Double-layer circuit board
By introducing an adjustable mounting bracket and auxiliary heat dissipation mechanism on the double-layer circuit board, the problems of fixed mounting hole positions and overheating are solved, achieving flexible adjustment and efficient heat dissipation.
Patent Information
- Application Number
- CN202520471772.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-18
- Publication Date
- 2026-02-17
- Estimated Expiration
- 2035-03-18
AI Technical Summary
The existing double-layer circuit board has fixed mounting holes, which makes it difficult to meet installation requirements and causes serious overheating problems.
It adopts an adjustable mounting bracket and an auxiliary heat dissipation mechanism. The mounting hole position can be adjusted by adjusting the mounting bracket, and the combination of heat conduction strips and heat dissipation fins can achieve good heat dissipation and prevent overheating.
It allows for flexible adjustment of the mounting hole positions, improves heat dissipation, prevents overheating, and meets installation requirements.
Smart Images

Figure CN223928638U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board technology, and in particular to a double-layer circuit board. Background Technology
[0002] Circuit boards are also known as ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, PCBs, aluminum-based boards, high-frequency boards, thick copper boards, impedance boards, ultra-thin circuit boards, and printed circuit boards (copper etching technology). Circuit boards miniaturize and visualize circuits, playing a crucial role in the mass production of fixed circuits and optimizing the layout of electrical appliances. A circuit board, also called a printed circuit board, is a highly reliable and highly flexible printed circuit board made with polyimide or polyester film as the substrate.
[0003] Circuit boards are classified into single-layer circuit boards, double-layer circuit boards, and multi-layer circuit boards. Among them, double-layer circuit boards are a commonly used type of circuit board, which can mount electronic components on both sides.
[0004] The mounting holes on existing double-layer circuit boards are fixed. However, due to manufacturing errors and limited installation space, the mounting holes on the double-layer circuit boards often cannot meet the installation requirements. In addition, existing double-layer circuit boards generate a lot of heat during use and are prone to overheating. Therefore, in view of the above situation, there is an urgent need to develop a double-layer circuit board that is easy to adjust, allows for adjustment of the mounting holes according to specific installation requirements, has good heat dissipation, and prevents overheating, in order to overcome the shortcomings in current practical applications and meet current needs. Utility Model Content
[0005] The purpose of this invention is to provide a double-layer circuit board to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, the present invention adopts the following technical solution:
[0007] A double-layer circuit board includes a printed circuit board, an insulating partition, an auxiliary heat dissipation mechanism, and adjustable mounting brackets. There are two printed circuit boards, with an insulating partition fixed between them. An auxiliary heat dissipation mechanism is fixed to each of the left and right sides of the printed circuit boards. There are four adjustable mounting brackets, each penetrating through the printed circuit boards and the insulating partition. The printed circuit boards have a first sliding groove for moving the adjustable mounting brackets, and the insulating partition has a second sliding groove for moving the adjustable mounting brackets. Multiple ventilation and heat dissipation slots are provided on both the upper and lower sides of the insulating partition.
[0008] Preferably, the adjustable mounting bracket includes: an adjusting screw, a baffle, a fastening nut, a toggle lever, a support block, and a mounting hole. The adjusting screw has a baffle fixed to its top, a fastening nut installed on the adjusting screw, multiple toggle levers fixed to the outside of the fastening nut, a support block fixed to the bottom of the fastening nut, and a mounting hole provided on the support block for mounting screws.
[0009] Preferably, the adjusting screw passes through the first and second slide grooves.
[0010] Preferably, the insulating partition is made of polyimide material.
[0011] Preferably, the auxiliary heat dissipation mechanism includes a heat-conducting strip and heat dissipation fins, wherein the heat-conducting strip is fixed to the printed circuit board, and multiple heat dissipation fins are fixed on the heat-conducting strip.
[0012] Preferably, the heat-conducting strip is made of heat-dissipating silicone, and the heat dissipation fins are made of copper.
[0013] The beneficial effects of this utility model are as follows: During installation, the double-layer circuit board is first loosened by manually turning the lever. Then, the adjusting screw is slid within the first and second sliding grooves, moving the support block to adjust the position of the mounting hole. Alternatively, the adjusting screw can be rotated within the first and second sliding grooves to adjust the position of the mounting hole, allowing for adjustments based on specific installation requirements. After adjustment, the fastening nut is tightened to fix the adjusting screw. Finally, the screw is passed through the mounting hole and fixed to an external object, thus securing the printed circuit board. The adjustable mounting bracket supports the printed circuit board, allowing airflow to pass under it. The ventilation and heat dissipation slots allow air to flow through, carrying away heat from the printed circuit board. Furthermore, heat is conducted through heat-conducting strips and dissipated into the air through heat dissipation fins. In summary, this utility model offers convenient adjustment, facilitating the adjustment of the mounting space according to specific installation needs; it also provides good heat dissipation, preventing overheating. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 1 .
[0015] Figure 2 This is a schematic diagram of the three-dimensional structure of the present invention. Figure 2 .
[0016] Figure 3 This is an exploded view of the present invention.
[0017] Figure 4 This is a partial structural diagram of the present invention. Figure 1 .
[0018] Figure 5 This is a partial structural diagram of the present invention. Figure 2 .
[0019] Figure 6 This is a partial structural diagram of the present invention. Figure 3 .
[0020] Figure 7 This is a partial structural diagram of the present invention. Figure 4 .
[0021] Legend:
[0022] 1. Printed circuit board; 101. First slide groove; 2. Insulating partition plate; 201. Ventilation and heat dissipation groove; 202. Second slide groove; 3. Auxiliary heat dissipation mechanism; 301. Heat conduction strip; 302. Heat dissipation fins; 4. Adjustable mounting bracket; 401. Adjusting screw; 402. Baffle; 403. Fastening nut; 404. Actuating rod; 405. Support block; 406. Mounting hole. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.
[0024] Specific implementation examples are given below.
[0025] See Figures 1 to 7 In this embodiment of the utility model, a double-layer circuit board includes a printed circuit board 1, an insulating partition plate 2, an auxiliary heat dissipation mechanism 3, and an adjustable mounting bracket 4. There are two printed circuit boards 1, each capable of mounting electronic components. An insulating partition plate 2 is fixed between the two printed circuit boards 1 to separate them and prevent mutual interference. An auxiliary heat dissipation mechanism 3 is fixed on each of the left and right sides of each printed circuit board 1. There are four adjustable mounting brackets 4, which pass through the printed circuit board 1 and the insulating partition plate 2. The printed circuit board 1 has a first sliding groove 101 for moving the adjustable mounting bracket 4, and the insulating partition plate 2 has a second sliding groove 202 for moving the adjustable mounting bracket 4.
[0026] The adjustable mounting bracket 4 includes: an adjusting screw 401, a baffle 402, a fastening nut 403, a lever 404, a support block 405, and a mounting hole 406. The baffle 402 is fixed to the top of the adjusting screw 401, and the fastening nut 403 is installed on the adjusting screw 401. The adjusting screw 401 passes through the first slide groove 101 and the second slide groove 202. Multiple levers 404 are fixed to the outside of the fastening nut 403. The fastening nut 403 can be turned by hand by turning the levers 404. The support block 405 is fixed to the bottom of the fastening nut 403, and the support block 405 is provided with a mounting hole 406 for mounting screws. First, loosen the fastening nut 403 by manually turning the lever 404. Then, slide the adjusting screw 401 in the first slide groove 101 and the second slide groove 202. The adjusting screw 401 drives the support block 405 to move, thereby adjusting the position of the mounting hole 406. Alternatively, the adjusting screw 401 can be rotated in the first slide groove 101 and the second slide groove 202 to adjust the position of the mounting hole 406, so as to adjust according to specific installation requirements. After adjustment, tighten the fastening nut 403 to fix the adjusting screw 401. Finally, pass the screw through the mounting hole 406 to fix it to an external object.
[0027] The insulating partition 2 is made of polyimide material, which has good high temperature resistance and good electrical insulation properties.
[0028] The insulating partition plate 2 has multiple ventilation and heat dissipation slots 201 on both its upper and lower sides. The ventilation and heat dissipation slots 201 allow air to flow through them, thereby carrying away the heat from the printed circuit board 1.
[0029] The auxiliary heat dissipation mechanism 3 includes a heat-conducting strip 301 and heat dissipation fins 302. The heat-conducting strip 301 is fixed to the printed circuit board 1. Multiple heat dissipation fins 302 are fixed on the heat-conducting strip 301. The heat-conducting strip 301 is made of heat-dissipating silicone, which gives it good thermal conductivity and insulation. The heat dissipation fins 302 are made of copper. In use, the heat on the printed circuit board 1 is conducted through the heat-conducting strip 301, and the heat is dissipated into the air through the heat dissipation fins 302.
[0030] Working principle: During installation, the double-layer circuit board is first loosened by manually turning the lever 404 to loosen the fastening nut 403. Then, the adjusting screw 401 is slid within the first slide groove 101 and the second slide groove 202. This movement of the adjusting screw 401 moves the support block 405, adjusting the position of the mounting hole 406. Alternatively, the adjusting screw 401 can be rotated within the first slide groove 101 and the second slide groove 202 to adjust the position of the mounting hole 406, allowing for adjustments based on specific installation requirements. After adjustment, the fastening nut 403 is tightened. Tighten the nut 403 to fix the adjusting screw 401 in place. Finally, pass the screw through the mounting hole 406 to fix it to an external object, thereby fixing the printed circuit board 1. The adjustable mounting bracket 4 supports the printed circuit board 1, allowing airflow to pass through the underside of the printed circuit board 1. The ventilation and heat dissipation slots 201 allow air to flow through them, thereby removing heat from the printed circuit board 1. In addition, the heat is conducted through the heat-conducting strip 301 and dissipated into the air through the heat dissipation fins 302.
[0031] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A double-layer circuit board, characterized in that, The device includes a printed circuit board (1), an insulating partition plate (2), an auxiliary heat dissipation mechanism (3), and an adjustable mounting bracket (4). There are two printed circuit boards (1), and an insulating partition plate (2) is fixed between the two printed circuit boards (1). An auxiliary heat dissipation mechanism (3) is fixed on both the left and right sides of each printed circuit board (1). There are four adjustable mounting brackets (4). The adjustable mounting brackets (4) pass through the printed circuit board (1) and the insulating partition plate (2). The printed circuit board (1) is provided with a first sliding groove (101) for the adjustable mounting bracket (4) to move. The insulating partition plate (2) is provided with a second sliding groove (202) for the adjustable mounting bracket (4) to move. Multiple ventilation and heat dissipation slots (201) are provided on both the upper and lower sides of the insulating partition plate (2).
2. The double-layer circuit board according to claim 1, characterized in that, The adjustable mounting bracket (4) includes: an adjusting screw (401), a baffle (402), a fastening nut (403), a lever (404), a support block (405), and a mounting hole (406). The adjusting screw (401) has a baffle (402) fixed to its top. The adjusting screw (401) has a fastening nut (403) installed on it. Multiple levers (404) are fixed to the outside of the fastening nut (403). The fastening nut (403) has a support block (405) fixed to its bottom. The support block (405) has a mounting hole (406) for mounting screws.
3. The double-layer circuit board according to claim 2, characterized in that, The adjusting screw (401) passes through the first slide (101) and the second slide (202).
4. The double-layer circuit board according to claim 1, characterized in that, The insulating partition (2) is made of polyimide material.
5. The double-layer circuit board according to claim 1, characterized in that, The auxiliary heat dissipation mechanism (3) includes: a heat-conducting strip (301) and heat dissipation fins (302). The heat-conducting strip (301) is fixed to the printed circuit board (1), and multiple heat dissipation fins (302) are fixed on the heat-conducting strip (301).
6. The double-layer circuit board according to claim 5, characterized in that, The heat-conducting strip (301) is made of heat-dissipating silicone, and the heat dissipation fins (302) are made of copper.