Wire bonding structure of LED wire bonding machine

Abstract

The utility model discloses a wire bonding structure of an LED wire bonding machine, which comprises a machine table, and a wire bonding mechanism, a conveying mechanism and a material receiving and releasing mechanism which are arranged on the machine table, the wire bonding mechanism comprises a welding needle and a feeding component, the feeding component is used for conveying a metal wire to the welding needle, the metal wire is welded on an electrode of an LED chip and a bonding pad of a substrate, and the welding needle is used for welding the metal wire to the substrate. The wire bonding mechanism further comprises an air blowing mechanism, the air blowing mechanism comprises an air bottle and an air nozzle, the air bottle is connected with the air nozzle and used for supplying air to the air nozzle, and the air nozzle is arranged beside the welding needle and used for guiding air in the air bottle to the welding needle. The wire bonding structure of the LED wire bonding machine is provided with the blowing mechanism, the air nozzle of the blowing mechanism is arranged beside the welding needle, and after the welding needle welds the LED chip, the blowing mechanism cools the welding spot, so that the firmness degree of the welding spot can be improved, the welding spot can become more attractive, and the impression of the LED chip is improved.

Description

Technical Field

[0001] This utility model relates to the field of LED chip processing technology, specifically to a wire bonding structure for an LED wire bonding machine. Background Technology

[0002] An LED wire bonding machine is a device used in the LED packaging process to bond metal wires (such as gold, aluminum, or copper wires) to the LED chip and substrate. The LED wire bonding machine precisely solders the metal wires to the electrodes of the LED chip and the pads on the substrate using ultrasonic waves, hot pressing, or a combination of both, forming an electrical connection. However, existing LED wire bonding machines operate at high speeds, and the solder balls used for soldering dissipate heat slowly. When the solder joints fall onto the substrate, they are pulled away by the soldering needles before they have solidified, resulting in weak and unsightly solder joints that affect the LED chip's performance. Utility Model Content

[0003] To address the problem of insufficient solder joint strength in existing LED wire bonding machines, this invention provides a wire bonding structure for the LED wire bonding machine. The specific technical solution of this invention is as follows:

[0004] A wire bonding structure for an LED wire bonding machine includes a machine base and a wire bonding mechanism, a conveying mechanism, and a feeding / receiving mechanism disposed on the machine base. The feeding / receiving mechanism is used to output and receive a substrate loaded with LED chips. The conveying mechanism is used to convey the substrate loaded with LED chips to a position below the wire bonding mechanism. The wire bonding mechanism is used to bond metal wires to the LED chips and the substrate to form an electrical connection. The wire bonding mechanism includes a bonding pin and a feeding component. The feeding component is used to feed metal wires to the bonding pin. The metal wires are bonded to the electrodes of the LED chips and the pads of the substrate. The wire bonding mechanism also includes an air blowing mechanism. The air blowing mechanism includes a gas cylinder and a gas nozzle. The gas cylinder is connected to the gas nozzle and is used to supply air to the gas nozzle. The gas nozzle is disposed next to the bonding pin and is used to guide the air from the gas cylinder to the bonding pin.

[0005] Furthermore, the wire bonding mechanism includes a needle holder, the welding needle is disposed on the needle holder, the air blowing mechanism includes a fixing member, the air nozzle is connected to the fixing member, and the fixing member is fixedly connected to the needle holder.

[0006] Furthermore, the air nozzle is a universal joint tube.

[0007] Furthermore, the blowing mechanism also includes a pressure regulator for adjusting the air pressure of the air nozzle, and the fixing member is connected to the air cylinder through the pressure regulator.

[0008] Furthermore, the gas in the gas cylinder is nitrogen.

[0009] Furthermore, the bonding mechanism also includes a CCD camera, which is located behind the needle holder.

[0010] Furthermore, the receiving and unloading mechanism includes a substrate storage compartment for storing substrates, which is located on both sides of the machine.

[0011] Furthermore, the metal wire is a silver wire.

[0012] Compared with the existing technology, the beneficial effects of this utility model are as follows: The LED wire bonding machine described in this application has a blowing mechanism in its wire bonding structure. The air nozzle of the blowing mechanism is located next to the welding needle. After the welding needle welds the LED chip, the blowing mechanism cools the welding point, which can not only improve the firmness of the welding point, but also make the welding point more beautiful and improve the appearance of the LED chip. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the wire bonding structure in one embodiment of the present invention. Figure 1 ;

[0014] Figure 2 This is a schematic diagram of the wire bonding structure in one embodiment of the present invention. Figure 2 ;

[0015] Figure 3 This is a front view of the wire bonding structure in one embodiment of the present invention;

[0016] Figure 4 This is a schematic diagram of the wire-punching mechanism in one embodiment of the present invention. Detailed Implementation

[0017] The embodiments of this utility model are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0018] In the description of this utility model, it should be noted that the directional terms such as "center", "lateral", "longitudinal", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", and "counterclockwise" are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. They should not be construed as limiting the specific protection scope of this utility model.

[0019] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features. Thus, the use of "first" and "second" to define a feature may explicitly or implicitly include one or more of that feature, and in this description of the utility model, "at least" means one or more, unless otherwise explicitly specified.

[0020] In this utility model, unless otherwise explicitly specified and limited, the terms "assembly," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can also refer to a mechanical connection; they can refer to a direct connection or a connection through an intermediate medium; or they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0021] In this utility model, unless otherwise specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "below," and "over" the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Above," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] The following description, in conjunction with the accompanying drawings, further illustrates specific embodiments of the present invention, making the technical solution and beneficial effects of the present invention clearer and more explicit. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, but should not be construed as limiting the present invention.

[0023] like Figures 1 to 4As shown, an LED wire bonding machine includes a machine base 1 and a wire bonding mechanism 2, a conveying mechanism 3, and a receiving / unloading mechanism 4 mounted on the machine base 1. The receiving / unloading mechanism 4 is used to output and receive a substrate 5 loaded with LED chips, outputting a substrate 5 before the LED chips are soldered, and receiving a substrate 5 after the LED chips are soldered. The conveying mechanism 3 is used to convey the substrate 5 loaded with LED chips to below the wire bonding mechanism 2. The wire bonding mechanism 2 is used to bond metal wires to the LED chips and the substrate 5 to form an electrical connection. The wire bonding mechanism 2 includes a soldering needle 6 and a feeding component 7. The soldering needle 6 is a magnetic nozzle. The feeding component 7 is used to feed metal wires to the soldering needle 6. The metal wires are soldered to the electrodes of the LED chips and the pads of the substrate 5. The wire bonding mechanism 2 also includes an air blowing mechanism 8. The air blowing mechanism 8 includes a gas cylinder 9 and an air nozzle 10. The gas cylinder 9 is connected to the air nozzle 10 and is used to supply air to the air nozzle 10. The air nozzle 10 is located next to the soldering needle 6 and is used to guide the air from the gas cylinder 9 to the soldering needle 6. The feeding component 7 is a feeding tray. After the feeding tray delivers the metal wire to the magnetic nozzle, the ignition rod of the wire bonding machine discharges, melting the end of the metal wire and forming a free air ball on the magnetic nozzle. This free air ball is then pressed onto the electrodes of the LED chip and the pads of the substrate 5 to form the first solder joint. The air nozzle 10 then blows on the solder joint, causing it to form a solder ball, which is not only strong but also facilitates observation of the LED chip's welding process. The wire bonding machine then moves the magnetic nozzle to weld the second joint using the same method. Finally, a cutting tool is used to cut the metal wire, completing the welding process. This process not only does not affect the working efficiency of the wire bonding machine but also makes the LED chip welding more robust.

[0024] In one embodiment, the wire bonding mechanism 2 includes a needle holder 11, the welding needle 6 is disposed on the needle holder 11, the air blowing mechanism 8 includes a fixing member 12, the air nozzle 10 is connected to the fixing member 12, and the fixing member 12 is fixedly connected to the needle holder 11.

[0025] In one embodiment, the air nozzle 10 is a universal joint tube, which makes it convenient for production personnel to adjust the air blowing direction of the air nozzle 10 and improve the welding quality of LED chips.

[0026] In one embodiment, the blowing mechanism 8 further includes a pressure regulator 13 for adjusting the air pressure of the nozzle 10, and the fixing member 12 is connected to the gas cylinder 9 through the pressure regulator 13.

[0027] In one embodiment, the gas in the gas cylinder 9 is nitrogen. Nitrogen prevents the metal wire from reacting with air.

[0028] In one embodiment, the wire bonding mechanism 2 further includes a CCD camera 14, which is located behind the pin holder 11. The CCD camera 14 is used to detect the soldering status of the LED chips, facilitating equipment adjustment by production personnel.

[0029] In one embodiment, the receiving and unloading mechanism 4 includes a substrate compartment 15 for storing substrates 5, the substrate compartment 15 being disposed on both sides of the machine base 1.

[0030] In one embodiment, the metal wire is a silver wire.

[0031] The LED wire bonding machine described in this application has a blowing mechanism 8. The air nozzle 10 of the blowing mechanism 8 is located next to the welding needle 6. After the welding needle 6 welds the LED chip, the blowing mechanism 8 cools the solder joint, which not only improves the firmness of the solder joint, but also makes the solder joint more beautiful and enhances the appearance of the LED chip.

[0032] In the description of this specification, the terms "in one embodiment," "preferred," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of this utility model. The illustrative expressions of the above terms in this specification do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described can be combined in any suitable manner in one or more embodiments or examples. The connection methods linked in the description of this specification have significant effects and practical utility.

[0033] Based on the above description of the structure and principle, those skilled in the art should understand that this utility model is not limited to the specific embodiments described above. Any improvements and substitutions made using techniques known in the art based on this utility model fall within the protection scope of this utility model and should be defined by the claims. 。

Claims

1. A wire bonding structure for an LED wire bonding machine, comprising a machine base and a wire bonding mechanism, a conveying mechanism, and a feeding / receiving mechanism disposed on the machine base, wherein the feeding / receiving mechanism is used to output and receive a substrate loaded with LED chips, the conveying mechanism is used to convey the substrate loaded with LED chips to a position below the wire bonding mechanism, and the wire bonding mechanism is used to bond metal wires to the LED chips and the substrate to form an electrical connection, characterized in that... The wire bonding mechanism includes a welding needle and a feeding component. The feeding component is used to feed metal wire to the welding needle. The metal wire is welded to the electrode of the LED chip and the pad of the substrate. The wire bonding mechanism also includes an air blowing mechanism, which includes an air cylinder and an air nozzle. The air cylinder is connected to the air nozzle and is used to supply air to the air nozzle. The air nozzle is located next to the welding needle and is used to guide the air from the air cylinder to the welding needle.

2. The wire bonding structure of the LED wire bonding machine according to claim 1, characterized in that, The wire bonding mechanism includes a needle holder, the welding needle is disposed on the needle holder, the air blowing mechanism includes a fixing member, the air nozzle is connected to the fixing member, and the fixing member is fixedly connected to the needle holder.

3. The wire bonding structure of the LED wire bonding machine according to claim 2, characterized in that, The air nozzle is a universal joint tube.

4. The wire bonding structure of the LED wire bonding machine according to claim 2, characterized in that, The blowing mechanism also includes a pressure regulator for adjusting the air pressure of the air nozzle, and the fixing member is connected to the air cylinder through the pressure regulator.

5. The wire bonding structure of the LED wire bonding machine according to claim 4, characterized in that, The gas in the gas cylinder is nitrogen.

6. The wire bonding structure of the LED wire bonding machine according to claim 2, characterized in that, The stitching mechanism also includes a CCD camera, which is located behind the needle holder.

7. The wire bonding structure of the LED wire bonding machine according to claim 1, characterized in that, The material receiving and unloading mechanism includes substrate bins for storing substrates, which are located on both sides of the machine.

8. The wire bonding structure of the LED wire bonding machine according to claim 1, characterized in that, The metal wire is a silver wire.

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