Multi-temperature-zone chip mounting equipment

Abstract

The utility model relates to the technical field of semiconductor mounting, and provides a multi-temperature-zone chip mounting device, which comprises a multi-temperature-zone vacuum heating table device and a temperature control system, the multi-temperature-zone vacuum heating table device comprises a vacuum heating disc, a cooling disc and a heat insulation assembly, the vacuum heating disc is provided with at least one vacuum heating table, and the cooling disc is provided with at least one heat insulation assembly. The vacuum heating table comprises an internal temperature sensor and a heating element; the cooling disc is controlled by the temperature control system to reduce the temperature of the vacuum heating disc through a cooling medium; the temperature control system comprises a temperature controller and an external temperature sensor, and the temperature controller controls the heating power of the heating element according to an external temperature signal from the external temperature sensor and an internal temperature signal from the internal temperature sensor. According to the scheme, multi-temperature-zone control is carried out by taking the vacuum heating table as a unit, and the temperature controller simultaneously controls the heating power of the heating element and the flux of the cooling medium, so that the surface temperature of the vacuum heating table can be regulated and controlled more quickly.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor mounting technology, specifically relating to a multi-temperature zone chip mounting device. Background Technology

[0002] Chip mounting equipment is a key piece of equipment in semiconductor manufacturing and electronic device assembly. Its main function is to accurately and efficiently mount chips to designated locations. With the trend of miniaturization and integration of electronic devices, higher requirements are placed on the accuracy, speed, and stability of chip mounting equipment.

[0003] Existing chip mounting equipment typically includes a heating stage module to preheat the chip or substrate before mounting and to provide necessary temperature control during the mounting process. The heating stage module includes a preheating stage, a heating worktable, a vacuum adsorption structure, a vision positioning structure, and a cooling worktable. The vision positioning system determines the current mounting position and target mounting position of the chip. The vacuum adsorption structure stably mounts the chip from its current position to the target mounting position on the PCB board. The preheating stage preheats the chip to a suitable mounting temperature range before mounting. The heating worktable precisely controls the temperature and monitors the heating status during the mounting process based on user-input heating control commands. The cooling stage provides a cooling medium and heat dissipation structure to achieve rapid and uniform cooling of the PCB board and electronic components after mounting.

[0004] In current chip bonding equipment, the high-temperature disk module in the heating stage often requires a corresponding increase in the size of the heating stage when dealing with large-size, high-volume chip products, resulting in poor temperature uniformity. Because of inaccurate temperature control, poor temperature uniformity, and the lack of active heat dissipation, the chip substrate edges are prone to warping and deformation, affecting bonding quality and soldering results. Furthermore, the cooling stage requires a separate cooling module, increasing the overall size of the equipment. Utility Model Content

[0005] To address the issue that when dealing with large-sized and numerous chip products, the heating stage in a chip bonding apparatus needs to be enlarged simultaneously, resulting in a drop in temperature and potentially causing chip edge warping and deformation, thus affecting bonding quality and soldering performance, this application provides a multi-temperature zone vacuum heating stage device and a multi-temperature zone chip bonding equipment.

[0006] The multi-temperature zone vacuum heating stage device and multi-temperature zone chip mounting equipment provided in this application adopt the following technical solutions:

[0007] A multi-zone chip mounting apparatus includes a multi-zone vacuum heating stage device 10 and a temperature control system 20. The multi-zone vacuum heating stage device includes a vacuum heating plate 11, a cooling plate 12, and a heat insulation component 13. The vacuum heating plate 11 has at least one vacuum heating stage 110, which includes an internal temperature sensor 111 and a heating element 112. The cooling plate 12 is located below the vacuum heating plate 11 and is used to reduce the temperature of the vacuum heating plate 11 by means of a cooling medium under the control of the temperature control system 20. The temperature control system 20 includes a temperature controller 21 and an external temperature sensor 22. The temperature controller 21 controls the heating power of the heating element 112 based on the external temperature signal from the external temperature sensor 22 and the internal temperature signal from the internal temperature sensor 21.

[0008] By adopting the above technical solution, the temperature control system 20 independently controls the temperature of each vacuum heating stage 110 in the vacuum heating plate 11 through the temperature controller 21, and controls the on / off state and working power of the circuit where the heating element 112 inside the vacuum heating stage 110 is located based on the external temperature signal measured on the surface of the vacuum heating stage 110 and the external temperature signal measured inside the vacuum heating stage 110.

[0009] The multi-zone vacuum heating stage device 10 in this invention integrates the functions of a traditional preheating plate, cooling plate, and heating plate. By precisely controlling the heating elements 112 of each vacuum heating stage 110, it achieves both chip preheating and heating functions. In other words, the vacuum heating plate 11 in this invention not only meets the high-temperature requirements of the mounting process but also functions as a preheating plate, effectively reducing the design size, improving mounting process efficiency, and lowering energy consumption. Furthermore, in this invention, both the vacuum heating plate 11 and the cooling plate 12 are designed as independent structures, allowing for replacement of the vacuum heating plate 11 according to product requirements, facilitating maintenance.

[0010] Optionally, the vacuum heating plate 11 has a plurality of vacuum heating stages 110, and there are gaps between the vacuum heating stages 110, the gaps being 0.1mm to 0.2mm; the heating element 112 is a heating rod, and the heating rods are distributed according to a preset position to ensure that the external temperature signal of the vacuum heating stage 110 meets the temperature uniformity rule, and the internal temperature sensor 111 is located in the middle of all the heating rods.

[0011] By adopting the above technical solution, since the temperature control system 20 regulates temperature on a unit basis (vacuum heating stage 110), the vacuum heating plate 11 in this case is divided into multiple vacuum heating stages 110, enabling different vacuum heating stages 110 to operate in different temperature environments. That is, the vacuum heating plate 11 is set as a multi-temperature zone independent structure, realizing independent temperature control of a single temperature zone; and gaps are set between each vacuum heating stage 110 to reduce temperature interference between them. The heating element 112 can be one or more heating rods, and the preset position of the heating rods is calculated through simulation to ensure the temperature uniformity of the heating stage surface.

[0012] Optionally, the heating element includes two heating rods, and the internal temperature sensor 111 is installed inside the vacuum heating stage 110, with the axis of the internal temperature sensor 111 and the axis of the heating rods in the same plane.

[0013] By adopting the above technical solution, and by limiting the position of the internal temperature sensor 111, the internal temperature signal generated by the internal temperature sensor 111 can fully represent the temperature inside the vacuum heating stage 110 when the heating rod is working.

[0014] Optionally, the upper surface of the vacuum heating stage 110 is provided with a matrix of vacuum adsorption holes 113, the vacuum heating stage is provided with vacuum holes 114, and the lower surface of the vacuum heating stage 110 is provided with vacuum connection holes 115. The vacuum holes 114 connect the vacuum adsorption holes 113 and the vacuum connection holes 115 to form a vacuum adsorption circuit.

[0015] The vacuum heating table 110 is also provided with a sealing ring positioning groove 116 coaxial with the vacuum connection hole 115. The cooling plate 12 is provided with a vacuum sealing groove 121 and a vacuum sealing ring 122. The vacuum sealing ring 122 is coaxially connected with the vacuum sealing groove 121 and the vacuum connection hole 115 and is in contact with the inner wall of the sealing ring positioning groove 116 to form a vacuum sealing structure.

[0016] By adopting the above technical solution, the vacuum connection hole 115, vacuum hole 114, and vacuum adsorption hole 113 constitute a vacuum adsorption circuit. This vacuum adsorption circuit is used to adsorb the chip, wafer, or substrate to be heated onto the upper surface of the vacuum heating stage 110 in a vacuum environment through the pressure between the vacuum and the outside. The vacuum connection hole 115, sealing ring positioning groove 116, vacuum sealing ring 122, and vacuum sealing groove 121 constitute a vacuum sealing structure between the vacuum heating stage 110 and the cooling plate 12, ensuring vacuum performance, isolating temperature interference between the various vacuum heating stages 110, reducing the heat transferred downward by the vacuum heating stage 110, and reducing the temperature gradient of the integrated cooling plate 12. This reduces the influence of the temperature gradient of the cooling plate 12 on the vacuum heating stage 110 and ensures the temperature uniformity of the single-area vacuum heating stage.

[0017] Optionally, the lower surface of the vacuum heating stage 110 is provided with an active heat dissipation groove 117, and the vacuum hole 114 is a concealed hole.

[0018] By adopting the above technical solution, the setting of the active heat dissipation groove 117 increases the heat dissipation area of ​​the vacuum heating plate, ensuring that the heat dissipation rate meets the cooling speed requirements of the vacuum heating plate 11. At the same time, it reduces the contact area between the vacuum heating plate 11 and the heat insulation plate 131, increases the contact thermal resistance between the vacuum heating plate 11 and the cooling plate 12, and sets the vacuum hole 114 as a dark hole to ensure the sealing of the vacuum hole 114.

[0019] Optionally, the vacuum heating plate 11 is provided with a first vacuum passage hole 118, which connects to all the vacuum connection holes 115; the cooling plate 12 is provided with a second vacuum passage hole 123 that connects to all the vacuum sealing grooves 121, and the first vacuum passage hole 118, the vacuum connection holes 115, the vacuum sealing ring 122, the vacuum sealing grooves 121, and the second vacuum passage hole 123 constitute a vacuum circuit.

[0020] By adopting the above technical solution, the first vacuum air passage 118 in the vacuum heating plate 11, which is connected to the vacuum adsorption circuit, and the portion of the vacuum heating plate 11 in the vacuum sealing structure constitute the vacuum flow channel of the vacuum heating plate. In the cooling plate 12, the second vacuum air passage 123 and the portion of the cooling plate 12 in the vacuum sealing structure constitute the vacuum flow channel in the cooling plate 12. The vacuum flow channels of the two components, the vacuum heating plate 11 and the cooling plate 12, together constitute a vacuum circuit, ensuring the vacuum adsorption function of the vacuum heating stage 110, while reducing thermal crosstalk between vacuum heating stages 110 in different temperature zones caused by the integrated vacuum flow channel.

[0021] Optionally, the cooling plate 12 is provided with a cooling medium inlet 124, a cooling medium outlet 125, and a heat dissipation groove 126. The cooling medium inlet 124 is used to receive cooling medium from the outside, and the cooling medium outlet 125 is used to adjust the flow rate of cooling medium under the control of the temperature controller 21. The cooling medium inlet 124, the cooling medium outlet 125, and the heat dissipation groove 126 constitute a cooling medium circulation channel.

[0022] By adopting the above technical solution, the temperature controller 21 can simultaneously control the flow rate of the cooling medium from the external pipe into the cooling plate 12 through the cooling medium inlet 124, and the flow rate of the cooling medium from the cooling medium outlet 125 into each section of the cooling plate 12 through the heat dissipation slot 126, thereby realizing the cooling cycle control of the cooling plate 12.

[0023] Optionally, the cooling plate 12 is further provided with a vacuum input hole 127 and a vacuum output hole 128. The vacuum output hole 128 is coaxial with the vacuum sealing groove 121. The vacuum input hole 127, the second vacuum air passage hole 123 and the vacuum output hole 128 constitute the cooling plate vacuum flow channel sub-circuit in the vacuum circuit.

[0024] By adopting the above technical solution, the external vacuum device, through the cooling input hole 127, the second vacuum air passage hole 123, and the vacuum output hole 128, forms a vacuum flow channel sub-loop of the cooling plate, which, combined with the vacuum sealing structure and the vacuum adsorption circuit in the vacuum heating plate, together constitutes a vacuum environment. In this vacuum environment, chips, wafers, or substrates are adsorbed through the vacuum adsorption holes 113 in the vacuum heating plate 11, so that the chips, wafers, or substrates are in close contact with the vacuum heating stage 110 of the corresponding temperature zone in the vacuum heating plate 11.

[0025] Optionally, the heat insulation assembly 13 includes a heat insulation plate 131 and a heat insulation base 132. The heat insulation plate 131 is provided with a through heat dissipation groove 133, and the cooling plate 12 is provided with a heat dissipation groove sealing hole 129. The heat dissipation groove 133 cooperates with the heat dissipation groove sealing hole 129. The heat insulation plate 131 is provided with a mounting through hole 134 in the circumferential direction.

[0026] By adopting the above technical solution, the heat insulation plate 131 and the cooling plate 12 cooperate with each other to ensure the sealing of the heat dissipation medium. At the same time, these mounting through holes 134 also ensure that the heat insulation plate 132 can be firmly connected to the vacuum heating plate 11 and tightly connected to the cooling plate 12.

[0027] Optionally, the side wall of the vacuum heating stage has a wiring groove 31 corresponding to the heating element 112 and the internal temperature sensor 111, and the heat insulation base 132 is provided with a wire groove 33, which is on the same side as the wiring groove 31; the heat insulation base 132 is also provided with a threaded mounting bracket, and there are three mounting brackets.

[0028] By adopting the above technical solution, the wiring of each heating element 112 and the internal temperature sensor 111 can be routed through the wiring channel 31 and the side channel of the heat insulation base 132 to the wire channel 32, ensuring that the wiring of the heating element 112 and the internal temperature sensor 111 can be kept away from high-temperature areas and avoiding premature aging of the wiring. The mounting base of the heat insulation base 132 is designed to maximize the heat dissipation efficiency of the heat insulation base.

[0029] In summary, this application includes at least one of the following beneficial technical effects:

[0030] 1. In the multi-temperature zone chip mounting equipment, the vacuum heating plate 11 and the cooling plate 12 are independent structures. The structure of the vacuum heating plate 11 can be replaced according to product requirements, which improves the quality stability of components, is easy to operate, easy to disassemble and maintain, and reduces maintenance costs.

[0031] 2. In the multi-temperature zone chip mounting equipment, the heating elements 112 of each vacuum heating stage 110 in the vacuum heating plate 11 can be independently controlled by the temperature control system 20 to achieve independent temperature control of multiple temperature zones. Furthermore, each vacuum heating stage 110 in each temperature zone can ensure uniform heating, rapid heating and cooling, and vacuum adsorption fixation.

[0032] 3. The multiple vacuum heating stages 110 in the vacuum heating plate 11 are not in direct contact with each other and are independent structures, which ensures that there is no temperature interference between the vacuum heating stages.

[0033] 4. In this design, the vacuum circuit is configured as a multi-segment system. In the vacuum heating stage 110, the vacuum adsorption hole 113, vacuum hole 11, first vacuum air passage hole 118, and vacuum connection hole 115 constitute an independent vacuum flow channel for the vacuum heating stage 110. The vacuum input hole 127, second vacuum air passage hole 123, and vacuum output hole 128 of the cooling plate 12 constitute an independent cooling plate vacuum flow channel sub-circuit for the cooling plate 12. This cooling plate vacuum flow channel sub-circuit, the vacuum sealing structure, and the independent vacuum flow channel of the vacuum heating stage 110 together constitute the overall vacuum circuit.

[0034] An external vacuum device is used to draw a vacuum through the vacuum input port 127, so that the entire vacuum circuit is in a vacuum state. Then, chips, wafers or substrates are adsorbed through the vacuum adsorption port 113, so that they are tightly attached to the vacuum heating plate 11. The vacuum heating plate 11 heats them to achieve the suitable mounting temperature range in the preheating state, the optimal mounting temperature range in the heating state, and the predetermined cooling temperature after mounting.

[0035] 5. Double-layer insulation is achieved through the heat insulation plate 131 and the cooling plate 12, which effectively reduces the heat energy transmitted downward from the vacuum heating stage 110. After passing through the cooling plate 12 and the heat insulation plate 131, the heat energy is transmitted back and affects other vacuum heating stages 110, thereby reducing temperature crosstalk between vacuum heating stages 110 and ensuring the uniformity of the surface temperature indicated by the external temperature signal of the working surface of the vacuum heating plate 11 in the corresponding temperature zone of the vacuum heating stage 110.

[0036] 6. The temperature controller 21 in this case can simultaneously control multiple heating rods of the heating element 112 in each vacuum heating stage 110, and can also control the flow rate of the cooling medium in the cooling plate 12, realizing dual control of temperature control and cooling control, which can improve the overall control response capability of the working surface adjustment of the vacuum heating stage 110. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the modules of the multi-temperature zone chip mounting equipment provided in this case;

[0038] Figure 2 A schematic diagram of the multi-temperature zone chip mounting equipment provided for this case;

[0039] Figure 3 for Figure 2 Exploded view of a multi-temperature zone chip mounting equipment;

[0040] Figure 4 for Figure 2 A cross-sectional view of the medium vacuum heating stage along its length;

[0041] Figure 5 for Figure 2 A schematic diagram showing the connection between the medium vacuum heating stage and the cooling plate;

[0042] Figure 6 for Figure 2 Perspective view of the lower surface of the medium vacuum heating stage;

[0043] Figure 7 for Figure 2 A schematic diagram of wiring channels in a medium vacuum heating stage;

[0044] Figure 8 for Figure 2 Top view of the central heat insulation base;

[0045] Figure 9 This is a schematic diagram of the vacuum flow channel sub-circuit in the cooling plate;

[0046] Figure 10 Perspective view of the top of the cooling tray;

[0047] Figure 11 This is a schematic diagram of the top of the cooling tray;

[0048] Figure 12 This is a schematic diagram of the thermal insulation component. Detailed Implementation

[0049] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by one of ordinary skill in the art to which this utility model pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed following the word and its equivalents, but does not exclude other elements or objects.

[0050] This utility model provides a multi-temperature zone chip mounting device, referenced... Figure 1 As shown, the device includes a multi-zone vacuum heating stage 10 and a temperature control system 20. The temperature control system 20 includes a temperature controller 21 and an external temperature sensor 22. The multi-zone vacuum heating stage 10 includes a vacuum heating plate 11, a cooling plate 12, and a heat insulation component 13. The cooling plate 12 is located below the vacuum heating plate 11 and, under the control of the temperature control system 20, reduces the temperature of the vacuum heating plate 11 through a cooling medium. The heat insulation component 13 is used to isolate the temperature transfer between the vacuum heating plate 11 and the cooling plate 12. The vacuum heating plate 11 has at least one vacuum heating stage 110, which includes an internal temperature sensor 111 and a heating element 112. The temperature control system 20 includes a temperature controller 21 and an external temperature sensor 22. The temperature controller 21 controls the heating power of the heating element 112 based on the external temperature signal from the external temperature sensor 22 and the internal temperature signal from the internal temperature sensor 21.

[0051] In this case, the temperature control system 20 operates on a unit basis, the vacuum heating stage 110. It changes the on / off state and operating power of the circuit containing the heating element 112 within the vacuum heating stage 110, and adjusts the flow rate of the cooling medium in the cooling plate 12 to change the heat dissipation efficiency of the vacuum heating stage 110. This allows the temperature controller 21 to independently control the temperature of each vacuum heating stage 110 within the vacuum heating plate 11. Furthermore, both the vacuum heating plate 11 and the cooling plate 12 are designed as independent structures, allowing for replacement of the vacuum heating plate 11 according to product requirements, facilitating maintenance. Simultaneously, the temperature of the vacuum heating stage 110 is accurately controlled by the temperature control system 20, enabling it to perform the functions of traditional preheating and heating plates, thus achieving structural simplification.

[0052] In one embodiment, continue to refer to Appendix Figure 1 The temperature controller 21 has a first input terminal, a second input terminal, a temperature control terminal, and a flow control terminal. The first input terminal is connected to an external temperature sensor 22 to obtain the external temperature signal of the vacuum heating stage. The second input terminal is connected to an internal temperature sensor 111 to obtain the internal temperature signal of the vacuum heating stage 110. The temperature control terminal is connected to the circuit where the heating element 112 is located to transmit the heating control signal. The flow control terminal is connected to the cooling plate 12 to transmit the flow control signal.

[0053] The temperature controller 21 obtains the external temperature value based on the external temperature signal, the internal temperature value based on the internal temperature signal, and the temperature difference value based on the difference between the external and internal temperature values. Based on the temperature difference value, it obtains the heating control signal and the flow control signal. The temperature controller 21 uses the heating control signal to change the on / off state of the circuit containing the heating element 112 in the corresponding vacuum heating stage 110 and to change the heating power of the heating element 112. Specifically, this can be achieved by increasing or decreasing the current supplied to the heating element 112, or by directly disconnecting the circuit containing the heating element 112, etc.

[0054] The temperature controller 21 changes the flow rate of the cooling medium in the cooling plate 12 through the flow control signal. As the cooling medium flows through the cooling plate 12, the temperature of the cooling plate 12 drops, thereby providing active cooling for the vacuum heating plate 11. This ensures that the temperature of the lower surface of the entire device is within a safe temperature range when the vacuum heating plate 11 is in high-temperature working condition.

[0055] In one embodiment, reference Figure 2 and Figure 3 As shown, the vacuum heating plate 11 has multiple vacuum heating stages 110, and there are gaps between adjacent vacuum heating stages 110. Figure 2 (The text in bold is a diagram). The vacuum heating plate 11 is divided into multiple vacuum heating stages 110, and the temperature control system 20 regulates the temperature on a per-stage basis. Therefore, this invention can control different vacuum heating stages 110 to operate at different temperatures through the temperature control system 20. This allows different vacuum heating stages 110 to operate in different temperature environments; that is, the vacuum heating plate is set as a multi-temperature-zone independent structure to achieve independent temperature control for each zone. Furthermore, gaps are provided between each vacuum heating stage 110 to reduce temperature interference between them.

[0056] by Figure 3For example, the vacuum heating plate 11 has four vacuum heating stages 110. From left to right, the first and fourth vacuum heating stages 110 do not have chips to be heated, and the circuit of the heating element 112 in these stages is disconnected under the control of the temperature controller 21, so the vacuum heating stage 110 is not working. The chip on the second vacuum heating stage 110 is still in a preheating state, and the heating element 112 in this stage operates at the corresponding preheating power under the control of the temperature controller 21, preheating the chip to facilitate subsequent placement. During chip placement on the third vacuum heating stage 110, the heating element 112 operates at the corresponding heating power under the control of the temperature controller 21, heating the chip to ensure the placement process proceeds smoothly. The gap between adjacent vacuum heating stages 110 is between 0.1mm and 0.2mm. Here, the chip can be replaced with wafers, substrates, or other electronic devices that need to be mounted.

[0057] In one embodiment, reference is made to the appendix. Figure 3 As shown, heating elements 112 are embedded in each vacuum heating stage 110. Each vacuum heating stage 110 is a temperature controller 21 that controls the temperature through the heating elements 112 and the cooling plate 12 matched with the vacuum heating stage 110.

[0058] Each vacuum heating stage 110 contains two heating elements 112. These heating elements are distributed according to preset positions to ensure that the external temperature signal of the vacuum heating stage 110 meets the temperature uniformity rule. In other words, the positions of the heating elements are determined through simulation calculations, and this positioning ensures that the surface temperature of the vacuum heating stage 110 is uniform (i.e., meets the temperature uniformity rule). For example, refer to the attached... Figure 2 and attached Figure 3 As shown, from left to right, in the first vacuum heating stage 110, the length direction of the two heating rods is left-right, and the two heating rods are arranged one in front of the other; in the second vacuum heating stage 110, the direction of the two heating rods is front-back, and the two heating rods are arranged one on the left and one on the right; in the third vacuum heating stage 110, the direction of the two heating rods is front-back, and the two heating rods are arranged one on the left and one on the right; in the fourth vacuum heating stage 110, the length direction of the heating rods is left-right, and the two heating rods are arranged one in front of the other.

[0059] The sensing end of the internal temperature sensor 111 is located in the middle of all the heating rods inside the vacuum heating stage 110 to ensure that the operating temperature of the two heating rods is collected as much as possible. Figure 3 The internal temperature sensor 111 is elongated and is installed between the two heating rods. The axis of the internal temperature sensor 111 is on the same horizontal plane as the axis of the two heating rods.

[0060] The internal temperature sensor 111 generates an internal temperature signal based on the internal temperature of the vacuum heating stage 110 and transmits the internal temperature signal to the first input terminal of the temperature controller 21 in the form of an electrical signal. The external temperature sensor 22 is usually a contact temperature sensor. The external temperature sensor 22 generates an external temperature signal based on the temperature of the outer surface of the vacuum heating stage 110 and transmits the external temperature signal to the second input terminal of the temperature controller 21 in the form of an electrical signal.

[0061] The temperature controller 21 is preset with a temperature offset, which represents the change in the heating control signal and the change in the flow control signal corresponding to a unit increase in temperature. Therefore, the temperature controller 21 obtains a heating control signal based on the temperature difference between the external and internal temperature values, combined with the temperature offset, to control the circuit where the heating rod is located, ensuring that the surface of the heating table is within the preset operating temperature range corresponding to the preheating / heating working state. It also obtains a flow control signal, which changes the flow rate of the cooling medium in the cooling plate 12 through the flow meter integrated in the temperature controller 21, so that the cooling medium circulates in the cooling medium circulation channel composed of the "cooling medium inlet 124, cooling medium outlet 125 and heat dissipation groove 126".

[0062] In one embodiment, reference Figure 2 , Figure 3 As shown, the upper surface of the vacuum heating stage 110 is provided with a matrix of vacuum adsorption holes 113, for reference. Figure 4 As shown, the vacuum heating stage 110 is provided with a vacuum hole 114 and a first vacuum air passage hole 118. Both the vacuum hole 114 and the first vacuum air passage hole 118 are concealed holes. The length direction of the vacuum hole 114 is the front-to-back direction, and the number of vacuum holes 114 is related to the number of columns in the array formed by the vacuum adsorption holes 113. The length direction of the first vacuum air passage hole 118 is the left-to-right direction, and the number of first vacuum air passage holes 118 is related to the number of rows in the array formed by the vacuum adsorption holes 113. The lower surface of the vacuum heating stage 110 is provided with a vacuum connection hole 115. The vacuum hole 114 connects upward to the vacuum adsorption hole 113, connects to the first vacuum air passage hole 118 to the left and right, and connects downward to the vacuum connection hole 115. Therefore, the vacuum adsorption hole 113, the vacuum hole 114, and the vacuum connection hole 115 constitute a vacuum adsorption circuit, which is an independent vacuum flow channel of the vacuum heating stage 110.

[0063] In one embodiment, reference Figure 5As shown, the bottom of the vacuum heating stage 110 is also provided with a sealing ring positioning groove 116 coaxial with the vacuum connection hole 115. The top of the cooling plate 12 is provided with a vacuum sealing groove 121. The top of the cooling plate 12 is also provided with a vacuum sealing ring 122. The vacuum sealing ring 122 has no direct contact with any of the vacuum heating stages 110 in the vacuum heating plate 11. The vacuum sealing ring 122 is coaxial with the vacuum sealing groove 121. The vacuum sealing ring 122 is made of heat insulation material, preferably polyimide with low thermal conductivity.

[0064] This example reduces the contact area between the vacuum heating plate 11 and the cooling plate 12, thereby reducing the heat transferred from the vacuum heating plate 11 to the cooling plate 12 during operation, since the cooling plate 12 is a one-piece structure. In this example, because the cooling plate 12 is a one-piece structure, this design reduces the heat transferred downwards from each vacuum heating stage 110 in the vacuum heating plate 11, reduces the temperature gradient of the cooling plate 12, indirectly reduces the influence of the temperature gradient of the vacuum heating plate 11 on the cooling plate 12, and ensures the temperature uniformity of each vacuum heating stage 110 in the vacuum heating plate 11.

[0065] Furthermore, the top of the vacuum sealing ring 122 is in line contact with the sealing ring positioning groove 116 of the vacuum heating plate 11, and an O-ring mounting groove is formed between the vacuum sealing ring 122 and the sealing ring positioning groove 116. An O-ring 119 is set in the O-ring mounting groove, and the O-ring 119 is made of high temperature resistant material.

[0066] The sealing ring positioning groove 116, the O-ring 119, the vacuum sealing ring 122, and the sealing ring positioning groove 116 together constitute the vacuum sealing structure (vacuum sealing channel) between the vacuum heating table 110 and the cooling plate 12.

[0067] In one embodiment, reference is made to the appendix. Figure 6 As shown, the lower surface of the vacuum heating stage 110 is provided with an active heat dissipation groove 117, which increases the heat dissipation area, ensures that the heat dissipation rate meets the cooling speed requirements of the heating plate, reduces the contact area between the vacuum heating plate 11 and other components, increases the contact thermal resistance between the vacuum heating plate and the cooling plate, reduces the heat transferred downward by each vacuum heating stage 110 in the vacuum heating plate 11, reduces the temperature gradient of the cooling plate 12, indirectly reduces the influence of the temperature gradient of the vacuum heating plate 11 on the cooling plate 12, and ensures the temperature uniformity of a single vacuum heating stage 110 in the vacuum heating plate 11.

[0068] In one embodiment, reference Figure 6 and Figure 7 As shown, the side wall of the vacuum heating stage 110 is also provided with multiple wiring slots 31. These wiring slots 31 correspond to the heating element 112 and the internal temperature sensor 111. The wiring of the heating element 112 and the internal temperature sensor 111 are all led out from the wiring slots 31.

[0069] refer to Figure 1 and Figure 2 As shown, the heat insulation component 13 includes a heat insulation plate 131 and a heat insulation base 132. The heat insulation plate 131 is disposed between the vacuum heating stage 110 and the cooling plate 12 to increase the thermal resistance between the vacuum heating stage 110 and the cooling plate 12, so as to ensure that the temperature of each vacuum heating stage 110 in the vacuum heating stage 11 will not be affected by each other when the temperature is controlled independently.

[0070] refer to Figure 7 and Figure 8 As shown, the bottom of the heat insulation base 132 has a side groove and a wire groove 33 that are interconnected. The side groove and the wiring groove 31 are located on the same side to facilitate the routing of the heating element 112 and the internal temperature sensor 111. After passing through the wiring groove 31, the wires run along... Figure 3 The side groove at the bottom of the heat insulation base 132 shown enters the wire groove 33 at the bottom of the heat insulation base 132.

[0071] refer to Figure 6 As shown, the lower surface of the vacuum heating stage 110 is also provided with positioning bolt holes 30, which facilitates the connection of the cooling plate 12 to the vacuum heating plate 11 by bolt connection.

[0072] In one embodiment, reference Figure 9 and Figure 10 As shown, the cooling plate 12 has a second vacuum passage hole 123, which is a concealed hole. The cooling plate 12 also has a vacuum input hole 127 and a vacuum output hole 128. The vacuum output hole 128 is coaxial with the vacuum sealing groove 121. The vacuum input hole 127, the second vacuum passage hole 123, and the vacuum output hole 128 constitute a vacuum flow channel sub-loop of the cooling plate. The position of the vacuum input hole 127 is arbitrary and is used to allow external vacuum equipment to be connected.

[0073] In the vacuum heating plate 11, the vacuum adsorption hole 113, vacuum hole 114, first vacuum air passage hole 118, and vacuum connection hole 115 constitute the vacuum flow channel sub-circuit of the heating plate. The vacuum connection hole 115, O-ring 119, sealing ring positioning groove 116, vacuum sealing ring 122, and vacuum sealing groove 121 constitute the vacuum sealing structure. The vacuum flow channel sub-circuit of the heating plate, the vacuum sealing structure, and the vacuum flow channel sub-circuit of the cooling plate together constitute the vacuum circuit. That is to say, the first vacuum air passage hole 118 and vacuum connection hole 115 of the vacuum heating plate 11, and the vacuum sealing ring 122, vacuum sealing groove 121, vacuum output hole 128, and second vacuum air passage hole 123 of the cooling plate 12 constitute the vacuum circuit.

[0074] In one embodiment, continue to refer to the appendix. Figure 10 and Figure 11As shown, the cooling plate 12 is provided with a cooling medium inlet 124, a cooling medium outlet 125, and a heat dissipation groove 126. The cooling medium inlet 124 is used to receive cooling medium from the outside, and the cooling medium outlet 125 is used to adjust the flow rate of the cooling medium under the control of the temperature controller 21.

[0075] While the vacuum heating plate 11 begins heating, the cooling plate 21 continuously receives cooling gas as a cooling medium through an external pipe and cooling medium inlet 126. This cooling gas circulates within the cooling plate 12 along its internal zones, specifically along the cooling medium circulation channels of the cooling medium inlet 124, cooling medium outlet 125, and heat dissipation groove 126. This enhances the thermal insulation performance of the cooling plate 21, preventing heat from the upper vacuum heating plate 11 from being transferred to the outside or other unrelated vacuum heating stage 110, thus avoiding injury to components and personnel, and improving the independent temperature control performance of the vacuum heating stage 110.

[0076] In one embodiment, reference Figure 2 and Figure 12 As shown, the heat insulation component 13 includes a heat insulation plate 131 and a heat insulation base 132. The heat insulation plate is a separate and independent structure, located between the vacuum heating plate 11 and the cooling plate 12, and is used to increase the thermal resistance between the vacuum heating plate 11 and the cooling plate 12.

[0077] The heat insulation base 132 is installed on the lower surface of the cooling plate 12 to ensure that the working temperature of this patented device meets the temperature design requirements. At the same time, it reduces the contact area between the leads of the heating element 112 and the internal temperature sensor 111 and the high-temperature area of ​​the vacuum heating plate 11, thus avoiding circuit failure caused by high temperature.

[0078] The heat insulation plate 132 uses polyimide heat insulation material to increase the direct contact thermal resistance between the vacuum heating plate 11 and the cooling plate 12, reduce heat transfer between the plate surfaces, and play a certain role in heat insulation. At the same time, it reduces thermal crosstalk between the vacuum heating plate 11 and the cooling plate 12. The size of the heat insulation plate 132 is set according to the structural dimensions of the vacuum heating table 110. The heat insulation plate 131 has mounting through holes 134 around its circumference. The mounting through holes 134 are usually fastening bolt through holes, used to fix the heat insulation plate 132 to the upper vacuum heating plate 11 and the lower cooling plate 12 to ensure the installation position.

[0079] Furthermore, refer to Figure 12 As shown, the heat insulation plate 131 has a through heat dissipation groove 133, for reference. Figure 11 As shown, the cooling plate 12 is provided with a heat dissipation groove sealing hole 129. The heat dissipation groove 133 cooperates with the heat dissipation groove sealing hole 129 to form a heat dissipation sealing structure, ensuring the sealing of the heat dissipation medium.

[0080] The heat insulation base 132 also uses polyimide heat insulation material. A wire channel 33 is designed on the bottom of the heat insulation base 132, allowing the wiring of each module to be concentrated on one side of the structure according to the equipment design requirements, facilitating installation and use. Due to the special properties of the material, the heat insulation base 132, while meeting high-temperature resistance requirements, increases the temperature gradient between the cooling plate 12 and the mounting bracket, ensuring the temperature requirements of the installation contact surface of the multi-temperature zone vacuum heating component.

[0081] In this multi-temperature zone chip mounting equipment, during the chip mounting process, the vacuum heating stage 110 is used as a unit for independent temperature control of each zone. Areas not yet being mounted are heated to the pre-temperature zone by the vacuum heating stage 110; mounted areas are heated to the high-temperature zone; and areas where mounting has been completed are cooled to the cooling zone. Wafers or substrates are placed above the vacuum heating plate 110, and an external vacuum device... Figure 9 The vacuum input port 127 shown provides a vacuum environment through a vacuum circuit, and the wafer or substrate is adsorbed through the vacuum adsorption port 113 in the vacuum heating plate 11, so that the wafer or substrate is tightly attached to the vacuum heating plate 11.

[0082] Under the control of the temperature controller 21, the vacuum heating plate 11 uses a heating rod as the heating element 112 for heating, ensuring temperature uniformity across all vacuum heating surfaces during operation. The vacuum heating stage 110 heats the product being mounted via heat conduction. The heat insulation plate 12 below the vacuum heating plate reduces thermal crosstalk between different temperature zones of the vacuum heating stage 110, further ensuring temperature uniformity of the vacuum heating stage 110 during the mounting process.

[0083] While the vacuum heating plate 11 starts heating, the cooling plate 12 continuously receives cooling gas from the external pipe through the cooling medium inlet hole 124. The cooling gas flows in the partitioned circulation channel inside the cooling plate 12. The cooling plate 12 as a whole plays a role in heat insulation, preventing the heat from the upper vacuum heating plate 11 from being transferred to the outside, thus avoiding damage to external components and personnel.

[0084] Before mounting, the vacuum heating plate 11 heats to the preheating zone temperature point to preheat the substrate or wafer, bringing it to a suitable mounting temperature range, thereby improving mounting quality and efficiency. During mounting, the high-temperature working area of ​​the vacuum heating stage 110 continues to heat, while the cooling plate 12 circulates a cooling medium to ensure that the temperature controller 21 accurately controls the temperature to the mounting process temperature, ensuring optimal soldering or bonding between the wafer and the substrate. Furthermore, when the vacuum heating plate 11 operates at high temperature, a cooling medium circulates within the cooling plate 12 to ensure high thermal insulation under high temperatures, preventing heat transfer from the high-temperature vacuum heating plate 11 to the mounting bracket at the bottom of the thermal insulation base 132, thus avoiding damage to equipment and personnel from high temperatures. After the placement is completed, the vacuum heating plate 11 stops heating, and the cooling medium of the cooling plate 12 continues to circulate, rapidly cooling the vacuum heating stage 110 to reduce the temperature of the substrate or wafer and electronic components, ensuring the placement or bonding quality and product stability. When the temperature drops to the predetermined cooling temperature, the temperature controller continues to work to precisely control the temperature. At the same time, the vacuum heating stage 110 of the next placement area continues to heat.

[0085] After all wafers and substrates on the board have been mounted, the vacuum heating stages 110 in all areas of the vacuum heating plate 11 stop heating. The cooling medium inside the cooling plate 12 circulates, achieving a rapid and uniform cooling effect to ensure the reliability of the mounting process. Once the wafers or substrates have cooled sufficiently, the vacuum chucks stop adhering, and the wafers or substrates are removed by an external device, completing the mounting process.

[0086] Although the embodiments of this utility model have been described in detail above, it will be apparent to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations fall within the scope and spirit of this utility model as described in the claims. Moreover, the utility model described herein may have other embodiments and can be implemented or realized in various ways.

Claims

1. A multi-temperature zone chip mounting equipment, characterized in that, The device includes a multi-zone vacuum heating stage and a temperature control system. The multi-zone vacuum heating stage includes a vacuum heating plate, a cooling plate, and a heat insulation component. The vacuum heating plate has at least one vacuum heating stage, which includes an internal temperature sensor and a heating element. The cooling plate is located below the vacuum heating plate and is used to reduce the temperature of the vacuum heating plate through a cooling medium under the control of the temperature control system. The temperature control system includes a temperature controller and an external temperature sensor. The temperature controller controls the heating power of the heating element and the flow rate of the cooling medium based on the external temperature signal from the external temperature sensor and the internal temperature signal from the internal temperature sensor.

2. The multi-temperature zone chip mounting equipment according to claim 1, characterized in that, The vacuum heating plate has multiple vacuum heating stages with gaps between them, the gaps being 0.1mm to 0.2mm; the heating element is a heating rod, which is distributed according to a preset position to ensure that the external temperature signal of the vacuum heating stage meets the temperature uniformity rule, and the internal temperature sensor is located in the middle of all the heating rods.

3. The multi-temperature zone chip mounting equipment according to claim 2, characterized in that, The heating element includes two heating rods, and the internal temperature sensor is installed inside the vacuum heating stage, with the axis of the internal temperature sensor and the axis of the heating rods in the same plane.

4. The multi-temperature zone chip mounting equipment according to claim 1, characterized in that, The upper surface of the vacuum heating stage is provided with a matrix of vacuum adsorption holes, the vacuum heating stage is provided with vacuum holes, and the lower surface of the vacuum heating stage is provided with vacuum connection holes. The vacuum holes connect the vacuum adsorption holes and the vacuum connection holes to form a vacuum adsorption circuit. The vacuum heating stage is also provided with a sealing ring positioning groove coaxial with the vacuum connection hole. The cooling plate is provided with a vacuum sealing groove and a vacuum sealing ring. The vacuum sealing ring is coaxially connected with the vacuum sealing groove and the vacuum connection hole and is in contact with the inner wall of the sealing ring positioning groove to form a vacuum sealing structure.

5. The multi-temperature zone chip mounting equipment according to claim 4, characterized in that, The lower surface of the vacuum heating stage is provided with an active heat dissipation groove, and the vacuum hole is a concealed hole.

6. The multi-temperature zone chip mounting equipment according to claim 4, characterized in that, The vacuum heating plate is provided with a first vacuum passage hole, which connects to all the vacuum connection holes; the cooling plate is provided with a second vacuum passage hole that connects to all the vacuum sealing grooves. The first vacuum passage hole, the vacuum connection holes, the vacuum sealing ring, the vacuum sealing groove, and the second vacuum passage hole constitute a vacuum circuit.

7. The multi-temperature zone chip mounting equipment according to claim 6, characterized in that, The cooling plate is provided with a cooling medium inlet, a cooling medium outlet, and a heat dissipation groove. The cooling medium inlet is used to receive cooling medium from the outside, and the cooling medium outlet is used to adjust the flow rate of the cooling medium under the control of the temperature controller. The cooling medium inlet, the cooling medium outlet, and the heat dissipation groove constitute a cooling medium circulation channel.

8. The multi-temperature zone chip mounting equipment according to claim 7, characterized in that, The cooling plate is also provided with a vacuum input hole and a vacuum output hole. The vacuum output hole is coaxial with the vacuum sealing groove. The vacuum input hole, the second vacuum air passage hole and the vacuum output hole constitute the cooling plate vacuum flow channel sub-circuit in the vacuum circuit.

9. The multi-temperature zone chip mounting equipment according to claim 1, characterized in that, The heat insulation component includes a heat insulation plate and a heat insulation base. The heat insulation plate has a through heat dissipation groove, and the heat insulation plate has a heat dissipation groove sealing hole. The heat dissipation groove cooperates with the heat dissipation groove sealing hole. The heat insulation plate has a mounting through hole in its circumference.

10. The multi-temperature zone chip mounting equipment according to claim 9, characterized in that, The side wall of the vacuum heating stage has wiring grooves corresponding to the heating element and the internal temperature sensor. The heat insulation base has wire grooves on the same side as the wiring grooves. The heat insulation base also has threaded mounting brackets, and there are three mounting brackets.

Images