Surface-mounted LED lamp bead capable of preventing heat accumulation

Abstract

The utility model provides a heat accumulation prevention paster type LED lamp bead, which comprises a fast-assembly structure, the fast-assembly structure comprises a push plate, two ends of the push plate are rotatably connected with pull rods, one end of each pull rod is rotatably connected with a rotating plate, one side of the rotating plate is provided with a fitting hole, and the inner wall of the fitting hole is fitted with the outer wall of a conductive column. According to the utility model, through the arrangement of the quick-mounting structure, the surface-mounted LED lamp bead can be quickly mounted on the top of the circuit board, the push plate is pushed inwards to drive the pull rod to rotate, the rotating plate is pulled to rotate inwards and extrude the reset spring, the push plate is loosened after the fitting hole is aligned with the conductive column, and the reset spring drives the rotating plate to reset, so that the surface-mounted LED lamp bead can be quickly mounted on the top of the circuit board. And then, the inner wall of the attaching hole is attached to the outer wall of the conductive column, so that the corresponding surface-mounted LED lamp beads can be quickly mounted on the top of the circuit board.

Description

Technical Field

[0001] This utility model belongs to the field of surface mount LED lamp bead technology, specifically relating to a surface mount LED lamp bead that prevents heat buildup. Background Technology

[0002] Surface mount LEDs, also known as SMD surface mount LEDs, are a type of LED that prevents heat buildup. They are a simple type of light fixture. Their light-emitting principle is that when an electric current is passed through a compound semiconductor, the excess energy is released in the form of light through the combination of electrons and holes, thus achieving the effect of emitting light.

[0003] Its light-emitting principle is cold light emission, rather than light emission through heating or discharge. Therefore, the lifespan of surface-mount LED lamp beads that prevent heat accumulation is about 50 to 100 times longer than that of tungsten filament bulbs, about 100,000 hours.

[0004] When connecting surface-mount LED chips to a circuit board, a soldering iron is typically used to directly attach the surface-mount LED chips to the surface of the circuit board. This makes it difficult to quickly replace surface-mount LED chips after they are damaged. Summary of the Invention

[0005] Purpose of utility model

[0006] To address the aforementioned technical problems, this utility model provides a surface-mount LED bead that prevents heat buildup, thereby solving the technical problems mentioned in the background art.

[0007] Technical solution

[0008] To achieve the above objectives, the present invention provides a surface-mount LED bead that prevents heat buildup, comprising a circuit board, conductive posts at the four corners of the top of the circuit board, a substrate at the top of the circuit board, an adhesive on the top of the substrate, and quick-release structures on both sides of the substrate.

[0009] The quick-installation structure includes a push plate, with pull rods rotatably connected to both ends of the push plate, and a rotating plate rotatably connected to one end of the pull rods. A fitting hole is provided on one side of the rotating plate, and the inner wall of the fitting hole fits against the outer wall of the conductive post.

[0010] Preferably, a first connection port is provided on one side of the top of the circuit board, and a plurality of second connection ports are provided on the other side of the top of the circuit board.

[0011] Preferably, conductive plates are provided on both sides of the substrate, and a mounting hole is provided at one end of the conductive plate.

[0012] Preferably, a rotating shaft is rotatably connected to the inner wall of the mounting hole, one end of the rotating shaft is connected to one side of the top of the rotating plate, and a return spring is provided between the rotating plate and the conductive plate.

[0013] Preferably, a heat-conducting groove is formed at the bottom of the colloid, and a heat-conducting plate is provided at the bottom of the heat-conducting groove.

[0014] Preferably, the heat-conducting plate is made of brass, and the number of heat-conducting plates is set to multiple, with the multiple heat-conducting plates evenly distributed at the bottom of the heat-conducting groove, and the heat-conducting plates are inclined.

[0015] Beneficial effects

[0016] The technical solution provided by this utility model has the following advantages compared with the prior art:

[0017] This utility model, through its quick-installation structure, allows surface-mount LED beads to be quickly installed onto the top of a circuit board. Pushing the push plate inward causes it to rotate the pull rod, which in turn rotates the rotating plate inward and compresses the return spring. Once the fitting hole aligns with the conductive post, the push plate is released, causing the return spring to reset the rotating plate. Then, the inner wall of the fitting hole fits against the outer wall of the conductive post, thus enabling the rapid installation of the corresponding surface-mount LED beads on the top of the circuit board.

[0018] When surface-mount LED chips are used, the heat generated by the surface-mount LED chips is conducted to the inside of the heat-conducting plate. When the outside air flows through the heat-conducting plate, it carries away the heat inside the heat-conducting plate, thereby achieving heat dissipation of the surface-mount LED chips and preventing heat from accumulating inside the surface-mount LED chips and damaging them. Attached Figure Description

[0019] Figure 1 This is a perspective view of the present utility model;

[0020] Figure 2 This is a perspective view of the substrate of this utility model;

[0021] Figure 3 This is a perspective view of the push plate of this utility model.

[0022] Figure Labels

[0023] 1. Circuit board; 2. First connection port; 3. Second connection port; 4. Conductive post; 5. Substrate; 6. Colloid; 7. Heat conduction groove; 8. Heat conduction plate; 9. Conductive plate; 10. Mounting hole; 11. Push plate; 12. Pull rod; 13. Rotating plate; 14. Fitting hole; 15. Rotating shaft; 16. Return spring. Detailed Implementation

[0024] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "page", "bottom", "inner", "outer", "clockwise", "counterclockwise", "coaxial", "bottom", "one end", "top", "other end", "one side", "front", "both ends", "both sides", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0026] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," "fixing," and "equipped with" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0027] Referring now to the accompanying drawings, the various figures are intended only to illustrate certain exemplary embodiments and are not intended to limit the scope of the invention. In the various figures, the same reference numerals denote the same or corresponding parts. The dimensions and scales in the various figures are also for illustrative purposes only and should not be construed as limiting the scope of the invention; these dimensions may be enlarged relative to actual products.

[0028] Reference Figure 1-3 The above describes a surface-mount LED bead that prevents heat buildup, comprising a circuit board 1, conductive posts 4 at the four corners of the top of the circuit board 1, a substrate 5 directly above the circuit board 1, an adhesive 6 on the top of the substrate 5, and quick-release structures on both sides of the substrate 5.

[0029] The quick-installation structure includes a push plate 11, with pull rods 12 rotatably connected to both ends of the push plate 11, and a rotating plate 13 rotatably connected to one end of the pull rods 12. A fitting hole 14 is provided on one side of the rotating plate 13, and the inner wall of the fitting hole 14 fits against the outer wall of the conductive post 4.

[0030] Furthermore, in the above technical solution, a first connection port 2 is provided on one side of the top of the circuit board 1, and a plurality of second connection ports 3 are provided on the other side of the top of the circuit board 1. The surface-mount LED beads can be powered and controlled through the first connection port 2 and the second connection port 3.

[0031] Furthermore, in the above technical solution, conductive plates 9 are provided on both sides of the substrate 5, and a mounting hole 10 is provided at one end of the conductive plate 9. A rotating shaft 15 is rotatably connected to the inner wall of the mounting hole 10. One end of the rotating shaft 15 is connected to one side of the top of the rotating plate 13. A return spring 16 is provided between the rotating plate 13 and the conductive plate 9. When the quick-release structure pushes the rotating plate 13 to rotate, the rotating plate 13 rotates along the connection position between the rotating shaft 15 and the mounting hole 10 and squeezes the return spring 16, so that the fitting hole 14 at one end of the rotating plate 13 can move inward, avoiding direct contact between the fitting hole 14 and the conductive post 4. After the quick-release structure is released, the rotating plate 13 returns to its original position, causing the fitting hole 14 to fit with the conductive post 4, thereby realizing the conduction of the surface-mount LED lamp bead.

[0032] Furthermore, in the above technical solution, a heat-conducting groove 7 is provided at the bottom of the colloid 6, and a heat-conducting plate 8 is provided at the bottom of the heat-conducting groove 7. The heat-conducting plate 8 is made of brass, and the number of heat-conducting plates 8 is set to multiple, which are evenly distributed at the bottom of the heat-conducting groove 7. The heat-conducting plate 8 is inclined, and the heat-conducting plate 8 can absorb the heat generated during the operation of the surface-mount LED. After the external air flows through the heat-conducting plate 8, it will carry the heat inside the heat-conducting plate 8, thereby realizing the heat dissipation of the surface-mount LED and avoiding the accumulation of heat inside the surface-mount LED and damaging the surface-mount LED.

[0033] The working principle of this practical application is as follows:

[0034] Refer to the instruction manual appendix Figure 1-3 First, when it is necessary to install surface-mount LED beads on the top of the circuit board 1, push the push plate 11 inward. The push plate 11 drives the pull rod 12 to rotate and the pull rod 12 pulls the rotating plate 13 to rotate along the connection position between the rotating shaft 15 and the mounting hole 10 and squeezes the reset spring 16. Then, put the glue 6 on the top of the circuit board 1 so that the bonding hole 14 is aligned with the conductive post 4. Release the push plate 11, and the reset spring 16 drives the rotating plate 13 to reset, so that the inner wall of the bonding hole 14 is attached to the outer wall of the conductive post 4 to achieve conduction of the surface-mount LED beads.

[0035] During the operation of the surface-mount LED beads, heat is transferred to the interior of the heat-conducting plate 8. After the external air flows through the heat-conducting plate 8, it will carry away the heat inside the heat-conducting plate 8, thereby achieving heat dissipation for the surface-mount LED beads.

[0036] The above-described embodiments are merely illustrative of certain implementations of this utility model, and their descriptions are relatively specific and detailed. However, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these modifications and improvements all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A surface-mount LED bead designed to prevent heat buildup, characterized in that, include Circuit board (1), conductive pillars (4) are provided at the four corners of the top of the circuit board (1), a substrate (5) is provided directly above the circuit board (1), a colloid (6) is provided on the top of the substrate (5), and quick-release structures are provided on both sides of the substrate (5). The quick-installation structure includes a push plate (11), with pull rods (12) rotatably connected to both ends of the push plate (11), and a rotating plate (13) rotatably connected to one end of the pull rods (12). A fitting hole (14) is provided on one side of the rotating plate (13), and the inner wall of the fitting hole (14) fits against the outer wall of the conductive post (4).

2. The surface-mount LED bead for preventing heat buildup according to claim 1, characterized in that: The circuit board (1) has a first connection port (2) on one side of its top and a plurality of second connection ports (3) on the other side of its top.

3. The surface-mount LED bead for preventing heat buildup according to claim 1, characterized in that: The substrate (5) has conductive plates (9) on both sides, and one end of the conductive plate (9) has a mounting hole (10).

4. A surface-mount LED bead for preventing heat buildup according to claim 3, characterized in that: The inner wall of the mounting hole (10) is rotatably connected to a rotating shaft (15), one end of the rotating shaft (15) is connected to one side of the top of the rotating plate (13), and a reset spring (16) is provided between the rotating plate (13) and the conductive plate (9).

5. A surface-mount LED bead for preventing heat buildup according to claim 1, characterized in that: The colloid (6) has a heat-conducting groove (7) at the bottom, and a heat-conducting plate (8) is provided at the bottom of the heat-conducting groove (7).

6. A surface-mount LED bead for preventing heat buildup according to claim 5, characterized in that: The heat-conducting plate (8) is made of brass. The number of heat-conducting plates (8) is set to multiple. The multiple heat-conducting plates (8) are evenly distributed at the bottom of the heat-conducting groove (7). The heat-conducting plates (8) are inclined.

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