, thus affecting the fuse's fusing effect. Utility Model Content

[0005] To solve or partially solve the above problems, this utility model discloses a protective circuit board and battery module to solve the problem in the prior art that the encapsulating adhesive will flow into the fuse through the through hole opened on the periphery of the fuse, thereby affecting the fuse's fusing effect.

[0006] To address the aforementioned problems, in a first aspect, embodiments of the present invention provide a protective circuit board, the protective circuit board comprising:

[0007] The circuit board body and the fuse assembly connected to the circuit board body, the fuse assembly includes a fuse, a cover and a carrier substrate, the cover and the carrier substrate form a receiving cavity, the fuse is disposed in the receiving cavity, and at least one of the cover and the carrier substrate has a through hole communicating with the receiving cavity;

[0008] A molding compound that encapsulates the fuse assembly and the circuit board body;

[0009] A plugging structure, wherein the plugging structure blocks the through hole.

[0010] Optionally, the through hole is provided on the cover body;

[0011] The plugging structure is a gel structure, which covers the opening of the through hole facing the encapsulating gel.

[0012] Optionally, the through hole is located on the periphery of the fuse.

[0013] Optionally, the through-hole is disposed on the carrier substrate;

[0014] The hole-blocking structure is disposed between the circuit board body and the carrier substrate, and the hole-blocking structure covers the opening of the through hole facing the circuit board body.

[0015] Optionally, electrical connection lines are provided on the surface of the circuit board body facing the carrier substrate, and solder pads are provided on the surface of the carrier substrate facing the circuit board body.

[0016] The pads and the electrical connection lines are electrically connected.

[0017] Optionally, the orthographic projection of the pad along the first direction and the orthographic projection of the via along the first direction overlap, and at least a portion of the pad covers the opening of the via facing the circuit board body, wherein the first direction is a direction perpendicular to the plane of the circuit board.

[0018] Optionally, the orthographic projection of the pad along the first direction and the orthographic projection of the through hole along the first direction do not overlap, and the hole plugging structure is a bottom filler, which fills the space between the opening of the through hole facing the circuit board body and the circuit board body.

[0019] Optionally, the underfill is disposed on one side of the pad and is in contact with the pad.

[0020] Optionally, a through groove is formed on the carrier substrate, the through groove penetrating the first surface and the second surface of the carrier substrate, wherein the first surface and the second surface are two surfaces of the carrier substrate facing each other in a first direction, the first direction being a direction perpendicular to the plane where the circuit board is located;

[0021] The wiring in the fuse assembly passes through the through slot and is connected to the pad;

[0022] The through hole is provided on at least one side of the through groove.

[0023] Secondly, this utility model embodiment also provides a battery module, the battery module including a battery cell and a protection circuit board as described in any embodiment of the first aspect;

[0024] The protection circuit is installed on the top of the battery cell.

[0025] In this embodiment of the invention, the fusible assembly includes a fuse, a cover, and a carrier substrate. The cover and the carrier substrate form a cavity, and the fuse is disposed in the cavity. At least one of the cover and the carrier substrate has a through hole communicating with the cavity. The encapsulant covers the fusible assembly and the circuit board body, and the hole-blocking structure blocks the through hole. Therefore, when the encapsulant is encapsulated, under the action of the hole-blocking structure, the pressurized encapsulant flowing in the mold cavity cannot enter the cavity formed by the cover and the carrier substrate, thereby preventing the encapsulant from damaging the fuse and thus protecting the fuse and ensuring the fuse's fusing effect. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is one of the structural schematic diagrams of a protective circuit board provided in this embodiment of the utility model;

[0028] Figure 2 This is a second schematic diagram of the structure of a protective circuit board provided in this embodiment of the present invention;

[0029] Figure 3 This is the third schematic diagram of a protective circuit board provided in this embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of a circuit board structure provided in an embodiment of the present invention.

[0031] Explanation of reference numerals in the attached figures:

[0032] 1: Protective circuit board; 11: Circuit board body; 111: Electrical connection line; 12: Fuse assembly; 121: Fuse; 122: Cover; 123: Carrier substrate; 1231: Solder pad; 1232: Through slot; 124: Through hole; 13: Hole plugging structure; 14: Accommodating cavity; 131: Glue structure; 132: Bottom filler; 2: Plastic encapsulant; 3: Battery cell; 4: Top seal; 5: Hot melt adhesive; 6: Tab; 7: Nickel sheet. Detailed Implementation

[0033] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0034] It should be understood that the phrase "one embodiment" or "an embodiment" throughout the specification means that a specific feature, structure, or characteristic related to the embodiment is included in at least one embodiment of the present invention. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0035] like Figures 1 to 3 As shown, this embodiment of the utility model provides a protective circuit board, which includes:

[0036] The circuit board body 11 and the fuse assembly 12 connected to the circuit board body 11. The fuse assembly 12 includes a fuse 121, a cover 122 and a carrier substrate 123. The cover 122 and the carrier substrate 123 form a receiving cavity 14. The fuse 121 is disposed in the receiving cavity 14. At least one of the cover 122 and the carrier substrate 123 has a through hole 124 communicating with the receiving cavity 14.

[0037] The encapsulating agent 2 encapsulates the fuse assembly 12 and the circuit board body 11.

[0038] Hole-plugging structure 13, hole-plugging structure 13 blocks through hole 124.

[0039] As can be seen from the above embodiments, in this utility model embodiment, since the fuse assembly 12 includes a fuse 121, a cover 122 and a carrier substrate 123, the cover 122 and the carrier substrate 123 form a receiving cavity 14, the fuse 121 is disposed in the receiving cavity 14, and at least one of the cover 122 and the carrier substrate 123 has a through hole 124 communicating with the receiving cavity 14, the encapsulating material 2 covers the fuse assembly 12 and the circuit board body 11, and the hole-blocking structure 13 blocks the through hole 124, when the encapsulating material is encapsulated, under the action of the hole-blocking structure 13, the pressurized encapsulating material 2 flowing in the mold cavity cannot enter the receiving cavity 14 formed by the cover 122 and the carrier substrate 123, thereby preventing the encapsulating material 2 from damaging the fuse 121, thus protecting the fuse 121 and ensuring the fusing effect of the fuse 121.

[0040] In the above embodiments, the circuit board body 11 may include a printed circuit board and a flexible circuit board. The circuit board body 11 is mainly used to ensure that the battery operates within a safe range and protect the battery from damage, including but not limited to the following functions: limiting the minimum discharge voltage, controlling the maximum charging current, and monitoring the battery temperature during the charging process. In addition, the circuit board body 11 and the fuse assembly 12 can be stacked in the first direction Z, that is, the fuse assembly 12 can be disposed on the top of the circuit board body 11.

[0041] The fuse assembly 12 includes a cover 122, which is a shell structure with an inner cavity. The cover 122 and the carrier are connected to form a receiving cavity 14, which provides a certain receiving cavity 14 for the fuse 121. In some embodiments, the cover 122 can be a cylindrical shell structure, a square shell structure, or a shell structure of other shapes. For example, the cover 122 is a shell structure with an open bottom. The bottom of the cover 122 is fastened to the carrier substrate 123, so that a sealed space is formed between the cover 122 and the carrier substrate 123, thereby forming the receiving cavity 14.

[0042] Since the gas pressure inside the accommodating cavity 14 and other external pressures need to be consistent during the fabrication and testing of the fuse 121, in this embodiment, a through hole 124 can be provided on the cover 122, on the carrier substrate 123, or on both the cover 122 and the carrier substrate 123. This embodiment does not limit the specific type of through hole 124. When the through hole 124 is provided on the carrier substrate 123, it can extend along the first and second surfaces of the carrier substrate 123 in the first direction Z. That is, the through hole 124 can penetrate both surfaces of the carrier substrate 123 in the first direction Z, allowing external gas to pass through the carrier substrate 123 and reach the interior of the accommodating cavity 14. When the through hole 124 is provided on the cover 122, it allows the cover 122 to communicate with the accommodating cavity 14, allowing external gas to pass through the cover 122 and reach the interior of the accommodating cavity 14.

[0043] The location and type of the hole-blocking structure 13 are determined based on the location of the through hole 124. If the through hole 124 is located on the cover 122, the hole-blocking structure 13 can be located on the outer wall of the cover 122. If the through hole 124 is located on the carrier substrate 123, the hole-blocking structure 13 can be located between the carrier substrate 123 and the circuit board body 11. This embodiment of the present invention does not limit this.

[0044] The encapsulating colloid 2 simultaneously encapsulates the fuse component 12 and the circuit board body 11, thereby protecting the fuse component 12 and the circuit board assembly from external environmental influences, improving the safety of the protective circuit board, and ensuring the internal and external pressure balance of the protective circuit board.

[0045] Regarding the location and type of the plugging structure 13, such as Figure 1 As shown, in one possible implementation, a through hole 124 is provided on the cover 122; the plugging structure 13 is a gel structure 131, which covers the opening of the through hole 124 facing the encapsulating gel 2.

[0046] In this embodiment, the through hole 124 is provided on the cover 122. It can be understood that the through hole 124 is provided through the outer wall and the inner wall of the cover 122. Therefore, the colloid structure 131 can cover the opening of the through hole 124 facing the encapsulating colloid 2. That is, the colloid structure 131 covers the position where the through hole 124 is provided on the outer wall of the cover 122. In this way, when the encapsulating colloid 2 is encapsulated, under the action of the colloid structure 131, the pressurized encapsulating colloid 2 cannot flow into the cavity 14 formed by the cover 122 and the carrier substrate 123, thereby preventing the encapsulating colloid 2 from damaging the fuse 121 and thus protecting the fuse 121.

[0047] In some embodiments, the through hole 124 is located on the periphery of the fuse 121.

[0048] In this embodiment, since the through hole 124 is provided on the cover 122, the through hole 124 can be located on the periphery of the fuse 121, thereby avoiding the opening of the through hole 124 from affecting the connection between the cover 122 and the carrier substrate 123. At the same time, the through hole 124 can also ensure the function of venting.

[0049] Regarding the location and type of the plugging structure 13, such as Figure 2 and Figure 3 As shown, in another possible implementation, a through hole 124 is disposed on a carrier substrate 123; a hole-blocking structure 13 is disposed between the circuit board body 11 and the carrier substrate 123, and the hole-blocking structure 13 covers the opening of the through hole 124 facing the circuit board body 11.

[0050] In this embodiment, since the through hole 124 is disposed on the carrier substrate 123 and the hole-blocking structure 13 is disposed between the circuit board body 11 and the carrier substrate 123, the hole-blocking structure 13 covers the opening of the through hole 124 facing the circuit board body 11. Therefore, the hole-blocking structure 13 can fill the gap between the circuit board body 11 and the carrier substrate 123 and block the through hole 124. Consequently, when the encapsulating agent 2 is encapsulated, under the action of the hole-blocking structure 13, the pressurized encapsulating agent 2 cannot flow into the receiving cavity 14 formed by the cover 122 and the carrier substrate 123, thereby preventing the encapsulating agent 2 from damaging the fuse 121 and thus protecting the fuse 121. It should be noted that in this embodiment, the through hole 124 should be located close to the location of the electrode of the fuse 121 to ensure the venting function of the through hole 124.

[0051] In some embodiments, an electrical connection line 111 is provided on the surface of the circuit board body 11 facing the carrier substrate 123, and a pad 1231 is provided on the surface of the carrier substrate 123 facing the circuit board body 11; the pad 1231 and the electrical connection line 111 are electrically connected.

[0052] In this embodiment, since the circuit board body 11 has an electrical connection line 111 on its surface facing the carrier substrate 123, and the carrier substrate 123 has a pad 1231 on its surface facing the circuit board body 11, and the pad 1231 and the electrical connection line 111 are electrically connected, the electrical connection between the circuit board body 11 and the carrier substrate 123 can be indirectly achieved through the electrical connection between the pad 1231 and the electrical connection line 111.

[0053] In some embodiments, the orthographic projection of the pad 1231 along the first direction Z and the orthographic projection of the via 124 along the first direction Z overlap, and at least a portion of the pad 1231 covers the opening of the via 124 facing the circuit board body 11, wherein the first direction Z is a direction perpendicular to the plane of the circuit board.

[0054] In this embodiment, since the orthographic projection of the pad 1231 along the first direction and the orthographic projection of the via 124 along the first direction Z overlap, at least a portion of the pad 1231 covers the opening of the via 124 facing the circuit board body 11. Therefore, the pad 1231 can fill the gap between the circuit board body 11 and the carrier substrate 123, and at the same time, the pad 1231 can block the via 124. In this way, while the circuit board body 11 and the carrier substrate 123 are electrically connected, the via 124 can be blocked, preventing the encapsulant 2 from entering the accommodating cavity 14. This saves on the manufacturing process of the circuit board body 11, simplifies the manufacturing process, and helps to improve the production efficiency of the protective circuit board.

[0055] In some embodiments, the orthographic projection of the pad 1231 along the first direction Z and the orthographic projection of the via 124 along the first direction Z do not overlap, and the hole plugging structure 13 is a bottom filler 132, which fills the space between the opening of the via 124 facing the circuit board body 11 and the circuit board body 11.

[0056] In this embodiment, since the orthographic projection of the pad 1231 along the first direction Z and the orthographic projection of the through hole 124 along the first direction Z do not overlap, the hole-blocking structure 13 is a bottom filler 132. The bottom filler 132 fills the gap between the opening of the through hole 124 facing the circuit board body 11 and the circuit board body 11. Therefore, the bottom filler 132 can fill the gap between the circuit board body 11 and the carrier substrate 123, and at the same time, the bottom filler 132 can block the through hole 124. Since the bottom filler 132 has a certain fluidity and viscosity, it can block the through hole 124 and prevent the molding compound 2 from entering the accommodating cavity 14. At the same time, the bottom filler 132 can increase the strength of the connection between the circuit board body 11 and the carrier substrate 123, which is convenient for subsequent injection molding.

[0057] In some embodiments, the underfill 132 is disposed on one side of the pad 1231 and is in contact with the pad 1231.

[0058] In this embodiment, since the underfill 132 is disposed on one side of the pad 1231 and the underfill 132 is in contact with the pad 1231, it can be ensured that the underfill 132 can completely fill the gap between the circuit board body 11 and the carrier substrate 123, thus avoiding the need for the encapsulating agent 2 to enter the gap between the circuit board body 11 and the carrier substrate 123 during subsequent injection molding, thereby reducing the difficulty of subsequent injection molding.

[0059] In some embodiments, a through groove 1232 is formed on the carrier substrate 123, the through groove 1232 penetrates the first surface and the second surface of the carrier substrate 123, wherein the first surface and the second surface are two opposite surfaces of the carrier substrate 123 in a first direction Z, the first direction Z being a direction perpendicular to the plane of the circuit board; the wiring in the fuse assembly 12 passes through the through groove 1232 and is connected to the pad 1231; the through hole 124 is provided on at least one side of the through groove 1232.

[0060] In this embodiment, since the through slot 1232 penetrates the first and second surfaces of the carrier substrate 123, the wiring in the fuse assembly 12 passes through the through slot 1232 and connects to the pad 1231. Therefore, the fuse assembly 12 can be connected to the pad 1231 through the through slot 1232, and then the electrical connection between the pad 1231 and the electrical connection line 111 is realized through the electrical connection between the circuit board body 11 and the fuse 121. Since the through hole 124 is provided on at least one side of the through slot 1232, the provision of the through hole 124 will not affect the electrical connection between the circuit board body 11 and the fuse 121, and will not cause interference between the through hole 124 and the through slot 1232.

[0061] As can be seen from the above embodiments, in this utility model embodiment, since the fuse assembly 12 includes a fuse 121, a cover 122 and a carrier substrate 123, the cover 122 and the carrier substrate 123 form a receiving cavity 14, the fuse 121 is disposed in the receiving cavity 14, and at least one of the cover 122 and the carrier substrate 123 has a through hole 124 communicating with the receiving cavity 14, the encapsulating material 2 covers the fuse assembly 12 and the circuit board body 11, and the hole-blocking structure 13 blocks the through hole 124, when the encapsulating material is encapsulated, under the action of the hole-blocking structure 13, the pressurized encapsulating material 2 flowing in the mold cavity cannot enter the receiving cavity 14 formed by the cover 122 and the carrier substrate 123, thereby preventing the encapsulating material 2 from damaging the fuse 121, thus protecting the fuse 121 and ensuring the fusing effect of the fuse 121.

[0062] In addition, such as Figure 4 As shown, this utility model embodiment also provides a battery module, which includes a battery cell 3 and a protection circuit board 1 of any of the above embodiments; the protection circuit board 1 is sequentially disposed on the top of the battery cell 3.

[0063] In this embodiment, since the battery module includes a battery cell 3 and a protection circuit board 1 as described in any of the above embodiments, and the protection circuit board 1 is disposed on the top of the battery cell 3, the protection strength of the fuse 121 included in the protection circuit board 1 assembly is improved, making the circuit protection function of the battery module through the fuse 121 more complete, and further ensuring the safety of battery use. Furthermore, hot melt adhesive 5, a top seal 4, a tab 6, a nickel sheet 7, a circuit board, and a fuse assembly 12 are sequentially disposed on the top of the battery cell 3. A plastic sealant simultaneously seals the hot melt adhesive 5, the top seal 4, the tab 6, the nickel sheet 7, the circuit board, and the fuse assembly 12. In the above embodiments, the battery cell 3 can be a single cell or a dual-cell battery cell. The battery cell 3 can be a cylindrical structure, a cuboid structure, or other shapes; this embodiment does not limit these. The battery cell 3 has a top surface, on which the top seal 4 can be connected. A tab 11 is connected to the top seal 4. The protection circuit board 1 contacts the top surface, and the tab 11 is electrically connected to the protection board 2.

[0064] The various embodiments in the specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0065] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0066] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0067] The present invention has been described in detail above. Specific examples have been used to illustrate the principle and implementation of the present invention. The description of the above embodiments is only for the purpose of helping to understand the method and core idea of ​​the present invention. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the present invention. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A protection circuit board, characterized by, The protection circuit board comprises: a circuit board body and a fuse assembly connected with the circuit board body, the fuse assembly comprising a fuse, a cover body and a carrier substrate, the cover body and the carrier substrate forming a containing cavity, the fuse being arranged in the containing cavity, at least one of the cover body and the carrier substrate being provided with a through hole in communication with the containing cavity; a plastic sealing glue body, the plastic sealing glue body covering the fuse assembly and the circuit board body; a hole blocking structure, the hole blocking structure blocking the through hole.

2. The protection circuit board according to claim 1, characterized by The through hole is arranged on the cover body. The hole blocking structure is a glue body structure, the glue body structure being arranged at an opening of the through hole towards the plastic sealing glue body.

3. The protection circuit board according to claim 2, characterized in that, The through hole is located at a side of the fuse.

4. The protection circuit board according to claim 1, characterized by The through hole is arranged on the carrier substrate. The hole blocking structure is arranged between the circuit board body and the carrier substrate, the hole blocking structure being arranged at an opening of the through hole towards the circuit board body.

5. The protection circuit board according to claim 4, characterized in that, The circuit board body is provided with an electric connection circuit on a surface thereof facing the carrier substrate, the carrier substrate being provided with a solder pad on a surface thereof facing the circuit board body; The solder pad and the electric connection circuit are electrically connected.

6. The protection circuit board according to claim 5, characterized in that, A normal projection of the solder pad along a first direction (Z) and a normal projection of the through hole along the first direction (Z) overlap, the solder pad being arranged at least partially at an opening of the through hole towards the circuit board body, wherein the first direction (Z) is a direction perpendicular to a plane in which the circuit board is arranged.

7. The protection circuit board according to claim 5, characterized by The normal projection of the solder pad along the first direction (Z) and the normal projection of the through hole along the first direction (Z) do not overlap, the hole blocking structure being a underfill glue, the underfill glue being arranged between an opening of the through hole towards the circuit board body and the circuit board body.

8. The protection circuit board according to claim 7, characterized by The underfill glue is arranged at one side of the solder pad, and the underfill glue is in contact with the solder pad.

9. The protection circuit board according to claim 5, characterized by The carrier substrate is provided with a through slot, the through slot penetrating a first surface and a second surface of the carrier substrate, wherein the first surface and the second surface are two surfaces of the carrier substrate opposite to each other in a first direction (Z), the first direction (Z) being a direction perpendicular to a plane in which the circuit board is arranged; A wire in the fuse assembly is connected through the through slot and the solder pad; The through hole is arranged at least at one side of the through slot.

10. A battery module, the battery module comprising a battery cell and the protection circuit board according to any one of claims 1 to 9; The protection circuit board is arranged on a top of the battery cell.

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