Wafer back washing nozzle, spray head and equipment

Abstract

The utility model relates to the field of integrated circuit production, in particular to a wafer back washing nozzle, a spray head and equipment, which comprise a sliding split body, a fixed split body and a driving assembly, the inner wall of the sliding split body and the inner wall of the fixed split body define a conveying pipeline for cleaning liquid. And the driving assembly drives the sliding split body to move in the axial direction of the conveying pipeline, so that the wafer back washing nozzle changes the ejection direction of the cleaning liquid according to different positions of the sliding split body. According to the utility model, the nozzle for wafer back washing is divided into the movable sliding split body and the fixed split body, the sliding split body moves in the axial direction of the conveying pipeline, so that the cleaning fluid is not uniformly stressed when being sprayed out from the outlet and is sprayed obliquely, and the position of the sliding split body is controlled by the driving assembly to adjust the ejection direction of the cleaning fluid, so that the wafer back washing efficiency is improved. Therefore, the cleaning area of the wafer to be backwashed is adjusted and controlled in real time, the adjustment precision of cleaning different areas of the wafer is improved, and the adjustment time consumption is shortened.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of integrated circuit production, in particular to a wafer back washing nozzle, shower nozzle and equipment. BACKGROUND

[0002] Back washing is an important process in photoetching glue coating and developing equipment, which cleans the back of the wafer and quickly shakes it off. The commonly used structure includes a cup, a pad and a nozzle fixed together, wherein the nozzle is responsible for spraying cleaning liquid.

[0003] The back washing nozzle used in the industry at present is a fixed nozzle with fixed structure and fixed spray angle. When different specifications of wafers to be back washed are replaced or different areas of the same wafer to be washed are cleaned, the spray angle and position of the nozzle need to be manually adjusted by workers so that the cleaning liquid sprayed by the nozzle falls on the preset cleaning area of the wafer to be back washed. This process usually takes a long time, and if the effect is not good after adjustment, the back washing needs to be paused and manually adjusted again. After several times of such repeated adjustment, a good spraying effect of the cleaning liquid can be achieved, which consumes a long time and the equipment cannot be used during this period. In other words, the wafer back washing nozzle in the prior art has relatively single adaptability to products and cannot quickly adjust the spraying direction when different specifications of wafers to be back washed are switched.

[0004] Therefore, how to solve the problem of low adjustment accuracy and long adjustment time caused by manual adjustment of the nozzle angle when back washing different specifications of wafers to be back washed or different areas of the wafer is an urgent problem for technicians in the field. UTILITY MODEL CONTENTS

[0005] The utility model aims to provide a wafer back washing nozzle, shower nozzle and equipment to solve the problem of low adjustment accuracy and long adjustment time caused by manual adjustment of the nozzle angle when back washing different specifications of wafers to be back washed in the prior art.

[0006] To solve the above technical problem, the utility model provides a wafer back washing nozzle, which comprises a sliding part, a fixed part and a driving assembly.

[0007] The inner wall of the sliding part and the inner wall of the fixed part form a cleaning liquid conveying pipeline.

[0008] The driving assembly drives the sliding part to move in the axial direction of the conveying pipeline, so that the wafer back washing nozzle changes the emission direction of the cleaning liquid according to the different positions of the sliding part.

[0009] Optionally, in the wafer back washing nozzle, the wafer back washing nozzle only comprises one sliding part and one fixed part.

[0010] Optionally, in the wafer back cleaning nozzle, the inner wall of the sliding part constitutes 50% of the delivery pipeline, and the inner wall of the fixed part constitutes 50% of the delivery pipeline.

[0011] Optionally, in the wafer back cleaning nozzle, the wafer back cleaning nozzle comprises a plurality of sliding parts and a plurality of driving assemblies.

[0012] Each of the sliding parts is driven to move by a corresponding driving assembly.

[0013] Optionally, in the wafer back cleaning nozzle, the wafer back cleaning nozzle is vertically upwardly arranged.

[0014] Optionally, in the wafer back cleaning nozzle, a limiting assembly is further included.

[0015] The limiting assembly limits the movement distance of the sliding part in the axial direction within a preset limiting difference.

[0016] Optionally, in the wafer back cleaning nozzle, the limiting difference ranges from 0.5 times to 1 times the length of the fixed part in the axial direction.

[0017] Optionally, in the wafer back cleaning nozzle, when the sliding part is located at the maximum extended position or the maximum retracted position limited by the limiting assembly, the liquid outlet end of the sliding part is flush with the liquid outlet end of the fixed part.

[0018] A wafer back cleaning nozzle, comprising a pressure cavity and any one of the wafer back cleaning nozzles described above.

[0019] The wafer back cleaning nozzle is arranged on the side wall of the pressure cavity.

[0020] The driving assembly comprises a driving motor and a driving rod; the driving motor is connected to the outer wall of the sliding part through the driving rod.

[0021] The driving rod comprises an axial extension part and a bent connecting part; the axial extension part is arranged outside the pressure cavity and extends along the axial direction of the delivery pipeline; one end of the bent connecting part is connected to the end of the axial extension part close to the wafer back cleaning nozzle, and the other end is connected to the outer wall of the sliding part.

[0022] The bent connecting part collides with the outer wall of the pressure cavity during the retraction of the wafer back cleaning nozzle along the axial direction, thereby limiting the maximum retracted position of the wafer back cleaning nozzle.

[0023] The sliding part is provided with a clamping position extension part; the clamping position extension part collides with the inner wall of the pressure cavity during the extension of the wafer back washing nozzle along the axial direction, and limits the maximum extension position of the wafer back washing nozzle.

[0024] A wafer back washing device, the wafer back washing nozzle comprises the wafer back washing nozzle and / or the wafer back washing nozzle head of any one of the above.

[0025] The wafer back washing nozzle comprises a sliding part, a fixed part and a driving assembly; the inner wall of the sliding part and the inner wall of the fixed part enclose a conveying pipeline of cleaning liquid; the driving assembly drives the sliding part to move in the axial direction of the conveying pipeline, so that the wafer back washing nozzle changes the emission direction of the cleaning liquid according to the different positions of the sliding part. The wafer back washing nozzle comprises a sliding part, a fixed part and a driving assembly; the inner wall of the sliding part and the inner wall of the fixed part enclose a conveying pipeline of cleaning liquid; the driving assembly drives the sliding part to move in the axial direction of the conveying pipeline, so that the wafer back washing nozzle changes the emission direction of the cleaning liquid according to the different positions of the sliding part. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0027] Figure 1 The structure diagram of one specific embodiment of the wafer back washing nozzle provided by the present application is shown in the figure.

[0028] Figure 2 The cross-sectional schematic view of one specific embodiment of the wafer back washing nozzle provided by the present application is shown in the figure.

[0029] Figure 3 The cross-sectional schematic view of another specific embodiment of the wafer back washing nozzle provided by the present application is shown in the figure.

[0030] Figure 4 The structure diagram of one specific embodiment of the wafer back washing nozzle provided by the present application is shown in the figure.

[0031] Figure 5This is a schematic diagram of a specific embodiment of the wafer backwash nozzle provided by this utility model.

[0032] The figure includes 10-fixed split part, 20-sliding split part, 30-drive assembly, 31-drive motor, 32A-axial extension, 32B-bending connection, and 40-pressure chamber. Detailed Implementation

[0033] To enable those skilled in the art to better understand the present invention, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] The core of this utility model is to provide a wafer backwash nozzle, the structural schematic diagram of one specific embodiment of which is shown below. Figure 1 As shown, this is referred to as Specific Implementation Method 1, which includes a sliding split body 20, a fixed split body 10, and a driving assembly 30.

[0035] The inner wall of the sliding body 20 and the inner wall of the fixed body 10 form a cleaning fluid delivery pipeline.

[0036] The drive assembly 30 drives the sliding split 20 to move axially in the delivery pipeline, so that the wafer backwash nozzle changes the ejection direction of the cleaning fluid according to the different positions of the sliding split 20.

[0037] The axial direction of the conveying pipeline is Figure 1 The double-headed arrow is used to represent this.

[0038] In one specific embodiment, the wafer backwash nozzle includes only one sliding segment 20 and one fixed segment 10. Dividing the wafer backwash nozzle into only one sliding segment 20 and one fixed segment 10 greatly simplifies the structure of the wafer backwash nozzle, reduces hardware costs, and improves the operational reliability of the wafer backwash nozzle. Of course, other combinations of the number of sliding segments 20 and fixed segments 10 can also be used, and this invention is not limited thereto.

[0039] Further, the inner wall of the sliding part 20 constitutes 50% of the conveying pipeline, and the inner wall of the fixed part 10 constitutes 50% of the conveying pipeline. In the preferred embodiment, the inner wall of the sliding part 20 is considered to be semicircular, and the inner wall of the fixed part 10 is considered to be semicircular. Compared with other modes, the semicircular inner wall can greatly reduce the processing difficulty of the sliding part 20 and the fixed part 10, and reduce the corresponding production cost. The structural schematic diagram of the preferred embodiment is shown in Figure 2 , Figure 2 is a sectional view of the wafer back washing nozzle, and the axial direction of the conveying pipeline is perpendicular to the sectional view of the wafer back washing nozzle. Figure 2 ,

[0040] As another specific embodiment, the wafer back washing nozzle comprises a plurality of sliding parts 20 and a plurality of driving assemblies 30.

[0041] Each of the sliding parts 20 is driven to move by a corresponding driving assembly 30.

[0042] The structural schematic diagram of the specific embodiment is shown in Figure 3 It can be seen from the structural schematic diagram of the specific embodiment that in the specific embodiment, the plurality of sliding parts 20 can independently move under the corresponding driving assemblies 30, more cleaning liquid outlet shapes can be created, the force of the cleaning liquid when sprayed at the outlet can be more finely and variably controlled, and the utility model has greater versatility.

[0043] Further, the wafer back washing nozzle is vertically upwardly arranged. Compared with the inclined arrangement, the vertically upwardly arranged wafer back washing nozzle can avoid the influence of different gravity components of the cleaning liquid at different inclined angles of the wafer back washing nozzle on the relationship between the position of the sliding part 20 and the corresponding cleaning position of the cleaning liquid, that is, the vertically upwardly arranged wafer back washing nozzle can greatly reduce the calculation difficulty of the cleaning liquid trajectory and improve the processing efficiency.

[0044] As a preferred embodiment, a limiting assembly is further included.

[0045] The limiting assembly limits the movement distance of the sliding part 20 in the axial direction within a preset limiting difference.

[0046] In the preferred embodiment, by adding the limiting assembly, the movement distance of the sliding part 20 in the axial direction is physically limited in space, so that the sliding part 20 is prevented from moving beyond the preset movement area due to the failure of the driving assembly 30 or external force, and the cleaning liquid is prevented from splashing to the area outside the design to cause equipment failure, thereby further improving the working stability and service life of the device.

[0047] Further, the limit difference is in the range of 0.5 to 1 times the length of the fixed part 10 in the axial direction; further, when the sliding part 20 is at the maximum extended position or the maximum retracted position under the limit of the limiting assembly, the liquid outlet end of the sliding part 20 is flush with the liquid outlet end of the fixed part 10.

[0048] In the preferred embodiment, the activity distance of the sliding part 20 is limited, that is, the range of the limit difference, and the size of the limit difference needs to be determined according to the length of the fixed part 10 in the axial direction, which is 0.5 to 1 times the length of the fixed part 10 in the axial direction, including the end value, such as any one of 0.50 times, 0.77 times or 1.00 times. The above range is the best range after a large number of theoretical calculations and actual tests, and of course, it can be adjusted according to the actual situation, which will not be described here. In addition, the preferred embodiment further limits the case that the sliding part 20 is at the maximum extended position or the maximum retracted position under the limit of the limiting assembly. The maximum extended position refers to the end position that the sliding part 20 can reach in the flow direction of the cleaning liquid, and the maximum retracted position refers to the end position that the sliding part 20 can reach in the reverse flow direction of the cleaning liquid. When the sliding part 20 is at the maximum extended position or the maximum retracted position, the liquid outlet end of the sliding part 20 is flush with the liquid outlet end of the fixed part 10. The liquid outlet end, that is, the position where the wafer back washing nozzle sprays cleaning liquid, is in the flow direction of the cleaning liquid, and the wafer back washing nozzle is in the flow direction of the cleaning liquid. Figure 4 In the preferred embodiment, the activity distance of the sliding part 20 is limited, that is, the range of the limit difference, and the size of the limit difference needs to be determined according to the length of the fixed part 10 in the axial direction, which is 0.5 to 1 times the length of the fixed part 10 in the axial direction, including the end value, such as any one of 0.50 times, 0.77 times or 1.00 times. The above range is the best range after a large number of theoretical calculations and actual tests, and of course, it can be adjusted according to the actual situation, which will not be described here. In addition, the preferred embodiment further limits the case that the sliding part 20 is at the maximum extended position or the maximum retracted position under the limit of the limiting assembly. The maximum extended position refers to the end position that the sliding part 20 can reach in the flow direction of the cleaning liquid, and the maximum retracted position refers to the end position that the sliding part 20 can reach in the reverse flow direction of the cleaning liquid. When the sliding part 20 is at the maximum extended position or the maximum retracted position, the liquid outlet end of the sliding part 20 is flush with the liquid outlet end of the fixed part 10. The liquid outlet end, that is, the position where the wafer back washing nozzle sprays cleaning liquid, is in the flow direction of the cleaning liquid, and the wafer back washing nozzle is in the flow direction of the cleaning liquid.

[0049] The wafer back washing nozzle provided by the utility model, including sliding part 20, fixed part 10 and drive assembly 30, the inner wall of sliding part 20 and the inner wall of fixed part 10 form the conveying pipeline of cleaning liquid, drive assembly 30 drives sliding part 20 to move in the axial direction of the conveying pipeline, so that the wafer back washing nozzle changes the emission direction of cleaning liquid according to the different positions of sliding part 20.

[0050] The utility model further provides a wafer back washing nozzle, and a structure diagram of a specific embodiment is as shown in Figure 5 The wafer back washing nozzle is arranged on the side wall of pressure cavity 40.

[0051] The wafer back washing nozzle is arranged on the side wall of pressure cavity 40.

[0052] Drive motor 31 is connected with the outer wall of sliding part 20 through drive rod.

[0053] The drive rod includes axial extension 32A and bending connecting part 32B; axial extension 32A is arranged on the outside of pressure cavity 40 and extends along the axial direction of the conveying pipeline; one end of bending connecting part 32B is connected with the end of axial extension 32A close to the wafer back washing nozzle, and the other end is connected with the outer wall of sliding part 20.

[0054] Bending connecting part 32B collides with the inner wall of pressure cavity 40 in the process of the wafer back washing nozzle retracting along the axial direction, so as to limit the maximum retracted position of the wafer back washing nozzle.

[0055] The sliding part 20 is provided with a clamping position extension part; the clamping position extension part collides with the inner wall of the pressure cavity 40 in the process of the wafer back washing nozzle extending along the axial direction, so as to limit the maximum extended position of the wafer back washing nozzle.

[0056] The wafer back washing nozzle in the embodiment of the present application limits the sliding part 20 by limiting the structure of the driving assembly 30 and the setting position and connection mode of the driving rod, and the structure of the sliding part 20. In other words, in the embodiment of the present application, the bending connection part 32B of the driving rod undertakes part of the function of the limiting assembly, the clamping position extension part undertakes another part of the function of the limiting assembly, and the clamping position extension part cooperates with the bending connection part 32B to limit the movement range of the sliding part 20 from both ends of the axial direction. The embodiment of the present application provides a limiting scheme of the sliding part 20 under the premise of occupying as little space as possible and affecting the flow of the cleaning liquid as little as possible, thereby facilitating the miniaturization and structural simplification of the device and reducing the cost.

[0057] The utility model also provides a kind of wafer back washing equipment, and the wafer back washing nozzle includes the wafer back washing nozzle as any one of the above and / or the wafer back washing nozzle as above.The wafer back washing nozzle provided by the utility model includes sliding part 20, fixed part 10 and driving assembly 30;The inner wall of the sliding part 20 and the inner wall of the fixed part 10 form the conveying pipeline of cleaning liquid;The driving assembly 30 drives the sliding part 20 to move in the axial direction of the conveying pipeline, so that the wafer back washing nozzle changes the emission direction of the cleaning liquid according to the different positions of the sliding part 20.The utility model divides the nozzle for wafer back washing into movable sliding part 20 and fixed fixed part 10, by the movement of sliding part 20 in the axial direction of conveying pipeline, so that cleaning liquid is unevenly stressed when being sprayed at outlet and is obliquely sprayed, the position of sliding part 20 is adjusted by driving assembly 30 to control the emission direction of cleaning liquid, and then the real-time adjustment control to the cleaning area of wafer to be back washed is realized, the adjustment accuracy when replacing different wafer to be back washed or cleaning different areas of the same wafer to be back washed is greatly improved, and the adjustment time consumption is shortened.

[0058] The embodiments in the specification are described in a progressive manner, and each embodiment focuses on the difference from other embodiments, and the same or similar parts of each embodiment can be referred to each other. For the device disclosed by the embodiment, since it corresponds to the method disclosed by the embodiment, the description is relatively simple, and the related parts can be referred to the method part.

[0059] It should be noted that, in the present specification, the relational terms such as first and second and the like merely refer to one entity or action being distinguished from another entity or action, without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the recited element.

[0060] The wafer backwash nozzle, the shower head and the equipment provided by the present application are described in detail above. The principles and implementation manners of the present application are described by applying specific examples in the present paper. The above description of the examples is only used to help understand the method of the present application and its core idea. It should be pointed out that, for the ordinary skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A wafer backwash nozzle characterized by, The wafer back washing nozzle comprises a sliding part, a fixed part and a driving assembly. The inner wall of the sliding part and the inner wall of the fixed part form a delivery pipeline of the cleaning liquid. The driving assembly drives the sliding part to move in the axial direction of the delivery pipeline, so that the wafer back washing nozzle changes the emission direction of the cleaning liquid according to different positions of the sliding part.

2. The wafer rinseback nozzle of claim 1, wherein, The wafer back washing nozzle only comprises one sliding part and one fixed part.

3. The wafer rinseback nozzle of claim 2, wherein, The inner wall of the sliding part accounts for 50% of the delivery pipeline, and the inner wall of the fixed part accounts for 50% of the delivery pipeline.

4. The wafer rinseback nozzle of claim 1, wherein, The wafer back washing nozzle comprises a plurality of sliding parts and a plurality of driving assemblies. Each sliding part moves under the driving of a corresponding driving assembly.

5. The wafer rinseback nozzle of claim 1, wherein, The wafer back washing nozzle is vertically upwardly arranged.

6. The wafer rinseback nozzle of claim 1, wherein, Further comprising a limiting assembly. The limiting assembly limits the movement distance of the sliding part in the axial direction within a preset limiting difference.

7. The wafer rinseback nozzle of claim 6, wherein, The limiting difference ranges from 0.5 times to 1 times the length of the fixed part in the axial direction.

8. The wafer rinseback nozzle of claim 6, wherein, When the sliding part is located at the maximum extension position or the maximum retraction position limited by the limiting assembly, the liquid outlet end of the sliding part is flush with the liquid outlet end of the fixed part.

9. A wafer backwash showerhead characterized by, The wafer back washing nozzle comprises a pressure chamber and the wafer back washing nozzle according to any one of claims 6 to 8. The wafer back washing nozzle is arranged on the side wall of the pressure chamber. The driving assembly comprises a driving motor and a driving rod; the driving motor is connected with the outer wall of the sliding part through the driving rod. The driving rod comprises an axial extension part and a bent connecting part; the axial extension part is arranged outside the pressure chamber and extends in the axial direction of the delivery pipeline; one end of the bent connecting part is connected with one end of the axial extension part close to the wafer back washing nozzle, and the other end is connected with the outer wall of the sliding part. The bent connecting part collides with the outer wall of the pressure chamber in the process of retraction of the wafer back washing nozzle in the axial direction, thereby limiting the maximum retraction position of the wafer back washing nozzle. The sliding part is provided with a clamping extension part; the clamping extension part collides with the inner wall of the pressure chamber in the process of extension of the wafer back washing nozzle in the axial direction, thereby limiting the maximum extension position of the wafer back washing nozzle.

10. A wafer backwash apparatus, characterized by, The wafer back washing nozzle comprises the wafer back washing nozzle according to any one of claims 1 to 8 and / or the wafer back washing nozzle according to claim 9.

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