Display module and display device

By using the U-shaped design of the flexible connecting plate and the optimized layout of the buffer adhesive layer, the problem of low space utilization in medium and large-sized display modules is solved, achieving more efficient overall space utilization and structural stability.

CN223943127UActive Publication Date: 2026-02-24CHONGQING BOE DISPLAY TECH CO LTD +1
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202520609160.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-28
Publication Date
2026-02-24
Estimated Expiration
2035-03-28

AI Technical Summary

Technical Problem

In existing technologies, the space utilization rate of medium and large-sized display modules is low, especially the space between the panel and the PCB is not effectively utilized, which makes it impossible to place taller components when arranging the whole machine.

Method used

The design adopts a flexible connecting plate, including a first binding part, a main body part, and a second binding part. The main body part is bent towards the side closer to the display part to form a U-shaped structure. The space layout is optimized by adhesive layer and buffer component, and the overall space utilization is improved by combining heat dissipation layer and rigid support component.

Benefits of technology

It improves the internal space utilization of the whole machine, allows for the placement of taller components in the corresponding positions of the display module, enhances the structural stability and reliability of the display device, and reduces molding risks.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN223943127U_ABST
    Figure CN223943127U_ABST
Patent Text Reader

Abstract

The utility model discloses a display module and a display device, the display module comprises a display panel, the display panel comprises a display part and a non-display part, the non-display part is connected with the display part in a bending manner, and the non-display part is arranged on the backlight side of the display part; the printed circuit board is arranged on the backlight side of the display part; the flexible connecting plate is arranged on the backlight side of the display part and comprises a first binding part, a main body part and a second binding part which are connected in sequence, the first binding part is connected with the printed circuit board, the second binding part is connected with the non-display part, the main body part is arranged between the printed circuit board and the non-display part, and the main body part is connected with the non-display part. And the first binding part and the second binding part are bent towards one side close to the display part. According to the utility model, the structural arrangement between the flexible connecting plate and the display part is more compact, components with higher sizes can be conveniently arranged at the position corresponding to the main body part, and the space utilization rate is improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] This utility model relates to the field of display technology, and in particular to a display module and a display device. Background Technology

[0002] In consumer electronics, space utilization has always been a major issue in structural design. For medium to large-sized display modules, in order to save space for the whole device, in addition to simply reducing the size of individual components, it is also necessary to study how to save space through structural design. For example, the space between the panel (display panel) and the PCB (printed circuit board) has always been occupied by the suspended FPC in previous designs because the two are connected by the FPC. In order to avoid interference with the FPC, taller components cannot be placed in the overall design, which greatly reduces the utilization rate of this space. Utility Model Content

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one objective of the present invention is to provide a display module that, through an improved flexible connecting plate, can avoid other components during overall machine layout, providing space for other components and thus improving the internal space utilization rate during overall machine layout.

[0004] This invention also aims to provide a display device for using the aforementioned display module.

[0005] The display module according to an embodiment of the present invention includes a display part and a non-display part, wherein the non-display part and the display part are bent and connected, and the non-display part is disposed on the backlight side of the display part; a printed circuit board, wherein the printed circuit board is disposed on the backlight side of the display part; and a flexible connecting plate, wherein the flexible connecting plate is disposed on the backlight side of the display part and includes a first binding part, a main body part and a second binding part connected in sequence, wherein the first binding part is connected to the printed circuit board, the second binding part is connected to the non-display part, the main body part is disposed between the printed circuit board and the non-display part, and is bent toward the side closer to the display part relative to the first binding part and the second binding part.

[0006] According to the present invention, the display module is configured such that the flexible connecting plate includes a first binding part, a main body part, and a second binding part, and the main body part is bent towards the side closer to the display part relative to the first binding part and the second binding part. The flexible connecting plate can be constructed into a U-shaped structure, with the main body part closer to the display part. This makes the structural arrangement between the flexible connecting plate and the display part more compact. When the display module is arranged in the whole machine, the side of the flexible connecting plate away from the display part is recessed, which can provide more space for the whole machine components. This makes it easier to arrange taller components at the position corresponding to the main body part of the whole machine, which is beneficial to improving the space utilization rate inside the whole machine.

[0007] In some embodiments of this utility model, an arc-connected connecting segment is formed between the main body and the first binding part and the second binding part, and the connecting segment is inclined relative to the main body.

[0008] In some embodiments of this utility model, the display module includes a first adhesive layer disposed between the display portion and the non-display portion. The first adhesive layer extends toward the side close to the printed circuit board beyond the main body portion and is bonded to the main body portion.

[0009] In some embodiments of this utility model, the orthographic projection of the first adhesive layer on the display portion overlaps with the orthographic projection of the first bonding portion on the display portion; the display module includes a first buffer member, which is disposed between the first adhesive layer and the first bonding portion.

[0010] In some embodiments of this utility model, the display module includes a first adhesive layer and a second adhesive layer. The first adhesive layer is disposed between the display part and the non-display part, and the second adhesive layer is disposed between the main body part and the display part. The thickness of the second adhesive layer is less than the thickness of the first adhesive layer.

[0011] In some embodiments of this utility model, a first space is formed between the first binding part, the connecting segment, and the printed circuit board, and a second space is formed between the second binding part, the connecting segment, and the flexible connecting plate. The display module includes a first buffer and a second buffer, with the first buffer disposed in the first space and the second buffer disposed in the second space.

[0012] In some embodiments of this utility model, the display module includes a heat dissipation layer, which is disposed on the backlight side of the display unit and is attached to the display unit. The first buffer, the second buffer, and the second adhesive layer are integral with the heat dissipation layer. The printed circuit board and the first adhesive layer are disposed on the side of the heat dissipation layer facing away from the display unit.

[0013] In some embodiments of this utility model, a first space is formed between the first binding part, the connecting segment, and the printed circuit board, and a second space is formed between the second binding part, the connecting segment, and the flexible connecting plate. The display module includes a first buffer member, which is disposed in the first space, and the first adhesive layer extends into the second space.

[0014] In some embodiments of this utility model, the flexible connecting plate is a pre-formed part, and the display module includes a rigid support member. The rigid support member has the same shape as the flexible connecting plate, and the rigid support member is attached to and connected to the flexible connecting plate.

[0015] In some embodiments of this utility model, the display module includes a heat dissipation layer, which is disposed on the backlight side of the display unit and is attached to the display unit. The printed circuit board and the non-display unit are disposed on the side of the heat dissipation layer away from the display unit.

[0016] A display device according to an embodiment of the present invention includes the display module described in any of the preceding claims.

[0017] According to the present utility model, the display device optimizes the spatial layout of the display module, making the internal space of the display device more compact and increasing the usable space in the thickness direction of the display device. The area of ​​the flexible connecting plate corresponding to the display module in the display device can accommodate components with larger height dimensions, thereby improving the internal space utilization of the display device.

[0018] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0020] Figure 1 This is a side view of the display module according to some embodiments of this utility model. Figure 1 ;

[0021] Figure 2 This is a rear view of the display module according to some embodiments of this utility model. Figure 1 ;

[0022] Figure 3 This is a plan view of the first adhesive layer in some embodiments of this utility model;

[0023] Figure 4 This is a side view of the display module according to some embodiments of this utility model. Figure 2 ;

[0024] Figure 5 This is a rear view of the display module according to some embodiments of this utility model. Figure 2 ;

[0025] Figure 6 yes Figure 4 The embodiment shows a partial structural diagram of the display module. Figure 1 ;

[0026] Figure 7 yes Figure 4 The embodiment shows a partial structural diagram of the display module. Figure 2;

[0027] Figure 8 This is a schematic diagram of the structure of the flexible connecting plate according to some embodiments of this utility model. Figure 1 ;

[0028] Figure 9 This is a schematic diagram of the structure of the flexible connecting plate according to some embodiments of this utility model. Figure 2 ;

[0029] Figure 10 This is a side view of the display module according to some embodiments of this utility model. Figure 3 ;

[0030] Figure 11 This is a rear view of the display module according to some embodiments of this utility model. Figure 3 ;

[0031] Figure 12 This is a partial structural diagram of the display module according to some embodiments of this utility model. Figure 1 ;

[0032] Figure 13 This is a partial structural diagram of the display module according to some embodiments of this utility model. Figure 2 ;

[0033] Figure 14 This is a side view of the display module according to some embodiments of this utility model. Figure 4 ;

[0034] Figure 15 yes Figure 14 Assembly diagram of rigid support and flexible connecting plate in the embodiment Figure 1 ;

[0035] Figure 16 yes Figure 14 Assembly diagram of rigid support and flexible connecting plate in the embodiment Figure 2 ;

[0036] Figure 17 yes Figure 14 A schematic diagram of the rigid support member in the embodiment.

[0037] Figure label:

[0038] 100. Display module;

[0039] 10. Display panel; 11. Display section; 12. Non-display section; 121. Driver chip;

[0040] 20. Flexible connecting plate; 21. First binding part; 22. Main body part; 23. Second binding part; 24. Connecting section;

[0041] 30. Printed circuit boards;

[0042] 40. First adhesive layer; 41. Main body of adhesive layer; 42. Extension of adhesive layer;

[0043] 50. Second adhesive layer;

[0044] 60. First space; 61. First buffer;

[0045] 70. Second space; 71. Second buffer;

[0046] 80. Heat dissipation layer;

[0047] 90. Rigid support; 91. Opening. Detailed Implementation

[0048] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0049] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0050] Furthermore, features specified as "first" or "second" may explicitly or implicitly include one or more of the same feature, used to distinguish and describe features, without any order or distinction of importance.

[0051] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0052] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0053] The following is for reference. Figures 1-14 This describes a display module 100 according to an embodiment of the present utility model.

[0054] like Figures 1 to 3 As shown, the display module 100 according to an embodiment of the present invention includes: a display panel 10, a printed circuit board 30, and a flexible connecting plate 20. The display panel 10 includes a display portion 11 and a non-display portion 12, which are bent and connected to the display portion 11, and the non-display portion 12 is disposed on the backlight side of the display portion 11. The printed circuit board 30 is disposed on the backlight side of the display portion 11. The flexible connecting plate 20 is disposed on the backlight side of the display portion 11 and includes a first binding portion 21, a main body portion 22, and a second binding portion 23 connected in sequence. The first binding portion 21 is connected to the printed circuit board 30, the second binding portion 23 is connected to the non-display portion 12, and the main body portion 22 is disposed between the printed circuit board 30 and the non-display portion 12, and is bent towards the display portion 11 relative to the first binding portion 21 and the second binding portion 23.

[0055] Display panel 10 can refer to the electronic component in display module 100 used to display visual information such as images, text, and video; it can be understood as a "panel" in the display field. Display section 11 can refer to the part of display panel 10 that performs the display function, and the backlight side can refer to the side of display section 11 that does not emit light. Non-display section 12 can refer to the part of display panel 10 that is bent to the backlight side of display section 11; it can refer to panel bending in the industry. Display panel 10 can be, but is not limited to, an OLED panel.

[0056] Printed circuit board 30 can refer to a rigid circuit board with conductive lines and pads formed on an insulating substrate for supporting and connecting electronic components. It mainly consists of a substrate, copper foil, solder mask, silkscreen printing, and pads. In short, printed circuit board 30 can refer to the PCB (Printed Circuit Board) as understood in the industry.

[0057] Flexible interconnect 20 refers to a circuit board with high reliability and excellent flexibility made of polyimide or polyester film as the substrate. It typically uses polyimide (PI) or polyester (PET) film, which has good flexibility, insulation, and high-temperature resistance, and can withstand multiple bends without damage. In short, flexible interconnect 20 can refer to FPC (Flexible Printed Circuit) or COF (Chip On Flex, or Chip On Film, often called flip-chip film) in the industry.

[0058] In the flexible connecting plate 20, the main body 22 can refer to the main body portion of the flexible connecting plate 20, the first bonding portion 21 can refer to the bonding area between the flexible connecting plate 20 and the printed circuit board 30, and the second bonding portion 23 can refer to the bonding area between the flexible connecting plate 20 and the non-display portion 12. Since the main body 22 is bent towards the side closer to the display portion 11 relative to the first bonding portion 21 and the second bonding portion 23, the flexible connecting plate 20 as a whole can have a concave structure.

[0059] It should be noted that the display module 100 of this utility model can be, but is not limited to, flexible screens and rigid screens; no specific limitations are made here.

[0060] According to the present invention, the display module 100 is configured such that the flexible connecting plate 20 includes a first binding part 21, a main body part 22 and a second binding part 23, and the main body part 22 is bent toward the side closer to the display part 11 relative to the first binding part 21 and the second binding part 23. The flexible connecting plate 20 can be constructed as a U-shaped structure, with the main body part 22 closer to the display part 11. This makes the structural arrangement between the flexible connecting plate 20 and the display part 11 more compact. When the display module 100 is arranged in the whole machine, the side of the flexible connecting plate 20 away from the display part 11 is recessed, which can provide more space for the whole machine components. This makes it easier to arrange taller components at the position corresponding to the main body part 22 in the whole machine, which is beneficial to improving the space utilization rate inside the whole machine.

[0061] In some embodiments of this utility model, such as Figure 1 As shown, a connecting segment 24 with an arc is formed between the main body 22, the first binding part 21, and the second binding part 23. The connecting segment 24 is inclined relative to the main body 22.

[0062] "Connecting segment 24 with circular arcs" can be referenced. Figure 1 This arc connection can be a semicircle or an arc of other curvature.

[0063] In the above technical solution, an arc-shaped connecting segment 24 is formed between the main body 22 and the first binding part 21 and the second binding part 23. The connecting segment 24 is inclined relative to the main body 22. This makes the transition between the main body 22 and the first binding part 21, and between the main body 22 and the second binding part 23, smoother during the bending and forming process of the flexible connecting plate 20. It prevents vertical or near-vertical corners at the bending position and reduces stress concentration. Since the flexible connecting plate 20 contains a large circuit, this method reduces the risk of damage at the bending position of the flexible connecting plate 20 and improves the reliability of the flexible connecting plate 20. Moreover, compared with right-angle or straight-line connections, the inclined arc-shaped connecting segment 24 can provide a larger bending angle range, and during the bending process, the connecting segment 24 can better adapt to shape changes, reducing the impact on the main body 22, the first binding part 21, and the second binding part 23.

[0064] Optionally, such as Figure 1 and Figure 2 As shown, a driver chip 121 is provided on the side of the non-display section 12 away from the display section 11. The driver chip 121 can refer to a miniature electronic circuit integrated on a semiconductor chip, and is the core component for controlling and driving the screen display. It can be understood that the driver chip 121 can refer to an IC (Integrated Circuit).

[0065] In some embodiments of this utility model, such as Figure 1 As shown, the display module 100 includes a first adhesive layer 40, which is disposed between the display part 11 and the non-display part 12. The first adhesive layer 40 extends to the side close to the printed circuit board 30 beyond the main body 22 and is bonded to the main body 22.

[0066] The first adhesive layer 40 can refer to a layer structure that can serve an adhesive function and also provide support for the non-display portion 12. For example, the first adhesive layer 40 can be double-sided tape.

[0067] The first adhesive layer 40 can be used to directly bond the non-display part 12 and the display part 11, the main body part 22 and the display part 11. Alternatively, the first adhesive layer 40 can be used to bond the upper layer structure of the non-display part 12 and the display part 11, or the upper layer structure of the main body part 22 and the display part 11.

[0068] Optionally, the first adhesive layer 40 can be a polyethylene terephthalate (PET) based double-sided adhesive. When the edge of the second bonding portion 23 is subjected to downward pressure, the edge of the display panel 10 can reduce the pressure on the display portion 11 through the buffering effect of the first adhesive layer 40, thereby improving the molding problem.

[0069] In the above technical solution, the first adhesive layer 40 can form the non-display part 12, the main body part 22, and the display part 11 into a whole through bonding, improving the connection stability and reliability of the non-display part 12, the main body part 22, and the display part 11. When the display module 100 is subjected to external force, the components are less likely to experience relative displacement or loosening, reducing the risk of failure due to unreliable connection and helping to extend the service life of the display module 100. Moreover, in addition to its bonding function, the first adhesive layer 40 can also support the bottom of the main body part 22, reducing the step height formed by bending between the main body part 22 and the second binding part 23. When the flexible connecting plate 20 is pressed into shape during the assembly stage, this solution can reduce the force acting on the display part 11 when the flexible connecting plate 20 is pressed down, reducing the risk of mold marks forming on the display panel 10 and improving the reliability of the display panel 10.

[0070] In some embodiments of this utility model, such as Figure 1 As shown, the orthographic projection of the first adhesive layer 40 on the display section 11 overlaps with the orthographic projection of the first bonding part 21 on the display section 11; the display module 100 includes a first buffer 61, which is disposed between the first adhesive layer 40 and the first bonding part 21.

[0071] "The orthographic projection of the first adhesive layer 40 on the display unit 11 overlaps with the orthographic projection of the first bonding part 21 on the display unit 11," which can be understood as referring to... Figure 1 In the left and right direction, the first adhesive layer 40 extends beyond the position of the main body 22 and extends to the lower side of the first binding part 21, so that the first adhesive layer 40 and the first binding part 21 have an overlapping area.

[0072] The first buffer 61 can refer to a component with a buffering function, and can be, but is not limited to, foam, rubber pads, silicone buffer pads, etc. When the flexible connecting plate 20 is recessed, a force is formed between the main body 22 and the first binding part 21. Without the first buffer 61, the flexible connecting plate 20 would directly pull the edge of the printed circuit board 30 when it is recessed. By adopting the above solution, the object of pulling of the flexible connecting plate 20 when it is recessed can be changed from the printed circuit board 30 to the first buffer 61. The first buffer 61 can buffer the pulling force through deformation, thereby helping to improve the molding problem.

[0073] In the above technical solution, the first buffer 61 is disposed between the first adhesive layer 40 and the first bonding portion 21. The first buffer 61 contacts the first adhesive layer 40 and the first bonding portion 21, and can play a buffering role at the bending position of the first bonding portion 21 and the main body portion 22, preventing a large force from being exerted on the display portion 11 through the printed circuit board 30 when the flexible connecting plate 20 is bent, thus avoiding molding problems. Since the first buffer 61 has a certain degree of elasticity, it can also prevent the formation of stress concentration positions between the first bonding portion 21 and the main body portion 22 when the flexible connecting plate 20 is bent, avoiding the risk of damage to the flexible connecting plate 20 and improving the reliability of the flexible connecting plate 20.

[0074] In some embodiments of this utility model, such as Figure 3 As shown, the first adhesive layer 40 includes an adhesive layer body 41 and a plurality of adhesive layer extensions 42. The plurality of adhesive layer extensions 42 are connected to the adhesive layer body 41 and are equal in number to the flexible connecting plate 20 and correspond one-to-one.

[0075] Understandably, referring to Figure 2 The non-display unit 12 and the printed circuit board 30 can be connected by multiple flexible connecting plates 20, which are arranged along... Figure 2 Arranged at intervals in the front and back directions. (Refer to...) Figure 3 The adhesive layer body 41 is along Figure 3 A long strip extending in the front-to-back direction, with multiple adhesive layer extensions 42 along Figure 3 The adhesive layer extensions 42 are arranged at intervals in the front-to-back direction, with each extension corresponding to the underside of the flexible connecting plate 20. This arrangement eliminates the need for the flexible connecting plate 20 in locations where electrical connections are not required, saving space, reducing costs, and providing installation space for other components. The corresponding arrangement of multiple adhesive layer extensions 42 and multiple flexible connecting plates 20 reduces the size of the adhesive layer body 41, avoiding excessive waste and further lowering costs.

[0076] In some embodiments of this utility model, such as Figure 1 As shown, the first adhesive layer 40 extends beyond the display panel 10 by a length L1, which is 5mm to 20mm. That is, L1 can be, but is not limited to, 5mm, 7mm, 9mm, 10mm, 12mm, 14mm, 16mm, 18mm, 20mm, etc. By setting the length of the first adhesive layer 40 extending beyond the display panel 10 within the above range, it can accommodate the manufacturing of most display modules 100, exhibiting high adaptability.

[0077] In some embodiments of this utility model, such as Figure 1As shown, the distance between the first adhesive layer 40 and the printed circuit board 30 is L2, which is 0.5mm to 1.0mm. That is, L2 can be, but is not limited to, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc. By forming a distance between the first adhesive layer 40 and the printed circuit board 30, the first adhesive layer 40 does not contact the edge of the printed circuit board 30. This prevents the first adhesive layer 40 from interfering with the printed circuit board 30 during installation, thereby affecting the installation of other components.

[0078] Optionally, the width of the first buffer member 61 is 1.0 mm to 2.0 mm, and its thickness is 0.2 mm to 1.0 mm. (Refer to...) Figure 1 The "width of the first buffer 61" can refer to the dimension of the first buffer 61 in the left-right direction, and the "height of the first buffer 61" can refer to the dimension of the first buffer 61 in the up-down direction. It is understood that the width of the first buffer 61 can be, but is not limited to, 1.0mm, 1.2mm, 1.4mm, 1.5mm, 1.6mm, 1.8mm, 2.0mm, etc., and the height of the first buffer 61 can be, but is not limited to, 0.2mm, 0.4mm, 0.6mm, 0.8mm, 1.0mm, etc.

[0079] In the above technical solution, by setting the width and height of the first buffer 61 within the above range, the first buffer 61 can have suitable buffering performance, enhance the buffering effect of the first buffer 61 when the flexible connecting plate 20 is pressed down, thereby further reducing the risk of mold marks appearing on the display panel 10 due to the pressure of the flexible connecting plate 20, and also further reducing the risk of stress concentration and damage caused by bending of the flexible connecting plate 20.

[0080] Optionally, the gap between the first buffer 61 and the printed circuit board 30 is 0.2mm to 0.5mm. It is understood that the gap between the first buffer 61 and the printed circuit board 30 can be, but is not limited to, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, etc.

[0081] In some embodiments of this utility model, the first buffer member 61 is bonded to the first binding part 21. That is, the first buffer member 61 has a single-sided adhesive structure and can be bonded to the first binding part 21. This method can improve the connection stability and reliability between the first buffer member 61 and the first binding part 21, and enhance the buffering effect of the first buffer member 61 on the bending position between the first binding part 21 and the main body part 22.

[0082] In some embodiments of this utility model, such as Figures 4 to 9As shown, the display module 100 includes a first adhesive layer 40 and a second adhesive layer 50. The first adhesive layer 40 is disposed between the display part 11 and the non-display part 12, and the second adhesive layer 50 is disposed between the main body part 22 and the display part 11. The thickness of the second adhesive layer 50 is less than the thickness of the first adhesive layer 40.

[0083] The second adhesive layer 50 can refer to a layer structure with adhesive properties, and its structure can be the same as or different from the first adhesive layer 40. The statement "the thickness of the second adhesive layer 50 is less than the thickness of the first adhesive layer 40" can be found in [reference needed]. Figure 4 The up and down directions, in reference Figure 4 In the vertical direction, the thickness of the second adhesive layer 50 is smaller than the thickness of the first adhesive layer 40.

[0084] In the above technical solution, the first adhesive layer 40 is disposed between the display part 11 and the non-display part 12, serving to bond the non-display part 12 and the display part 11, or to bond the upper layer structure of the non-display part 12 and the display part 11. The second adhesive layer 50 serves to bond the main body part 22 and the display part 11, or to bond the upper layer structure of the main body part 22 and the display part 11. Since the thickness of the second adhesive layer 50 is less than the thickness of the first adhesive layer 40, the flexible connecting plate 20 can be recessed to a greater depth, thereby facilitating the installation of components with larger height dimensions during overall machine layout, further saving space and improving the overall space utilization rate of the machine.

[0085] In some embodiments of this utility model, the thickness of the first adhesive layer 40 is 0.03 mm to 0.1 mm. It is understood that "the thickness of the first adhesive layer 40" can refer to... Figure 4 The dimensions in the vertical direction are specified, and the thickness of the first adhesive layer 40 can be, but is not limited to, 0.03mm, 0.04mm, 0.05mm, 0.06mm, 0.07mm, 0.08mm, 0.09mm, 0.1mm, etc. By setting the thickness of the first adhesive layer 40 within the above range, a large thickness of the first adhesive layer 40 can be avoided, thereby providing a greater depth space for the recess of the flexible connecting plate 20, saving space in the display module 100, and thus providing greater installation space for the components corresponding to the main body 22 during overall layout.

[0086] In some embodiments of this invention, the peel force of the first adhesive layer 40 is greater than or equal to 800 gf / inch. By setting the peel force of the first adhesive layer 40 within the above range, the adhesion of the first adhesive layer 40 can be enhanced, and the connection reliability between the main body 22 and the display part 11, or the layer structure on the upper side of the main body 22 and the display part 11, can be improved.

[0087] In some embodiments of this utility model, such as Figure 10As shown, a first space 60 is formed between the first binding part 21, the connecting section 24, and the printed circuit board 30, and a second space 70 is formed between the second binding part 23, the connecting section 24, and the flexible connecting plate 20. The display module 100 includes a first buffer 61 and a second buffer 71. The first buffer 61 is disposed in the first space 60, and the second buffer 71 is disposed in the second space 70.

[0088] The first space 60 can refer to the gap formed between the first binding part 21, the connecting section 24, and the printed circuit board 30. Similarly, the second space 70 refers to the gap formed between the second binding part 23, the connecting section 24, and the flexible connecting plate 20.

[0089] The second buffer 71 refers to a buffer component with a certain degree of elasticity, and its structure may be the same as or different from that of the first buffer 61. For example, both the second buffer 71 and the first buffer 61 can be made of foam.

[0090] In the above technical solution, when the flexible connecting plate 20 is pressed and formed during the assembly stage, the first buffer 61 can act as a buffer at the location of the first binding part 21, reducing the bending force between the main body part 22 and the first binding part 21 on the display part 11, and reducing the risk of molding problems in the area of ​​the display part 11 corresponding to the first binding part 21. The second buffer 71 can act as a buffer at the location of the second binding part 23, reducing the bending force between the main body part 22 and the second binding part 23 on the display part 11, and reducing the risk of molding problems in the area of ​​the display part 11 corresponding to the second binding part 23. Therefore, it is evident that by setting the first buffer 61 and the second buffer 71, the effect of improving the molding problem on the display part 11 is better, and the reliability of the display panel 10 can be improved.

[0091] In some embodiments of this invention, the gap between the second buffer 71 and the non-display part 12 is 0.2mm to 0.5mm. (Refer to...) Figure 10 In conjunction with the explanation of the spacing between the first buffer 61 and the printed circuit board 30, the gap between the second buffer 71 and the non-display part 12 can refer to the size of the gap in the left-right direction. The gap between the second buffer 71 and the non-display part 12 can be, but is not limited to, 0.2mm, 0.25mm, 0.3mm, 0.35mm, 0.4mm, 0.45mm, 0.5mm, etc. By setting the gap between the second buffer 71 and the non-display part 12 within the above range, a certain degree of tolerance can be provided for the installation of the second buffer 71, facilitating installation and improving efficiency.

[0092] Optionally, the width of the second buffer 71 is equal to the width of the first buffer 61, and the thickness of the second buffer 71 is equal to the thickness of the first buffer 61.

[0093] In some embodiments of this utility model, such as Figures 10 to 13 As shown, the display module 100 includes a heat dissipation layer 80, which is disposed on the backlight side of the display unit 11 and is attached to the display unit 11. The first buffer 61, the second buffer 71, and the second adhesive layer 50 are integral with the heat dissipation layer 80. The printed circuit board 30 and the first adhesive layer 40 are disposed on the side of the heat dissipation layer 80 facing away from the display unit 11.

[0094] The heat dissipation layer 80 can refer to a structural or material layer used to help an object dissipate heat. For ease of understanding, the heat dissipation layer 80 can refer to the SCF heat dissipation film as understood in the industry.

[0095] In the above technical solution, the heat dissipation layer 80 is located on the backlight side of the display unit 11 and is attached to the display unit 11. It can directly absorb the heat generated by the display unit 11 and quickly conduct the heat away, effectively reducing the temperature of the display unit 11, thereby playing a heat dissipation role. The first buffer 61, the second buffer 71, and the second adhesive layer 50 are integrated with the heat dissipation layer 80. This reduces the number of parts and assembly steps during the assembly of the display module 100, improves assembly efficiency, reduces the risk of loosening caused by loose connections between parts, enhances the stability and reliability of the overall structure of the display module 100, and provides more height space for the whole machine, improving space utilization. The main body 22 can also be supported on the display unit 11 by the second adhesive layer 50 and the heat dissipation layer 80. When the display module 100 is arranged on the whole machine, the position of the main body 22 can provide a support position for the whole machine components. Thus, it can play a supporting role when the finger or stylus presses the area of ​​the display unit 11 corresponding to the main body 22, reducing the probability of large deformation of the display unit 11 and improving the overall reliability of the display panel 10.

[0096] In some embodiments of this utility model, such as Figure 4 and Figure 7 As shown, a first space 60 is formed between the first bonding part 21, the connecting section 24, and the printed circuit board 30, and a second space 70 is formed between the second bonding part 23, the connecting section 24, and the flexible connecting plate 20. The display module 100 includes a first buffer 61, which is disposed in the first space 60, and the first adhesive layer 40 extends into the second space 70.

[0097] In the above technical solution, the buffer component (i.e., the first buffer 61) can be arranged only in the first space 60, and the second space 70 does not need to be arranged. Instead, the first adhesive layer 40 is extended into the second space 70. Since the first adhesive layer 40 is a flexible structural component, it has a certain buffering effect and a large thickness. Thus, while satisfying the buffering effect at the locations of the first binding part 21 and the second binding part 23 and alleviating the molding problem, the overall buffering structure is simplified, the cost is reduced, the assembly steps are simplified, and the assembly efficiency is improved.

[0098] In some embodiments of this utility model, such as Figures 14 to 17 As shown, the flexible connecting plate 20 is a pre-pressed part, and the display module 100 includes a rigid support member 90. The rigid support member 90 has the same shape as the flexible connecting plate 20, and the rigid support member 90 is attached to and connected to the flexible connecting plate 20.

[0099] "The flexible connecting plate 20 is a pre-pressed part" can mean that the flexible connecting plate 20 is pre-pressed before assembly to form a concave U-shaped structural part.

[0100] The rigid support member 90 can refer to a component used to provide structural support and stability. It can be made of materials such as aluminum alloy, stainless steel, and composite materials, and its shape is consistent with that of the pre-formed flexible connecting plate 20. For example, if the flexible connecting plate 20 is U-shaped, then the rigid support member 90 is also a U-shaped structural component. The rigid support member 90 can reinforce the pre-formed flexible connecting plate 20 and reduce the risk of deformation of the flexible connecting plate 20.

[0101] In the above technical solution, since the flexible connecting plate 20 is a pre-formed part, it does not need to be pressed down during assembly, thus avoiding pressure on the first binding part 21 and the second binding part 23 areas, thereby preventing mold marks on the display part 11. The flexible connecting plate 20 itself is relatively soft and easily deformed under force, which may affect the stability of the internal circuitry. The rigid support member 90 has the same shape as the flexible connecting plate 20 and is closely connected to it, providing additional rigid support for the flexible connecting plate 20. This prevents excessive deformation or damage when subjected to external forces (such as bending, stretching, or compression), thereby enhancing the overall stability and reliability of the display module 100.

[0102] Meanwhile, since the rigid support member 90 can provide rigid support and installation stability for the flexible connecting plate 20, the adhesive layer structure (e.g., the second adhesive layer 50) that ensures the connection between the main body 22 of the flexible connecting plate 20 and the display part 11 or the layer structure on the upper side of the display part 11 (e.g., the heat dissipation layer 80) can be omitted. Moreover, compared with the adhesive layer structure, the rigid support member 90 has better support and can be made thinner, thereby further increasing the recessed depth of the flexible connecting plate 20. This can provide a greater installation depth when the display module 100 is arranged on the whole machine, which is conducive to arranging components with larger height dimensions at the location of the main body 22, and further improving the space utilization of the whole machine.

[0103] Optionally, the rigid support 90 can be a steel sheet. Specifically, it can be a SUS steel sheet, which refers to a thin sheet made of SUS series stainless steel according to Japanese Industrial Standard (JIS), possessing characteristics such as high strength, corrosion resistance, and high temperature resistance. In this technical solution, during the assembly process of the display module 100, the SUS steel sheet can be bent into the required concave shape first, and then the flexible connecting plate 20 can be similarly pasted onto the SUS steel sheet, with the shape of the SUS steel sheet flush with the flexible connecting plate 20.

[0104] Optionally, the rigid support 90 can be a pre-preg sheet, where pre-preg is an abbreviation for prepreg material, a sheet material made of resin and reinforcing materials (such as fiberglass cloth) through partial curing (stage B). In this embodiment, during the assembly of the display module 100, the pre-preg sheet can be adhered to the back of the flexible connecting plate 20, and the flexible connecting plate 20 with the added prepreg sheet is molded in a mold into the desired concave shape, and then cured by applying temperature and pressure to form the concave shape.

[0105] In some embodiments of this utility model, the thickness of the rigid support member 90 is 0.1mm to 0.2mm. That is, the thickness of the rigid support member 90 can be, but is not limited to, 0.1mm, 0.12mm, 0.14mm, 0.15mm, 0.16mm, 0.18mm, 0.2mm, etc. By setting the thickness of the rigid support member 90 within the above range, the rigid support member 90 can have a smaller thickness dimension while ensuring support rigidity. This allows the flexible connecting plate 20 to form a larger depth after being recessed, saving more space and further improving the space utilization rate of the entire machine.

[0106] In some embodiments of this invention, the flexible connecting plate 20 is provided with binding marking points, and the rigid support member 90 is made of a transparent or semi-transparent material. This allows the binding marking points of the flexible connecting plate 20 to be observed through the rigid support member 90 without affecting the bonding between the flexible connecting plate 20 and the printed circuit board 30 and the non-display part 12.

[0107] In some embodiments of this utility model, such as Figure 17 As shown, the flexible connecting plate 20 has binding mark points (not shown), and the rigid support member 90 has multiple openings 91, which correspond to the binding mark points of the second binding part 23 and the first binding part 21. In this technical solution, the rigid support member 90 can be made of a non-transparent material with higher strength. The openings 91 on the rigid support member 90 can expose the binding mark points on the flexible connecting plate 20 for alignment when the second binding part 23 and the first binding part 21 are bound together.

[0108] In some embodiments of this utility model, such as Figure 1 , Figure 2 , Figures 4 to 7 , Figure 14 As shown, the display module 100 includes a heat dissipation layer 80, which is disposed on the backlight side of the display unit 11 and is attached to the display unit 11. The printed circuit board 30 and the non-display unit 12 are disposed on the side of the heat dissipation layer 80 away from the display unit 11.

[0109] In the above technical solution, the heat dissipation layer 80 is attached to the display unit 11 and located on the backlight side, which can directly absorb the heat generated by the display unit 11 during operation. Since the display unit 11 is the main heat source of the display module 100, this close-fitting design allows heat to be quickly transferred to the heat dissipation layer 80, and then dissipated through the heat dissipation layer 80, effectively reducing the temperature of the display unit 11 and improving the heat dissipation efficiency of the display module 100. By placing the printed circuit board 30 and the non-display unit 12 on the side of the heat dissipation layer 80 away from the display unit 11, they can avoid being directly affected by the heat from the display unit 11.

[0110] Furthermore, the main body 22 can be supported on the display unit 11 by the heat dissipation layer 80. When the display module 100 is arranged on the whole machine, the position of the main body 22 can provide a support position for the whole machine components. Thus, it can play a supporting role when the finger or stylus presses the area of ​​the display unit 11 corresponding to the main body 22, reducing the large deformation of the display unit 11 and improving the overall reliability of the display panel 10.

[0111] A display device according to an embodiment of the present invention includes a display module 100 of any of the preceding embodiments.

[0112] A display device can refer to any device capable of converting electronic signals into visual images or text information, and may include, but is not limited to, liquid crystal displays, mobile phones, tablet computers, etc. A display device can also be, but is not limited to, foldable displays, candybar displays, etc.; no specific limitations are made here.

[0113] In the above technical solution, by optimizing the spatial layout of the display module 100, the internal space of the display device is more compact, and the available space in the thickness direction of the display device is increased. The area of ​​the flexible connecting plate 20 corresponding to the display module 100 in the display device can accommodate components with larger height dimensions, which can improve the internal space utilization of the display device.

[0114] The following describes a specific embodiment of the display module 100 of the present invention with reference to the accompanying drawings.

[0115] Example 1

[0116] like Figures 1 to 3 As shown, the display module 100 includes: a display panel 10, a printed circuit board 30, a flexible connecting plate 20, a first adhesive layer 40, a first buffer 61, and a heat dissipation layer 80.

[0117] The display panel 10 includes a display section 11 and a non-display section 12. The non-display section 12 is bent and connected to the display section 11, and the non-display section 12 is located on the backlight side of the display section 11.

[0118] A printed circuit board 30 is disposed on the backlight side of the display unit 11. A flexible connecting plate 20 is disposed on the backlight side of the display unit 11 and includes a first bonding portion 21, a main body portion 22, and a second bonding portion 23 connected in sequence. The first bonding portion 21 connects to the printed circuit board 30, and the second bonding portion 23 connects to the non-display unit 12. The main body portion 22 is disposed between the printed circuit board 30 and the non-display unit 12 and is bent towards the display unit 11 relative to the first bonding portion 21 and the second bonding portion 23. An arc-shaped connecting segment 24 is formed between the main body portion 22 and the first bonding portion 21 and the second bonding portion 23, and the connecting segment 24 is inclined relative to the main body portion 22.

[0119] The first adhesive layer 40 is double-sided adhesive and is disposed between the display part 11 and the non-display part 12. The first adhesive layer 40 extends beyond the main body 22 to the side closest to the printed circuit board 30 and is bonded to the main body 22. The first adhesive layer 40 extends to a point where it partially overlaps with the orthographic projection of the first bonding part 21 on the display part 11. The first buffer 61 is foam and is disposed between the first adhesive layer 40 and the first bonding part 21.

[0120] The heat dissipation layer 80 is a heat dissipation film and is provided on the backlight side of the display unit 11. The heat dissipation layer 80 is attached to the display unit 11 and is bonded to the main body 22 through the first adhesive layer 40.

[0121] Example 2

[0122] like Figure 4As shown, the structure of the display module 100 in Embodiment 2 is largely the same as that of the display module 100 in Embodiment 1, except that the display module 100 includes a second adhesive layer 50, which is bonded to the heat dissipation layer 80 and the main body 22. A first space 60 is formed between the first bonding part 21, the connecting section 24, and the printed circuit board 30, and a second space 70 is formed between the second bonding part 23, the connecting section 24, and the flexible connecting plate 20. A first buffer 61 is disposed in the first space 60, and the first adhesive layer 40 extends into the second space 70.

[0123] Example 3

[0124] like Figure 10 As shown, the structure of the display module 100 in Embodiment 3 is largely the same as that of the display module 100 in Embodiment 1, except that the display module 100 further includes a second adhesive layer 50 and a second buffer member 71. The second adhesive layer 50 is bonded to the heat dissipation layer 80 and the main body 22. A first space 60 is formed between the first bonding part 21, the connecting section 24, and the printed circuit board 30, and a second space 70 is formed between the second bonding part 23, the connecting section 24, and the flexible connecting plate 20. The first buffer member 61 is disposed within the first space 60, and the second buffer member 71 is disposed within the second space 70.

[0125] Example 4

[0126] like Figure 12 and Figure 13 As shown, the structure of the display module 100 in Embodiment 4 is largely the same as that of the display module 100 in Embodiment 3. The difference is that the first buffer 61, the second buffer 71, the second adhesive layer 50 and the heat dissipation layer 80 are integrated into one piece and can be supplied as a single unit.

[0127] Example 5

[0128] like Figure 14 As shown, the structure of the display module 100 in Embodiment 5 is largely the same as that of the display module 100 in Embodiment 1. The difference is that the display module 100 does not have a first adhesive layer 40 and a first buffer member 61, and the flexible connecting plate 20 is a pre-formed part with a U-shaped bending structure. The display module 100 also includes a rigid support member 90, which is a sheet-like component with the same shape as the flexible connecting plate 20 and is bonded together.

[0129] It is understood that the display module 100 of the above embodiments one to five provides a higher height space utilization rate for the whole machine and improves the molding problem at the edges of the first binding part 21 and the second binding part 23.

[0130] In the description of this specification, references to terms such as "some embodiments," "optionally," "furthermore," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0131] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A display module, characterized in that, include: The display panel includes a display section and a non-display section, wherein the non-display section and the display section are bent and connected, and the non-display section is disposed on the backlight side of the display section; A printed circuit board, wherein the printed circuit board is disposed on the backlight side of the display unit; A flexible connecting plate is disposed on the backlight side of the display unit and includes a first binding part, a main body part, and a second binding part connected in sequence. The first binding part is connected to the printed circuit board, and the second binding part is connected to the non-display unit. The main body part is disposed between the printed circuit board and the non-display unit and is bent towards the side closer to the display unit relative to the first binding part and the second binding part.

2. The display module according to claim 1, characterized in that, An arc-shaped connecting segment is formed between the main body and the first binding part and the second binding part, and the connecting segment is inclined relative to the main body.

3. The display module according to claim 2, characterized in that, The display module includes a first adhesive layer disposed between the display portion and the non-display portion. The first adhesive layer extends toward the side close to the printed circuit board beyond the main body portion and is bonded to the main body portion.

4. The display module according to claim 3, characterized in that, The orthographic projection of the first adhesive layer on the display portion overlaps with the orthographic projection of the first bonding portion on the display portion; the display module includes a first buffer member, which is disposed between the first adhesive layer and the first bonding portion.

5. The display module according to claim 2, characterized in that, The display module includes a first adhesive layer and a second adhesive layer. The first adhesive layer is disposed between the display part and the non-display part, and the second adhesive layer is disposed between the main body part and the display part. The thickness of the second adhesive layer is less than the thickness of the first adhesive layer.

6. The display module according to claim 5, characterized in that, A first space is formed between the first bonding part, the connecting segment, and the printed circuit board; a second space is formed between the second bonding part, the connecting segment, and the flexible connecting plate; the display module includes a first buffer and a second buffer, the first buffer being disposed in the first space and the second buffer being disposed in the second space.

7. The display module according to claim 6, characterized in that, The display module includes a heat dissipation layer disposed on the backlight side of the display unit and attached to the display unit. The first buffer, the second buffer, and the second adhesive layer are integral with the heat dissipation layer. The printed circuit board and the first adhesive layer are disposed on the side of the heat dissipation layer facing away from the display unit.

8. The display module according to claim 5, characterized in that, A first space is formed between the first bonding part, the connecting segment, and the printed circuit board; a second space is formed between the second bonding part, the connecting segment, and the flexible connecting plate; the display module includes a first buffer member disposed within the first space; and the first adhesive layer extends into the second space.

9. The display module according to claim 2, characterized in that, The flexible connecting plate is a pre-formed part, and the display module includes a rigid support member. The rigid support member has the same shape as the flexible connecting plate, and the rigid support member is attached to and connected to the flexible connecting plate.

10. The display module according to any one of claims 1 to 6, 8, and 9, characterized in that, The display module includes a heat dissipation layer disposed on the backlight side of the display unit and attached to the display unit. The printed circuit board and the non-display unit are disposed on the side of the heat dissipation layer away from the display unit.

11. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 10.