Thermotank with energy storage function

Abstract

The utility model provides a thermostat with an energy storage function, and relates to the field of temperature control. The energy storage device comprises a power assembly, an energy storage assembly, an evaporator assembly and a heat preservation cavity, the power assembly comprises a semiconductor refrigeration unit, the energy storage assembly is divided into a cold end energy storage assembly and a cold and hot energy storage assembly, and each energy storage assembly comprises an energy storage cavity, a fluid circulating pump and a connecting pipeline. During alternate cooling and heating temperature control, energy which is not utilized by the hot end or the cold end of the semiconductor refrigeration unit is stored through the added cold and hot end energy storage assembly, and when heating or refrigeration is needed, the stored energy can be rapidly utilized to conduct heat exchange on the heat preservation cavity so as to control the temperature. According to the utility model, through an energy storage mode, the energy utilization efficiency during alternate cooling and heating temperature control is improved, and meanwhile, the speed of alternate cooling and heating temperature control can also be improved.

Description

Technical Field

[0001] This utility model relates to the field of temperature control, specifically to a constant temperature box with energy storage function. Background Technology

[0002] A thermoelectric cooler is a temperature control element based on the Peltier effect. It consists of an electrical couple composed of N-type and P-type semiconductor materials. When direct current is applied, energy transfer occurs, and the thermoelectric cooler transfers heat from one end to the other, resulting in heat absorption at one end and heat release at the other, creating hot and cold ends, thus achieving heating or cooling. Therefore, precision temperature control equipment often uses thermoelectric coolers for temperature control. However, temperature control equipment requires frequent alternating heating and cooling, which consumes more time and energy than simple heating or cooling.

[0003] Existing temperature control devices using thermoelectric coolers, when controlling temperature through alternating heating and cooling, typically have the heat generated at the hot end directly dissipated to the outside via a radiator during cooling (using the cold end) and directly absorbed heat from the outside during heating (using the hot end). This lack of secondary utilization of energy generated at both ends results in energy waste. Therefore, for temperature control devices, which are already relatively energy-intensive, improving energy efficiency through technological means is particularly important. Utility Model Content

[0004] To address the problem of low energy utilization in existing temperature control equipment, this invention provides a constant temperature box with energy storage function. By storing energy at both the hot and cold ends, it improves the energy utilization efficiency of the temperature control equipment during alternating hot and cold temperature control, and also increases the rate of alternating hot and cold temperature control.

[0005] To achieve the above technical objectives, the present invention adopts the following technical solution:

[0006] A constant temperature box with energy storage function includes a power component, an energy storage component, an evaporator component and an insulation cavity. The power component and the energy storage component are adjacent to each other, the energy storage component is connected to the evaporator, and the evaporator is disposed inside the insulation cavity.

[0007] The power component includes a semiconductor cooling unit, a heat-conducting plate, and a cold-conducting plate. The heat-conducting plate and the cold-conducting plate are respectively attached to the cold end and the hot end of the semiconductor cooling unit. The semiconductor cooling unit is fixed in the groove between the heat-conducting plate and the cold-conducting plate.

[0008] The energy storage module is divided into a hot-end energy storage module and a cold-end energy storage module. The hot-end energy storage module includes a hot-end energy storage cavity, a hot-end fluid circulation pump, and a hot-end connecting pipeline. The cold-end energy storage module includes a cold-end energy storage cavity, a cold-end fluid circulation pump, and a cold-end connecting pipeline. Both the hot-end and cold-end energy storage cavities are filled with energy storage liquid media. The hot-end and cold-end energy storage cavities are connected to the hot-end fluid circulation pump and the cold-end fluid circulation pump, respectively. The power module is located between the hot-end and cold-end energy storage cavities. The hot-end energy storage cavity is attached to the heat-conducting plate, and the cold-end energy storage cavity is attached to the cold-conducting plate.

[0009] The insulation cavity is equipped with an insulation layer, and the space enclosed by the insulation layer constitutes the insulation zone;

[0010] The evaporator assembly includes a hot-end evaporator and a cold-end evaporator disposed within an insulated cavity. One end of the hot-end connecting pipe is connected to a hot-end fluid circulation pump, and the other end of the hot-end connecting pipe extends into the insulated cavity and is connected to the hot-end evaporator. One end of the cold-end connecting pipe is connected to a cold-end fluid circulation pump, and the other end of the cold-end connecting pipe extends into the insulated cavity and is connected to the cold-end evaporator.

[0011] Preferably, the semiconductor cooling unit includes a number of semiconductor cooling chips arranged in series and in parallel, and the number of semiconductor cooling chips and the series and parallel connection method can be changed.

[0012] Preferably, the hot-end fluid circulation pump includes a first diaphragm pump and a second diaphragm pump, and the hot-end connection pipeline includes a first connecting pipe and a second connecting pipe. The first diaphragm pump is connected to the input end of the hot-end evaporator through the first connecting pipe, and the output end of the hot-end evaporator is connected to the second diaphragm pump through the second connecting pipe.

[0013] The cold-end fluid circulation pump includes a third diaphragm pump and a fourth diaphragm pump. The cold-end connection pipeline includes a third connecting pipe and a fourth connecting pipe. The third diaphragm pump is connected to the input end of the cold-end evaporator through the third connecting pipe, and the output end of the cold-end evaporator is connected to the fourth diaphragm pump through the fourth connecting pipe.

[0014] Preferably, the energy storage component further includes a first liquid guide plate and a second liquid guide plate. The hot-end energy storage cavity is connected to the hot-end fluid circulation pump through the first liquid guide plate, and the cold-end energy storage cavity is connected to the cold-end fluid circulation pump through the second liquid guide plate.

[0015] Preferably, both the hot-end evaporator and the cold-end evaporator include copper tubes, aluminum heat exchange plates, and a fan. The aluminum heat exchange plates are attached to the front end of the copper tubes, and the fan is located at the rear end of the copper tubes.

[0016] Preferably, a protruding structure is provided in the middle of one side of the insulation layer, and the cold end evaporator and the hot end evaporator are respectively installed on the upper and lower parts of the protruding structure. The space formed by the insulation layer and the insulation cavity is divided into an upper refrigeration circulation zone and a lower heating circulation zone by the protruding structure.

[0017] Preferably, a number of cooling air circulation holes are provided on the upper part of the insulation layer, and a number of heating air circulation holes are provided on the lower part of the insulation layer.

[0018] Preferably, the semiconductor cooling unit, the hot-end fluid circulation pump, and the cold-end fluid circulation pump are all connected to an external power source via lead-out wires.

[0019] Preferably, the insulation cavity is made of aluminum or stainless steel, and the insulation layer is made of foam material.

[0020] Preferably, the heat-conducting plate and the cold-conducting plate are made of copper plate material, and the energy storage liquid medium is pure water.

[0021] Compared with the prior art, the beneficial effects of this utility model are:

[0022] 1) This invention introduces a cold-end and hot-end energy storage component. When the semiconductor refrigeration unit is cooling, and the cold-end energy storage component starts working to cool the insulation cavity, the hot-end energy storage cavity simultaneously stores the unused energy generated at the hot end through a stored energy storage liquid medium. When heating is needed, the hot-end fluid circulation pump immediately circulates the stored high-temperature energy storage liquid medium through the hot-end connecting pipe to the hot-end evaporator in the insulation cavity. The hot-end evaporator releases heat in the insulation cavity, achieving rapid temperature rise. Similarly, when the hot-end energy storage component starts working in heating mode to heat the insulation cavity, the cold-end energy storage cavity simultaneously stores the unused energy at the cold end through a stored energy storage liquid medium. When switching to cooling mode, the stored energy can be utilized. By storing energy at both the cold and hot ends, the energy generated at both ends during the switching between cooling and heating modes is reused, improving the energy utilization efficiency of the temperature control equipment during temperature control.

[0023] 2) At the same time, regardless of whether it is in cooling or heating mode, the energy storage components at both ends of the present invention will store the energy generated by the semiconductor cooling unit at both ends of the cooling and heating, so that when the temperature is controlled by alternating cooling and heating, the pre-stored energy can be used immediately for temperature control. Therefore, the speed of temperature control by alternating cooling and heating can also be improved by pre-storing energy.

[0024] 3) Moreover, the constant temperature box of this utility model has a simple structure. Whether it is cooling or heating, it is achieved through a set of cold end and hot end energy storage components. Then, through two sets of energy storage chambers, fluid circulation pumps and connecting pipelines, the temperature of the heat-insulating chamber can be controlled by using the energy storage liquid medium as the heat exchange transfer medium, thus achieving low cost.

[0025] In summary, this invention stores unused energy from the hot or cold ends of the semiconductor refrigeration unit during alternating hot and cold temperature control by incorporating energy storage components at both ends. When heating or cooling is needed, the stored energy can be quickly used to exchange heat with the insulation cavity to control the temperature. This invention improves energy utilization efficiency and speed during alternating hot and cold temperature control through energy storage. Furthermore, the constant temperature chamber of this invention has a simple structure and low implementation cost. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the overall structure of one embodiment of the present utility model;

[0027] Figure 2 This is a rear view of one embodiment of the present invention;

[0028] Figure 3 This is a schematic diagram of a power component structure according to an embodiment of the present invention;

[0029] Figure 4 This is a schematic diagram of the semiconductor cooling unit and heat-conducting plate structure in a power component according to an embodiment of the present invention;

[0030] Figure 5 This is a schematic diagram of the evaporator assembly structure according to an embodiment of the present invention;

[0031] Figure 6 This is a front view of an evaporator assembly according to an embodiment of the present invention;

[0032] Figure 7 This is a schematic diagram of the heat-insulating cavity structure according to an embodiment of the present invention;

[0033] Figure 8 This is a rear view of the heat-insulating cavity according to an embodiment of the present invention;

[0034] In the attached diagram: 1. Semiconductor cooling unit; 2. Heat-conducting plate; 3. Cold-conducting plate; 4. Hot-end energy storage cavity; 5. Cold-end energy storage cavity; 6. First diaphragm pump; 7. Second diaphragm pump; 8. Third diaphragm pump; 9. Fourth diaphragm pump; 10. First connecting pipe; 11. Second connecting pipe; 12. Third connecting pipe; 13. Fourth connecting pipe; 14. Hot-end evaporator; 15. Cold-end evaporator; 16. Copper pipe; 17. Aluminum heat exchange plate; 18. Fan; 19. First liquid guide plate; 20. Second liquid guide plate; 21. Insulation cavity; 22. Insulation layer; 23. Protruding structure; 24. Cooling air circulation hole; 25. Heating air circulation hole; 26. Semiconductor cooling chip wire; 27. Diaphragm pump wire; 28. Semiconductor cooling chip; 29. ​​Middle insulation layer. Detailed Implementation

[0035] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.

[0036] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0037] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0038] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.

[0039] To better understand the purpose, structure, and function of this utility model, the following description is in conjunction with the appendix. Figures 1-8 The present invention provides a more detailed description of a constant temperature box with energy storage function.

[0040] Example 1

[0041] Reference Appendix Figures 1-8 As shown, this utility model embodiment provides a constant temperature box with energy storage function, including a power component, an energy storage component, an evaporator component and an insulation cavity 21. The power component and the energy storage component are adjacent to each other, the energy storage component is connected to the evaporator, and the evaporator is disposed inside the insulation cavity 21.

[0042] The power assembly includes a semiconductor cooling unit 1, a heat-conducting plate 2, and a cold-conducting plate 3. The heat-conducting plate 2 and the cold-conducting plate 3 are respectively attached to the cold end and the hot end of the semiconductor cooling unit 1. The semiconductor cooling unit 1 is fixed in the groove between the heat-conducting plate 2 and the cold-conducting plate 3.

[0043] The energy storage components are divided into hot-end energy storage components and cold-end energy storage components. The hot-end energy storage component includes a hot-end energy storage cavity 4, a hot-end fluid circulation pump, and a hot-end connecting pipeline. The cold-end energy storage component includes a cold-end energy storage cavity 5, a cold-end fluid circulation pump, and a cold-end connecting pipeline. Both the hot-end energy storage cavity 4 and the cold-end energy storage cavity 5 are filled with energy storage liquid medium. The hot-end energy storage cavity 4 and the cold-end energy storage cavity 5 are connected to the hot-end fluid circulation pump and the cold-end fluid circulation pump, respectively. The power component is set between the hot-end energy storage cavity 4 and the cold-end energy storage cavity 5. The hot-end energy storage cavity 4 is attached to the heat-conducting plate 2, and the cold-end energy storage cavity 5 is attached to the cold-conducting plate 3.

[0044] The insulation cavity 21 is provided with an insulation layer 22, and the space enclosed by the insulation layer 22 constitutes an insulation zone;

[0045] The evaporator assembly includes a hot-end evaporator 14 and a cold-end evaporator 15 disposed within the insulation cavity 21. One end of the hot-end connecting pipe is connected to a hot-end fluid circulation pump, and the other end of the hot-end connecting pipe extends into the insulation cavity 21 and is connected to the hot-end evaporator 14. One end of the cold-end connecting pipe is connected to a cold-end fluid circulation pump, and the other end of the cold-end connecting pipe extends into the insulation cavity 21 and is connected to the cold-end evaporator 15.

[0046] In this invention, the power component generates cold and hot end energy and transfers it to the energy storage component. The energy storage component stores the cold and hot end energy and can deliver it to the evaporator. The evaporator releases or absorbs energy within an insulated cavity to achieve cooling or heating. Furthermore, the semiconductor refrigeration unit transfers heat from one end to the other during operation, thus creating a hot end and a cold end on both sides of the semiconductor refrigeration unit. The temperature of the hot end increases, and the temperature of the cold end decreases, generating cold and hot end energy.

[0047] In this invention's semiconductor refrigeration unit, during refrigeration, the cold-end energy storage component activates to cool the insulated cavity. Simultaneously, the hot-end energy storage cavity stores energy generated from unused hot ends. This energy is transferred to the hot-end energy storage cavity via a heat-conducting plate. The hot-end energy storage cavity collects this energy through a stored energy storage liquid medium, which is then heated. When heating is needed, the hot-end fluid circulation pump immediately circulates the stored high-temperature energy storage liquid medium through the hot-end connecting pipeline to the hot-end evaporator. The hot-end evaporator releases heat within the insulated cavity, achieving rapid heating. Similarly, when the conductor cooling unit is heating, the hot-end energy storage component starts working to heat the insulated cavity. The cold-end energy storage cavity stores the energy generated by the unused cold end. The cold-end energy is transferred to the cold-end energy storage cavity through the heat-conducting plate. The cold-end energy storage cavity collects the cold-end energy through the stored energy storage liquid medium. The energy storage liquid medium is cooled down. When cooling is needed, the cold-end fluid circulation pump immediately circulates the stored low-temperature energy storage liquid medium through the cold-end connecting pipe to the cold-end evaporator. The cold-end evaporator absorbs heat from the air in the insulated cavity to achieve rapid cooling.

[0048] In summary, this invention, during alternating hot and cold temperature control, collects unused energy from the hot or cold ends of the semiconductor refrigeration unit through an added energy storage component. When heating or cooling is needed, the stored energy can be quickly used to exchange heat with the insulation cavity to control the temperature. This invention can improve the energy utilization efficiency during alternating hot and cold temperature control, and the pre-stored energy also increases the speed of alternating hot and cold temperature control.

[0049] Example 2

[0050] Reference Appendix Figures 1-8 As shown, this utility model embodiment provides a constant temperature box with energy storage function, which includes: a power component, an energy storage component, an evaporator component and an insulation cavity 21. The power component and the energy storage component are adjacent to each other, the energy storage component is connected to the evaporator, and the evaporator is disposed inside the insulation cavity 21.

[0051] The power assembly includes a semiconductor cooling unit 1 composed of several semiconductor cooling chips 28, a heat-conducting plate 2 and a cold-conducting plate 3. The heat-conducting plate 2 and the cold-conducting plate 3 are tightly attached to the cold end and the hot end of the semiconductor cooling unit 1, respectively. The semiconductor cooling unit 1 is fixed in the groove position between the heat-conducting plate 2 and the cold-conducting plate 3.

[0052] The energy storage components are divided into hot-end energy storage components and cold-end energy storage components. The hot-end energy storage component includes a hot-end energy storage cavity 4, a hot-end fluid circulation pump, and a hot-end connecting pipeline. The cold-end energy storage component includes a cold-end energy storage cavity 5, a cold-end fluid circulation pump, and a cold-end connecting pipeline. Both the hot-end energy storage cavity 4 and the cold-end energy storage cavity 5 are filled with energy storage liquid medium. The hot-end energy storage cavity 4 and the cold-end energy storage cavity 5 are connected to the hot-end fluid circulation pump and the cold-end fluid circulation pump, respectively. The power component is set between the hot-end energy storage cavity 4 and the cold-end energy storage cavity 5. The hot-end energy storage cavity 4 is attached to the heat-conducting plate 2, and the cold-end energy storage cavity 5 is attached to the cold-conducting plate 3.

[0053] The insulation cavity 21 is provided with an insulation layer 22, and the space enclosed by the insulation layer 22 constitutes an insulation zone.

[0054] The evaporator assembly includes a hot-end evaporator 14 and a cold-end evaporator 15 disposed within the insulation cavity 21. One end of the hot-end connecting pipe is connected to a hot-end fluid circulation pump, and the other end of the hot-end connecting pipe extends into the insulation cavity 21 and is connected to the hot-end evaporator 14. One end of the cold-end connecting pipe is connected to a cold-end fluid circulation pump, and the other end of the cold-end connecting pipe extends into the insulation cavity 21 and is connected to the cold-end evaporator 15.

[0055] Furthermore, the semiconductor cooling unit 1 includes a number of semiconductor cooling chips 28 arranged in series and in parallel. The number of semiconductor cooling chips 28 and the series and parallel connection method can be changed according to actual needs.

[0056] In this embodiment, the semiconductor cooling unit 1 has several semiconductor cooling chips 28 arranged in an array, consisting of four vertical rows. Each vertical row has four semiconductor cooling chips 28 connected in series to form an independent cooling branch. The four cooling branches are connected in parallel to form the entire semiconductor cooling unit 1. The series and parallel semiconductor cooling chips in each row and column cooperate with each other to achieve efficient cooling and heating effects, while also ensuring that the normal operation of the entire semiconductor cooling unit is not affected when one of the semiconductor cooling chips fails.

[0057] In this embodiment, the positions where the thermoelectric cooling unit 1 is installed in the heat-conducting plate 2 and the cold-conducting plate 3 have grooves for fixing the thermoelectric cooling unit 1 therein. One side of the heat-conducting plate 2 is attached to the hot end of the thermoelectric cooling unit 1, and the other side is attached to the side wall of the hot end energy storage cavity 4. One side of the cold-conducting plate 3 is attached to the cold end of the thermoelectric cooling unit 1, and the other side is attached to the side wall of the cold end energy storage cavity 5.

[0058] Furthermore, the hot-end fluid circulation pump includes a first diaphragm pump 6 and a second diaphragm pump 7, and the hot-end connection pipeline includes a first connecting pipe 10 and a second connecting pipe 11. The first diaphragm pump 6 is connected to the input end of the hot-end evaporator 14 through the first connecting pipe 10, and the output end of the hot-end evaporator 14 is connected to the second diaphragm pump 7 through the second connecting pipe 11. The cold-end fluid circulation pump includes a third diaphragm pump 8 and a fourth diaphragm pump 9, and the cold-end connection pipeline includes a third connecting pipe 12 and a fourth connecting pipe 13. The third diaphragm pump 8 is connected to the input end of the cold-end evaporator 15 through the third connecting pipe 12, and the output end of the cold-end evaporator 15 is connected to the fourth diaphragm pump 9 through the fourth connecting pipe 13.

[0059] The specific working process of the four diaphragm pumps is as follows: When cooling is required, the third and fourth diaphragm pumps operate. The third diaphragm pump transports the low-temperature energy storage liquid medium in the cold-end energy storage chamber to the cold-end evaporator through the third connecting pipe. The cold-end evaporator absorbs heat from the air in the insulation chamber for cooling. Then, the high-temperature energy storage liquid medium is transported to the fourth diaphragm pump through the fourth connecting pipe. The fourth diaphragm pump introduces the high-temperature energy storage liquid into the cold-end energy storage chamber for cooling, thus achieving circulation. Similarly, when heating is required, the first and second diaphragm pumps operate. The first diaphragm pump transports the high-temperature energy storage liquid medium in the hot-end energy storage chamber to the hot-end evaporator through the second connecting pipe. The hot-end evaporator releases heat to the insulation chamber for heating. Then, the low-temperature energy storage liquid medium is transported to the second diaphragm pump through the second connecting pipe. The second diaphragm pump introduces the low-temperature energy storage liquid into the hot-end energy storage chamber for heating. The hot-end fluid circulation pump and the cold-end fluid circulation pump provide circulation power for the energy storage liquid medium. The energy storage liquid medium achieves cooling and heating functions by continuously circulating in a directional manner and exchanging heat with the air in the insulation cavity.

[0060] Furthermore, the energy storage assembly also includes a first liquid guide plate 19 and a second liquid guide plate 20. The hot-end energy storage cavity 4 is connected to the hot-end fluid circulation pump through the first liquid guide plate 19, and the cold-end energy storage cavity 5 is connected to the cold-end fluid circulation pump through the second liquid guide plate 20.

[0061] The first liquid guide plate 19 has a flow channel inside. One end of the flow channel is connected to the hot-end energy storage cavity 4, and the other end is connected to the hot-end fluid circulation pump. The directional flow of the energy storage liquid medium can be realized through the connected hot-end fluid circulation pump. In this embodiment, the first liquid guide plate 19 has two independent flow channels, which are respectively connected to the first diaphragm pump 6 and the second diaphragm pump 7 to realize the directional circulation flow of the energy storage liquid medium. The internal structure and connection relationship of the second liquid guide plate 20 are similar and will not be described again.

[0062] Furthermore, both the hot-end evaporator 14 and the cold-end evaporator 15 include a copper tube 16, an aluminum heat exchange plate 17, and a fan 18. The aluminum heat exchange plate 17 is attached to the front end of the copper tube 16, and the fan 18 is located at the rear end of the copper tube 16.

[0063] The evaporator is connected to two connecting pipes at both ends to allow the energy storage liquid medium to flow in the evaporator. Aluminum heat exchange fins are used to increase the contact area between the evaporator and the air to improve the heat exchange efficiency with the air. The fan installed on the evaporator will accelerate the heat exchange speed between the evaporator and the air.

[0064] Furthermore, within the insulation cavity 21, insulation layers 22 are provided at its top, bottom, left, right, and center positions, respectively, forming top, bottom, left, right, and center insulation layers. The spaces enclosed by each insulation layer constitute the insulation zone. The center insulation layer 29 divides the insulation cavity into the front insulation zone (see appendix). Figure 2 The central insulation cavity (shown in the image) and the rear cooling and heating circulation area (see attached image). Figure 8 (Partial view of the central insulation cavity). On one side of the cooling and heating circulation zone, the central insulation layer 29 has a protruding structure 23 in its middle position. The cold-end evaporator 15 and the hot-end evaporator 14 are respectively installed on the upper and lower parts of the protruding structure 23. The space formed by the insulation layer and the insulation cavity is divided into the upper cooling circulation zone and the lower heating circulation zone by the central protruding structure 23. In this embodiment, the protruding structure 23 in the middle of the central insulation layer 29 is a heat insulation plate.

[0065] Because hot air rises, the hot-end evaporator is positioned below and the cold-end evaporator above, allowing for better heat dissipation. Simultaneously, the raised structure in the middle of the insulation layer separates the cold-end and hot-end evaporators, creating an upper cooling cycle zone and a lower heating cycle zone. This reduces heat exchange between the two evaporators and improves the overall heat exchange efficiency of the device.

[0066] Furthermore, a plurality of cooling air circulation holes 24 are provided on the upper part of the middle insulation layer 29, and a plurality of heating air circulation holes 25 are provided on the lower part of the middle insulation layer 29. In this embodiment, a plurality of cooling air circulation holes 24 and heating air circulation holes 25 are arranged at equal intervals in the upper and lower halves of the middle insulation layer 29, respectively. The holes are strip-shaped to increase air circulation efficiency.

[0067] In conjunction with the placement of the hot-end and cold-end evaporators, corresponding cooling and heating air circulation vents are installed in the designated areas. This is primarily to precisely control the temperature inside the chamber. Through proper air circulation, the temperature inside the chamber can be evenly distributed, preventing localized overheating or underheating, thus achieving a good constant temperature effect. During cooling, cold air from the cooling circulation zone enters the insulation cavity through the cooling air circulation vents. Because cold air is denser, it naturally sinks, thereby cooling the entire chamber space. During heating, hot air from the heating circulation zone enters the insulation cavity through the heating air circulation vents. Because hot air is less dense, it naturally rises, ensuring even heat distribution within the chamber.

[0068] Furthermore, the conductor cooling unit, the hot-end fluid circulation pump, and the cold-end fluid circulation pump are all connected to an external power source via lead-out wires. In this embodiment, the conductor cooling unit is composed of a 4×4 semiconductor refrigeration chip matrix connected in series and parallel, and is connected to an external power source via several semiconductor refrigeration chip lead-out wires to introduce external DC power into the semiconductor refrigeration chips. The four diaphragm pumps used in this embodiment each have a diaphragm pump lead-out wire 27 connected to an external power source for power supply.

[0069] Furthermore, the insulation cavity 21 can be made of high-temperature resistant plastic or metal materials, such as aluminum or stainless steel, and the insulation layer can be made of foam with good thermal insulation properties.

[0070] Furthermore, the heat-conducting plate 2 and the cold-conducting plate 3 can be made of materials with good thermal conductivity, such as copper plates; the energy storage liquid medium can be pure water.

[0071] The specific working process of the constant temperature chamber in this embodiment, which achieves efficient temperature control through energy storage, is as follows:

[0072] 1) During the cooling process, when the temperature of the insulation cavity is higher than the preset temperature, cooling is required. The cold-end energy storage component starts to work, and the energy storage liquid medium in the cold-end energy storage cavity is cooled down. The third diaphragm pump provides directional circulation power, so that the low-temperature energy storage liquid medium is transported to the cold-end evaporator in sequence through the second liquid guide plate, the third diaphragm pump, and the third connecting pipe. It absorbs heat from the air in the insulation cavity to cool down. Then, the fourth diaphragm pump provides directional circulation power, so that the high-temperature energy storage liquid medium passes through the fourth connecting pipe, the fourth diaphragm pump, and the second liquid guide plate in sequence, and finally returns to the cold-end energy storage cavity to cool down. The circulation of the energy storage liquid medium achieves cooling.

[0073] 2) During the cooling process, when the semiconductor cooling unit is working, the unused energy at the hot end is collected through the energy storage liquid medium stored in the hot end energy storage cavity, and the energy storage liquid medium is heated.

[0074] 3) The cooling process transitions to heating. When the temperature of the insulation cavity drops below the preset temperature, heating is required. The hot-end energy storage component starts working. The high-temperature energy storage liquid medium stored in the hot-end energy storage cavity is provided with directional circulation power by the first diaphragm pump. It is then transported to the hot-end evaporator through the first liquid guide plate, the first diaphragm pump, and the first connecting pipe in sequence, releasing heat in the insulation cavity to achieve rapid heating. Then, the second diaphragm pump provides directional circulation power, causing the low-temperature energy storage liquid medium to pass through the second connecting pipe, the second diaphragm pump, and the first liquid guide plate in sequence, and finally return to the hot-end energy storage cavity for heating. The circulation of the energy storage liquid medium achieves heating.

[0075] 4) Similarly, during the heating process, the unused energy at the cold end is stored in the cold end energy storage cavity and used when cooling is required.

[0076] In summary, this invention, during alternating hot and cold temperature control, collects unused heat from the hot or cold ends of the semiconductor refrigeration unit through an added energy storage component. When heating or cooling is needed, the stored heat can be quickly used to exchange heat with the insulation cavity to control the temperature. This invention can improve the energy utilization efficiency during alternating hot and cold temperature control, and the pre-stored heat also increases the speed of alternating hot and cold temperature control.

[0077] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A constant temperature chamber with energy storage function, characterized in that: It includes a power component, an energy storage component, an evaporator component, and an insulation cavity. The power component is adjacent to the energy storage component, the energy storage component is connected to the evaporator, and the evaporator is disposed inside the insulation cavity. The power component includes a semiconductor cooling unit, a heat-conducting plate, and a cold-conducting plate. The heat-conducting plate and the cold-conducting plate are respectively attached to the cold end and the hot end of the semiconductor cooling unit. The semiconductor cooling unit is fixed in the groove position between the heat-conducting plate and the cold-conducting plate. The energy storage component is divided into a hot-end energy storage component and a cold-end energy storage component. The hot-end energy storage component includes a hot-end energy storage cavity, a hot-end fluid circulation pump, and a hot-end connecting pipeline. The cold-end energy storage component includes a cold-end energy storage cavity, a cold-end fluid circulation pump, and a cold-end connecting pipeline. Both the hot-end and cold-end energy storage cavities are filled with an energy storage liquid medium. The hot-end and cold-end energy storage cavities are respectively connected to the hot-end fluid circulation pump and the cold-end fluid circulation pump. The power component is disposed between the hot-end and cold-end energy storage cavities. The hot-end energy storage cavity is attached to the heat-conducting plate, and the cold-end energy storage cavity is attached to the cold-conducting plate. The insulation cavity is provided with an insulation layer inside, and the space enclosed by the insulation layer constitutes an insulation zone; The evaporator assembly includes a hot-end evaporator and a cold-end evaporator disposed within an insulated cavity. One end of the hot-end connecting pipe is connected to the hot-end fluid circulation pump, and the other end of the hot-end connecting pipe extends into the insulated cavity and connects to the hot-end evaporator. One end of the cold-end connecting pipe is connected to the cold-end fluid circulation pump, and the other end of the cold-end connecting pipe extends into the insulated cavity and connects to the cold-end evaporator.

2. A constant temperature chamber with energy storage function according to claim 1, characterized in that: The semiconductor cooling unit includes a number of semiconductor cooling chips arranged in series and in parallel. The number of semiconductor cooling chips and the series and parallel connection method can be changed.

3. A constant temperature chamber with energy storage function according to claim 1, characterized in that: The hot-end fluid circulation pump includes a first diaphragm pump and a second diaphragm pump. The hot-end connection pipeline includes a first connecting pipe and a second connecting pipe. The first diaphragm pump is connected to the input end of the hot-end evaporator through the first connecting pipe, and the output end of the hot-end evaporator is connected to the second diaphragm pump through the second connecting pipe. The cold-end fluid circulation pump includes a third diaphragm pump and a fourth diaphragm pump. The cold-end connection pipeline includes a third connecting pipe and a fourth connecting pipe. The third diaphragm pump is connected to the input end of the cold-end evaporator through the third connecting pipe, and the output end of the cold-end evaporator is connected to the fourth diaphragm pump through the fourth connecting pipe.

4. A constant temperature chamber with energy storage function according to claim 3, characterized in that: The energy storage component further includes a first liquid guide plate and a second liquid guide plate. The hot-end energy storage cavity is connected to the hot-end fluid circulation pump through the first liquid guide plate, and the cold-end energy storage cavity is connected to the cold-end fluid circulation pump through the second liquid guide plate.

5. A constant temperature chamber with energy storage function according to claim 1, characterized in that: Both the hot-end evaporator and the cold-end evaporator include copper tubes, aluminum heat exchange plates, and a fan. The aluminum heat exchange plates are attached to the front end of the copper tubes, and the fan is located at the rear end of the copper tubes.

6. A constant temperature chamber with energy storage function according to claim 1, characterized in that: A protruding structure is provided in the middle of one side of the insulation layer. The cold end evaporator and the hot end evaporator are respectively installed on the upper and lower parts of the protruding structure. The protruding structure divides the space formed by the insulation layer and the insulation cavity into an upper refrigeration circulation zone and a lower heating circulation zone.

7. A constant temperature chamber with energy storage function according to claim 6, characterized in that: Several cooling air circulation holes are provided on the upper part of the insulation layer, and several heating air circulation holes are provided on the lower part of the insulation layer.

8. A constant temperature chamber with energy storage function according to claim 1, characterized in that: The semiconductor cooling unit, the hot-end fluid circulation pump, and the cold-end fluid circulation pump are all connected to an external power source via lead wires.

9. A constant temperature chamber with energy storage function according to claim 1, characterized in that: The insulated cavity is made of aluminum or stainless steel, and the insulation layer is made of foam material.

10. A constant temperature chamber with energy storage function according to claim 1, characterized in that: The heat-conducting plate and the cold-conducting plate are made of copper plate material, and the energy storage liquid medium is pure water.

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