Stamping die for processing EI chip of transformer

Abstract

The utility model relates to a stamping die, in particular to a stamping die for processing an EI chip of a transformer, which comprises a stamping die assembly, the stamping die assembly comprises an upper die plate and a lower die plate arranged below the upper die plate, the lower die plate is provided with a clamping assembly, and the clamping assembly is provided with a clamping groove. The clamping assembly comprises sliding grooves, the number of the sliding grooves is four, sliding blocks are slidably connected into the four sliding grooves, and clamping plates are arranged on the sides, away from the lower die plate, of the sliding blocks. The EI chip stamping die is simple in structure and reasonable in design, when an EI chip is stamped, the upper die plate downwards drives the second fixing block to move downwards, the second fixing block drives the connecting rod to rotate so that the connecting rod can push the first fixing block, and then the first fixing block drives the sliding block and the clamping plate to move towards the EI chip. The EI chip can be clamped at the central position of the upper end of the lower die plate by the clamping plate, so that the EI chip always corresponds to the position of the forming cavity and does not deviate.

Description

TECHNICAL FIELD

[0001] The utility model relates to a punch die, concretely is a punch die for transformer EI chip processing. BACKGROUND

[0002] The transformer is a kind of device for changing alternating voltage using electromagnetic induction principle, and the transformer EI chip is a kind of core shape commonly seen in electronic transformer, which is formed by superimposing "E" type sheet and "I" type sheet, this structure can improve the degree of closure of magnetic circuit, so that magnetic flux line passes through the core as much as possible, thereby enhancing the efficiency of transformer. The transformer EI chip is usually formed using a punch process.

[0003] The current EI chip punch forming die can realize automatic punching of EI chip, but the position of EI chip needs to be adjusted on the lower die before punching, and when the position of EI chip and the position of forming cavity are offset, it will cause error in EI chip punching. UTILITY MODEL CONTENTS

[0004] The utility model discloses a kind of punch dies for transformer EI chip processing, with Simple structure, reasonable in design, when EI chip is punched, upper die plate drives second fixed block to move downwards, second fixed block drives connecting rod to rotate so that connecting rod pushes first fixed block, first fixed block drives slider and clamping plate to move towards the direction of EI chip again, so that EI chip can be clamped on the upper end central position of lower die by clamping plate, so that EI chip is always corresponding with the position of forming cavity, without offset advantage, solve the current EI chip punch forming die can realize automatic punching of EI chip, but the position of EI chip needs to be adjusted on the lower die before punching, when the position of EI chip and the position of forming cavity are offset, it will cause error in EI chip punching Problem.

[0005] To achieve the above object, the utility model provides the following technical scheme: a kind of punch die for transformer EI chip processing, the punch die for transformer EI chip processing, including punch die assembly, the punch die assembly includes upper die plate and the lower die plate being arranged below upper die plate, clamping assembly is provided on the lower die plate, the clamping assembly includes setting sliding slot, the sliding slot is provided with four, four the sliding block of sliding connection in the sliding slot is provided with the clamping plate on the side away from lower die plate of the sliding block, the clamping plate top end height is higher than lower die plate top end height, first fixed block is further provided on the sliding block, the connecting rod is provided on the first fixed block, the second fixed block is provided at the end away from first fixed block of the connecting rod.

[0006] Preferably, the second fixed block is arranged at the lower end of the upper die plate, and the connecting rod is connected to the first fixed block and the second fixed block through a rotating shaft at both ends.

[0007] Preferably, the stamping die assembly further comprises a forming cavity arranged on the lower die plate.

[0008] Preferably, the lower die plate is further provided with a movable assembly, the movable assembly comprising a top plate, the top plate being provided at the upper end with a rotating rod, the rotating rod comprising a support rod, the support rod being provided at the bottom end with support columns on both sides, the rotating rod being provided at the central position with a limiting rod, the limiting rod being provided at the bottom end on the lower die plate.

[0009] Preferably, the forming cavity is internally provided with a guide column, the guide column being externally provided with a bottom plate, the bottom plate being provided below with an air bag.

[0010] Preferably, the top plate is internally slid at the end away from the rotating rod in the forming cavity, and the outer side thereof is in contact with the outer side of the air bag, the support columns being respectively rotatably connected on the upper end of the top plate and the sliding block.

[0011] Compared with the prior art, the stamping die assembly has the following beneficial effects:

[0012] 1. The stamping die assembly is simple in structure and reasonable in design, when the EI chip is stamped, the upper die plate drives the second fixed block to move downwards, the second fixed block drives the connecting rod to rotate to make the connecting rod push the first fixed block, the first fixed block drives the sliding block and the clamping plate to move towards the EI chip, so that the EI chip can be clamped by the clamping plate at the central position on the upper end of the lower die plate, and the EI chip always corresponds to the position of the forming cavity and cannot be deviated.

[0013] 2. When the clamping assembly clamps the EI chip, the sliding block drives the rotating rod to rotate along the limiting rod, the rotating rod drives the top plate to move outward, the top plate does not press the air bag, the bottom plate moves to the bottom end inside the forming cavity, so that the EI chip can be formed in the forming cavity under the action of the upper die plate, when the forming is completed, the upper die plate moves upward, the sliding block slides outward, and drives the rotating rod to rotate reversely, the top plate presses the air bag, the air bag pushes the bottom plate upward, the bottom plate pushes the EI chip out of the forming cavity, the EI chip is conveniently demolded, and the EI chip cannot be retained in the forming cavity. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is the overall structural drawing of the utility model;

[0015] Figure 2 It is the stamping die assembly structure drawing of the utility model;

[0016] Figure 3 It is the clamping assembly structure drawing of the utility model;

[0017] Figure 4 is a structure diagram of the movable assembly of the utility model;

[0018] Figure 5 is a structure diagram of the rotating rod of the utility model;

[0019] Figure 6 is an internal structure diagram of the forming cavity of the utility model.

[0020] The reference signs and names in the drawings are as follows:

[0021] 1, stamping die assembly; 11, upper die plate; 12, lower die plate; 13, forming cavity; 2, clamping assembly; 21, sliding groove; 22, sliding block; 23, clamping plate; 24, first fixed block; 25, connecting rod; 26, second fixed block; 3, movable assembly; 31, top plate; 32, rotating rod; 321, support rod; 322, support column; 33, limiting rod; 34, guide column; 35, bottom plate; 36, air bag. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the utility model will be apparently and completely described in combination with the drawings in the embodiments of the utility model. Apparently, the described embodiments are only part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the person skilled in the art without making creative efforts fall within the protection scope of the utility model.

[0023] In the description of the embodiments of the utility model, it should be understood that the directions or position relations indicated by the terms "length", "width", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer" and the like are the directions or position relations based on the directions or position relations shown in the drawings, and are only for the convenience of describing the embodiments of the utility model and simplifying the description, and thus cannot be understood as indicating or implying that the devices or elements indicated must have particular directions, be constructed and operated in particular directions, and thus cannot be understood as limiting the utility model. In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include one or more of the features. In the description of the embodiments of the utility model, the meaning of "multiple" is two or more than two, unless otherwise specifically limited.

[0024] In the embodiments of the utility model, unless another definite provision and limitation, the terms "mount", "link", "connect", "fix" and so on should be understood in broad sense, for example, can be fixed connection, also can be detachable connection, or be integrated, can be mechanical connection, also can be electrical connection, can be direct connection, also can be indirectly connected through intermediate medium, can be the communication of two elements or the interaction of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the embodiments of the utility model can be understood according to specific circumstances.

[0025] Please refer to Figures 1 to 3 The utility model provides an embodiment: a stamping die for transformer EI chip processing, the stamping die for transformer EI chip processing, including stamping die assembly 1, stamping die assembly 1 includes upper die plate 11 and the lower die plate 12 of setting below upper die plate 11, be provided with clamping assembly 2 on lower die plate 12, clamping assembly 2 includes setting sliding slot 21, four sliding slots 21 are provided, four sliding slots 21 are slidably connected with sliding block 22, the side away from lower die plate 12 of sliding block 22 is provided with clamping plate 23, and the top end height of clamping plate 23 is higher than the top end height of lower die plate 12, still be provided with first fixed block 24 on sliding block 22, and be provided with connecting rod 25 on first fixed block 24, and the one end away from first fixed block 24 of connecting rod 25 is provided with second fixed block 26, and second fixed block 26 sets in the lower end of upper die plate 11, and the both ends of connecting rod 25 are connected with first fixed block 24 and second fixed block 26 through pivot respectively, when second fixed block 26 moves downwards, second fixed block 26 can drive connecting rod 25 to rotate through pivot, and the rotation of connecting rod 25 makes the other end of connecting rod 25 drive first fixed block 24 to move through pivot.

[0026] Please refer to Figure 2 Stamping die assembly 1 still includes the forming cavity 13 of setting on lower die plate 12, and the forming cavity 13 is used for forming EI chip.

[0027] Please refer to Figures 4 to 6 Lower die plate 12 still be provided with movable assembly 3, and movable assembly 3 includes top plate 31, and the top end of top plate 31 is provided with rotary rod 32, and rotary rod 32 includes support rod 321, and the both sides of support rod 321 bottom end are provided with support column 322, and the central position of rotary rod 32 is provided with limiting rod 33, and the bottom end of limiting rod 33 sets on lower die plate 12, and the one end away from rotary rod 32 of top plate 31 slides inside forming cavity 13, and its outside and air bag 36 outside contact, and support column 322 is rotatably connected on the top end of top plate 31 and sliding block 22 respectively, when sliding block 22 slides, sliding block 22 drives support column 322 to rotate inside it and drives support rod 321 to rotate along limiting rod 33.

[0028] Please refer to Figure 6The guiding column 34 is internally provided with the forming cavity 13, and externally provided with the bottom plate 35, and the bottom plate 35 is provided with the air bag 36 below, when the top plate 31 extrudes the air bag 36, the air bag 36 expands to exert upward pushing force on the bottom plate 35.

[0029] Please refer to Figures 1 to 6 When the EI chip is punched and formed, the upper die plate 11 moves downward and the lower die plate 12 is closed, the second fixed block 26 moves downward driven by the upper die plate 11, the second fixed block 26 drives the connecting rod 25 to rotate, the connecting rod 25 drives the first fixed block 24 to move to the direction of the EI chip, the first fixed block 24 moves to make the sliding block 22 slide in the sliding groove 21 and make the sliding block 22 drive the clamping plate 23 to clamp the two sides of the EI chip, so that the EI chip is limited, and the EI chip is always positioned on the upper end of the lower die plate 12, and the sliding block 22 can drive the rotating rod 32 to rotate along the limiting rod 33, so that the rotating rod 32 drives the top plate 31 to move from the inside of the forming cavity 13, the top plate 31 does not extrude the air bag 36, the bottom plate 35 can move downward to open the forming cavity 13 to make the EI chip be formed, when the forming is completed, the upper die plate 11 moves upward, so that the connecting rod 25 reversely rotates, and the sliding block 22 and the top plate 31 also reversely move, the top plate 31 reversely moves to the inside of the forming cavity 13 to extrude the air bag 36, the air bag 36 is extruded to drive the bottom plate 35 to move downward, so that the bottom plate 35 moves the EI chip upward from the inside of the forming cavity 13.

[0030] It is apparent for those skilled in the art that the present application is not limited to the details of the above exemplary embodiments, but can be implemented in other concrete forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered as exemplary and not restrictive, and the scope of the present application is defined by the appended claims rather than the above description, and all changes falling within the meaning and range of equivalent elements of the claims are intended to be embraced therein. Any reference signs in the claims should not be considered as limiting the claims involved.

Claims

1. A punching die for processing transformer EI cores, comprising a punching die assembly (1), characterized in that: The punch die assembly (1) comprises an upper die plate (11) and a lower die plate (12) arranged below the upper die plate (11), the lower die plate (12) is provided with a clamping assembly (2), the clamping assembly (2) comprises a slide groove (21), the slide groove (21) is provided with four, four slide grooves (21) are slidably connected with a sliding block (22), the sliding block (22) is provided with a clamping plate (23) away from one side of the lower die plate (12), the clamping plate (23) is higher than the top end height of the lower die plate (12), the sliding block (22) is further provided with a first fixed block (24), the first fixed block (24) is provided with a connecting rod (25), the connecting rod (25) is provided with a second fixed block (26) away from one end of the first fixed block (24).

2. The punching die for processing transformer EI core according to claim 1, characterized in that: The second fixed block (26) is arranged at the lower end of the upper die plate (11), and the connecting rod (25) is connected with the first fixed block (24) and the second fixed block (26) through the rotating shaft at both ends.

3. The stamping die for processing transformer EI core according to claim 1, characterized in that: The punch die assembly (1) further comprises a forming cavity (13) arranged on the lower die plate (12).

4. The stamping die for processing transformer EI core according to claim 1, characterized in that: The lower die plate (12) is further provided with a movable assembly (3), the movable assembly (3) comprises a top plate (31), the top plate (31) is provided with a rotating rod (32) at the upper end, the rotating rod (32) comprises a support rod (321), the support rod (321) is provided with a support column (322) at both sides of the bottom end, the rotating rod (32) is provided with a limiting rod (33) at the central position, and the limiting rod (33) is arranged on the lower die plate (12) at the bottom end.

5. The punching die for processing transformer EI core according to claim 3, characterized in that: The forming cavity (13) is provided with a guide column (34) inside, the guide column (34) is provided with a bottom plate (35) outside, and the bottom plate (35) is provided with an air bag (36) below.

6. The punching die for processing transformer EI core according to claim 4, characterized in that: The end of the top plate (31) away from the rotating rod (32) slides inside the forming cavity (13), and the outer side thereof is in contact with the outer side of the air bag (36), and the support columns (322) are rotatably connected to the upper ends of the top plate (31) and the sliding block (22), respectively.

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