Novel water-seepage-resistant single-beam depth finder

Abstract

The utility model discloses a novel water-seepage-resistant single-beam depth finder, which relates to the technical field of sonar measurement equipment and comprises a microcontroller circuit, a microcontroller power supply circuit, a receiving module isolation power supply circuit, a receiving module circuit, an ultrasonic transducer driving circuit, an ultrasonic transducer driving power supply circuit and a digital analog power supply circuit. The microcontroller circuit is sequentially connected with the microcontroller power supply circuit, the receiving module circuit, the ultrasonic transducer driving circuit and the digital analog power supply circuit; the receiving module isolation power supply circuit is connected with the receiving module circuit, and the ultrasonic transducer driving power supply circuit is connected with the ultrasonic transducer driving circuit. The water-seepage-resistant single-beam depth finder provided by the utility model has the advantages of high reliability, high integration level and low cost, and solves the technical problem that the transducer is easy to damage when exposed in the air.

Description

Technical Field

[0001] This utility model relates to the field of sonar measurement equipment technology, specifically to a novel water-resistant single-beam depth sounder. Background Technology

[0002] Marine altimeters, primarily single-beam echo sounders, are mainly used for depth measurement in their respective sea areas, laying a solid foundation for marine exploration and development. Depth measurement is also crucial for ship navigation, ensuring safety and optimizing route selection. Accurate depth measurement information allows navigators to better understand seabed topography, effectively avoiding potential marine obstacles.

[0003] Existing single-beam echo sounders, such as the Chinese patent CN204666812U which discloses a novel single-beam echo sounder, include a transducer, a transmitting device, a receiving device, a microcontroller, a display device, an external storage device, and a power conversion device, to achieve high-precision hydrological measurements in shallow water.

[0004] However, existing single-beam depth sounders still have the following shortcomings: due to the long-term immersion of the wet end of the relevant sensors in seawater, they are affected by seawater penetration, resulting in short service life, easy aging, damage when the instrument is turned on in the air, minimum measurable depth ≥1 meter, measurement accuracy ≥0.2%, low integration, and no warning settings in the display window.

[0005] No effective solutions have yet been proposed to address the problems in the relevant technologies. Utility Model Content

[0006] In view of the problems in related technologies, this utility model proposes a novel water-resistant single-beam depth sounder to overcome the above-mentioned technical problems existing in the existing related technologies.

[0007] Therefore, the specific technical solution adopted by this utility model is as follows:

[0008] A novel water-resistant single-beam depth sounder includes a microcontroller (MCU) module, a microcontroller power supply circuit, a receiver module isolation power supply circuit, a receiver module circuit, an ultrasonic transducer drive circuit, an ultrasonic transducer drive power supply circuit, and a digital-analog power supply circuit. The microcontroller circuit is sequentially connected to the microcontroller power supply circuit, the receiver module circuit, the ultrasonic transducer drive circuit, and the digital-analog power supply circuit. The receiver module isolation power supply circuit is connected to the receiver module circuit, and the ultrasonic transducer drive power supply circuit is connected to the ultrasonic transducer drive circuit.

[0009] Furthermore, the microcontroller circuit includes chip U18, capacitor C8, and capacitor C22; wherein, the seventh terminal of chip U18 is connected to one end of capacitor C8, the other end of capacitor C8 is connected to the eleventh terminal of chip U18, and the first terminal of chip U18 is connected to capacitor C22.

[0010] Furthermore, the microcontroller power supply circuit includes chip U20, capacitor C20, capacitor C21, capacitor C13, capacitor C14, resistor R22, and LED1. The first terminal of chip U20 is sequentially connected to one end of capacitor C21, one end of capacitor C20, one end of capacitor C13, one end of capacitor C14, and the negative terminal of LED1. The third terminal of chip U20 is sequentially connected to the other ends of capacitor C21 and C20. The second terminal of chip U20 is sequentially connected to the fourth terminal of chip U20, the other end of capacitor C13, the other end of capacitor C14, and one end of resistor R22. The other end of resistor R22 is connected to the positive terminal of LED1.

[0011] Furthermore, the receiving module isolation power supply circuit includes chip U16, capacitor C51, inductor L5, capacitor C52, capacitor C54, and capacitor C53; wherein, the first terminal of chip U16 is connected to one end of capacitor C52 and one end of inductor L5 in sequence, the other end of inductor L5 is connected to one end of capacitor C51, the other end of capacitor C51 is connected to the other end of capacitor C52, the second terminal of chip U16 is connected to one end of capacitor C54, the other end of capacitor C54 is connected to the fourth terminal of chip U16, and the sixth terminal of chip U16 is connected to capacitor C53.

[0012] Furthermore, the receiving module circuit includes operational amplifier U5, connector H1, resistors R2, R3, and R1, capacitors C5, R19, C6, C2, C3, and C4, resistors R56, RF1, RF2, C55, C56, and C57, operational amplifier U17, capacitor C12, resistors R18, R57, and R7, operational amplifier U8, resistor R12, chip U2, capacitors C58, C59, and C60, operational amplifier U14, resistors R13 and R45, and capacitor C4. 3. Capacitors C61, C62, and C63; The third terminal of operational amplifier U5 is connected to resistor R3. The second terminal of operational amplifier U5 is connected sequentially to one end of resistor R2, one end of resistor R1, and one end of capacitor C5. The other end of resistor R2 is connected to the first terminal of connector H1. The sixth terminal of operational amplifier U5 is connected sequentially to the other end of resistor R1, the other end of capacitor C5, and one end of resistor R19. The other end of resistor R19 is connected to one end of capacitor C6. The other end of capacitor C6 is connected sequentially to the second terminal of operational amplifier U17, one end of resistor R18, and capacitor C12. One end of resistor R18 is connected to the first end of resistor RF2. The second end of resistor RF2 is connected in sequence to the other end of capacitor C12, the sixth terminal of operational amplifier U17, and one end of resistor R57. The other end of resistor R57 is connected to one end of resistor R7. The other end of resistor R7 is connected in sequence to the second terminal of operational amplifier U8 and the third terminal of chip U2. The sixth terminal of operational amplifier U8 is connected to one end of resistor R12. The other end of resistor R12 is connected to the first terminal of chip U2. The fifth terminal of chip U2 is connected to the third terminal of operational amplifier U14. The sixth terminal of chip U2... The second terminal of operational amplifier U14 and resistor R13 are connected in sequence. The other end of resistor R13 is connected in sequence to the sixth terminal of operational amplifier U14 and one end of resistor R45. The other end of resistor R45 is connected to capacitor C43. Capacitors C2, C3, and C4 are connected in parallel. Capacitors C55, C56, and C57 are connected in parallel. Capacitors C58, C59, and C60 are connected in parallel. Capacitors C61, C62, and C63 are connected in parallel. Resistor R56 and resistor RF1 are connected in series.

[0013] Furthermore, the ultrasonic transducer drive circuit includes chip U23, capacitor C39, resistor R41, resistor R42, diode D7, diode D8, diode D3, resistor R36, resistor R35, MOSFET M1, MOSFET M2, capacitor C40, chip U24, capacitor C41, resistor R43, resistor R44, diode D4, diode D5, diode D6, resistor R37, resistor R38, MOSFET M3, MOSFET M4, capacitor C42, LED5, LED6, resistor R39, resistor R40, transformer U10, resistor R111, inductor L10, capacitor C111, and capacitor C112; wherein, the second terminal of chip U23 is connected to resistor R41, and chip U2... The third terminal of chip 3 is connected to resistor R42. The first segment of chip U23 is connected sequentially to capacitor C39 and the anode of diode D7. The cathode of diode D7 is connected sequentially to the eighth terminal of chip U23 and one end of capacitor C40. The seventh terminal of chip U23 is connected sequentially to the cathode of diode D8 and one end of resistor R36. The anode of diode D8 is connected sequentially to the other end of resistor R36 and the first terminal of MOSFET M1. The third terminal of MOSFET M1 is connected sequentially to the sixth terminal of chip U23, the second terminal of MOSFET M2, the other end of capacitor C40, the anode of LED5, the cathode of LED6, and the first terminal of transformer U10. The fifth terminal of chip U23 is connected sequentially to the cathode of diode D3 and one end of resistor R35. The positive terminal of transistor D3 is connected in sequence to the other end of resistor R35 and the first terminal of MOSFET M2; the second terminal of chip U24 is connected to resistor R43, the third terminal of chip U24 is connected to resistor R44, the first terminal of chip U24 is connected in sequence to capacitor C41 and the positive terminal of diode D4, the negative terminal of diode D4 is connected in sequence to the eighth terminal of chip U24 and one end of capacitor C42, the seventh terminal of chip U24 is connected in sequence to the negative terminal of diode D6 and one end of resistor R38, the positive terminal of diode D6 is connected in sequence to the other end of resistor R38 and the first terminal of MOSFET M3, and the third terminal of MOSFET M3 is connected in sequence to the sixth terminal of chip U24, the second terminal of MOSFET M4, the other end of capacitor C42, and resistor R39. One end of resistor R40 is connected to the second end of transformer U10. The other end of resistor R39 is connected to the negative terminal of LED5. The other end of resistor R40 is connected to the positive terminal of LED6. The fifth end of chip U24 is connected to the negative terminal of diode D5 and one end of resistor R37 in sequence. The positive terminal of diode D5 is connected to the other end of resistor R37 and the first end of MOSFET M4 in sequence. The third end of transformer U10 is connected to one end of capacitor C111 and one end of capacitor C112 in sequence. The other end of capacitor C112 is connected to the fourth end of transformer U10 and one end of resistor R111 in sequence. The other end of resistor R111 is connected to one end of inductor L10. The other end of inductor L10 is connected to the other end of capacitor C111.

[0014] Furthermore, the ultrasonic transducer drive power supply circuit includes connector H4, capacitors C27 and C28, resistors R29 and C25, chip U21, diode D1, inductor L3, capacitors C26 and C30, resistors R31, C29, C31, resistor R55, fuse resistor PR2, resistor R30, resistor R54, and LED8. The first end of connector H4 is sequentially connected to one end of capacitor C27, one end of capacitor C28, the second end of chip U21, and the third end of chip U21. The second end of connector H4 is sequentially connected to the other end of capacitor C27, the other end of capacitor C28, and one end of resistor R29. The other end of resistor R29 is connected to the fourth end of chip U21. The first end of chip U21 is connected to one end of capacitor C25. The other end of C25 is connected in sequence to the eighth terminal of chip U21, the negative terminal of diode D1, and one end of inductor L3. The seventh terminal of chip U21 is connected in sequence to the positive terminal of diode D1, one end of capacitor C26, and one end of capacitor C30. The other end of inductor L3 is connected in sequence to the other end of capacitor C26, the other end of capacitor C30, one end of resistor R55, and one end of resistor R54. Fuse resistor PR2 is connected in parallel with resistor R55. The other end of resistor R54 is connected to LED8. The other end of resistor R55 is connected in sequence to resistor R30 and the fifth terminal of chip U21. The sixth terminal of chip U21 is connected in sequence to one end of resistor R31 and one end of capacitor C29. The other end of capacitor C29 is connected to one end of capacitor C31. The other end of capacitor C31 is connected to the other end of resistor R31.

[0015] Furthermore, the digital-analog power supply circuit includes chip U25, capacitors C46 and C47, resistors R49 and C44, diode D9, inductor L6, capacitors C45 and C49, resistors R51, C48, C50, R52, R53, and LED7. The second and third terminals of chip U25 are connected sequentially to one end of capacitor C47 and one end of capacitor C46. The other end of capacitor C46 is sequentially connected to the other end of capacitor C47 and one end of resistor R49. The other end of resistor R49 is connected to the fourth terminal of chip U25. The first terminal of chip U25 is connected to one end of capacitor C44. The other end of capacitor C44 is sequentially connected to the chip... The eighth terminal of chip U25, the negative terminal of diode D9, and one end of inductor L6 are connected. The seventh terminal of chip U25 is connected in sequence to the positive terminal of diode D9, one end of capacitor C45, and one end of capacitor C49. The other end of inductor L6 is connected in sequence to the other end of capacitor C45, the other end of capacitor C49, one end of resistor R52, and one end of resistor R53. The other end of resistor R53 is connected to LED7. The other end of resistor R52 is connected in sequence to resistor R50 and the fifth terminal of chip U25. The sixth terminal of chip U25 is connected in sequence to resistor R51 and one end of capacitor C48. The other end of capacitor C48 is connected to one end of capacitor C50. The other end of capacitor C50 is connected to the other end of resistor R51.

[0016] The beneficial effects of this utility model are as follows:

[0017] This novel water-resistant single-beam depth sounder boasts advantages such as water resistance, a large beam angle and wide detection range, high distance resolution, and adjustable warning thresholds. It also exhibits high reliability, remaining undamaged even when operating in air. Furthermore, this new water-resistant single-beam depth sounder features high integration, low cost, a minimum measurable depth of 1 meter, a measurement accuracy of 0.5%, and a data output interface for direct data transmission via string, reducing operating costs. To enhance transducer reliability, compared to traditional piezoelectric ceramic transducers, this invention employs a sandwich-type transducer array design, addressing the technical challenge of transducer damage when exposed to air. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1This is a block diagram of a novel water-resistant single-beam depth sounder according to an embodiment of the present utility model;

[0020] Figure 2 This is a schematic diagram of a microcontroller circuit according to an embodiment of the present utility model;

[0021] Figure 3 This is a schematic diagram of a microcontroller power supply circuit according to an embodiment of the present invention;

[0022] Figure 4 This is a schematic diagram of the isolated power supply circuit of the receiving module according to an embodiment of the present utility model;

[0023] Figure 5 This is one of the schematic diagrams of the receiving module circuit according to an embodiment of the present utility model;

[0024] Figure 6 This is a second schematic diagram of the receiving module circuit according to an embodiment of the present utility model;

[0025] Figure 7 This is the third schematic diagram of the receiving module circuit according to an embodiment of the present utility model;

[0026] Figure 8 This is one of the schematic diagrams of the ultrasonic transducer drive circuit according to an embodiment of the present utility model;

[0027] Figure 9 This is the second schematic diagram of the ultrasonic transducer drive circuit according to an embodiment of the present utility model;

[0028] Figure 10 This is one of the schematic diagrams of the ultrasonic transducer drive power supply circuit according to an embodiment of the present utility model;

[0029] Figure 11 This is the second schematic diagram of the ultrasonic transducer drive power supply circuit according to an embodiment of the present utility model.

[0030] Figure 12 This is a schematic diagram of a digital analog power supply circuit according to an embodiment of the present utility model;

[0031] Figure 13 This is a schematic diagram of a crystal oscillator circuit according to an embodiment of the present invention;

[0032] Figure 14 This is a circuit schematic diagram of the serial port + BSL (bootloader) download module according to an embodiment of the present utility model;

[0033] Figure 15 This is a circuit schematic diagram of the JTAG (interface standard) interface according to an embodiment of the present invention;

[0034] Figure 16This is a circuit diagram of the USB interface and debugging power switch according to an embodiment of the present utility model;

[0035] Figure 17 This is a circuit diagram of the button module according to an embodiment of the present utility model;

[0036] Figure 18 This is a circuit diagram of an LED module according to an embodiment of the present utility model;

[0037] Figure 19 This is a schematic diagram of the reset circuit according to an embodiment of the present utility model;

[0038] Figure 20 This is a circuit diagram of an analog power supply according to an embodiment of the present invention;

[0039] Figure 21 This is a circuit schematic diagram of the ADC (Analog-to-Digital Converter) acquisition module according to an embodiment of the present invention;

[0040] Figure 22 This is a complete system working block diagram of a novel water-resistant single-beam depth sounder according to an embodiment of the present utility model.

[0041] In the picture:

[0042] 1. Microcontroller circuit; 2. Microcontroller power supply circuit; 3. Receiver module isolation power supply circuit; 4. Receiver module circuit; 5. Ultrasonic transducer drive circuit; 6. Ultrasonic transducer drive power supply circuit; 7. Digital-analog power supply circuit. Detailed Implementation

[0043] To further illustrate the various embodiments, the present invention provides accompanying drawings, which are part of the disclosure of the present invention. These drawings are mainly used to illustrate the embodiments and can be used in conjunction with the relevant descriptions in the specification to explain the operating principles of the embodiments. With reference to these contents, those skilled in the art should be able to understand other possible implementation methods and the advantages of the present invention. The components in the figures are not drawn to scale, and similar component symbols are usually used to represent similar components.

[0044] According to an embodiment of the present invention, a novel water-resistant single-beam depth sounder is provided.

[0045] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments, such as... Figure 1As shown, the novel water-resistant single-beam depth sounder according to an embodiment of this utility model includes a microcontroller circuit 1, a microcontroller power supply circuit 2, a receiving module isolation power supply circuit 3, a receiving module circuit 4, an ultrasonic transducer drive circuit 5, an ultrasonic transducer drive power supply circuit 6, and a digital-analog power supply circuit 7; wherein, the microcontroller circuit 1 is sequentially connected to the microcontroller power supply circuit 2, the receiving module circuit 4, the ultrasonic transducer drive circuit 5, and the digital-analog power supply circuit 7; the receiving module isolation power supply circuit 3 is connected to the receiving module circuit 4, and the ultrasonic transducer drive power supply circuit 6 is connected to the ultrasonic transducer drive circuit 5.

[0046] With the help of the above solution, the novel water-resistant single-beam depth sounder of this utility model has the advantages of water resistance; large beam angle and wide detection range; high distance resolution and the ability to set early warning thresholds; and high reliability, and will not be damaged when working in air.

[0047] like Figure 2 As shown, in one embodiment, for the microcontroller circuit 1 described above, the microcontroller circuit 1 includes a chip U18, a capacitor C8, and a capacitor C22; wherein, the seventh terminal of the chip U18 is connected to one end of the capacitor C8, the other end of the capacitor C8 is connected to the eleventh terminal of the chip U18, and the first terminal of the chip U18 is connected to the capacitor C22.

[0048] Microcontroller circuit 1 (MCU module) controls the transmitting and receiving circuits, and the set electrical parameters are matched by the transmitting circuit to generate mechanical wave electrical signals that can drive the transducer to work.

[0049] like Figure 3 As shown, in one embodiment, the microcontroller power supply circuit 2 includes a chip U20, capacitors C20, C21, C13, C14, a resistor R22, and an LED1. The first terminal of chip U20 is sequentially connected to one end of capacitor C21, one end of capacitor C20, one end of capacitor C13, one end of capacitor C14, and the negative terminal of LED1. The third terminal of chip U20 is sequentially connected to the other ends of capacitors C21 and C20. The second terminal of chip U20 is sequentially connected to the fourth terminal of chip U20, the other end of capacitor C13, the other end of capacitor C14, and one end of resistor R22. The other end of resistor R22 is connected to the positive terminal of LED1.

[0050] like Figure 4As shown, in one embodiment, the receiving module isolation power supply circuit 3 includes a chip U16, a capacitor C51, an inductor L5, a capacitor C52, a capacitor C54, and a capacitor C53. The first terminal of the chip U16 is sequentially connected to one end of the capacitor C52 and one end of the inductor L5. The other end of the inductor L5 is connected to one end of the capacitor C51. The other end of the capacitor C51 is connected to the other end of the capacitor C52. The second terminal of the chip U16 is connected to one end of the capacitor C54. The other end of the capacitor C54 is connected to the fourth terminal of the chip U16. The sixth terminal of the chip U16 is connected to the capacitor C53.

[0051] The receiver module isolation power supply circuit 3 provides isolated power to the receiver module circuit 4 to prevent interference. An isolated DC-DC module (such as B0505S) is used to achieve electrical isolation between power supply and signal.

[0052] like Figures 5-7As shown, in one embodiment, the receiving module circuit 4 includes operational amplifier U5, connector H1, resistors R2, R3, R1, capacitor C5, R19, C6, C2, C3, C4, R56, RF1, RF2, C55, C56, C57, operational amplifier U17, capacitor C12, resistors R18, R57, R7, operational amplifier U8, resistor R12, chip U2, capacitors C58, C59, C60, operational amplifier U14, and capacitors... Resistor R13, resistor R45, capacitor C43, capacitor C61, capacitor C62, and capacitor C63; wherein, the third terminal of operational amplifier U5 is connected to resistor R3, the second terminal of operational amplifier U5 is connected in sequence to one end of resistor R2, one end of resistor R1, and one end of capacitor C5, the other end of resistor R2 is connected to the first terminal of connector H1, the sixth terminal of operational amplifier U5 is connected in sequence to the other end of resistor R1, the other end of capacitor C5, and one end of resistor R19, the other end of resistor R19 is connected to one end of capacitor C6, and the other end of capacitor C6 is connected in sequence to the second terminal of operational amplifier U17, resistor R1, and resistor R45. One end of resistor R8 is connected to one end of capacitor C12. The other end of resistor R18 is connected to the first end of resistor RF2. The second end of resistor RF2 is connected in sequence to the other end of capacitor C12, the sixth end of op-amp U17, and one end of resistor R57. The other end of resistor R57 is connected to one end of resistor R7. The other end of resistor R7 is connected in sequence to the second end of op-amp U8 and the third end of chip U2. The sixth end of op-amp U8 is connected to one end of resistor R12. The other end of resistor R12 is connected to the first end of chip U2. The fifth end of chip U2 is connected to the third end of op-amp U14. The sixth terminal of 2 is connected in sequence to the second terminal of operational amplifier U14 and resistor R13. The other end of resistor R13 is connected in sequence to the sixth terminal of operational amplifier U14 and one end of resistor R45. The other end of resistor R45 is connected to capacitor C43. Capacitors C2, C3, and C4 are connected in parallel. Capacitors C55, C56, and C57 are connected in parallel. Capacitors C58, C59, and C60 are connected in parallel. Capacitors C61, C62, and C63 are connected in parallel. Resistor R56 and resistor RF1 are connected in series.

[0053] Receiver module circuit 4 (isolated type) is used to receive ultrasonic signals and perform signal processing. Isolation devices such as optocouplers are used to ensure that the receiving circuit is isolated from other circuits, preventing noise interference.

[0054] like Figures 8-9As shown, in one embodiment, the ultrasonic transducer driving circuit 5 includes chip U23, capacitor C39, resistor R41, resistor R42, diode D7, diode D8, diode D3, resistor R36, resistor R35, MOSFET M1, MOSFET M2, capacitor C40, chip U24, capacitor C41, resistor R43, resistor R44, diode D4, diode D5, diode D6, resistor R37, resistor R38, MOSFET M3, MOSFET M4, capacitor C42, LED5, LED6, resistor R39, resistor R40, transformer U10, and resistor R1. 11. Inductor L10, capacitors C111 and C112; wherein, the second terminal of chip U23 is connected to resistor R41, the third terminal of chip U23 is connected to resistor R42, the first segment of chip U23 is connected sequentially to capacitor C39 and the positive terminal of diode D7, the negative terminal of diode D7 is connected sequentially to the eighth terminal of chip U23 and one end of capacitor C40, the seventh terminal of chip U23 is connected sequentially to the negative terminal of diode D8 and one end of resistor R36, the positive terminal of diode D8 is connected sequentially to the other end of resistor R36 and the first terminal of MOSFET M1, the third terminal of MOSFET M1 is connected sequentially to the sixth terminal of chip U23, the second terminal of MOSFET M2, and the capacitor C40. The other end of capacitor C40, the positive terminal of LED5, the negative terminal of LED6, and the first end of transformer U10 are connected. The fifth terminal of chip U23 is connected in sequence to the negative terminal of diode D3 and one end of resistor R35. The positive terminal of diode D3 is connected in sequence to the other end of resistor R35 and the first end of MOSFET M2. The second terminal of chip U24 is connected to resistor R43. The third terminal of chip U24 is connected to resistor R44. The first terminal of chip U24 is connected in sequence to capacitor C41 and the positive terminal of diode D4. The negative terminal of diode D4 is connected in sequence to the eighth terminal of chip U24 and one end of capacitor C42. The seventh terminal of chip U24 is connected in sequence to the negative terminal of diode D6 and resistor R42. One end of R38 is connected, the positive terminal of diode D6 is connected in sequence to the other end of resistor R38 and the first end of MOSFET M3, the third end of MOSFET M3 is connected in sequence to the sixth end of chip U24, the second end of MOSFET M4, the other end of capacitor C42, one end of resistor R39, one end of resistor R40 and the second end of transformer U10, the other end of resistor R39 is connected to the negative terminal of LED5, the other end of resistor R40 is connected to the positive terminal of LED6, the fifth end of chip U24 is connected in sequence to the negative terminal of diode D5 and one end of resistor R37, and the positive terminal of diode D5 is connected in sequence to the other end of resistor R37 and the first end of MOSFET M4;The third terminal of transformer U10 is connected in sequence to one end of capacitor C111 and one end of capacitor C112. The other end of capacitor C112 is connected in sequence to the fourth terminal of transformer U10 and one end of resistor R111. The other end of resistor R111 is connected to one end of inductor L10. The other end of inductor L10 is connected to the other end of capacitor C111.

[0055] The ultrasonic transducer drive circuit 5 is used to drive the ultrasonic transducer to transmit signals. A driver chip (such as EG3112) is used for high-voltage or high-current driving, converting the input signal into a high-frequency oscillation voltage that drives the ultrasonic transducer.

[0056] like Figures 10-11 As shown, in one embodiment, the ultrasonic transducer drive power supply circuit 6 includes a connector H4, capacitors C27 and C28, resistors R29 and C25, a chip U21, a diode D1, an inductor L3, capacitors C26 and C30, resistors R31, C29, C31, R55, a fuse resistor PR2, resistors R30 and R54, and an LED 8. The first end of connector H4 is sequentially connected to one end of capacitor C27, one end of capacitor C28, the second end of chip U21, and the third end of chip U21. The second end of connector H4 is sequentially connected to the other end of capacitor C27, the other end of capacitor C28, and one end of resistor R29. The other end of resistor R29 is connected to the fourth end of chip U21. The first end of chip U21 is connected to... One end of capacitor C25 is connected to the circuit. The other end of capacitor C25 is connected in sequence to the eighth terminal of chip U21, the negative terminal of diode D1, and one end of inductor L3. The seventh terminal of chip U21 is connected in sequence to the positive terminal of diode D1, one end of capacitor C26, and one end of capacitor C30. The other end of inductor L3 is connected in sequence to the other end of capacitor C26, the other end of capacitor C30, one end of resistor R55, and one end of resistor R54. Fuse resistor PR2 is connected in parallel with resistor R55. The other end of resistor R54 is connected to LED8. The other end of resistor R55 is connected in sequence to resistor R30 and the fifth terminal of chip U21. The sixth terminal of chip U21 is connected in sequence to one end of resistor R31 and one end of capacitor C29. The other end of capacitor C29 is connected to one end of capacitor C31. The other end of capacitor C31 is connected to the other end of resistor R31.

[0057] The ultrasonic transducer drive power supply circuit 6 provides a +20V power supply to drive the ultrasonic transducer. A DC-DC converter (such as the TPS54360) boosts the input voltage to a stable +20V.

[0058] like Figure 12As shown, in one embodiment, the digital-analog power supply circuit 7 includes a chip U25, capacitors C46 and C47, resistors R49 and C44, a diode D9, an inductor L6, capacitors C45 and C49, resistors R51, C48, C50, R52, R53, and an LED 7. The second and third terminals of chip U25 are sequentially connected to one end of capacitor C47 and one end of capacitor C46. The other end of capacitor C46 is sequentially connected to the other end of capacitor C47 and one end of resistor R49. The other end of resistor R49 is connected to the fourth terminal of chip U25. The first terminal of chip U25 is connected to one end of capacitor C44. The other end of C44 is connected in sequence to the eighth terminal of chip U25, the negative terminal of diode D9, and one end of inductor L6. The seventh terminal of chip U25 is connected in sequence to the positive terminal of diode D9, one end of capacitor C45, and one end of capacitor C49. The other end of inductor L6 is connected in sequence to the other end of capacitor C45, the other end of capacitor C49, one end of resistor R52, and one end of resistor R53. The other end of resistor R53 is connected to LED7. The other end of resistor R52 is connected in sequence to resistor R50 and the fifth terminal of chip U25. The sixth terminal of chip U25 is connected in sequence to resistor R51 and one end of capacitor C48. The other end of capacitor C48 is connected to one end of capacitor C50. The other end of capacitor C50 is connected to the other end of resistor R51.

[0059] The digital-analog power supply circuit 7 provides a +5V power supply to both digital and analog circuits. A voltage regulator circuit (such as TPS54360) steps the input voltage down to +5V to provide a stable power supply.

[0060] also, Figure 5 line segment ① and Figure 6 Connect line segment ① in the middle. Figure 6 Line segments ② and ③ in the diagram are respectively with Figure 7 Connect line segments ② and ③ in the diagram; Figure 8 Line segments ④ and ⑤ in the diagram are respectively with Figure 9 Connect line segments ④ and ⑤ in the diagram; Figure 10 Line segments ⑥ and ⑦ in the diagram are respectively with Figure 11 Connect line segments ⑥ and ⑦ in the diagram.

[0061] like Figures 12-21 As shown, this utility model also provides schematic diagrams of a crystal oscillator circuit, a serial port + BSL download module, a JTAG interface, a USB interface, a debug power switch, a button module, an LED module, a reset circuit, an analog power supply, and an ADC acquisition module.

[0062] The crystal oscillator circuit includes capacitors C15, C16, C17, and C7, as well as crystal X1 and crystal X2. The function of the crystal oscillator circuit is to generate a stable frequency signal using the piezoelectric effect of a quartz crystal. The physical properties of a crystal allow it to oscillate at a fixed frequency under certain conditions. This frequency is typically very stable and unaffected by temperature, humidity, and voltage fluctuations. Therefore, crystal oscillator circuits are widely used in applications requiring precise frequency control.

[0063] The serial port + BSL download module includes chip U19, capacitor C18, and connector H2. The RST pin of connector H2 is connected to the DTR pin of chip U19, the TCK pin of connector H2 is connected to the RTS pin of chip U19, the BSL_R pin of connector H2 is connected to the CH340_TXD pin of chip U19, and the BSL_T pin of connector H2 is connected to the CH340_RXD pin of chip U19. The serial port + BSL download module is used for program download and debugging. It uses the CH340 chip to convert between serial and USB interfaces and uses BSL (Boot Strap Loader) mode to short-circuit specific pins for fast firmware loading. The serial port download module's function is to transmit serial signals.

[0064] The JTAG interface, also known as CN1, is used for debugging and programming the MCU. The JTAG interface uses signal pins such as TCK, TMS, TDI, and TDO to control the internal state of the MCU and to program the code.

[0065] The USB interface and debug power switch include USB1, resistor R23, and slide switch SW2, which provide power to the circuit and enable debug connections. The USB interface communicates via the CH340 chip and, in conjunction with the switch control circuit, provides power supply and debug functions.

[0066] The button module includes resistors R25, R26, and R27, as well as switches SW3, SW4, and SW5, allowing the user to input control signals. By pressing the buttons, the pin levels are changed, and the MCU performs corresponding operations based on the button logic.

[0067] The LED module includes resistors R6, R8, R28, LED2, LED3, and LED4, used to provide status indication. Through current limiting by the resistors, the LEDs are connected to the MCU's GPIO pins to display the circuit's operating status or indicate signal changes.

[0068] The reset circuit includes resistor R21 and switch SW1 to ensure the MCU's stable state during startup. Alternatively, a resistor and capacitor, or other reset IC, can be used to generate a reset signal when the voltage changes, forcing the MCU to reinitialize.

[0069] The analog power supply includes resistor R24, capacitor C23, and capacitor C24, which provide a stable power supply for the analog circuit. The output voltage is stabilized using an LDO (Low Dropout, an electronic power conversion device) or a DC-DC converter to meet the low-noise power requirements of analog modules such as ADCs and operational amplifiers.

[0070] The ADC acquisition module includes chip U1, resistor R46, resistor R47 and resistor R48, which are used to complete the analog signal to digital signal conversion process.

[0071] Each module in this invention plays a specific role in the overall design. Through functions such as power supply regulation, signal isolation, driving, and communication, it ensures the stable operation of the circuit. In particular, it plays a core role in measurement and control in the water-resistant single-beam depth sounder.

[0072] like Figure 22 The diagram shows the overall system block diagram of a novel water-resistant single-beam depth sounder. It mainly includes a transducer, power supply, microprocessor, and transmitting / receiving devices. The power supply is a DC power supply of 24V–36V, converted to the required voltage for each module by a power conversion circuit. An isolation circuit provides protection and isolation. CW waves are constant-amplitude electromagnetic waves, and SPI (Serial Peripheral Interface) communication is a high-speed, full-duplex, synchronous serial communication protocol.

[0073] The transmitting circuit employs a full-bridge mode, using a full-bridge circuit formed by four switching transistors to directly apply amplified DC current to the transducer, generating a low-range acoustic wave. To reduce space occupation and heat loss, gallium nitride (GaN) MOSFETs are selected. Because the full-bridge MOSFETs are directly driven by DC current, both sides of the bridge circuit are connected and applied to the two stages of the transducer, forming positive and negative half-cycle signals. These signals are directly applied to the two ends of the transducer through the drive circuit, eliminating the electromagnetic conversion process and ensuring undistorted transmitted waveforms, thus guaranteeing normal transducer operation. The transmitting device also includes a protection module design. In case of short circuits, overcurrent, or other abnormal conditions, the output control signal is stopped, shutting down the entire transmitting circuit to protect the system. The receiving device uses a two-stage amplification circuit to amplify the received weak electrical signal. Bandpass filters and RC networks are used directly in the two-stage amplification stage to preprocess the electrical signal. The two-stage gain signal design prevents oversaturation. The bandpass filter circuit has a center frequency f0 of 100kHz, with signal attenuation greater than 3dB at ±3kHz, and a designed signal passband of 96kHz~104kHz.

[0074] The transducer converts the excitation electrical signal into a mechanical wave. After being arrayed, it transmits sound wave pulses to the seabed and receives the echoes, converting them back into electrical signals for easy processing. The transducer linear array of this invention is a combined transmitter and receiver type. Based on the sound speed in seawater c = 1500 m / s, the operating frequency point f = 100 kHz, and the c / 2f = 7.5 mm interval, the linear array is formed by crossing the two sides. Waterproofing and fixation are achieved by pouring water-resistant polyurethane. The polyurethane layer has the functions of waterproofing and vibration isolation.

[0075] The microprocessor generates transmission control signals, transmits signals, and processes electrical signals transmitted by the receiving device. After the system is powered on, it extracts the envelope of the received signal according to a certain threshold, calculates the extracted envelope signal, transmits the calculation result through a serial port, and completes the early warning value judgment. This invention uses an MSP430 microcontroller for processing and control, and can calculate and issue early warnings for ocean depths up to 300 meters.

[0076] The technical problems to be solved by this utility model include:

[0077] 1. Water-resistant. 2. Wide beam angle for broad detection range. 3. High distance resolution with adjustable warning thresholds. 4. High reliability; will not be damaged while operating in air.

[0078] The working principle of a bottom altimeter is to drive sound waves for detection. After the sound waves are reflected by the seabed or obstacles, the system receives the detection echo signal. Based on the time difference between the driving sound wave and the received pulse signal, and the speed of sound propagation in the sea, the distance between the altimeter and the seabed can be obtained.

[0079] The objective of this utility model is achieved through the following technical solution:

[0080] The transducer converts the electrical signal from the transmitting device into an acoustic signal, transmits sound wave pulses in a specified direction, and then processes and calculates the reflected feedback signal from the seabed.

[0081] How the echo signal is processed and calculated: The acquired echo signal is filtered by various types of filters to remove noise and unnecessary frequency components. In order to adapt to different signal strengths, after the signal passes through the receiving module circuit, environmental noise is removed to improve the signal quality. By calculating the arrival time of the echo signal, the distance between the target and the sensor is estimated. After compensating for changes in the speed of sound, the signal-to-noise ratio of the signal is improved by matched filtering technology. By detecting the peak value of the signal, the reflection characteristics of the target are analyzed, and the spectral characteristics are analyzed to complete the echo signal detection.

[0082] The transmitting and receiving device is used to output the characteristics of a fixed acoustic pulse signal to a transducer, drive the transducer to generate a mechanical wave signal, end the transmission process and start the signal receiving process, condition the received electrical signal of the transducer, and input the conditioning result to the microprocessor.

[0083] The microprocessor is used to generate control signals for the transmitting and receiving devices, control the electrical signal characteristics of the transmitting device, drive the transducer to emit mechanical waves periodically, modulate and process the received echo signals, calculate the distance to the ground, and output the data through a serial port or LAN (local area network interface).

[0084] Calculation of distance from the bottom:

[0085] Based on the environmental parameters of the measurement area (such as water temperature, salinity, and depth), the depth sounder calculates or refers to the sound velocity profile data to obtain the propagation speed of sound waves in water. If the sound velocity C is different, corresponding corrections are required. The distance between the depth sounder transducer and the water surface is D. The single-beam depth sounder transducer radiates a pulsed sound wave of a certain frequency from point A. The sound wave travels through the water to point O on the bottom. After being reflected by the sand and gravel on the bottom surface, the reflected sound wave is received by the transducer at point B. The distance between points A and B is 2L. The propagation speed of sound in water under the given environment is represented by c. The time it takes for the sound wave to travel from A to B in the water is t. The vertical distance between the single-beam depth sounder transducer and the bottom surface is represented by h. M is a point on the sound wave path. The depth H of the measured water area is: H = D + h. Where:

[0086]

[0087] Generally, single-beam echo sounders use a transceiver merging transducer, meaning points A and B coincide. The measured depth can then be simplified to: H = D + ct / 2. D is a fixed, measurable value. The speed of sound c is related to water temperature, salinity, etc., and can be obtained using empirical formulas or by looking up tables. Time t is the interval between the echo sounder's transmitted signal and the received reflected echo. Because users may experience power outages or other unforeseen circumstances during operation, this invention employs an energy storage combined with a DC input mode in the power conversion device. The DC input range is 24V to 36V, allowing for one detection operation even in the event of an unexpected power outage.

[0088] The transducer consists of 6 independent sandwich transducers arranged in an "X" array with a 7mm interval. The 6 transducers are divided into 2 groups according to the arrangement direction. The transducers in each group are connected in parallel with cables that are simultaneously connected to the transmitting and receiving device. All transducers are of the transceiver type, and the transmitting and receiving operation is controlled by a processor.

[0089] The transmitting and receiving device is a switching circuit that uses a GaN (gallium nitride) semiconductor field-effect transistor as a driver. After amplifying the input signal from the microcontroller, it controls the gate voltage of the transistor, thereby controlling the current flow between the source and drain, achieving power amplification and output. It features fast response, high efficiency, high temperature resistance, and high output power. The receiving section is a two-stage fixed-gain amplifier circuit including a bandpass filter. The transmitting and receiving circuits are connected to the microprocessor via a function conversion circuit.

[0090] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A novel water-resistant single-beam depth sounder, characterized in that, It includes a microcontroller circuit (1), a microcontroller power supply circuit (2), a receiver module isolation power supply circuit (3), a receiver module circuit (4), an ultrasonic transducer drive circuit (5), an ultrasonic transducer drive power supply circuit (6), and a digital-analog power supply circuit (7). The microcontroller circuit (1) is connected in sequence to the microcontroller power supply circuit (2), the receiving module circuit (4), the ultrasonic transducer drive circuit (5), and the digital-analog power supply circuit (7). The receiving module isolation power supply circuit (3) is connected to the receiving module circuit (4), and the ultrasonic transducer drive power supply circuit (6) is connected to the ultrasonic transducer drive circuit (5). In the receiving module circuit (4), the third terminal of operational amplifier U5 is connected to resistor R3. The second terminal of operational amplifier U5 is connected in sequence to one end of resistor R2, one end of resistor R1, and one end of capacitor C5. The other end of resistor R2 is connected to the first terminal of connector H1. The sixth terminal of operational amplifier U5 is connected in sequence to the other end of resistor R1, the other end of capacitor C5, and one end of resistor R19. The other end of resistor R19 is connected to one end of capacitor C6. The other end of capacitor C6 is connected in sequence to the second terminal of operational amplifier U17, one end of resistor R18, and one end of capacitor C12. The other end of resistor R18 is connected to the first terminal of resistor RF2. The second terminal of resistor RF2 is connected in sequence to the other end of capacitor C12, the sixth terminal of operational amplifier U17, and one end of resistor R57. The other end of resistor R57 is connected to one end of resistor R7. The other end of resistor R7 is connected in sequence to... The second terminal of operational amplifier U8 is connected to the third terminal of chip U2. The sixth terminal of operational amplifier U8 is connected to one end of resistor R12. The other end of resistor R12 is connected to the first terminal of chip U2. The fifth terminal of chip U2 is connected to the third terminal of operational amplifier U14. The sixth terminal of chip U2 is connected to the second terminal of operational amplifier U14 and resistor R13 in sequence. The other end of resistor R13 is connected to the sixth terminal of operational amplifier U14 and one end of resistor R45 in sequence. The other end of resistor R45 is connected to capacitor C43. Capacitors C2, C3, and C4 are connected in parallel. Capacitors C55, C56, and C57 are connected in parallel. Capacitors C58, C59, and C60 are connected in parallel. Capacitors C61, C62, and C63 are connected in parallel. Resistor R56 and resistor RF1 are connected in series.

2. The novel water-resistant single-beam depth sounder according to claim 1, characterized in that, The microcontroller circuit (1) includes chip U18, capacitor C8 and capacitor C22; Specifically, the seventh terminal of the chip U18 is connected to one end of the capacitor C8, the other end of the capacitor C8 is connected to the eleventh terminal of the chip U18, and the first terminal of the chip U18 is connected to the capacitor C22.

3. The novel water-resistant single-beam depth sounder according to claim 1, characterized in that, The microcontroller power supply circuit (2) includes chip U20, capacitor C20, capacitor C21, capacitor C13, capacitor C14, resistor R22 and LED1; Specifically, the first terminal of chip U20 is sequentially connected to one end of capacitor C21, one end of capacitor C20, one end of capacitor C13, one end of capacitor C14, and the negative terminal of LED1. The third terminal of chip U20 is sequentially connected to the other end of capacitor C21 and the other end of capacitor C20. The second terminal of chip U20 is sequentially connected to the fourth terminal of chip U20, the other end of capacitor C13, the other end of capacitor C14, and one end of resistor R22. The other end of resistor R22 is connected to the positive terminal of LED1.

4. A novel water-resistant single-beam depth sounder according to claim 1, characterized in that, The receiving module isolation power supply circuit (3) includes chip U16, capacitor C51, inductor L5, capacitor C52, capacitor C54 and capacitor C53. Specifically, the first terminal of the chip U16 is connected to one end of the capacitor C52 and one end of the inductor L5 in sequence; the other end of the inductor L5 is connected to one end of the capacitor C51; the other end of the capacitor C51 is connected to the other end of the capacitor C52; the second terminal of the chip U16 is connected to one end of the capacitor C54; the other end of the capacitor C54 is connected to the fourth terminal of the chip U16; and the sixth terminal of the chip U16 is connected to the capacitor C53.

5. A novel water-resistant single-beam depth sounder according to claim 1, characterized in that, The ultrasonic transducer drive circuit (5) includes chip U23, capacitor C39, resistor R41, resistor R42, diode D7, diode D8, diode D3, resistor R36, resistor R35, MOSFET M1, MOSFET M2, capacitor C40, chip U24, capacitor C41, resistor R43, resistor R44, diode D4, diode D5, diode D6, resistor R37, resistor R38, MOSFET M3, MOSFET M4, capacitor C42, LED5, LED6, resistor R39, resistor R40, transformer U10, resistor R111, inductor L10, capacitor C111 and capacitor C112; Specifically, the second terminal of chip U23 is connected to resistor R41, the third terminal of chip U23 is connected to resistor R42, the first segment of chip U23 is sequentially connected to capacitor C39 and the anode of diode D7, the cathode of diode D7 is sequentially connected to the eighth terminal of chip U23 and one end of capacitor C40, the seventh terminal of chip U23 is sequentially connected to the cathode of diode D8 and one end of resistor R36, and the anode of diode D8 is sequentially connected to the other end of resistor R36. The first terminal of the MOS transistor M1 is connected to the third terminal of the MOS transistor M1. The third terminal of the MOS transistor M1 is connected in sequence to the sixth terminal of the chip U23, the second terminal of the MOS transistor M2, the other terminal of the capacitor C40, the positive terminal of the LED5, the negative terminal of the LED6, and the first terminal of the transformer U10. The fifth terminal of the chip U23 is connected in sequence to the negative terminal of the diode D3 and one end of the resistor R35. The positive terminal of the diode D3 is connected in sequence to the other end of the resistor R35 and the first terminal of the MOS transistor M2. The second terminal of chip U24 is connected to resistor R43, the third terminal of chip U24 is connected to resistor R44, the first terminal of chip U24 is connected in sequence to capacitor C41 and the positive terminal of diode D4, the negative terminal of diode D4 is connected in sequence to the eighth terminal of chip U24 and one end of capacitor C42, the seventh terminal of chip U24 is connected in sequence to the negative terminal of diode D6 and one end of resistor R38, the positive terminal of diode D6 is connected in sequence to the other end of resistor R38 and the first terminal of MOSFET M3, and the third terminal of MOSFET M3 is connected in sequence to the fourth terminal of the first terminal of the second terminal of the third ... The three terminals are connected in sequence to the sixth terminal of the chip U24, the second terminal of the MOS transistor M4, the other terminal of the capacitor C42, one terminal of the resistor R39, one terminal of the resistor R40, and the second terminal of the transformer U10. The other terminal of the resistor R39 is connected to the negative terminal of the LED5, and the other terminal of the resistor R40 is connected to the positive terminal of the LED6. The fifth terminal of the chip U24 is connected in sequence to the negative terminal of the diode D5 and one terminal of the resistor R37. The positive terminal of the diode D5 is connected in sequence to the other terminal of the resistor R37 and the first terminal of the MOS transistor M4. The third terminal of the transformer U10 is connected in sequence to one end of the capacitor C111 and one end of the capacitor C112. The other end of the capacitor C112 is connected in sequence to the fourth terminal of the transformer U10 and one end of the resistor R111. The other end of the resistor R111 is connected to one end of the inductor L10. The other end of the inductor L10 is connected to the other end of the capacitor C111.

6. A novel water-resistant single-beam depth sounder according to claim 1, characterized in that, The ultrasonic transducer drive power supply circuit (6) includes connector H4, capacitor C27, capacitor C28, resistor R29, capacitor C25, chip U21, diode D1, inductor L3, capacitor C26, capacitor C30, resistor R31, capacitor C29, capacitor C31, resistor R55, fuse resistor PR2, resistor R30, resistor R54 and LED8; Specifically, the first end of connector H4 is sequentially connected to one end of capacitor C27, one end of capacitor C28, the second end of chip U21, and the third end of chip U21. The second end of connector H4 is sequentially connected to the other end of capacitor C27, the other end of capacitor C28, and one end of resistor R29. The other end of resistor R29 is connected to the fourth end of chip U21. The first end of chip U21 is connected to one end of capacitor C25. The other end of capacitor C25 is sequentially connected to the eighth end of chip U21, the negative terminal of diode D1, and one end of inductor L3. The seventh end of chip U21 is sequentially connected to the positive terminal of diode D1 and capacitor C28. One end of the inductor L3 is connected to one end of the capacitor C30. The other end of the inductor L3 is connected in sequence to the other end of the capacitor C26, the other end of the capacitor C30, one end of the resistor R55, and one end of the resistor R54. The fuse resistor PR2 is connected in parallel with the resistor R55. The other end of the resistor R54 is connected to the LED8. The other end of the resistor R55 is connected in sequence to the resistor R30 and the fifth end of the chip U21. The sixth end of the chip U21 is connected in sequence to one end of the resistor R31 and one end of the capacitor C29. The other end of the capacitor C29 is connected to one end of the capacitor C31. The other end of the capacitor C31 is connected to the other end of the resistor R31.

7. A novel water-resistant single-beam depth sounder according to claim 1, characterized in that, The digital analog power supply circuit (7) includes chip U25, capacitor C46, ​​capacitor C47, resistor R49, capacitor C44, diode D9, inductor L6, capacitor C45, capacitor C49, resistor R51, capacitor C48, capacitor C50, resistor R52, resistor R50, resistor R53 and LED7. Specifically, the second and third terminals of chip U25 are sequentially connected to one end of capacitor C47 and one end of capacitor C46. The other end of capacitor C46 is sequentially connected to the other end of capacitor C47 and one end of resistor R49. The other end of resistor R49 is connected to the fourth terminal of chip U25. The first terminal of chip U25 is connected to one end of capacitor C44. The other end of capacitor C44 is sequentially connected to the eighth terminal of chip U25, the negative terminal of diode D9, and one end of inductor L6. The seventh terminal of chip U25 is sequentially connected to the positive terminal of diode D9 and one end of capacitor C45. One end of the inductor L6 is connected to one end of the capacitor C49. The other end of the inductor L6 is connected in sequence to the other end of the capacitor C45, the other end of the capacitor C49, one end of the resistor R52, and one end of the resistor R53. The other end of the resistor R53 is connected to the LED7. The other end of the resistor R52 is connected in sequence to the resistor R50 and the fifth end of the chip U25. The sixth end of the chip U25 is connected in sequence to the resistor R51 and one end of the capacitor C48. The other end of the capacitor C48 is connected to one end of the capacitor C50. The other end of the capacitor C50 is connected to the other end of the resistor R51.

Images