Water jet cutter flow dividing machining equipment

Abstract

The utility model discloses a water jet cutter shunting processing device, which adopts a shunting cavity with a cross section reduced in equal proportion, the pressure drop along the length direction of the shunting cavity is compensated by the equal proportion reduction of the cross section, and simultaneously, the bottom surface of the shunting cavity is provided with shunting holes which are uniformly distributed; the cross section area S1 of the first end face of the flow dividing cavity is equal to the accumulated cross section area S3 of all the flow dividing holes, the flow section and the flow of fluid in the flow dividing cavity are changed in an equal proportion through the common association effect of the characteristics, it is guaranteed that the flow speed of the fluid in the flow dividing cavity is kept unchanged, and therefore the pressure of the fluid in the flow dividing cavity tends to be consistent; the flow dividing holes are formed in the inrush current cavity, so that an equal amount of fluid can uniformly pass through each flow dividing hole, uniform flow dividing is realized, the overall uniformity of circuit board processing is improved, furthermore, the working surface of the inrush current cavity is provided with a semi-open working surface, and a plurality of strip-shaped notches are uniformly distributed on the semi-open working surface, so that the flow and the pressure of the fluid released to the circuit board are accurately controlled.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and specifically to a water jet splitting processing equipment for circuit boards. Background Technology

[0002] In the production of printed circuit boards (PCBs), various chemical treatment processes are required, employing equipment containing chemical solutions. In the working tanks of these devices, a water jet diversion structure is typically installed on top of the PCB to spray the chemical solution onto the board, enhancing the treatment effect. Chinese Patent CN 217283645U discloses a water jet specifically for PCB browning, comprising a water jet body with a cavity formed along its length. One end of the water jet body has a water inlet communicating with the cavity, and the bottom of the water jet body has a water spraying body along its length, with multiple rows of water outlet channels communicating with the cavity at the bottom.

[0003] The waterjet cutter disclosed in the above scheme and common waterjet cutters in the prior art, such as Figures 1a to 1c As shown, the cavity 1' is a rectangular cavity with a uniform cross-section along the length of the water jet body. The fluid enters the cavity from the inlet 2'. As the fluid flows through the length of the cavity 1', the pressure of the fluid gradually decreases, resulting in inconsistent pressure and flow rate in each outlet channel 3'. This leads to uneven flow distribution, causing uneven processing of the fluid on the circuit board surface, which has an adverse effect on the appearance and quality of the circuit board.

[0004] Therefore, how to enable water jets to effectively and uniformly distribute fluid and improve the overall uniformity of circuit board processing has become an urgent problem to be solved in this field. Utility Model Content

[0005] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a water jet splitting processing equipment with uniform flow distribution and consistent internal fluid pressure.

[0006] To achieve the above objectives, this utility model provides a water jet splitting processing device, including a frame and a water jet splitting structure disposed on the frame, wherein the water jet splitting structure includes:

[0007] The diversion cavity is defined by a bottom surface, a peripheral surface, a first end surface, and a second end surface to form a closed chamber.

[0008] Several diversion holes are provided on the bottom surface;

[0009] An inlet pipe is provided on the first end face, the inlet pipe introducing the working fluid into the distribution chamber, and

[0010] A flow-inlet cavity is disposed below the flow-dividing cavity, and the flow-inlet cavity is connected to the flow-dividing cavity through the plurality of flow-dividing holes.

[0011] The diversion cavity is defined by the cross-section of the peripheral surface and the bottom surface, which is proportionally reduced from the first end face to the second end face along the length direction of the diversion cavity. The diversion holes are evenly distributed at equal intervals along the length direction of the diversion cavity, and the cross-sectional area S1 of the first end face of the diversion cavity is equal to the cumulative cross-sectional area S3 of all the diversion holes. Furthermore, a number of elongated slots are evenly distributed on the semi-open working surface at the bottom of the flow cavity.

[0012] Furthermore, the included angle θ of the diversion cavity is...

[0013]

[0014] Where L is the length of the diversion cavity, w is the width of the diversion cavity, R is the radius of the diversion hole, and n is the total number of the diversion holes.

[0015] Furthermore, flow walls are provided on both sides of the flow cavity to limit the flow range of the working fluid.

[0016] Furthermore, the total cross-sectional area of ​​all the elongated slots is ≥ the cumulative cross-sectional area S3 of all the diversion holes.

[0017] Furthermore, each end of the flow cavity is provided with a connector for detachably connecting and engaging with the circuit board device.

[0018] Furthermore, the connector is composed of a pin.

[0019] The waterjet flow splitting processing equipment provided by this utility model cleverly employs a flow splitting cavity with a proportionally reduced cross-section. This proportional reduction in cross-section compensates for the pressure drop along the length of the flow splitting cavity. Simultaneously, uniformly distributed flow splitting holes are provided on the bottom surface of the flow splitting cavity, and the cross-sectional area S1 of the first end face of the flow splitting cavity is equal to the cumulative cross-sectional area S3 of all the flow splitting holes. The combined effect of these features ensures that the flow cross-section and flow rate of the fluid in the flow splitting cavity change proportionally, guaranteeing a constant fluid velocity and thus making the fluid pressure in the flow splitting cavity more uniform. This results in an equal amount of fluid passing through each flow splitting hole, achieving uniform flow splitting and improving the overall uniformity of circuit board processing. Furthermore, the working surface of the flow chamber is configured with a semi-open working surface, and several elongated slots are evenly distributed on the semi-open working surface to precisely control the flow rate and pressure of the fluid released onto the circuit board. Attached Figure Description

[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0021] Figures 1a to 1c This is a schematic diagram of the structure of a water jet in the prior art;

[0022] Figure 2 This is a schematic diagram of the overall structure of the water jet diversion structure in this utility model;

[0023] Figures 3a to 3c The figures are a bottom view, a front view, and a cross-sectional view of the water jet diversion structure in this utility model.

[0024] Figure 4 This is a schematic diagram of the fluid diversion structure of the water jet in this utility model;

[0025] Figure 5 for Figure 4 A magnified view of a portion of the image;

[0026] Figure 6 This is a schematic diagram of the flow divider cavity in this utility model;

[0027] Figure 7 This is a cross-sectional view of the flow-dividing cavity and the gushing cavity of the water jet flow-dividing structure in this utility model;

[0028] Figure label:

[0029] 1. Diverter cavity; 11. First end face; 12. First end face; 13. Bottom surface; 14. Peripheral surface;

[0030] 2. Inflow cavity; 21. Semi-open working surface; 22. Long strip groove; 23. Inflow wall;

[0031] 3. Inlet pipe; 4. Diversion hole; 5. Connecting parts. Detailed Implementation

[0032] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the following description, in conjunction with specific illustrations, further elaborates on this utility model.

[0033] The waterjet splitting processing equipment provided by this utility model includes a frame and a waterjet splitting structure mounted on the frame, see 2 to 3. Figure 3c The diagram shown is a schematic diagram of the water jet splitting structure in the water jet splitting processing equipment provided by this utility model.

[0034] As shown in the figure, the water jet splitting structure mainly includes a splitting cavity 1 and a gushing cavity 2.

[0035] The diversion chamber 1 is defined by a first end face 11, a second end face 12, a bottom surface 13, and a peripheral surface 14 to form a closed chamber. The first end face 11 of the diversion chamber 1 is connected to the inlet pipe 3, the second end face 12 is closed, and the bottom surface 13 is provided with a plurality of diversion holes 4. The inrush chamber 2 is located below the diversion chamber 1 and is connected to the diversion chamber 1 through the diversion holes 4. A semi-open working surface 21 is formed on the bottom surface that mates with the circuit board. A plurality of elongated slots 22 are evenly distributed on the semi-open working surface 21 so that the inlet pipe 3 introduces the working fluid into the diversion chamber 1, and then evenly enters the inrush chamber 2 through the diversion holes 4. Finally, the fluid is released onto the circuit board through the elongated slots 22 of the inrush chamber 2 to process the circuit board.

[0036] To illustrate the composition of this water jet flow splitting structure, the following example is provided.

[0037] By Bernoulli's principle, that is It refers to the pressure potential energy (p) and kinetic energy of a unit volume of fluid at any cross-section of the same flow tube. The sum of the potential energy ρgh is a constant.

[0038] Where p is the fluid pressure, ρ is the fluid density, v is the fluid velocity, g is the gravitational acceleration, h is the fluid height, and C is a constant.

[0039] Since the water jet diversion structure is installed horizontally in the circuit board equipment, the height h of the fluid at each location in the diversion cavity 1 can be considered equal. At the same time, the fluid density ρ and the gravitational acceleration g are known and determined. Therefore, the pressure p and the flow velocity v of the fluid at different locations in the diversion cavity 1 are proportional.

[0040] by Figure 6 Taking the fluids at points A and B in the flow divider 1 as an example, according to Bernoulli's principle,

[0041] Where p1 is the pressure of the fluid at point A, v1 is the velocity of the fluid at point A, h1 is the height of the fluid at point A, p2 is the pressure of the fluid at point B, v2 is the velocity of the fluid at point B, h2 is the height of the fluid at point B, ρ is the fluid density, and g is the acceleration due to gravity.

[0042] Since this water jet flow divider structure is horizontally installed in the circuit board equipment, the fluid levels at points A and B are equal, i.e., h1 = h2. Therefore...

[0043] Therefore, the pressure p1 and velocity v1 of the fluid at point A are proportional to the pressure p2 and velocity v2 of the fluid at point B. Thus, when the velocity v1 of the fluid at point A is the same as the velocity v2 of the fluid at point B, the pressure p1 of the fluid at point A is the same as the pressure p2 of the fluid at point B.

[0044] Therefore, in the same fluid system, if the velocity v is the same at the same height, then the pressure p is also the same.

[0045] Furthermore, the relationship between flow velocity v and flow rate Q can be expressed as follows: Where Q is the fluid flow rate and S is the fluid flow cross section, it can be seen that when the fluid flow cross section S and the flow rate Q change proportionally, the flow velocity v can remain unchanged, that is, the fluid pressure p remains unchanged, so that the fluid pressure p is consistent at all points in the diversion cavity 1, thereby allowing each diversion hole 4 to pass through an equal amount of fluid uniformly.

[0046] Combination Figures 2 to 5 In order to ensure that the flow cross section S and flow rate Q of the fluid in the flow divider 1 change proportionally, so as to keep the flow velocity v and the fluid pressure p constant, the cross section of the flow divider 1 is configured to decrease proportionally from the first end face 11 to the first end face 12 along the length L of the flow divider 1, so that the flow cross section S of the fluid in the flow divider 1 decreases proportionally.

[0047] At the same time, combined Figure 5 and Figure 6 The flow divider holes 4 are evenly distributed at equal intervals along the length of the flow divider cavity 1, and the fluid flow rate Q is proportional to the distance L′ from the fluid location to the first end face 12, so that the fluid flow rate Q in the flow divider cavity 1 decreases proportionally from the first end face 11 to the first end face 12 in the length L direction.

[0048] Furthermore, the cross-sectional area S of the fluid in the flow distribution cavity 1 is equal to the cumulative cross-sectional area of ​​the flow distribution holes 4. That is, the cross-sectional area S1 of the first end face 11 of the flow distribution cavity 1 is equal to the cumulative cross-sectional area S3 of all the flow distribution holes 4, expressed as S1 = S3. This ensures that the cross-sectional change of the flow distribution cavity 1 corresponds and matches the arrangement of the flow distribution holes 4, so that the cross-sectional area S and the flow rate Q of the fluid in the flow distribution cavity 1 change proportionally, keeping the flow velocity v constant, that is, the fluid pressure p constant. This makes the fluid pressure p consistent in the flow distribution cavity 1, and each flow distribution hole 4 can pass through an equal amount of fluid, ensuring uniform flow distribution and improving the overall uniformity of the circuit board processing.

[0049] To illustrate the specific structure of the flow divider 1, the following example illustrates the included angle θ of the flow divider 1.

[0050] Specifically, S1 = S3, where S1 = w × H1, S3 = (π × R) 2 )×n, where H1 is the cross-sectional height of the first end face 11, w is the width of the diversion cavity 1, R is the radius of the diversion hole 4, and n is the total number of diversion holes 4.

[0051] Therefore, we can obtain w×H1=(π×R) 2 )×n, that is, H1=(π×R2 )×n / w, since the included angle θ of the shunt cavity 1 is Thus, the inclination angle of the diversion cavity 1 can be determined.

[0052]

[0053] Therefore, the included angle θ of the flow divider 1 can be determined by knowing the length L of the flow divider 1, the width w of the flow divider 1, the radius R of the flow divider orifice 4, and the total number n of the flow divider orifice 4, so as to configure the specific structure of the flow divider 1. Here, the included angle θ of the flow divider 1 is preferably between 3° and 30°, so that the flow cross section S and flow rate Q of the fluid at each point in the flow divider 1 can be easily configured to change proportionally, so that the pressure p of the fluid remains constant.

[0054] Furthermore, the fluid in each part of the diversion cavity 1 flows into the surge cavity 2 in a uniform and equal amount through each diversion hole 4, so that the surge cavity 2 releases the fluid onto the circuit board through the working surface of the bottom surface.

[0055] Specifically, the flow cavity 2 is provided with flow walls 23 on both sides, and a working surface is provided between the bottoms of the two flow walls 23, so that when the fluid flows into the flow cavity 2 from the diversion hole 4, the flow walls 23 can limit the flow range of the fluid, and at the same time, the flow of the fluid in the flow cavity 2 will not be affected by the outside, so that the fluid can be evenly released from the flow cavity 2 through the working surface onto the circuit board.

[0056] Furthermore, when this water jet diversion structure is used in a diversion processing equipment for a high-flow-rate, low-pressure system, in order to increase the flow rate of fluid released onto the circuit board and achieve uniform spraying of fluid onto the circuit board, so that the fluid flow rate on the circuit board is larger and the circuit board is effectively flushed and treated, it is necessary to control the flow rate and pressure released onto the circuit board.

[0057] Therefore, combining Figures 3a to 7 The working surface of the flow cavity 2 is configured as a semi-open working surface 21, and several long strip-shaped slots 22 are evenly distributed on the semi-open working surface 21.

[0058] Furthermore, the total cross-sectional area of ​​all the elongated slots 22 on the semi-open working surface 21 is greater than or equal to the cumulative cross-sectional area S3 of all the diversion holes 4 in the diversion cavity 1. This allows the fluid in the diversion cavity 1 to enter the flow chamber 2 through the diversion holes 4 and then be released onto the circuit board through the elongated slots 22 on the semi-open working surface 21 at the bottom of the flow chamber 2. Because the elongated slots 22 have a large cross-sectional area, the elongated slots 22 allow the fluid to travel a longer path during its passage through the elongated slots 22, thereby increasing the friction between the fluid and the slot wall in the elongated slots 22, thus reducing the fluid velocity, decreasing kinetic energy, and causing a pressure drop.

[0059] Meanwhile, the elongated slot 22 can also generate more vortices and turbulence when the fluid passes through the slot. These vortices and turbulence will further consume the kinetic energy of the fluid, resulting in a decrease in pressure, thereby increasing the flow rate released to the circuit board through the elongated slot 22.

[0060] Here, the number and size of the elongated slots 22 are not limited, and can be adjusted adaptively according to the fluid type and the required flow rate. Preferably, the semi-open working surface 21 is provided with two rows of evenly staggered elongated slots 22 to increase the contact area between the fluid and the elongated slots 22, reduce the pressure, and increase the flow rate through the elongated slots 22, so that the fluid is released from the elongated slots 22 at a larger flow rate onto the circuit board, achieving a spraying effect on the circuit board and effectively treating the circuit board evenly.

[0061] In order to facilitate the installation and removal of this water jet flow divider structure from the flow divider processing equipment, connectors 5 are provided at both ends of the flow chamber 2, so that the water jet flow divider structure can be connected to the circuit board equipment through the connectors 5. Preferably, the connectors 5 are made of pins, so that the water jet flow divider structure can be easily and quickly disassembled and assembled.

[0062] Furthermore, this waterjet flow divider structure can be made of titanium or stainless steel panels, or engineering plastic panels such as PVC or PP, depending on the fluid characteristics, so that this waterjet flow divider structure meets the requirements of corrosion resistance and high temperature resistance.

[0063] Furthermore, the water jet splitting structure can be installed in multiple directions. In this example, the splitting cavity 1 and the gushing cavity 2 are installed horizontally downwards. As an example, the splitting cavity 1 and the gushing cavity 2 can also be installed horizontally upwards, to the left, or to the right, so that the water jet splitting structure can be adapted to different splitting processing equipment and set on the frame of the splitting processing equipment.

[0064] The equipment rack and circuit board are existing technologies and should be well known to those skilled in the art, so they will not be described in detail here.

[0065] The water jet diversion structure and circuit board equipment provided by this utility model adopts a proportionally reduced diversion cavity 1, while the diversion holes 4 are evenly distributed, so that when the flow cross section S and flow rate Q of the fluid in the diversion cavity 1 change proportionally, the flow velocity v can remain constant, that is, the fluid pressure p remains constant, so that the fluid pressure p is consistent at all points in the diversion cavity 1, thereby allowing each diversion hole 4 to pass through an equal amount of fluid evenly; at the same time, the working surface of the surge cavity 2 is configured with a semi-open working surface 21 to achieve the effect of depressurization and flow enhancement of the fluid.

[0066] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A water jet parting machining apparatus comprising a frame and a water jet parting structure provided on the frame, characterized in that, The water jet flow splitting structure comprises: a flow splitting cavity defined by a bottom surface, a peripheral surface, a first end surface and a second end surface into a closed chamber; a plurality of flow splitting holes provided on the bottom surface; an inlet pipeline provided on the first end surface, the inlet pipeline introducing working liquid into the flow splitting cavity, and a surge cavity provided below the flow splitting cavity, the surge cavity being in communication with the flow splitting cavity through the plurality of flow splitting holes, wherein a cross section of the flow splitting cavity defined by the peripheral surface and the bottom surface is proportionally reduced along a length direction of the flow splitting cavity from the first end surface to the second end surface, the flow splitting holes are uniformly distributed at equal intervals along the length direction of the flow splitting cavity, and a cross sectional area S1 of the first end surface of the flow splitting cavity is equal to a cumulative cross sectional area S3 of all the flow splitting holes; and wherein a semi-open working surface of a bottom of the surge cavity is uniformly provided with a plurality of long slot openings.

2. The water jet flow splitting machining apparatus according to claim 1, characterized in that, An included angle θ of the flow splitting cavity is wherein L is a length of the flow splitting cavity, w is a width of the flow splitting cavity, R is a radius of the flow splitting holes, and n is a total number of the flow splitting holes.

3. The apparatus according to claim 1, wherein The surge cavity is provided with surge walls on both sides to limit a flow range of the working liquid.

4. The apparatus of claim 1, wherein, A total cross sectional area of all the long slot openings is greater than or equal to the cumulative cross sectional area S3 of all the flow splitting holes.

5. The apparatus of claim 1, wherein, The surge cavity is respectively provided with connecting members at both ends to detachably connect with a circuit board device.

6. A water jet flow splitting machining apparatus according to claim 5, wherein The connecting members are formed by a latch.

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