Wafer film pressing and cutting machine

Abstract

The utility model provides a wafer film pressing and cutting machine, and relates to the technical field of wafer film pressing and cutting. The wafer film pressing and cutting machine comprises a frame body and a wafer body, a sliding groove is formed in the middle of the frame body, and the two sides of the frame body convey a film body through conveying rollers respectively; a driving motor is fixed to the upper side of the frame body, a threaded rod is fixed to the driving end of the driving motor, a threaded frame is in threaded connection with the outer surface of the threaded rod, a cutting knife is detachably installed in the middle of the threaded frame through a bolt, a connecting structure is arranged at the other end of the threaded rod, and two clamping frames are arranged on the connecting structure. According to the wafer film pressing and cutting machine, the threaded rod is driven by the driving motor to rotate, the effect of automatic clamping and limiting is achieved, the effect of improving the use convenience of the wafer film pressing and cutting machine is achieved, the effect of automatic smoothing is achieved, and the effect of improving the use effect of the wafer film pressing and cutting machine is achieved.

Description

Technical Field

[0001] This utility model relates to a wafer lamination and cutting machine, belonging to the field of wafer lamination and cutting technology. Background Technology

[0002] In the modern semiconductor industry, wafers serve as the core carrier for integrated circuit manufacturing, and the precision and efficiency of their processing directly affect chip performance and production costs. With the continuous increase in chip integration, the requirements for wafer surface treatment and thin-film processing are becoming increasingly stringent. The wafer lamination and dicing process, a crucial step in wafer manufacturing, aims to attach functional thin films to the wafer surface and precisely remove excess material to ensure the smooth execution of subsequent processes such as photolithography and etching.

[0003] Currently, wafer laminating and dicing machines used in daily production have revealed some significant problems in actual operation. On the one hand, operators need to manually align the wafers precisely and place them on trays of fixed size. This process is highly dependent on manual labor, involves cumbersome steps, and greatly reduces the ease of use of the equipment, thus making the wafer laminating and dicing machine less user-friendly. On the other hand, wrinkles are easily formed during the film transport process, resulting in poor wafer lamination and directly affecting the overall efficiency of the equipment, thus making the wafer laminating and dicing machine less effective. Utility Model Content

[0004] (a) Technical problems to be solved

[0005] This invention provides a wafer lamination and cutting machine to solve the problems of insufficient ease of use and poor performance of existing wafer lamination and cutting machines.

[0006] (II) Technical Solution

[0007] This utility model is achieved through the following technical solution: a wafer laminating and cutting machine, comprising a frame and a wafer body, wherein a sliding groove is provided in the middle of the frame, and the wafer body is conveyed by conveying rollers on both sides of the frame;

[0008] A drive motor is fixed to the upper side of the frame, and a threaded rod is fixed to the drive end of the drive motor. A threaded frame is threadedly connected to the outer surface of the threaded rod. A cutting blade is detachably installed in the middle of the threaded frame by bolts. A connecting structure is provided at the other end of the threaded rod, and two clamping frames are provided on the connecting structure. The connecting structure can slide in opposite directions along the length of the frame with the two clamping frames to automatically clamp the placed wafer body.

[0009] Preferably, the connection structure includes a driving gear, which meshes with a driven gear. The driven gear has inclined grooves on both sides, and sliding frames are slidably connected to the inner walls of the two inclined grooves. Clamping frames are detachably installed on the adjacent sides of the two sliding frames by bolts.

[0010] Preferably, the driving gear is fixed at the lower end of the threaded rod, the driving gear is meshed with the driven gear, the driven gear is rotatably connected to the inner wall of the middle part of the frame, the two inclined slots are opened opposite each other on both sides of the driven gear, the outer surfaces of the two sliding frames are slidably connected to the inner walls of the two inclined slots, and the outer surfaces of the two sliding frames are slidably connected to the inner walls of both sides of the sliding slots.

[0011] Preferably, the outer surfaces of the two clamping frames are slidably connected to the upper surfaces of both sides of the frame, the inner walls of the two clamping frames on the adjacent sides are in contact with the side surface of the wafer body, and the middle of the two clamping frames at opposite ends are detachably mounted on the upper ends of the two sliding frames by bolts.

[0012] Preferably, the outer surface of the threaded bracket is slidably connected to the inner wall of the frame, the middle part of the threaded bracket is threadedly connected to the outer surface of the threaded rod, the outer surface of the threaded rod is rotatably connected to the inner wall of the frame, and the vertical cross-section of the frame is L-shaped.

[0013] Preferably, a stabilizing groove is provided on one side of the frame, and two stabilizing frames are slidably connected to the inner wall of the stabilizing groove. A connecting frame is rotatably connected to the upper end of each of the two stabilizing frames, and a smoothing frame is fixed to one side of each of the two stabilizing frames.

[0014] Preferably, the outer surfaces of the two stabilizers are slidably connected to the inner walls on both sides of the stabilizer groove, and the vertical cross-section of each stabilizer is T-shaped. The two connecting frames are rotatably connected to the upper ends of the two stabilizers at opposite ends, and the two connecting frames are rotatably connected to the two sides of the threaded frame at near ends. One end of the two smoothing frames is fixed to one side of the two stabilizers, and the two smoothing frames are in contact with the outer surface of the membrane.

[0015] This utility model provides a wafer lamination and cutting machine, which has the following beneficial effects:

[0016] (1) The wafer laminating and cutting machine is driven by a drive motor to rotate the threaded rod, so that the drive gear, driven gear, inclined groove, sliding frame and clamping frame work together to achieve automatic clamping and limiting effect, without the need for manual and precise alignment by the staff, thereby improving the ease of use of the wafer laminating and cutting machine.

[0017] (2) The wafer laminating and cutting machine uses a drive motor to drive the threaded rod to rotate, so that the connecting frame, stabilizing frame, stabilizing groove and smoothing frame work together to achieve automatic smoothing effect, avoid the film wrinkles from affecting the lamination effect, and thus improve the performance of the wafer laminating and cutting machine. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0019] Figure 2 This is a partial cross-sectional view of the present invention;

[0020] Figure 3 This utility model Figure 2 Enlarged view of the A-section structure;

[0021] Figure 4 This is a partial structural schematic diagram of the present invention.

[0022] [Explanation of Key Component Symbols]

[0023] 1. Frame; 2. Slide rail; 3. Wafer body; 4. Conveyor roller; 5. Film body; 6. Drive motor; 7. Threaded rod; 8. Threaded frame; 9. Cutting blade; 10. Drive gear; 11. Driven gear; 12. Inclined groove; 13. Sliding frame; 14. Clamping frame; 15. Connecting frame; 16. Stabilizing frame; 17. Stabilizing groove; 18. Smoothing frame. Detailed Implementation

[0024] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0025] Example 1

[0026] This utility model provides a wafer lamination and cutting machine.

[0027] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4The system includes a frame 1 and a wafer body 3. A groove 2 is provided in the middle of the frame 1, which limits the sliding of two sliding frames 13. Conveyor rollers 4, electrically powered, convey the wafer body 5 from both sides of the frame 1. A drive motor 6 is fixed to the upper side of the frame 1, providing driving force. A threaded rod 7 is fixed to the drive end of the drive motor 6, and a threaded frame 8 is threaded onto the outer surface of the threaded rod 7. A detachable cutting blade 9 is bolted to the center of the threaded frame 8, allowing for replacement to accommodate wafers of different sizes. Corresponding to the dimensions, the other end of the threaded rod 7 is provided with a connecting structure, which includes a driving gear 10. The driving gear 10 is meshed with a driven gear 11. Both sides of the driven gear 11 are provided with inclined grooves 12. The inner walls of the two inclined grooves 12 are slidably connected with sliding frames 13. The adjacent sides of the two sliding frames 13 are detachably installed with clamping frames 14 by bolts. The two clamping frames 14 can be detached and replaced to adapt to the corresponding dimensions of wafers of different sizes. Furthermore, the two clamping frames 14 can be combined into a whole when clamping, so that there will be no incomplete cutting when the cutting blade 9 cuts.

[0028] Please refer to it again. Figure 1 , Figure 2 , Figure 3 and Figure 4 It is worth noting that the driving gear 10 is fixed to the lower end of the threaded rod 7 in the middle. The driving gear 10 is meshed with the driven gear 11. The driven gear 11 is rotatably connected to the inner wall of the middle part of the frame 1. Two inclined slots 12 are opened opposite each other on both sides of the driven gear 11. The outer surfaces of the two sliding frames 13 are slidably connected to the inner walls of the two inclined slots 12. The outer surfaces of the two sliding frames 13 are slidably connected to the inner walls of both sides of the sliding slot 2. The outer surfaces of the two clamping frames 14 are slidably connected to the upper surfaces of both sides of the frame 1. The inner walls of the two clamping frames 14 on the near side are in contact with the side surface of the wafer body 3. The middle of the two clamping frames 14 on the far side are detachably installed on the upper end of the two sliding frames 13 by bolts. The outer surface of the threaded frame 8 is slidably connected to the inner wall of the frame 1. The middle part of the threaded frame 8 is threadedly connected to the outer surface of the threaded rod 7. The outer surface of the threaded rod 7 is rotatably connected to the inner wall of the frame 1. The vertical section of the frame 1 is L-shaped.

[0029] In use, this invention involves a drive motor 6 driving the threaded rod 7 to rotate. Since the threaded frame 8 is threadedly connected to the outer surface of the threaded rod 7 and is limited by the inner wall of the frame 1, the threaded frame 8 slides along the inner wall of the frame 1 when the threaded rod 7 rotates. A cutting blade 9 is detachably mounted on the middle of the threaded frame 8 via bolts, thus the cutting blade 9 moves downwards synchronously with the threaded frame 8.

[0030] Simultaneously, the drive gear 10 rotates together with the lower end of the threaded rod 7. Since the driven gear 11 meshes with the drive gear 10, it also begins to rotate. The driven gear 11 has inclined grooves 12 on both sides. When it rotates, under the action of the inclined grooves 12, the two sliding frames 13 slide towards each other along the grooves 2. The clamping frame 14 is detachably mounted to the adjacent side of the two sliding frames 13 via bolts. Therefore, the approach of the sliding frames 13 causes the two clamping frames 14 to approach synchronously, thereby clamping the wafer body 3 placed on the frame 1. At the moment the clamping is completed, the downward-moving dicing blade 9 precisely completes the cutting of the film body 5. The entire process achieves automatic clamping and limiting, eliminating the need for manual precise alignment by operators, thus improving the ease of use of the wafer laminating and cutting machine.

[0031] Example 2

[0032] Please see Figure 1 , Figure 2 , Figure 3 and Figure 4 An automatic smoothing function has been added based on Embodiment 1;

[0033] Please refer to it again. Figure 1 , Figure 2 , Figure 3 and Figure 4 It is worth noting that a stabilizing groove 17 is provided on one side of the frame 1. Two stabilizing frames 16 are slidably connected to the inner wall of the stabilizing groove 17. A connecting frame 15 is rotatably connected to the upper end of each of the two stabilizing frames 16. A smoothing frame 18 is fixed to one side of each of the two stabilizing frames 16. The outer surfaces of the two stabilizing frames 16 are slidably connected to the inner walls on both sides of the stabilizing groove 17. The vertical section of each stabilizing frame 16 is T-shaped. The two connecting frames 15 are rotatably connected to the upper ends of the two stabilizing frames 16 at opposite ends and rotatably connected to the two sides of the threaded frame 8 at near ends. One end of each smoothing frame 18 is fixed to one side of each of the two stabilizing frames 16. The two smoothing frames 18 are in contact with the outer surface of the membrane 5.

[0034] In use, this invention involves a drive motor 6 driving a threaded rod 7 to rotate. Since the threaded frame 8 is threadedly connected to the outer surface of the threaded rod 7 and is constrained by the inner wall of the frame 1, the threaded frame 8 moves downwards along the inner wall of the frame 1. Connecting frames 15 are rotatably connected to both sides of the threaded frame 8. During the downward movement of the threaded frame 8, the connecting frames 15 drive two stabilizing frames 16. The stabilizing frames 16, constrained by the stabilizing groove 17, move away from each other. Each stabilizing frame 16 has a smoothing frame 18 fixed to one side; therefore, when two stabilizing frames 16 move away from each other, the corresponding smoothing frames 18 also move away from each other. At this time, the film 5 conveyed by the conveyor roller 4 is smoothed from the middle outwards by these two moving smoothing frames 18. This achieves an automatic smoothing effect, preventing wrinkles in the film 5 from affecting the lamination effect, thereby improving the performance of the wafer lamination and cutting machine.

[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A wafer lamination and dicing machine, comprising a frame (1) and a wafer body (3), characterized in that: The frame (1) has a groove (2) in the middle, and the membrane (5) is conveyed by conveying rollers (4) on both sides of the frame (1); A drive motor (6) is fixed on the upper side of the frame (1). A threaded rod (7) is fixed on the drive end of the drive motor (6). A threaded frame (8) is threadedly connected to the outer surface of the threaded rod (7). A cutting blade (9) is detachably installed in the middle of the threaded frame (8) by bolts. A connecting structure is provided at the other end of the threaded rod (7). Two clamping frames (14) are provided on the connecting structure. The connecting structure can slide in the opposite direction along the length of the frame (1) with the two clamping frames (14) to automatically clamp the placed wafer body (3).

2. The wafer lamination and dicing machine according to claim 1, characterized in that: The connection structure includes a drive gear (10), which meshes with a driven gear (11). The driven gear (11) has inclined grooves (12) on both sides. The inner walls of the two inclined grooves (12) are slidably connected with sliding frames (13). The adjacent sides of the two sliding frames (13) are detachably installed with clamping frames (14) by bolts.

3. The wafer lamination and dicing machine according to claim 2, characterized in that: The driving gear (10) is fixed in the middle to the lower end of the threaded rod (7). The driving gear (10) meshes with the driven gear (11). The driven gear (11) is rotatably connected to the inner wall of the frame (1). The two inclined slots (12) are opened opposite each other on both sides of the driven gear (11). The outer surfaces of the two sliding frames (13) are slidably connected to the inner walls of the two inclined slots (12). The outer surfaces of the two sliding frames (13) are slidably connected to the inner walls of both sides of the sliding groove (2).

4. A wafer laminating and cutting machine according to claim 2, characterized in that: The outer surfaces of the two clamping frames (14) are slidably connected to the upper surfaces of both sides of the frame (1). The inner walls of the two clamping frames (14) on the near side are in contact with the side surface of the wafer body (3). The middle of the two clamping frames (14) on opposite sides are detachably mounted on the upper ends of the two sliding frames (13) by bolts.

5. A wafer laminating and cutting machine according to claim 1, characterized in that: The outer surface of the threaded frame (8) is slidably connected to the inner wall of the frame (1), the middle part of the threaded frame (8) is threadedly connected to the outer surface of the threaded rod (7), the outer surface of the threaded rod (7) is rotatably connected to the inner wall of the frame (1), and the vertical section of the frame (1) is L-shaped.

6. A wafer laminating and dicing machine according to claim 1, characterized in that: The frame (1) has a stabilizing groove (17) on one side. Two stabilizing frames (16) are slidably connected to the inner wall of the stabilizing groove (17). A connecting frame (15) is rotatably connected to the upper end of each of the two stabilizing frames (16). A smoothing frame (18) is fixed to one side of each of the two stabilizing frames (16).

7. A wafer laminating and dicing machine according to claim 6, characterized in that: The outer surfaces of the two stabilizers (16) are slidably connected to the inner walls of both sides of the stabilizer groove (17). The vertical cross-section of each stabilizer (16) is T-shaped. The two connecting frames (15) are rotatably connected to the upper ends of the two stabilizers (16) at opposite ends and rotatably connected to the two sides of the threaded frame (8) at near ends. One end of each of the two smoothing frames (18) is fixed to one side of the two stabilizers (16). The two smoothing frames (18) are in contact with the outer surface of the membrane (5).

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