Novel dehumidifier energy-saving temperature control module
By combining copper plates, air guide channels, semiconductor cooling boxes, and fans, the problem of low heat dissipation efficiency of the dehumidifier's energy-saving temperature control module is solved, achieving efficient module cooling and heat dissipation effects.
Patent Information
- Application Number
- CN202520587322.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-31
- Publication Date
- 2026-02-24
- Estimated Expiration
- 2035-03-31
AI Technical Summary
Existing dehumidifier energy-saving temperature control modules are inefficient in heat dissipation, making it difficult to effectively prevent module overheating and overload, and air-cooling methods cannot ensure rapid cooling.
The system employs a combination design of copper plate, flow channel, semiconductor cooling box, return pipe, delivery pipe, micro water pump and drain pipe. It utilizes the circulation of coolant to remove heat and combines it with a small fan and air box to exhaust hot air, forming a highly efficient heat dissipation system.
This achieves efficient heat dissipation of the module, avoids overheating and overload, ensures long-term efficient operation, and improves heat dissipation efficiency and effectiveness.
Smart Images
Figure CN223939613U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of new energy-saving temperature control modules for dehumidifiers, specifically a new type of energy-saving temperature control module for dehumidifiers. Background Technology
[0002] In industries such as rotary dehumidification, PLCs are mostly used for heating temperature control. In small control systems such as dehumidification and air conditioning, PLCs from Siemens, Germany, are mainly used. When controlling heating, an expansion module of the PLC is required. The expansion module is used to collect data on temperature changes on site, and the output of the module is used to control the heating power.
[0003] Existing new dehumidifier energy-saving temperature control modules mostly use air cooling to dissipate accumulated heat when the module is working. However, air cooling cannot ensure that the module itself cools down quickly. In most cases, air cooling can only ensure that heat does not accumulate in large quantities, while the module itself still heats up quite significantly.
[0004] Therefore, in view of this, we have studied and improved the existing structure to propose a new type of energy-saving temperature control module for dehumidifiers. Utility Model Content
[0005] The purpose of this invention is to provide a novel energy-saving temperature control module for dehumidifiers to solve the problems mentioned in the background art.
[0006] To achieve the above objectives, this utility model provides the following technical solution: a novel energy-saving temperature control module for a dehumidifier, comprising an assembly frame, a copper plate fixedly mounted on the front side of the surface of the assembly frame, a guide groove opened inside the copper plate, a return pipe fixedly connected to the upper left opening of the guide groove, a drain pipe fixedly connected to the lower left opening of the guide groove, a micro water pump fixedly connected to the upper end of the drain pipe, a delivery pipe fixedly connected to the upper end of the micro water pump, and a semiconductor refrigeration box fixedly connected to the left rear end of the delivery pipe.
[0007] Preferably, the lower end of the reflux pipe is connected to the upper part of the semiconductor cooling box, and the guide groove is located inside the copper plate and is opened in an "S" shape.
[0008] Preferably, the semiconductor cooling box is fixedly connected to the left side of the assembly frame, and the micro water pump is fixedly connected to the lower left side of the front surface of the assembly frame.
[0009] Preferably, a temperature control module body is fixedly installed on the front side of the copper plate, and connecting brackets are fixedly installed on both the upper and lower sides of the rear surface of the assembly frame.
[0010] Preferably, a bellows is fixedly installed on the right side of the front surface of the assembly frame, and three sets of small fans are evenly distributed on the left side of the bellows surface.
[0011] Preferably, an air groove is provided on the front side of the outer surface of the bellows, and the air groove communicates with the interior of the bellows.
[0012] Compared with the prior art, the beneficial effects of this utility model are:
[0013] 1. This utility model, through the arrangement of a copper plate, a guide channel, a semiconductor cooling box, a return pipe, a delivery pipe, a micro water pump, and a drain pipe, utilizes the copper plate to absorb the heat generated by the temperature control module during operation, thereby cooling the module. At the same time, the micro water pump draws coolant from inside the semiconductor cooling box through the delivery pipe, and delivers it into the guide channel through the drain pipe. The coolant carries away the heat of the copper plate itself and provides secondary cooling to the module. The coolant then flows back into the semiconductor cooling box through the return pipe for further cooling, and is drawn back by the micro water pump for reuse. This cycle allows for more efficient and complete heat dissipation of the entire module, preventing overheating and overload, and enabling the entire module to operate efficiently for extended periods.
[0014] 2. This utility model, through the arrangement of a bellows, a small fan, and an air duct, allows the small fan to draw in air around the module and facilitates the rapid circulation of hot air generated by the thermoelectric cooler. The hot air generated by the module and the thermoelectric cooler is discharged into the bellows and then through the air duct. This effectively disperses the hot air around the module, preventing the accumulation of hot air that could cause the module to overheat, and further improves the overall heat dissipation efficiency and effect of the module. Attached Figure Description
[0015] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention;
[0016] Figure 2 This is a schematic cross-sectional view of the copper plate structure of this utility model;
[0017] Figure 3 This is a schematic diagram of the bellows structure of this utility model.
[0018] In the diagram: 1. Assembly frame; 2. Copper plate; 3. Guide channel; 4. Semiconductor cooling box; 5. Return pipe; 6. Delivery pipe; 7. Miniature water pump; 8. Drain pipe; 9. Temperature control module body; 10. Connecting frame; 11. Air box; 12. Small fan; 13. Air tank. Detailed Implementation
[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0020] like Figures 1-3 As shown, a novel energy-saving temperature control module for a dehumidifier includes an assembly frame 1. A copper plate 2 is fixedly installed on the front side of the surface of the assembly frame 1. A guide channel 3 is opened inside the copper plate 2. A return pipe 5 is fixedly connected to the upper left opening of the guide channel 3. A drain pipe 8 is fixedly connected to the lower left opening of the guide channel 3. A micro water pump 7 is fixedly connected to the upper end of the drain pipe 8. A delivery pipe 6 is fixedly connected to the upper end of the micro water pump 7. A semiconductor refrigeration box 4 is fixedly connected to the left rear end of the delivery pipe 6.
[0021] The lower end of the return pipe 5 is connected to the upper part of the semiconductor cooling box 4, and the guide groove 3 is located inside the copper plate 2 and is opened in an "S" shape.
[0022] By adopting the above technical solution, the copper plate 2 can absorb the heat generated by the temperature control module body 9 during operation, thereby cooling the module.
[0023] The micro water pump 7 uses the delivery pipe 6 to draw the coolant inside the semiconductor cooling box 4, and then delivers it into the guide groove 3 through the drain pipe 8. The coolant can remove the heat of the copper plate 2 itself and perform secondary cooling of the module.
[0024] The coolant will flow back into the semiconductor cooling box 4 through the return pipe 5 for heat dissipation and cooling, and will be pumped back by the micro water pump 7 for use, thus creating a cycle.
[0025] The S-shaped guide channel 3 extends the flow path of the coolant and allows the coolant to more fully cover the entire copper plate 2, thereby ensuring comprehensive heat exchange.
[0026] Furthermore, the semiconductor cooling box 4 is fixedly connected to the left side of the assembly frame 1, and the micro water pump 7 is fixedly connected to the lower left side of the front surface of the assembly frame 1.
[0027] By adopting the above technical solution, the stable installation and use of the semiconductor cooling box 4 and the micro water pump 7 can be ensured.
[0028] Furthermore, a temperature control module body 9 is fixedly installed on the front side of the surface of the copper plate 2, and a connecting bracket 10 is fixedly installed on both the upper and lower sides of the rear surface of the assembly frame 1.
[0029] By adopting the above technical solution, the entire module and connectors can be assembled using the connecting frame 10.
[0030] Furthermore, a bellows 11 is fixedly installed on the right side of the front surface of the assembly frame 1, and three sets of small fans 12 are evenly distributed on the left side of the surface of the bellows 11.
[0031] By adopting the above technical solution, the small fan 12 can draw in the air around the module when it rotates, and can make the hot air generated by the heat exchange of the semiconductor cooling box 4 circulate quickly, so as to discharge the hot air generated by the module and the hot air generated by the semiconductor cooling box 4 into the air box 11.
[0032] Furthermore, an air groove 13 is provided on the front side of the outer surface of the bellows 11, and the air groove 13 is connected to the interior of the bellows 11.
[0033] By adopting the above technical solution, the hot air accumulated inside the bellows 11 can be discharged through the air groove 13, thus preventing the hot air inside the bellows 11 from accumulating and failing to dissipate.
[0034] Working Principle: When using this new energy-saving temperature control module for dehumidifiers, firstly, during the operation of the main body 9 of the temperature control module, the copper plate 2 absorbs the heat generated during the operation of the main body 9, thereby cooling the module. At the same time, the micro water pump 7 uses the delivery pipe 6 to draw the coolant inside the semiconductor refrigeration box 4, which is then transported through the drain pipe 8 into the guide groove 3. The coolant carries away the heat of the copper plate 2 and cools the module a second time. The coolant then flows back into the semiconductor refrigeration box 4 through the return pipe 5 for heat dissipation and cooling, and is drawn back by the micro water pump 7 for reuse. This cycle continues. In addition, the small fan 12 rotates, which can draw in the air around the module and enable the hot air generated by the heat exchange of the semiconductor refrigeration box 4 to circulate quickly. The hot air generated by the module and the semiconductor refrigeration box 4 is discharged into the air box 11 and discharged through the air groove 13. This can effectively disperse the hot air around the module and prevent the hot air from accumulating and causing the module to overheat. This is the working principle of this new energy-saving temperature control module for dehumidifiers.
Claims
1. A novel energy-saving temperature control module for dehumidifiers, comprising an assembly frame (1), characterized in that, A copper plate (2) is also fixedly installed on the front side of the surface of the assembly frame (1). A guide groove (3) is opened inside the copper plate (2). A return pipe (5) is fixedly connected to the upper left opening of the guide groove (3). A drain pipe (8) is fixedly connected to the lower left opening of the guide groove (3). A micro water pump (7) is fixedly connected to the upper end of the drain pipe (8). A delivery pipe (6) is fixedly connected to the upper end of the micro water pump (7). A semiconductor refrigeration box (4) is fixedly connected to the left rear end of the delivery pipe (6).
2. The novel energy-saving temperature control module for a dehumidifier according to claim 1, characterized in that, The lower end of the return pipe (5) is connected to the upper part of the semiconductor cooling box (4), and the guide groove (3) is located inside the copper plate (2) and is opened in an "S" shape.
3. The novel energy-saving temperature control module for a dehumidifier according to claim 1, characterized in that, The semiconductor cooling box (4) is fixedly connected to the left side of the assembly frame (1), and the micro water pump (7) is fixedly connected to the lower left side of the front surface of the assembly frame (1).
4. The novel energy-saving temperature control module for a dehumidifier according to claim 1, characterized in that, The temperature control module body (9) is fixedly installed on the front side of the surface of the copper plate (2), and the connecting frame (10) is fixedly installed on the upper and lower sides of the rear surface of the assembly frame (1).
5. The novel energy-saving temperature control module for a dehumidifier according to claim 1, characterized in that, A bellows (11) is fixedly installed on the right side of the front surface of the assembly frame (1), and three sets of small fans (12) are evenly distributed on the left side of the surface of the bellows (11).
6. A novel energy-saving temperature control module for a dehumidifier according to claim 5, characterized in that, The outer surface of the bellows (11) is provided with an air groove (13), which is connected to the interior of the bellows (11).