Semiconductor plate precise cutting jig and semiconductor plate precise cutting machine

Abstract

The utility model relates to the technical field of cutting machines, and particularly discloses a semiconductor plate precise cutting jig. Comprising a jig body, and the jig body is provided with a plate placing position, a measuring lamp light position and a cover plate sucking position; the measuring lamp light positions are arranged around the plate placing position, and at least part of the measuring lamp light positions are exposed out of the edge of the plate; the cover plate suction position is arranged on the side edge of the plate placing position, a circle of sealing groove is formed in the cover plate suction position, and a sealing ring is arranged in the sealing groove. The measuring lamp light positions are arranged on the peripheral side of the plate placing position of the jig body, accurate positioning can be carried out before cutting so as to facilitate automatic deviation correction, the cover plate suction position is arranged, so that when a plate is pressed by a pressing plate of a cutting machine, certain negative pressure is formed at the cover plate suction position through a sealing ring, the pressing stability is improved, and the working efficiency is improved. And product position deviation or damage caused by friction or vibration in the cutting process is avoided, the yield of products can be improved, the cutting efficiency is also improved, and the device is suitable for mass production of the products.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of cutting machine discloses a semiconductor plate material precision cutting fixture. BACKGROUND

[0002] With the development of electronic equipment to miniaturization, high performance, PCB and COB module production in semiconductor processing precision requirement is increasingly strict, semiconductor plate material cutting as a key link, its importance is increasingly prominent.

[0003] The current traditional semiconductor plate material cutting fixture has significant deficiencies. In terms of precision, due to limited positioning accuracy, the size deviation of the cut plate is large, such as PCB cutting with high line spacing requirement, the line spacing deviation can reach ±0.2mm, which affects product performance and yield; In terms of cutting efficiency, the traditional fixture clamping and cutting is complicated, which cannot meet the demand of large-scale industrial production. UTILITY MODEL CONTENT

[0004] The utility model aims at overcoming the prior art's insufficient, provide a kind of semiconductor plate material precision cutting fixture.

[0005] On the one hand, the utility model discloses a kind of semiconductor plate material precision cutting fixture, using the following technical solutions:

[0006] A kind of semiconductor plate material precision cutting fixture, comprising: fixture body the fixture body is equipped with plate material placement site, measuring light position and suction cover plate position;The measuring light position is set at the periphery of the plate material placement site, and the measuring light position is at least partially exposed plate material edge;The suction cover plate position is set at the side of the plate material placement site, and the suction cover plate position is equipped with a circle sealing groove, and the sealing groove is equipped with sealing ring.

[0007] Preferably, a plurality of support protrusions are provided in the suction cover plate position, the top surfaces of the plurality of support protrusions are flush, a gas groove is formed between the plurality of support protrusions, and the sealing groove surrounds the gas groove.

[0008] Preferably, at least one plate material sensing groove is provided on the fixture body, an optical fiber is provided in the plate material sensing groove, one end of the plate material sensing groove extends to the plate material placement site, and the other end of the plate material sensing groove is connected to an optical distance measuring device.

[0009] Preferably, two plate material sensing grooves are provided, and are arranged on adjacent sides or opposite sides of the plate material placement site.

[0010] Preferably, the jig body is provided with two opposite at least one set of sheet metal sensing groove, the sheet metal sensing groove is provided with optical fiber, one end of two sheet metal sensing groove extends to the sheet metal placement position, one of the sheet metal sensing groove is connected with light emitter, the other sheet metal sensing groove is connected with light receiver.

[0011] Preferably, the measuring light position comprises a lamp mounting groove provided on the jig body, and a lamp is mounted in the lamp mounting groove.

[0012] Preferably, the jig body is provided with a gantry gripper position.

[0013] Preferably, the jig body is provided with a screw fixing hole.

[0014] Preferably, the sealing ring is a rubber strip.

[0015] In another aspect, the utility model discloses a kind of semiconductor sheet material precision cutting machines, using following technical solutions:

[0016] A kind of semiconductor sheet material precision cutting machine, including CCD vision detection device and pressing plate, further including the semiconductor sheet material precision cutting jig, the CCD vision detection device is towards the semiconductor sheet material precision cutting jig setting, the pressing plate with the suction cover plate position is opposite setting, for holding the semiconductor sheet material precision cutting jig on sheet material.

[0017] Compared with prior art, the utility model at least includes following beneficial effects:

[0018] The utility model discloses a measuring light position is arranged on the side of the sheet material placement position of jig body, accurate positioning can be carried out before cutting, so as to facilitate automatic deviation correction, and the precision can reach 0.005mm, in addition, the jig of the present scheme does not need to be additionally provided with clamping to position, but is positioned by setting suction cover plate position, so that the sealing property of product and jig is guaranteed when sheet material is held by the pressing plate of cutting machine, the sealing property of product and jig is guaranteed, the cutting efficiency is improved, and the present scheme is suitable for mass production of product. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 For the semiconductor sheet material precision cutting jig of the embodiment;

[0020] Figure 2 For another embodiment of semiconductor sheet material precision cutting jig.

[0021] BRIEF DESCRIPTION OF DRAWINGS

[0022] 1, jig body; 2, sheet material placement position; 3, measuring light position; 4, suction cover plate position; 41, sealing ring; 5, sheet material induction groove; 51, optical fiber; 6, gantry gripper position; 7, screw fixing hole. DETAILED DESCRIPTION

[0023] In order to make the above-mentioned purposes, features and advantages of the utility model more apparent, obvious and easy to understand, the utility model will be further described in detail below with reference to the drawings and specific embodiments.

[0024] Embodiment 1

[0025] The embodiment discloses a semiconductor sheet material precision cutting jig and a semiconductor sheet material precision cutting machine. Figure 1 The semiconductor sheet material precision cutting jig comprises a jig body 1, and the jig body 1 is provided with a sheet material placement position 2, a measuring light position 3 and a suction cover plate position 4.

[0026] The measuring light position 3 is arranged around the sheet material placement position 2, and the measuring light position 3 specifically comprises a lamp installation groove arranged on the jig body, a lamp is arranged in the lamp installation groove, and the measuring light position 3 is at least partially exposed from the edge of the sheet material. The lamp has a certain area, so it can be used for various sizes of sheet materials, and it can be reused to reduce the working intensity of the operator.

[0027] The suction cover plate position 4 is arranged on the side of the sheet material placement position 1, the suction cover plate position 4 is provided with a sealing groove, the sealing groove is provided with a sealing ring 41, and the sealing ring 41 can be a soft rubber strip. In the embodiment, the suction cover plate position 4 can be arranged around the sheet material placement position 2 and can be arranged at intervals. As a preferred scheme, the suction cover plate position 4 is provided with a plurality of supporting protrusions (not shown in the figure), the top surfaces of the plurality of supporting protrusions are flush, an air groove is formed between the plurality of supporting protrusions, the sealing groove surrounds the air groove, and the sheet material can be better supported in this way.

[0028] The semiconductor sheet material precision cutting machine comprises the semiconductor sheet material precision cutting jig, a CCD visual detection device and a pressing plate, the CCD visual detection device is arranged towards the semiconductor sheet material precision cutting jig, is used for cooperating with the measuring light position 3, the pressing plate is arranged opposite to the suction cover plate position 4 and is distributed above the sheet material placement position 14, the pressing plate is driven by the jig clamping mechanism of the cutting machine and is used for pressing and holding the sheet material on the jig body 1, and the CCD visual detection device and the pressing plate driven by the jig clamping mechanism are prior art, so they are not described herein.

[0029] In the production of PCB / COB module, the machine hand places the board material on the board material placing position 2. At this time, the measuring light position 3 is covered by the board material, and the exposed part forms four positioning lines at the edge of the board material. In cooperation with the upper CCD visual detection device, the precise position of the board material is determined. The cutting machine can also automatically detect and correct the deviation, and the precision can reach 0.005mm. Subsequently, the jig clamping mechanism of the cutting machine drives the pressing plate to press down, and the four sides of the board material are pressed on the jig body 1. The air in the sealing ring 41 is slightly pressed out by the pressure, so that the board material and the jig body 1 are adsorbed together, ensuring the accuracy of positioning, and avoiding the product position deviation or damage caused by friction or vibration during cutting.

[0030] As a preferred solution, the jig body 1 is provided with a gantry gripper position 6 for grabbing the jig body 1 and placing it on the cutting machine workbench. The jig body 1 is also provided with a screw fixing hole 7 for fixing the jig body 1 on the cutting machine workbench.

[0031] As a preferred solution, the jig body 1 is also provided with a board material sensing groove 5, and the board material sensing groove 5 is provided with an optical fiber 51. The board material sensing groove 5 is at least one group of two opposite positions, which can be provided with two groups. One end of the two board material sensing grooves 5 extends to the board material placing position 2. One of the optical fibers 51 of the two board material sensing grooves 5 is connected with a light emitter, and the other optical fiber 51 is connected with a light receiver. When the board material is placed on the board material placing position 2 of the jig body 1, the board material blocks between the light receiver and the light emitter. According to whether the light receiver can receive light, whether there is board material on the board material placing position 2 of the jig body 1 is identified, and the next action is fed back by electric signal.

[0032] See Figures 1-2 According to the different sizes of the board material, the layout of the jig body 1 can be adjusted adaptively. The board material placing position 2 can be reduced or enlarged, and the board material sensing groove 5 can be designed as a straight line or a curve according to the position of the board material placing position 2. Both can realize the function of identifying whether the board material is placed well by using optical fiber light guide.

[0033] Embodiment 2

[0034] The embodiment discloses a kind of semiconductor board material precision cutting jig, and the difference between embodiment 1 is that the optical fiber 51 is arranged in the board material sensing groove 5, one end of the board material sensing groove 5 extends to the board material placing position 2, and the other end of the board material sensing groove 5 is connected with a light distance measuring device. The board material sensing groove 5 can be provided with only one, and two board material sensing grooves 5 can be provided to improve detection reliability. The two board material sensing grooves 5 can be arranged on the adjacent side or opposite side of the board material placing position 2 respectively. Whether there is board material on the board material placing position 2 of the jig body 1 is identified according to the emission distance of light, and the next action is fed back by electric signal.

[0035] The above technical solutions provided by the utility model are described in detail, and the principles and implementation manners of the utility model are described by applying specific examples, and the above example is only used for helping to understand the method and core idea of the utility model; meanwhile, for the general technical personnel in the field, the specific implementation manners and application ranges will be changed according to the idea of the utility model, and the above description should not be understood as the limitation of the utility model.

Claims

1. A semiconductor panel precision dicing gauge, comprising: The jig body is characterized in that the jig body is provided with a plate placing position, a measuring light position and a cover plate suction position; the measuring light position is arranged around the plate placing position, and the measuring light position is at least partially exposed to the plate edge; the cover plate suction position is arranged at the side of the plate placing position, the cover plate suction position is provided with a sealing groove, and the sealing groove is provided with a sealing ring.

2. The semiconductor board material precision cutting jig according to claim 1, wherein The cover plate suction position is provided with a plurality of support protrusions, the top surfaces of the support protrusions are flush, air grooves are formed between the support protrusions, and the sealing groove surrounds the air grooves.

3. The semiconductor board material precision cutting jig according to claim 1, wherein The jig body is provided with at least one plate sensing groove, the plate sensing groove is provided with an optical fiber, one end of the plate sensing groove extends to the plate placing position, and the other end of the plate sensing groove is connected with a light distance measuring device.

4. The semiconductor board material precision cutting jig according to claim 3, wherein The plate sensing grooves are two, and are arranged at adjacent sides or opposite sides of the plate placing position.

5. The semiconductor board material precision cutting jig according to claim 1, wherein The jig body is provided with two opposite at least one group of plate sensing grooves, the plate sensing grooves are provided with optical fibers, one end of the two plate sensing grooves extends to the plate placing position, one of the plate sensing grooves is connected with a light emitter, and the other plate sensing groove is connected with a light receiver.

6. The semiconductor board material precision cutting jig according to claim 1, wherein The measuring light position comprises a lamp mounting groove arranged on the jig body, and the lamp mounting groove is provided with a lamp.

7. The semiconductor board material precision cutting jig according to claim 1, wherein The jig body is provided with a gantry gripper position.

8. The semiconductor panel precision dicing gauge of claim 1, wherein, The jig body is provided with a screw fixing hole.

9. The semiconductor board material precision cutting jig according to Claim 1, wherein The sealing ring is a rubber strip.

10. A semiconductor plate material precision cutting machine comprising a CCD vision detection device and a pressing plate, characterized in that, Further comprising: The semiconductor plate precise cutting jig of any one of claims 1-9, wherein a CCD visual detection device is arranged towards the semiconductor plate precise cutting jig, and a pressing plate is arranged opposite to the cover plate suction position, and is used for pressing and holding a plate on the semiconductor plate precise cutting jig.

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